Sample box convenient for wafer transfer
By designing a sample box that facilitates wafer transfer, the combination of the inner concave box body, box cover and partition is used to solve the problem of easy damage and contamination of the wafer during transport, achieving efficient and clean wafer transfer, and reducing production costs.
Patent Information
- Application Number
- CN202420279076.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-05
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-02-05
AI Technical Summary
During the semiconductor wafer manufacturing process, the wafer is easily contaminated by foreign matter and dust, and is easily damaged during transportation. The existing wafer transfer tools are at risk of scratches and contamination.
A sample box is designed to facilitate wafer transfer, including a concave box body, box cover and partition plate. The partition plate is stacked up and down, a protective layer is provided to protect the wafer, and convenient wafer transfer is achieved through hinging and snap connection.
The sample box reduces the risk of wafer damage and contamination through the design of protective layer and partition, improves the efficiency and cleanliness of wafer transfer, and at the same time it is simple in structure, easy to manufacture and low cost.
Smart Images
Figure CN222600931U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor process, and particularly relates to a sample box which is convenient for wafer transfer. Background Art
[0002] During the semiconductor wafer manufacturing process, the wafer surface is easily contaminated by foreign objects, dust particles and other foreign matter; it is also very easy to be damaged during transportation, so during the transportation of wafers, wafer transfer tools are needed. Therefore, how to transfer wafers cleanly and efficiently is particularly important.
[0003] Existing wafer transfer tools generally use multi-side positioning of the wafer, with most of the wafer exposed to the outside, and the wafer is transferred by grabbing a specific position of the transfer tool. This method has the risk of scratching and collision during wafer transfer, and is easily contaminated. Utility Model Content
[0004] In order to solve the above problems, the utility model provides a sample box which is convenient for transferring wafers and can efficiently transfer wafers while avoiding wafer contamination.
[0005] A sample box for facilitating wafer transfer, the sample box comprising a concave box body, a box cover and a partition; the partition is adapted to the shape of the box body and can be detachably connected to the box body; the upper and lower layers of the partition are both provided with protective layers, and the wafer is arranged on the protective layers.
[0006] Furthermore, one side of the box body is hingedly connected to one side of the box cover.
[0007] Furthermore, the other side of the box body is snap-connected to the other side of the box cover.
[0008] Furthermore, the partition plate is connected to the box body by snap-fitting.
[0009] Furthermore, a pair of side edges of the partition are provided with a protruding structure, and the corresponding side edges of the box body are provided with a groove matched with the protruding structure, and the protruding structure is embedded in the groove.
[0010] Furthermore, a pick-and-place groove is provided on the side of the box body.
[0011] Furthermore, the material of the protective layer is sponge.
[0012] Furthermore, there are multiple partitions stacked one above the other; the thickness of the protruding structure is greater than the thickness of the partition, and when the partitions are stacked one above the other, the gap between the two partitions is greater than the sum of the crystal thickness and the protective layer thickness.
[0013] Furthermore, there are multiple partitions stacked up and down; the position of the protruding structure on each partition is different, and the corresponding box body is provided with multiple grooves with different positions and different groove depths; when the partitions are stacked up and down, the gap between the two partitions is greater than the sum of the crystal thickness and the protective layer thickness.
[0014] Furthermore, the sample box is made of antistatic material.
[0015] Compared with the prior art, one or more of the above technical solutions can achieve at least one of the following beneficial effects:
[0016] The sample box for easy wafer transfer reduces the risk of crystal damage compared with existing wafer transfer tools through the design of the concave box body, box cover and protective layer; the existence of the partition enables stacking of wafers, increases the number of transferred wafers, and greatly improves the transfer efficiency. The wafers are efficiently and cleanly transferred. In addition, the sample box has a simple structure, is easy to manufacture, and has a low cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0018] Figure 1 It is a three-dimensional diagram of the sample box for facilitating wafer transfer in Example 1.
[0019] Figure 2 It is a three-dimensional view of the lid of Example 1.
[0020] Figure 3 It is a three-dimensional diagram of the box body of Example 1.
[0021] Figure 4 This is a three-dimensional diagram of the partition of Example 1.
[0022] In the figure, 1, box cover; 101, box cover side; 102, box cover body; 103, hinge 1; 104, snap-on flap; 2, box body; 201, box body side; 202, box body bottom; 203, hinge 2; 204, snap-on groove; 205, take-and-put groove; 206, groove; 3, partition; 301, partition body; 302, raised structure; 4, protective layer; 5, first chip layer; 6, second chip layer. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] Example 1
[0025] This embodiment provides a sample box that facilitates wafer transfer.
[0026] like Figure 1 As shown, the sample box includes a concave box body 2, a box cover 1 and a partition 3; the partition 3 is adapted in shape to the box body 2 and can be detachably connected to the box body 2; the upper and lower layers of the partition 3 are both provided with a protective layer 4, and the chip is arranged on the protective layer 4.
[0027] As a preferred embodiment, the material of the protective layer 4 is sponge. The material of the sample box is antistatic material.
[0028] As a preferred embodiment, one side of the box body 2 is hingedly connected to one side of the box cover 1. The other side of the box body 2 is snap-connected to the other side of the box cover 1. The partition 3 is connected to the box body 2 by snap-connection.
[0029] The box cover 1, the box body 2 and the partition plate 3 are described in detail below.
[0030] like Figure 2 As shown, the box cover 1 is a rectangular structure, including a box cover side 101 and a concave box cover body 102. A hinge 103 is provided on the box cover side 101, and a snap-on flip cover 104 is provided on the opposite side.
[0031] like Figure 3 As shown, the shape of the box body 2 is adapted to the box cover 1, including the side edge 201 of the box body and the bottom 202 of the box body, and the side edge 201 of the box body and the bottom 202 of the box body form a concave structure. A groove 206 is provided on the inner side of a pair of the side edges 201 of the box body for positioning the partition 3. In the other pair of the side edges 201 of the box body, a buckle groove 204 is provided on the outer side of one side edge 201 of the box body, and a hinge 203 is provided on the outer side of the other side edge 201 of the box body. A pick-up and placement groove 205 is provided on the inner side of the side edge 201 of the box body, and the pick-up and placement groove 205 is an arc structure.
[0032] like Figure 4 As shown, the partition 3 is a flat rectangular shape, and the partition 3 includes a partition body 301. A pair of side edges of the partition body 301 are provided with protrusion structures 302, which are matched with the grooves 206 provided on the side edges 201 of the box body.
[0033] During assembly, the hinge 103 is connected with the hinge 2 203 , the buckle flip cover 104 is connected with the buckle groove 204 , and the protruding structure 302 is embedded in the groove 206 .
[0034] When transferring wafers, Figure 1 As shown, a protective layer 4 is disposed on the bottom 202 of the box body, followed by a first wafer layer 5, a partition 3, a protective layer 4 (not shown), and finally a second wafer layer 6. When taking and placing, the partition 3 is taken and placed through a pair of taking and placing grooves 205 disposed on the inner side of the side edge 201 of the box body.
[0035] The sample box for facilitating wafer transfer of this embodiment reduces the risk of crystal damage compared with existing wafer transfer tools through the design of the concave box body, box cover, and protective layer; the presence of the partition can realize stacking of wafers, increase the number of transferred wafers, and greatly improve the transfer efficiency. In addition, the structure is simple, easy to manufacture, and low in cost.
[0036] Example 2
[0037] The difference between this embodiment and embodiment 1 is that a plurality of partitions are provided, which are stacked one above the other. The thickness of the protruding structure is greater than the thickness of the partition body, and when the partitions are stacked one above the other, the gap between the two partitions is greater than the sum of the thickness of the crystal and the thickness of the protective layer.
[0038] The sample box of this embodiment further increases the number of wafers transferred at one time while protecting the wafers from damage.
[0039] Example 3
[0040] The difference between this embodiment and Embodiment 1 is that a plurality of partitions are provided, which are stacked one above the other; the position of the protruding structure on each partition is different, and a plurality of grooves with different positions and different groove depths are provided on the corresponding box body; in the height direction of the box body, the distance between the bottoms of two adjacent grooves is set to ensure that when the partitions are stacked up and down, the gap between the two partitions is greater than the sum of the crystal thickness and the protective layer thickness.
[0041] The sample box of this embodiment further increases the number of wafers transferred at one time while protecting the wafers from damage.
[0042] Obviously, the above embodiments are merely examples for clearly illustrating the technical solution of the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection of the claims of the utility model.
Claims
1. A sample box for facilitating wafer transfer, characterized in that: The sample box comprises a concave box body, a box cover and a partition; the partition is adapted to the box body in shape and can be detachably connected to the box body; the upper and lower layers of the partition are both provided with protective layers, and the chip is arranged on the protective layers.
2. The sample box for facilitating wafer transfer according to claim 1, characterized in that: One side of the box body is hingedly connected to one side of the box cover.
3. The sample box for facilitating wafer transfer according to claim 2, characterized in that: The other side of the box body is snap-connected with the other side of the box cover.
4. The sample box for facilitating wafer transfer according to claim 2, characterized in that: The partition plate is connected to the box body by snap-fitting.
5. The sample box for facilitating wafer transfer according to claim 4, characterized in that: A pair of side edges of the partition are provided with protruding structures, and the corresponding side edges of the box body are provided with grooves matched with the protruding structures, and the protruding structures are embedded in the grooves.
6. The sample box for facilitating wafer transfer according to claim 5, characterized in that: The side of the box body is provided with a taking and placing groove.
7. The sample box for facilitating wafer transfer according to claim 1, characterized in that: The material of the protective layer is sponge.
8. The sample box for facilitating wafer transfer according to claim 5, characterized in that: There are multiple partitions stacked one above the other; the thickness of the protruding structure is greater than the thickness of the partition, and when the partitions are stacked one above the other, the gap between the two partitions is greater than the sum of the crystal thickness and the protective layer thickness.
9. The sample box for facilitating wafer transfer according to claim 5, characterized in that: There are multiple partitions, which are stacked up and down; the position of the protruding structure on each partition is different, and the corresponding box body is provided with multiple grooves with different positions and different groove depths; when the partitions are stacked up and down, the gap between the two partitions is greater than the sum of the crystal thickness and the protective layer thickness.
10. The sample box for facilitating wafer transfer according to any one of claims 1 to 9, characterized in that: The sample box is made of antistatic material.