Light emitting diode packaging structure, light source module and lighting device

Abstract

The embodiment of the utility model provides a light emitting diode packaging structure, a light source module and a lighting device. The light emitting diode packaging structure comprises a substrate; the first light-emitting unit is arranged on the substrate; wherein the wavelength range of the light-emitting wavelength of the first light-emitting unit comprises the wavelength range of 595 nm to 780 nm; the second light-emitting unit is arranged on the substrate; wherein the second light-emitting unit is a monochromatic light-emitting chip; the light-emitting wavelength of the second light-emitting unit meets the condition that in light emitted by the light-emitting diode packaging structure, the ratio of radiation energy within the wavelength range of 595 nm to 780 nm to total radiation energy is smaller than 20%. The light emitted by the packaging structure of the light-emitting diode provided by the embodiment of the utility model can meet the condition that the ratio of the radiation energy to the total radiation energy within the wavelength range of 595-780 nm is less than 20%.

Description

Technical Field

[0001] The embodiments in this specification relate to the technical field of light emitting diodes, and specifically to a light emitting diode packaging structure, a light source module and a lighting device. Background Art

[0002] Due to its high efficiency, long life, and environmental protection, light emitting diode (LED) lighting technology has been widely used in multiple lighting scenarios such as aviation lighting, indoor lighting, and automotive lighting.

[0003] In aviation lighting scenarios, low color temperature LED light sources can emit warm tones close to sunset or candlelight, and can be installed in closed spaces such as airport lounges and aircraft cabins to create a warm and comfortable atmosphere. Currently, researchers mainly add red or orange phosphors to the phosphors of LED light sources to make the luminous color of low color temperature LED light sources closer to the luminous color of natural light sources.

[0004] However, according to the spectral distribution requirements of the International Civil Aviation Organization or various national civil aviation standards, there are specified requirements for the radiant energy of light emitted by low color temperature LED light sources used in special scenarios, that is, the ratio of the radiant energy of the light emitted within the wavelength range of 595nm to 780nm to the total radiant energy needs to be less than 20%, and the radiant energy of light emitted by the low color temperature LED light source prepared by the above-mentioned phosphor combination scheme is difficult to meet the above-mentioned specified requirements. Utility Model Content

[0005] In view of this, multiple embodiments of the present specification provide an LED packaging structure, a light source module and a lighting device, so that while the light color of the LED packaging structure is close to the light color of a natural light source, the radiation energy of the light emitted can meet the requirement that the ratio of the radiation energy within the wavelength range of 595nm to 780nm to the total radiation energy is less than 20%.

[0006] An embodiment of the present specification provides a light-emitting diode packaging structure, comprising: a substrate; a first light-emitting unit arranged on the substrate; wherein the wavelength range of the light-emitting wavelength of the first light-emitting unit includes a wavelength range of 595nm to 780nm; a second light-emitting unit arranged on the substrate; wherein the second light-emitting unit is a monochromatic light-emitting chip; the light-emitting wavelength of the second light-emitting unit satisfies: so that in the light emitted by the light-emitting diode packaging structure, the ratio of the radiation energy in the wavelength range of 595nm to 780nm to the total radiation energy is less than 20%.

[0007] In some embodiments, the wavelength range of the light emitting wavelength of the second light emitting unit does not overlap with the wavelength range of 595 nm to 780 nm.

[0008] In some embodiments, the light emitting wavelength of the first light emitting unit is in the wavelength range of 380 nm to 780 nm; the light emitting wavelength of the second light emitting unit falls within the wavelength range of 380 nm to 595 nm.

[0009] In some embodiments, the light emission wavelength of the second light emitting unit has a wavelength range of 580 nm to 590 nm.

[0010] In some embodiments, the first light emitting unit includes a blue light chip and a yellow-green phosphor film attached to the blue light chip.

[0011] In some embodiments, the light emitting diode packaging structure further includes: a light shielding adhesive layer disposed on a side of the blue light chip.

[0012] In some embodiments, the height of the light shielding adhesive layer protruding from the substrate is greater than the height of the blue light chip protruding from the substrate, and is less than the sum of the heights of the blue light chip and the yellow-green phosphor film protruding from the substrate.

[0013] In some embodiments, the blue light chip is a flip chip; the second light emitting unit is a vertical chip; or the second light emitting unit is an orange light chip or a yellow light chip.

[0014] In some embodiments, the light emitting diode packaging structure further includes: a packaging glue layer covering the first light emitting unit and the second light emitting unit.

[0015] An embodiment of the present specification provides a light source module, which includes the light emitting diode packaging structure as described in the above embodiment.

[0016] An embodiment of the present specification provides a lighting device, which includes the light emitting diode packaging structure described in the above embodiment or the light source module described in the above embodiment.

[0017] In multiple embodiments provided in the present specification, a monochromatic light-emitting chip that emits light of a different color from that of the single light-emitting chip is added to a single light-emitting chip, and the light-emitting color of a light-emitting diode package structure is adjusted using the added monochromatic light-emitting chip, so that the light-emitting color of the light-emitting diode package structure is close to the light-emitting color of a natural light source, and the ratio of the radiation energy of the light emitted by the light-emitting diode package structure in the wavelength range of 595nm to 780nm to the total radiation energy is less than 20%. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the drawings required for describing the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is a spectrum diagram of a low color temperature LED light source prepared by a phosphor matching method in the prior art.

[0020] Figure 2 A top view of a light emitting diode package structure provided in one embodiment of the present specification.

[0021] Figure 3 A schematic cross-sectional view along line AA' of a light emitting diode package structure provided in one embodiment of the present specification.

[0022] Figure 4 A spectrum diagram of a light-emitting diode packaging structure provided for one embodiment of the present specification.

[0023] Figure 5 A schematic diagram comparing the ratio of the radiant energy in different wavelength ranges to the total radiant energy of the light emitted by the light emitting diode package structure provided in one embodiment of the present specification with the ratio of the radiant energy in different wavelength ranges to the total radiant energy of the light emitted by the low color temperature LED light source provided in the prior art.

[0024] Structure number description

[0025] 100 substrates

[0026] 101 Electrode

[0027] 102 base

[0028] 110 first light emitting unit

[0029] 111 Blu-ray chip

[0030] 112 yellow-green phosphor film

[0031] 120 second light emitting unit

[0032] 130 light-shielding adhesive layer

[0033] 140 packaging glue layer

[0034] 150 metal connecting wire

[0035] 160 bracket DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0037] In the description of the embodiments of the present application, it needs to be understood that the meaning of “on” should be interpreted in the broadest manner, so that “on” not only means “directly on something” but also means “on something” including the presence of intermediate components or layers therebetween.

[0038] In the description of the embodiments of the present application, it is to be understood that the term "layer" used refers to a material portion including an area with a certain thickness. The layer may extend over the entire lower or upper structure, or may have a degree less than the range of the lower or upper structure. In addition, the layer may be a region of a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, the layer may be located between the top and bottom surfaces of the continuous structure or between any pair of horizontal planes therebetween. The layer may extend horizontally, vertically and / or along a tapered surface. The layer may include multiple layers. For example, the semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0039] In the description of the embodiments of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0040] LED light sources with low color temperature can emit warm light and are often used to create a warm indoor atmosphere. In order to meet ergonomic principles and enhance the user's visual experience of the color of LED light sources, it is usually hoped that the color of low color temperature LED light sources will be close to natural light. At present, the degree of proximity between the color point on the chromaticity coordinate diagram and the black body trajectory is mainly used to evaluate the proximity between the color of the LED light source and the color of the natural light source. That is, the closer the color point is to the black body trajectory, the closer the color of the LED light source is to natural light.

[0041] See also Figure 1And as shown in Table 1. In the related art, in order to make the luminous color of the low color temperature LED light source close to the luminous color of the natural light source, the R&D personnel usually adjust the phosphor matching scheme of the low color temperature LED light source, that is, add a certain proportion of red or orange phosphor to the phosphor of the low color temperature LED light source, so as to use the LED light-emitting chip to excite the red or orange phosphor to emit red light or orange light, thereby adjusting the luminous color of the low color temperature LED light source. However, for some low color temperature LED light sources used in special scenes, in addition to the luminous color close to the luminous color of the natural light source, the ratio of the radiant energy of the light emitted in the wavelength range of 595nm to 780nm to the total radiant energy needs to be less than 20%. Due to the large half-wave width of red light or orange light, the ratio of the radiant energy of the light emitted by the low color temperature LED light source prepared by the above-mentioned phosphor matching scheme in the wavelength range of 595nm to 780nm to the total radiant energy is usually more than 30%.

[0042] Therefore, it is necessary to provide a light-emitting diode packaging structure, by adding a monochromatic light-emitting chip that emits light of a different color from the single light-emitting chip on the basis of a single light-emitting chip, and using the added monochromatic light-emitting chip to adjust the light color of the light-emitting diode packaging structure, so as to achieve that the light color of the light-emitting diode packaging structure is close to the light color of the natural light source, and at the same time, the ratio of the radiation energy of the light emitted by the light emitting diode packaging structure in the wavelength range of 595nm to 780nm to the total radiation energy satisfies less than 20%.

[0043] Table 1 Ratio of the radiant energy of the light emitted by the low color temperature LED light source in each wavelength range to the total radiant energy in the related art

[0044] Each band Number of photons in each band (umol / s) Energy ratio 360nm~400nm 0.03251 0.79％ 400nm~500nm 0.62902 15.34％ 500nm~600nm 1.97819 48.25％ 600nm~700nm 1.32955 32.43％ 700nm~800nm 0.13070 3.19％

[0045] See also Figure 2 and Figure 3 An embodiment of the present specification provides a light emitting diode package structure, including: a substrate 100 ; a first light emitting unit 110 disposed on the substrate 100 ; and a second light emitting unit 120 disposed on the substrate 100 .

[0046] The substrate 100 can be used to carry the light-emitting unit and provide power drive for the light-emitting unit. Specifically, the substrate 100 may include an electrode 101 and a base 102. The electrode 101 may be electrically connected to a driving circuit to drive the light-emitting unit. The electrode 101 may be made of a conductive material. For example, it may be at least one of a metal and a conductive glue, wherein the metal may be at least one of materials such as aluminum (Al), copper (Cu), platinum (Pt), chromium (Cr), titanium (Ti), germanium (Ge), and nickel (Ni). The driving circuit may be an active matrix driving circuit or a passive matrix driving circuit.

[0047] The substrate 102 may be a complementary metal-oxide-semiconductor (CMOS), a thin film transistor (TFT), or a liquid crystal on silicon (LCOS). The substrate 102 may be made of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc., or may be made of non-conductive materials, such as glass, sapphire, etc.

[0048] In this embodiment, the first light-emitting unit 110 may include a blue chip 111 and a yellow-green phosphor film 112 attached to the blue chip 111. Specifically, the blue chip 111 may be fixed to the substrate 100. In order to reduce the parasitic inductance and resistance between the blue chip 111 and the substrate 100, improve the electrical performance of the light-emitting diode package structure, and reduce the size of the light-emitting diode package structure, the blue chip 111 may be a flip chip. The yellow-green phosphor film 112 may be a square sheet made by mixing yellow-green phosphor and glue. The yellow-green phosphor film 112 emits yellow-green light with a smaller wavelength range after being excited by the blue chip 111. Specifically, during the manufacturing process, after the blue chip 111 is fixed to the substrate 100, the yellow-green phosphor film 112 may be attached to the surface of the blue chip 111 away from the substrate 100. The shape and area of ​​the yellow-green phosphor film 112 may be the same as the shape and area of ​​the blue chip 111. By pasting the yellow-green phosphor film 112 on the surface of the blue light chip 111 away from the substrate 100, the light emitted by the blue light chip 111 stimulating the yellow-green phosphor film 112 can be used to convert and adjust the luminous color of the blue light chip 111. At the same time, by covering the blue light chip 111 with the yellow-green phosphor film 112 having the same shape and area as the blue light chip 111, the influence of the yellow-green phosphor film 112 on the light emitting effect of the second light emitting unit 120 can be reduced, thereby improving the overall light emitting effect of the light emitting diode package structure.

[0049] The light emitting diode packaging structure may also include: a light shielding adhesive layer 130 disposed on the side of the blue light chip 111. Due to the scattering characteristics of light, the light emitted by the blue light chip 111 may escape from the side, resulting in a low light output intensity of the blue light chip 111 in a direction perpendicular to the substrate 100, and a poor light output effect. In order to improve the light output effect of the blue light chip 111, a light shielding adhesive layer 130 may be applied to the side of the blue light chip 111. Specifically, the light shielding adhesive layer 130 may be a white colloid that has the function of blocking the emission of light. On the one hand, the light shielding adhesive layer 130 can block the light emitted by the blue light chip 111 from escaping from the side, thereby enhancing the concentration of the light emitted by the blue light chip 111. On the other hand, the white light shielding adhesive layer 130 has a strong light reflection effect. For the light escaping from the side of the blue light chip 111 to the light shielding adhesive layer 130, the light shielding adhesive layer 130 can reflect it to the blue light chip 111, thereby reducing the loss of luminous intensity caused by the lateral escape of light.

[0050] In the case where the height of the light shielding adhesive layer 130 protruding from the substrate 100 exceeds the sum of the heights of the blue light chip 111 and the yellow-green phosphor film 112 protruding from the substrate 100, the light shielding adhesive layer 130 may overflow to the surface of the yellow-green phosphor film 112, blocking the light emitted by the yellow-green phosphor film 112, resulting in a reduction in the overall light emission effect of the first light-emitting unit 110. In order to enhance the blocking effect of the light shielding adhesive layer 130 on the escape of light from the blue light chip 111 and reduce the adverse effect of the light shielding adhesive layer 130 on the overall light emission effect of the first light-emitting unit 110, in some embodiments, the height of the light shielding adhesive layer 130 protruding from the substrate 100 may be greater than the height of the blue light chip 111 protruding from the substrate 100, and less than the sum of the heights of the blue light chip 111 and the yellow-green phosphor film 112 protruding from the substrate 100. Specifically, during the manufacturing process, after the blue light chip 111 is fixed to the substrate 100, a first light-shielding adhesive layer with a height less than that of the blue light chip 111 can be dotted along the circumference of the blue light chip 111, and then a yellow-green phosphor film 112 can be attached to the blue light chip 111. After the yellow-green phosphor film 112 is attached, a second light-shielding adhesive layer can be dotted along the circumference of the blue light chip 111 and the yellow-green phosphor film 112 on the surface of the first light-shielding adhesive layer away from the substrate 100, and the sum of the heights of the first light-shielding adhesive layer and the second light-shielding adhesive layer protruding from the substrate 100 is less than the sum of the heights of the blue light chip 111 and the yellow-green phosphor film 112 protruding from the substrate 100.

[0051] In some embodiments, after the yellow-green phosphor film 112 is attached to the blue light chip 111, a light-shielding adhesive layer 130 may be dotted along the circumference of the blue light chip 111 and the yellow-green phosphor film 112, and the height of the light-shielding adhesive layer 130 protruding from the substrate 100 is greater than the height of the blue light chip 111 protruding from the substrate 100, and is less than the sum of the heights of the blue light chip 111 and the yellow-green phosphor film 112 protruding from the substrate 100.

[0052] In the present embodiment, the second light-emitting unit 120 may be a monochrome light-emitting chip. Specifically, the second light-emitting unit 120 and the blue light chip 111 emit different light colors. In some embodiments, the second light-emitting unit 120 may be an orange light chip or a yellow light chip. Compared with the blue light chip 111, the second light-emitting unit 120 is smaller in size. The second light-emitting unit 120 may be fixed on the substrate 100. In order to reduce the overall volume of the light-emitting diode package structure and reduce the space occupied by the light-emitting diode package structure, the second light-emitting unit 120 may be a vertical chip and electrically connected to the blue light chip 111 through a metal connecting wire 150, so that the second light-emitting unit 120 and the blue light chip 111 can be driven together.

[0053] The light emitting wavelengths of the first light emitting unit 110 and the second light emitting unit 120 satisfy the following conditions: the wavelength range of the light emitting wavelength of the first light emitting unit 110 includes the wavelength range of 595nm to 780nm; the light emitting wavelength of the second light emitting unit 120 satisfies: in the light emitted by the light emitting diode packaging structure, the ratio of the radiation energy in the wavelength range of 595nm to 780nm to the total radiation energy is less than 20%.

[0054] Specifically, the wavelength range of the light-emitting wavelength of the second light-emitting unit 120 does not overlap with the wavelength range of 595nm to 780nm, so that the second light-emitting unit 120 can be used to adjust the proportion of the radiation energy of the light emitted by the light-emitting diode packaging structure within the wavelength range of 595nm to 780nm to the total radiation energy to be less than 20%.

[0055] The wavelength range of the light emitting wavelength of the first light emitting unit 110 may be 380nm to 780nm; the wavelength of the light emitting wavelength of the second light emitting unit 120 may fall within the wavelength range of 380nm to 595nm. Since the light emitted by the light emitting diode package structure is a mixture of the light emitted by the first light emitting unit 110 and the light emitted by the second light emitting unit 120, the peak wavelength of the light emitted by the second light emitting unit 120 is less than 595nm, thereby increasing the proportion of the radiation energy within the wavelength range of 380nm to 595nm in the total radiation energy, and reducing the proportion of the radiation energy within the wavelength range of 595nm to 780nm in the total radiation energy to less than 20%. Specifically, the peak wavelength of the light emitted by the second light emitting unit 120 may be less than 590nm. In some embodiments, the wavelength range of the light emitting wavelength of the second light emitting unit 120 may be 580nm to 590nm.

[0056] In some embodiments, the light-emitting diode packaging structure may further include: an encapsulation glue layer 140 covering the first light-emitting unit 110 and the second light-emitting unit 120. Specifically, a bracket 160 is provided on the substrate 100, and a bowl-shaped space is formed between the bracket 160 and the surface of the substrate 100. After the light-shielding glue layer 130 is applied, a transparent encapsulation glue can be filled into the bowl-shaped space until the encapsulation glue layer 140 with a surface parallel to the substrate 100 is formed. The encapsulation glue layer 140 can be used to protect the light-emitting unit and the metal connecting wire 150 between the blue light chip 111 and the second light-emitting unit 120, thereby improving the reliability of the light-emitting diode packaging structure and extending the service life of the light-emitting diode packaging structure.

[0057] See also Figure 1 and Figure 4 By comparing the two figures, it can be seen that compared with the light emitted by the low color temperature LED light source provided by the related art, the radiation energy of the light emitted by the light emitting diode package structure provided by the present application in the wavelength range of 595nm to 780nm is significantly reduced.

[0058] See also Figure 5 .exist Figure 5 In the figure, the black reference column represents the light emitting diode packaging structure provided by the present application, and the gray reference column represents the LED light source provided by the prior art. Figure 5 It can be seen that compared with the light emitted by the low color temperature LED light source provided by the related technology, the light emitted by the light emitting diode packaging structure provided in the present application has a larger ratio of the radiation energy to the total radiation energy in the wavelength range of 380nm to 595nm, and a smaller ratio of the radiation energy to the total radiation energy in the wavelength range of 595nm to 780nm.

[0059] In the embodiments of the present specification, a monochromatic light-emitting chip is added to the single light-emitting chip, which emits light of a different color from the single light-emitting chip and has a wavelength range that does not overlap with the wavelength range of 595nm to 780nm. The added monochromatic light-emitting chip is used to adjust the overall light-emitting effect of the light-emitting diode packaging structure, so that the light-emitting color of the light-emitting diode packaging structure is close to the light-emitting color of a natural light source, and the ratio of the radiation energy of the light emitted by the light-emitting diode packaging structure within the wavelength range of 595nm to 780nm to the total radiation energy is less than 20%.

[0060] An embodiment of the present specification provides a light source module, which may include the light emitting diode package structure as described in the above embodiment.

[0061] An embodiment of the present specification provides a lighting device, which may include the light emitting diode package structure described in the above embodiment or the light source module described in the above embodiment.

[0062] Regarding the technical effects of the light source module and the lighting device described in the above embodiments, reference can be made to other embodiments of this specification for comparative explanation, and no further details will be given here.

[0063] It should be understood that the specific examples in this specification are only intended to help those skilled in the art to better understand the embodiments of this specification, rather than to limit the scope of the present invention.

[0064] It can be understood that in the various embodiments in this specification, the size of the sequence number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this specification.

[0065] It can be understood that the various embodiments described in this specification can be implemented individually or in combination, and the embodiments of this specification are not limited to this.

[0066] Unless otherwise stated, all technical and scientific terms used in the embodiments of this specification have the same meaning as those generally understood by those skilled in the art of the technical field of this specification. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the scope of this specification. The term "and / or" used in this specification includes any and all combinations of one or more related listed items. The singular forms of "a kind of", "above" and "the" used in the embodiments of this specification and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0067] In the several embodiments provided in this specification, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the device or module is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0068] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0069] In addition, each functional module in each embodiment of the present specification may be integrated into one device, or each module may exist physically separately, or two or more modules may be integrated into one device.

[0070] The above is only a specific embodiment of this specification, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in this specification, which should be included in the protection scope of this specification. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A light emitting diode packaging structure, characterized in that: include: substrate; A first light-emitting unit is disposed on the substrate; wherein the wavelength range of the light-emitting wavelength of the first light-emitting unit includes a wavelength range of 595nm to 780nm; A second light-emitting unit is arranged on the substrate; wherein the second light-emitting unit is a monochromatic light-emitting chip; the light-emitting wavelength of the second light-emitting unit satisfies: so that in the light emitted by the light-emitting diode packaging structure, the ratio of the radiation energy in the wavelength range of 595nm to 780nm to the total radiation energy is less than 20%.

2. The light emitting diode packaging structure according to claim 1, characterized in that: The wavelength range of the light emission wavelength of the second light emitting unit does not overlap with the wavelength range of 595nm to 780nm.

3. The light emitting diode packaging structure according to claim 2, characterized in that: The wavelength range of the light emitting wavelength of the first light emitting unit is 380nm to 780nm; the light emitting wavelength of the second light emitting unit falls within the wavelength range of 380nm to 595nm.

4. The light emitting diode packaging structure according to claim 1, characterized in that: The wavelength range of the light emission wavelength of the second light emitting unit is 580nm to 590nm.

5. The light emitting diode packaging structure according to claim 1, characterized in that: The first light emitting unit includes a blue light chip and a yellow-green phosphor film attached to the blue light chip.

6. The light emitting diode packaging structure according to claim 5, characterized in that: The light emitting diode packaging structure further includes: A light shielding adhesive layer is arranged on the side of the blue light chip.

7. The light emitting diode packaging structure according to claim 6, characterized in that: The height of the light shielding adhesive layer protruding from the substrate is greater than the height of the blue light chip protruding from the substrate, and is less than the sum of the heights of the blue light chip and the yellow-green phosphor film protruding from the substrate.

8. The light emitting diode packaging structure according to claim 5, characterized in that: The blue light chip is a flip chip; the second light emitting unit is a vertical chip; Alternatively, the second light emitting unit is an orange light chip or a yellow light chip.

9. The light emitting diode packaging structure according to claim 1, characterized in that: The light emitting diode packaging structure further includes: A packaging glue layer covering the first light emitting unit and the second light emitting unit.

10. A light source module, characterized in that: The light source module comprises the light emitting diode package structure according to any one of claims 1 to 9.

11. A lighting device, characterized in that: The lighting device comprises the light emitting diode package structure according to any one of claims 1 to 9 or the light source module according to claim 10.

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