Substrate conductive copper foil testing device

Abstract

The utility model relates to the technical field of base support, in particular to a testing device for a conductive copper foil of a substrate, which comprises a base; the clamping assembly is used for clamping and fixing a base plate, and the buffering assembly is used for buffering the base plate in the clamping process. The buffering assembly comprises a groove body fixedly installed at the top of the base, a water bag for clamping the copper foil of the base plate, a water pipe for conveying water in the water bag, a water storage bag communicated with the water bag through the water pipe, and a pressing plate moving along with deformation of the water storage bag, wherein the water bag is installed on the clamping side of the clamping plate. According to the device for testing the conductive copper foil of the substrate, the water bag is extruded by the copper foil of the substrate, the water in the water bag flows into the water storage bag due to the property that the water cannot be compressed, the water storage bag is telescopic, the pressing plate is extruded by the expansion of the water storage bag, the first electrode of the pressing plate is communicated with the second electrode, and the rotation of the motor is stopped; and the clamping plate is prevented from further extruding the substrate copper foil.

Description

Technical Field

[0001] The utility model relates to the technical field of substrate testing, in particular to a testing device for conductive copper foil of a substrate. Background Art

[0002] With the rapid development of electronic technology in recent years, electronic products are constantly developing in the direction of being small, light and thin, and printed circuit boards are also developing in the direction of being small, light and high-density. A key process for interconnecting the layers of the circuit substrate of a higher-density circuit board is microporation, that is, the processing of micropores between the layers of the circuit substrate. Conductive paste has good processability and conductive effect. Introducing it into the micropores of the circuit substrate to form a conductive paste plug micropore structure can improve the flexibility of the interconnection design of the printed circuit board holes and provide support for the realization of printed circuit products with complex functions. When testing the copper foil of the substrate, the conductive performance of the copper foil directly affects the working efficiency and performance of the equipment, so effective measures must be taken to ensure that its conductive performance meets the requirements.

[0003] The application with application number CN202311395027.0 involves the field of substrate copper foil conductivity testing, and specifically involves a substrate copper foil conductivity testing device; it includes a testing table, a fixing module, a cleaning module, a detection module, a heating component and copper foil. Through the setting of the fixing module, the cleaning module, the detection module and the heating component, the copper foil can be detected in multiple directions and in multiple ways, and the conductivity of the copper foil in various states can be comprehensively detected, thereby increasing the accuracy of the test results and thus increasing practicality.

[0004] This application discloses that when clamping the substrate copper foil, manual clamping cannot determine whether the substrate copper foil can withstand the force applied to the substrate copper foil during clamping, and the substrate copper foil is easily squeezed and damaged during fixing.

[0005] Therefore, it is necessary to provide a new technical solution to overcome the above-mentioned defects. Utility Model Content

[0006] The utility model aims to provide a testing device for a substrate conductive copper foil which can effectively solve the above technical problems.

[0007] In order to achieve the purpose of this utility model, the following technical solutions are adopted:

[0008] A testing device for conductive copper foil of a substrate, comprising:

[0009] Base; a clamping assembly for clamping and fixing the substrate, a buffer assembly for buffering the substrate during the clamping process, and a power source;

[0010] The buffer assembly includes a trough body fixedly installed on the top of the base, a water bag clamping the copper foil of the substrate, the water bag installed on the clamping side of the clamping plate, a water pipe for transporting water in the water bag, a water storage bag connected to the water bag through the water pipe, a pressure plate that moves with the deformation of the water storage bag, a spring that drives the pressure plate to reset, a controller that controls the start and stop of the motor, and a push plate that compresses or releases the spring.

[0011] Furthermore, the controller includes electrode 1 and electrode 2. When electrode 1 is in contact with electrode 2, the power source is powered off, and when electrode 1 is not in contact with electrode 2, the power source operates normally.

[0012] Furthermore, the clamping assembly consists of a rotating disk, a power source for driving the rotating disk to rotate, a clamping plate, and a test probe; the rotating disk is provided with a driving groove, the base is provided with a guide groove, the bottom of the clamping plate is provided with an insertion rod that is plugged into the driving groove, and the test probe is fixedly connected to the clamping plate.

[0013] Furthermore, four groups of clamping plates are provided to clamp the copper foil of the substrate from four sides simultaneously.

[0014] Furthermore, four groups of driving grooves are provided, and the driving grooves are arranged in a curved shape, and the clamping plate is driven to move toward the copper foil of the substrate by rotating the curved portion of the driving grooves.

[0015] Furthermore, four groups of guide grooves are provided and arranged in a straight line, driving the insertion rod to move in a straight line in the guide groove, driving the clamping plate to clamp the four sides of the copper foil of the substrate.

[0016] Compared with the prior art, the utility model has the following beneficial effects: the utility model is a testing device for a conductive copper foil of a substrate, which squeezes a water bag through the substrate copper foil. Because the water is incompressible, the water in the water bag flows into the water storage bag. The water storage bag is retractable, and the expansion of the water storage bag squeezes the pressure plate, so that the pressure plate electrode 1 is connected with the electrode 2, and the motor stops rotating. By adjusting the movement of the push plate, the force of the spring is changed, and the elastic force of the spring is overcome accordingly, so as to achieve the purpose of clamping substrate copper foils of different sizes and prevent the clamping plate from further squeezing the substrate copper foil. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.

[0018] Figure 1 This is a schematic structural diagram of a testing device for conductive copper foil of a substrate according to the utility model;

[0019] Figure 2 This is a cross-sectional view of a testing device for a conductive copper foil of a substrate according to the utility model;

[0020] Figure 3 It is a cross-sectional view of a testing device for conductive copper foil of a substrate according to the utility model;

[0021] Figure 4 The utility model is a testing device for a substrate conductive copper foil Figure 2 The enlarged view of point A in the middle;

[0022] Figure 5 The utility model is a testing device for a substrate conductive copper foil Figure 3 The plane diagram at B in the middle;

[0023] In the figure: 1. base; 2. display controller; 3. snap-fit ​​assembly; 31. rotating disk; 32. drive slot; 33. guide slot; 34. snap-fit ​​plate; 35. test probe; 4. buffer assembly; 41. water bag; 42. water pipe; 43. tank body; 44. water storage bag; 45. pressure plate; 46. spring; 47. controller; 471. electrode one; 472. electrode two; 48. push plate; 5. electrical pipe; 6. cleaner. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below. Obviously, the described embodiments are partial embodiments of the utility model, rather than all embodiments.

[0025] In the description of the present utility model, it should be understood that the terms "center", "lateral", "longitudinal", "front", "back", "left", "right", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present utility model. When a mechanism is referred to as being "fixed to" another mechanism, it may be directly on the other mechanism or there may also be a centered mechanism. When a mechanism is considered to be "connected to" another mechanism, it may be directly connected to the other mechanism or there may be a centered mechanism at the same time. When a mechanism is considered to be "set on" another mechanism, it may be directly set on the other mechanism or there may be a centered mechanism at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] like Figures 1 to 5 As shown, a testing device for conductive copper foil of a substrate comprises:

[0027] A base 1, a clamping assembly for clamping and fixing the substrate, a buffer assembly 4 for buffering the substrate, and a power source.

[0028] The copper foil on the substrate is tested by the four-probe method. Since the four-probe test technology uses probes with equal spacing to pierce the semiconductor surface, this device is only suitable for testing copper foils with equal sides.

[0029] The clamping assembly consists of a rotating disk 31, a power source for driving the rotating disk 31 to rotate, a clamping plate 34, and a test probe 35; the rotating disk 31 is provided with a driving groove 32, the base is provided with a guide groove 33, the clamping plate 34 is provided with four groups, and the copper foil of the substrate is clamped from four sides at the same time, and a plug rod is provided at the bottom of the clamping plate 34 to be plugged into the driving groove 32. The driving groove 32 is provided with four groups, and the driving groove 32 is arranged in a curved shape. The clamping plate 34 is driven to move toward the copper foil of the substrate by rotating at the curved part of the driving groove 32. The guide grooves 33 are provided with four groups and are arranged in a straight line, driving the insertion rod to make a straight line movement in the guide grooves 33, driving the clamping plates 34 to clamp the four sides of the substrate copper foil, the test probe 35 is fixedly connected to the clamping plates 34, and the power source is a driving motor; the driving motor drives the rotating disk 31 to rotate, thereby driving the bottom end of the insertion rod to move in the driving groove 32, and at the same time, the middle part of the insertion rod moves in the guide groove 33, driving the clamping plates 34 to move along the guide grooves 33, and clamping the substrate copper foil.

[0030] The buffer assembly 4 includes a trough body 43 fixedly mounted on the top of the base 1, a water bag 41 clamping the copper foil of the substrate, the water bag 41 is mounted on the clamping side of the clamping plate 34, a water pipe 42 for transporting water in the water bag 41, a water storage bag 44 connected to the water bag 41 through the water pipe 42, a pressure plate 45 moving with the deformation of the water storage bag 44, a spring 46 driving the pressure plate 45 to return, a controller 47 controlling the start and stop of the motor, and a push plate 48 compressing or releasing the spring 46. , and the water bag 41 and the water storage bag 44 are both made of silicone material; the pressure plate 45 is provided with an electrode 1 471, and the push plate 48 is provided with an electrode 2 472, and the electrode 1 471 is electrically connected to the drive motor. When the electrode 1 471 is in contact with the electrode 2 472, that is, the power is cut off between the drive motor and the electrode 1 471, the drive motor stops rotating, and when the electrode 1 471 is separated from the electrode 2 472, that is, the external power supply is powered on to the drive motor, the drive motor starts rotating;

[0031] When the pressing plate 45 does not move, the electrode 1 471 and the electrode 2 472 are not in contact, and the external power supply energizes the driving motor to make the driving motor rotate. The driving motor can drive the multiple clamping plates 34 to approach each other through the rotation, and the clamping plates 34 drive the water bag 41 to clamp the copper foil of the substrate, thereby clamping and fixing the copper foil of the substrate, avoiding the movement of the copper foil of the substrate during detection, and improving the accuracy of the detection result;

[0032] When the water bag 41 is in contact with the copper foil of the substrate, the water bag 41 is deformed when it is squeezed by the copper foil of the substrate. Due to the incompressible nature of water, the water flow in the water bag 41 is squeezed at this time, and flows through the water pipe 42 into the water storage bag 44. The water storage bag 44 expands at this time. At the same time, the expansion of the water storage bag 44 squeezes the pressure plate 45. The pressure plate 45 drives the electrode 1 471 to move and drives the spring 46 to compress, so that the electrode 1 471 contacts the electrode 2 472. At this time, the external power supply cuts off the power to the drive motor, causing the drive motor to stop rotating, thereby preventing the water bag 41 from squeezing the copper foil of the substrate excessively and damaging the copper foil of the substrate.

[0033] It is to be added that the driving motor is also connected to a control switch for controlling the rotation direction of the driving motor. When the substrate copper foil detection is completed, the driving motor is controlled to change its rotation direction by starting the control switch, thereby driving the multiple clamping plates 34 away from each other, thereby releasing the clamping of the substrate copper foil, and at this time, the substrate copper foil can be easily taken out;

[0034] In addition, since the multiple snap-fit ​​plates 34 are far away from each other, the water bag 41 is no longer subjected to the squeezing force of the copper foil of the substrate, and the elastic force of the spring 46 can drive the pressure plate 45 to reset. The pressure plate 45 squeezes the water storage bag 44, so that the water in the water storage bag 44 flows back into the water bag 41, thereby restoring the shape of the water bag 41 for subsequent use.

[0035] As a further extension of this patent, the position of the push plate 48 is adjusted according to the size of the copper foil of the substrate to be inspected, such as Figure 5 As shown, the push plate 48 can be adjusted forward and backward in the groove body 43 to change the distance between the push plate 48 and the pressure plate 45. The advantage of this is that by adjusting the position of the push plate 48, the moving distance of the pressure plate 45 after the water storage bag 44 is expanded can be changed, and the contact time between the electrode 1 471 and the electrode 2 472 can be changed, so that the clamping pressure of the clamping plate 34 on the substrate copper foil can be changed to adapt to the different pressures that the substrate copper foils of different sizes can withstand, and avoid excessive clamping of the substrate by the clamping component, causing damage to the substrate copper foil.

[0036] Before testing the copper foil of the substrate, the surface of the copper foil of the substrate is vacuumed by a cleaner 6 to prevent the electrostatic adsorption of dust from affecting its conductivity, thereby causing inaccurate measurement results of the test probe 35. Here, the cleaner 6 can be a vacuum cleaner.

[0037] As a supplement: when the cleaner 6 is vacuuming the substrate copper foil, the substrate copper foil is clamped by the water bag 41, and its two sides pass through the electrical pipe 5 to make the current formed at the four ends of the substrate copper foil equal. At the same time, the test probe 35 detects the four ends of the surface of the substrate copper foil to test the conductive performance of the substrate copper foil under the same test environment to increase the accuracy of the conductive test.

[0038] Working principle:

[0039] The water bag 41 is squeezed by the substrate copper foil. Since water is incompressible, the water in the water bag 41 flows into the water bag 44. The water bag 44 is retractable. The expansion of the water bag 44 squeezes the pressure plate 45, so that the electrode 1 471 of the pressure plate 45 is connected to the electrode 2 472. The motor stops rotating, and the push plate 48 is adjusted to move to change the force of the spring 46, so that the elastic force of the spring 46 changes accordingly, thereby achieving the purpose of clamping substrate copper foils of different sizes and preventing the clamping plate 34 from further squeezing the substrate copper foil.

[0040] The standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The content not described in detail in this specification belongs to the prior art known to professional and technical personnel in this field.

[0041] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

Claims

1. A testing device for conductive copper foil of a substrate, characterized in that: include: Pedestal; A clamping assembly for clamping and fixing the substrate, a buffer assembly for buffering the substrate during the clamping process, and a power source; The buffer assembly includes a trough body fixedly installed on the top of the base, a water bag clamping the copper foil of the substrate, the water bag installed on the clamping side of the clamping plate, a water pipe for transporting water in the water bag, a water storage bag connected to the water bag through the water pipe, a pressure plate that moves with the deformation of the water storage bag, a spring that drives the pressure plate to reset, a controller that controls the start and stop of the motor, and a push plate that compresses or releases the spring.

2. A testing device for conductive copper foil of a substrate as claimed in claim 1, characterized in that: The controller comprises an electrode 1 and an electrode 2. When the electrode 1 is in contact with the electrode 2, the power source is powered off. When the electrode 1 is not in contact with the electrode 2, the power source operates normally.

3. A testing device for conductive copper foil of a substrate as claimed in claim 1, characterized in that: The clamping assembly consists of a rotating disk, a power source for driving the rotating disk to rotate, a clamping plate, and a test probe; the rotating disk is provided with a driving groove, the base is provided with a guide groove, the bottom of the clamping plate is provided with an insertion rod that is plugged into the driving groove, and the test probe is fixedly connected to the clamping plate.

4. A testing device for conductive copper foil of a substrate as claimed in claim 1, characterized in that: The clamping plates are provided in four groups, and the copper foil of the substrate is clamped from four sides simultaneously.

5. A testing device for conductive copper foil of a substrate as claimed in claim 3, characterized in that: The driving grooves are provided with four groups, and the driving grooves are arranged in a curved shape, and the clamping plate is driven to move toward the copper foil of the substrate by rotating the curved part of the driving grooves.

6. A testing device for conductive copper foil of a substrate as claimed in claim 3, characterized in that: The guide grooves are provided with four groups and are arranged in a straight line, driving the insertion rod to move in a straight line in the guide grooves, driving the clamping plate to clamp the four sides of the copper foil of the substrate.

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