Millimeter wave digital isolator

Abstract

The utility model discloses a millimeter wave digital isolator which comprises a first frame, a second frame and a packaging body wrapping the first frame and the second frame, and an isolation gap is arranged between the first frame and the second frame. The device further comprises a plurality of wireless signal sending modules and a plurality of wireless signal receiving modules, the number of the wireless signal sending modules is equal to that of the wireless signal receiving modules, the wireless signal sending modules and the wireless signal receiving modules are arranged in a one-to-one correspondence mode, and at least one wireless signal sending module is arranged on the first frame. At least one wireless signal receiving module is arranged on the second frame, the wireless signal transmitting module comprises a first chip and a first antenna unit which are electrically connected, and the wireless signal receiving module comprises a second chip and a second antenna unit which are electrically connected; the first frame is provided with a first slot, the first antenna unit is arranged at the first slot, the second frame is provided with a second slot, and the second antenna unit is arranged at the second slot. The millimeter wave digital isolator is high in communication quality and high in reliability.

Description

Technical Field

[0001] The utility model relates to the technical field of digital isolators, in particular to a millimeter wave digital isolator. Background Art

[0002] Digital isolators require isolated data transmission between two or more chips working in different voltage domains. The shortcomings of existing technologies are: 1. The two chips are isolated from each other by wire bonding or rewiring to achieve voltage domain isolation. The physical connection of the wires may result in reliability risks such as poor welding. 2. Existing digital isolators achieve communication through physical connections. Due to the limitations of the conductor material and the connection relationship, the code throughput and transmission rate cannot be improved, and the increasing requirements for high-quality communications cannot be met. 3. The design of digital isolation chips has a voltage resistance bottleneck. The insulation strength of the physical connection is limited by the wafer process, and complete high-voltage isolation cannot be achieved. In the case of a high voltage difference, there is a risk of breakdown. At that time, the high voltage will reach the low voltage domain through the bonding wires or the rewiring layer, eventually causing the low voltage domain to be damaged. Utility Model Content

[0003] The technical problem solved by the utility model is to provide a high-reliability millimeter-wave digital isolator that can meet the requirements of high-quality communication.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a millimeter wave digital isolator, comprising a first frame, a second frame and a packaging body covering the first frame and the second frame, and an isolation gap is provided between the first frame and the second frame; it also includes a plurality of wireless signal sending modules and a plurality of wireless signal receiving modules, the number of the wireless signal sending modules is equal to the number of the wireless signal receiving modules and the two are arranged in a one-to-one correspondence, at least one wireless signal sending module is arranged on the first frame, and at least one wireless signal receiving module is arranged on the second frame, the wireless signal sending module includes an electrically connected first chip and a first antenna unit, the wireless signal receiving module includes an electrically connected second chip and a second antenna unit, the first antenna unit cooperates with the second antenna unit to perform wireless data transmission; a first slot is provided on the first frame, and the first antenna unit is provided at the first slot, a second slot is provided on the second frame, and the second antenna unit is provided at the second slot.

[0005] In one embodiment, the first frame is in a first voltage domain, the second frame is in a second voltage domain, and a voltage of the first voltage domain is different from a voltage of the second voltage domain.

[0006] In one embodiment, the first slot is connected to an end surface of the first frame close to one end of the second frame, and / or the second slot is connected to an end surface of the second frame close to one end of the first frame.

[0007] In one embodiment, the first antenna unit provided on the first frame includes a first substrate and a first antenna pattern provided on the first substrate, the first substrate is connected to the first frame, and the first antenna pattern corresponds to the first slot; the second antenna unit provided on the second frame includes a second substrate and a second antenna pattern provided on the second substrate, the second substrate is connected to the second frame, and the second antenna pattern corresponds to the second slot.

[0008] In one embodiment, there are multiple wireless signal sending modules on the first frame, and there are multiple wireless signal receiving modules on the second frame, and the wireless signal sending modules on the first frame correspond one-to-one to the wireless signal receiving modules on the second frame.

[0009] In one embodiment, there are multiple wireless signal sending modules, at least one wireless signal receiving module is arranged on the first frame, and at least one wireless signal sending module is arranged on the second frame, and the wireless signal receiving module arranged on the first frame corresponds to the wireless signal sending module arranged on the second frame.

[0010] In one embodiment, a third slot is provided on the first frame, and the second antenna unit provided on the first frame is installed at the third slot; a fourth slot is provided on the second frame, and the first antenna unit provided on the second frame is installed at the fourth slot.

[0011] In one embodiment, the second antenna unit provided on the first frame includes a third substrate and a third antenna pattern provided on the third substrate, the third substrate is connected to the first frame, and the third antenna pattern corresponds to the third slot; the first antenna unit provided on the second frame includes a fourth substrate and a fourth antenna pattern provided on the fourth substrate, the fourth substrate is connected to the second frame, and the fourth antenna pattern corresponds to the fourth slot.

[0012] In one embodiment, the third slot is connected to an end surface of the first frame close to one end of the second frame, and / or the fourth slot is connected to an end surface of the second frame close to one end of the first frame.

[0013] The beneficial effects of the utility model are:

[0014] This millimeter wave digital isolator transmits data signals through a millimeter wave antenna, achieving complete isolation of high and low voltage domains. There is no interconnection between the high and low voltage domains, and there is no risk of high voltage damaging the low voltage domain chip through the conductor, which is conducive to ensuring the service life of the millimeter wave digital isolator.

[0015] In millimeter-wave digital isolators, the physical connection between chips is eliminated, so there is no reliability issue with the physical connection, and the difficulty of production and processing is reduced.

[0016] This millimeter wave digital isolator utilizes millimeter wave transmission, and the transmission rate can reach Gbps, which can meet the growing signal communication quality requirements.

[0017] The first frame / the second frame can be customized according to the first antenna unit / the second antenna unit, which helps to eliminate the influence of the conventional frame on the signal transmission performance.

[0018] The slot design on the frame corresponding to the antenna unit can effectively improve the impact of the frame on the antenna unit, which is beneficial to improving the performance of the antenna unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the structure of the millimeter wave digital isolator of the utility model;

[0021] Figure 2 This is a schematic diagram of the internal structure of the millimeter wave digital isolator according to the first embodiment of the present utility model;

[0022] Figure 3 This is the insertion loss simulation test result diagram of the existing millimeter wave digital isolator;

[0023] Figure 4 This is a diagram showing the insertion loss simulation test results of the millimeter wave digital isolator according to the first embodiment of the utility model;

[0024] Figure 5 This is a schematic diagram of the internal structure of the millimeter wave digital isolator according to the second embodiment of the present utility model.

[0025] Description of Figure Numbers:

[0026] 1. first frame; 11. first slot; 12. third slot;

[0027] 2. second frame; 21. second slot; 22. fourth slot;

[0028] 3. Encapsulation body;

[0029] 4. wireless signal transmission module; 41. first chip; 42. first antenna unit; 421. first substrate; 422. first antenna pattern; 423. fourth substrate; 424. fourth antenna pattern;

[0030] 5. Wireless signal receiving module; 51. Second chip; 52. Second antenna unit; 521. Second substrate; 522. Second antenna pattern; 523. Third substrate; 524. Third antenna pattern. DETAILED DESCRIPTION

[0031] The purpose, features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0035] In addition, if the meaning of "and / or" appears in the full text is to include three parallel solutions, taking "and / or" as an example, it includes solutions, or solutions, or solutions that are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0036] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] Embodiment 1

[0038] Please refer to Figures 1 to 4 , Embodiment 1 of the present utility model is: Figure 1 and Figure 2 As shown, a millimeter wave digital isolator includes a first frame 1, a second frame 2 and a packaging body 3 covering the first frame 1 and the second frame 2, wherein an isolation gap is provided between the first frame 1 and the second frame 2, and preferably, a main body of the first frame 1 and a main body of the second frame 2 are coplanarly arranged.

[0039] The millimeter wave digital isolator also includes a plurality of wireless signal transmission modules 4 and a plurality of wireless signal receiving modules 5, the number of the wireless signal transmission modules 4 is equal to the number of the wireless signal receiving modules 5 and the two are arranged in a one-to-one correspondence, at least one wireless signal transmission module 4 is arranged on the first frame 1, at least one wireless signal receiving module 5 is arranged on the second frame 2, the wireless signal transmission module 4 includes an electrically connected first chip 41 and a first antenna unit 42, the wireless signal receiving module 5 includes an electrically connected second chip 51 and a second antenna unit 52, the first antenna unit 42 cooperates with the second antenna unit 52 to perform wireless data transmission; the first frame 1 is provided with a first slot 11, the first antenna unit 42 is arranged at the first slot 11, the second frame 2 is provided with a second slot 21, the second antenna unit 52 is arranged at the second slot 21. Optionally, the first antenna unit 42 / the second antenna unit 52 is an end-fire antenna.

[0040] Specifically, the first antenna unit 42 provided on the first frame 1 includes a first substrate 421 and a first antenna pattern 422 provided on the first substrate 421, the first substrate 421 is connected to the first frame 1, and the first antenna pattern 422 corresponds to the first slot 11; the second antenna unit 52 provided on the second frame 2 includes a second substrate 521 and a second antenna pattern 522 provided on the second substrate 521, the second substrate 521 is connected to the second frame 2, and the second antenna pattern 522 corresponds to the second slot 21. It should be noted that the first antenna pattern 422 corresponds to the first slot 11, which means that when the millimeter wave digital isolator is viewed along the thickness direction of the first frame 1, at least a part of the first antenna pattern 422 is located in the first slot 11, and preferably the entire area of ​​the first antenna pattern 422 is located in the first slot 11. Similarly, the second antenna pattern 522 corresponds to the second slot 21, which means that when the millimeter wave digital isolator is viewed along the thickness direction of the second frame 2, at least part of the second antenna pattern 522 is located in the second slot 21, and preferably the entire area of ​​the second antenna pattern 522 is located in the second slot 21. The first substrate 421 can be an FPC board, etc., and similarly, the second substrate 521 can also be an FPC board, etc.

[0041] Optionally, the first frame 1 is in a first voltage domain, the second frame 2 is in a second voltage domain, and a voltage of the first voltage domain is different from a voltage of the second voltage domain.

[0042] For ease of processing, the first slot 11 is connected to an end surface of the first frame 1 close to one end of the second frame 2 , and / or the second slot 21 is connected to an end surface of the second frame 2 close to one end of the first frame 1 .

[0043] Optionally, the number of the wireless signal sending modules 4 on the first frame 1 is multiple, the number of the wireless signal receiving modules 5 on the second frame 2 is multiple, and the wireless signal sending modules 4 on the first frame 1 correspond to the wireless signal receiving modules 5 on the second frame 2 one by one. It is not difficult to understand that at this time, the millimeter wave digital isolator is a multi-channel millimeter wave digital isolator. For example, in this embodiment, the number of the wireless signal sending modules 4 on the first frame 1 is two, and the number of the wireless signal receiving modules 5 on the second frame 2 is two, that is, the millimeter wave digital isolator of this embodiment is a dual-channel millimeter wave digital isolator.

[0044] In other embodiments, the millimeter wave digital isolator may also be a single-channel millimeter wave digital isolator. In this case, the wireless signal sending module 4 and the wireless signal receiving module 5 are each one.

[0045] Figure 3 The figure shows the insertion loss simulation test result of the millimeter wave digital isolator in the prior art; Figure 4 FIG. 4 shows the insertion loss simulation test result of the millimeter wave digital isolator of this embodiment; FIG. Figure 3 It can be seen that the insertion loss of the existing millimeter wave digital isolator (using a conventional frame without slots) is -18.94 to -22.58 dB. Figure 4 It can be seen that the insertion loss of the millimeter wave digital isolator of this embodiment (using the frame of this embodiment, with the first slot and the second slot provided on the frame) is -11.87 to -11.46 dB. The insertion loss of the millimeter wave digital isolator of this embodiment is improved by 7 to 11 dB compared with the existing millimeter wave digital isolator.

[0046] Embodiment 2

[0047] Please refer to Figure 1 and Figure 5 Embodiment 2 of the present invention is: a millimeter wave digital isolator, comprising a first frame 1, a second frame 2 and a packaging body 3 covering the first frame 1 and the second frame 2, an isolation gap is provided between the first frame 1 and the second frame 2, and preferably, the main part of the first frame 1 and the main part of the second frame 2 are coplanarly arranged.

[0048] The millimeter wave digital isolator also includes a plurality of wireless signal transmission modules 4 and a plurality of wireless signal receiving modules 5, the number of the wireless signal transmission modules 4 is equal to the number of the wireless signal receiving modules 5 and the two are arranged in a one-to-one correspondence, at least one wireless signal transmission module 4 is arranged on the first frame 1, at least one wireless signal receiving module 5 is arranged on the second frame 2, the wireless signal transmission module 4 includes an electrically connected first chip 41 and a first antenna unit 42, the wireless signal receiving module 5 includes an electrically connected second chip 51 and a second antenna unit 52, the first antenna unit 42 cooperates with the second antenna unit 52 to perform wireless data transmission; the first frame 1 is provided with a first slot 11, the first antenna unit 42 is arranged at the first slot 11, the second frame 2 is provided with a second slot 21, the second antenna unit 52 is arranged at the second slot 21. Optionally, the first antenna unit 42 / the second antenna unit 52 is an end-fire antenna.

[0049] Specifically, the first antenna unit 42 provided on the first frame 1 includes a first substrate 421 and a first antenna pattern 422 provided on the first substrate 421, the first substrate 421 is connected to the first frame 1, and the first antenna pattern 422 corresponds to the first slot 11; the second antenna unit 52 provided on the second frame 2 includes a second substrate 521 and a second antenna pattern 522 provided on the second substrate 521, the second substrate 521 is connected to the second frame 2, and the second antenna pattern 522 corresponds to the second slot 21. It should be noted that the first antenna pattern 422 corresponds to the first slot 11, which means that when the millimeter wave digital isolator is viewed along the thickness direction of the first frame 1, at least a part of the first antenna pattern 422 is located in the first slot 11, and preferably the entire area of ​​the first antenna pattern 422 is located in the first slot 11. Similarly, the second antenna pattern 522 corresponds to the second slot 21, which means that when the millimeter wave digital isolator is viewed along the thickness direction of the second frame 2, at least part of the second antenna pattern 522 is located in the second slot 21, and preferably the entire area of ​​the second antenna pattern 522 is located in the second slot 21. The first substrate 421 can be an FPC board, etc., and similarly, the second substrate 521 can also be an FPC board, etc.

[0050] Optionally, the first frame 1 is in a first voltage domain, the second frame 2 is in a second voltage domain, and a voltage of the first voltage domain is different from a voltage of the second voltage domain.

[0051] For ease of processing, the first slot 11 is connected to an end surface of the first frame 1 close to one end of the second frame 2 , and / or the second slot 21 is connected to an end surface of the second frame 2 close to one end of the first frame 1 .

[0052] The millimeter wave digital isolator of this embodiment is a full-duplex millimeter wave digital isolator. Specifically, the number of the wireless signal transmitting modules 4 and the number of the wireless signal transmitting modules 4 are multiple respectively, at least one of the wireless signal receiving modules 5 is arranged on the first frame 1, at least one of the wireless signal transmitting modules 4 is arranged on the second frame 2, and the wireless signal receiving module 5 arranged on the first frame 1 corresponds to the wireless signal transmitting module 4 arranged on the second frame 2. In this embodiment, one of the wireless signal receiving modules 5 and one of the wireless signal transmitting modules 4 is arranged on the first frame 1, and one of the wireless signal receiving modules 5 and one of the wireless signal transmitting modules 4 is arranged on the second frame 2. The wireless signal receiving module 5 located on the first frame 1 cooperates with the wireless signal transmitting module 4 located on the second frame 2 to perform wireless data transmission, and the wireless signal transmitting module 4 located on the first frame 1 cooperates with the wireless signal receiving module 5 located on the second frame 2 to perform wireless data transmission.

[0053] In detail, a third slot 12 is provided on the first frame 1, and the second antenna unit 5 provided on the first frame 1 is installed at the third slot 12; a fourth slot 22 is provided on the second frame 2, and the first antenna unit 4 provided on the second frame 2 is installed at the fourth slot 22.

[0054] Specifically, the second antenna unit 52 provided on the first frame 1 includes a third substrate 523 and a third antenna pattern 524 provided on the third substrate 523, the third substrate 523 is connected to the first frame 1, and the third antenna pattern 524 corresponds to the third slot 12; the first antenna unit 42 provided on the second frame 2 includes a fourth substrate 423 and a fourth antenna pattern 424 provided on the fourth substrate 423, the fourth substrate 423 is connected to the second frame 2, and the fourth antenna pattern 424 corresponds to the fourth slot 22. It should be noted that the third antenna pattern 524 corresponds to the third slot 12, which means that when the millimeter wave digital isolator is viewed along the thickness direction of the first frame 1, at least a part of the third antenna pattern 524 is located in the third slot 12, and preferably the entire area of ​​the third antenna pattern 524 is located in the third slot 12. Similarly, the fourth antenna pattern 424 corresponds to the fourth slot 22, which means that when the millimeter wave digital isolator is viewed along the thickness direction of the second frame 2, at least part of the fourth antenna pattern 424 is located in the fourth slot 22, and preferably the entire area of ​​the fourth antenna pattern 424 is located in the fourth slot 22. The third substrate 523 can be an FPC board, etc., and similarly, the fourth substrate 423 can also be an FPC board, etc.

[0055] For ease of processing, the third slot 12 is connected to an end surface of the first frame 1 close to one end of the second frame 2 , and / or the fourth slot 22 is connected to an end surface of the second frame 2 close to one end of the first frame 1 .

[0056] The advantages of the millimeter-wave digital isolator of the present technical solution are as follows: from the processing aspect: no wire bonding or rewiring is required between the high and low voltage domains, wireless transmission is fully realized, and manufacturing cost and processing difficulty are reduced; from the performance aspect: a. The high voltage domain and the low voltage domain are completely isolated, without physical connection, and there is no risk of high voltage damaging the low voltage domain chip through the conductor, achieving true voltage-resistant isolation; b. Millimeter-wave transmission is not constrained by conductors, and the transmission rate is as high as Gbps; from the reliability aspect: no wire bonding or rewiring is required between the high and low voltage domains, and data transmission is completely realized through millimeter-wave transceiver, eliminating the hidden risks caused by the stress of the physical connection between high and low voltage; in addition, the millimeter-wave digital isolator can increase the number of digital isolator channels by increasing the number of slots on the frame and the number of antenna units as needed, and the transceiver direction can be customized according to the package to achieve more channels and more transceiver directions.

[0057] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A millimeter wave digital isolator, characterized in that: It includes a first frame, a second frame and a packaging body covering the first frame and the second frame, and there is an isolation gap between the first frame and the second frame; it also includes a plurality of wireless signal sending modules and a plurality of wireless signal receiving modules, the number of the wireless signal sending modules is equal to the number of the wireless signal receiving modules and the two are arranged in a one-to-one correspondence, at least one wireless signal sending module is arranged on the first frame, and at least one wireless signal receiving module is arranged on the second frame, the wireless signal sending module includes an electrically connected first chip and a first antenna unit, the wireless signal receiving module includes an electrically connected second chip and a second antenna unit, and the first antenna unit cooperates with the second antenna unit to perform wireless data transmission; the first frame is provided with a first slot, and the first antenna unit is arranged at the first slot, and the second frame is provided with a second slot, and the second antenna unit is arranged at the second slot.

2. The millimeter wave digital isolator according to claim 1, characterized in that: The first frame is in a first voltage domain, the second frame is in a second voltage domain, and a voltage of the first voltage domain is different from a voltage of the second voltage domain.

3. The millimeter wave digital isolator according to claim 1, characterized in that: The first slot is connected to an end surface of the first frame close to one end of the second frame, and / or the second slot is connected to an end surface of the second frame close to one end of the first frame.

4. The millimeter wave digital isolator according to claim 1, characterized in that: The first antenna unit disposed on the first frame includes a first substrate and a first antenna pattern disposed on the first substrate, the first substrate is connected to the first frame, and the first antenna pattern corresponds to the first slot; The second antenna unit disposed on the second frame includes a second substrate and a second antenna pattern disposed on the second substrate, the second substrate is connected to the second frame, and the second antenna pattern corresponds to the second slot.

5. The millimeter wave digital isolator according to claim 1, characterized in that: There are multiple wireless signal sending modules on the first frame, and there are multiple wireless signal receiving modules on the second frame. The wireless signal sending modules on the first frame correspond one to one with the wireless signal receiving modules on the second frame.

6. The millimeter wave digital isolator according to claim 1, characterized in that: There are multiple wireless signal sending modules, at least one wireless signal receiving module is arranged on the first frame, at least one wireless signal sending module is arranged on the second frame, and the wireless signal receiving module arranged on the first frame corresponds to the wireless signal sending module arranged on the second frame.

7. The millimeter wave digital isolator according to claim 6, characterized in that: A third slot is provided on the first frame, and the second antenna unit provided on the first frame is installed at the third slot; a fourth slot is provided on the second frame, and the first antenna unit provided on the second frame is installed at the fourth slot.

8. The millimeter wave digital isolator according to claim 7, characterized in that: The second antenna unit disposed on the first frame includes a third substrate and a third antenna pattern disposed on the third substrate, the third substrate is connected to the first frame, and the third antenna pattern corresponds to the third slot; The first antenna unit disposed on the second frame includes a fourth substrate and a fourth antenna pattern disposed on the fourth substrate, the fourth substrate is connected to the second frame, and the fourth antenna pattern corresponds to the fourth slot.

9. The millimeter wave digital isolator according to claim 8, characterized in that: The third slot is connected to an end surface of the first frame close to one end of the second frame, and / or the fourth slot is connected to an end surface of the second frame close to one end of the first frame.

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