Warped wafer substrate test chuck

Abstract

The utility model provides a warping wafer substrate test chuck, and belongs to the technical field of wafer processing. The warping wafer substrate test chuck comprises a panel, a sealing plate, a connecting plate and a bottom plate. The surface of one side of the panel is a negative pressure adsorption surface; the panel is provided with an annular negative pressure groove, a negative pressure adsorption hole and at least two air exhaust channels; from the center of the back surface of the panel to the edge direction, one or a plurality of adjacent annular negative pressure grooves are communicated with one or a plurality of air exhaust channels through communicating holes; at least two annular negative pressure adsorption areas can be formed from the center of the negative pressure adsorption face to the edge direction, and each annular negative pressure adsorption area is independently controlled by the corresponding air exhaust channel. The sealing plate is detachably connected with the panel and seals the annular negative pressure groove. According to the utility model, the warping wafer substrate can be completely tiled and adsorbed on the negative pressure adsorption surface, and the subsequent electrical parameter test stability and the result consistency can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a warped wafer substrate testing chuck. Background Art

[0002] In semiconductor technology, wafer substrate refers to the basic material used in the manufacture of electronic components such as transistors and integrated circuits, also known as "substrate material". It is the support plate of semiconductor components, has electrical properties, and can withstand various treatments in the process such as heating, cooling, corrosion and mechanical pressure. In addition to the common silicon wafers, wafer substrates also include sapphire, aluminum nitride, silicon carbide and gallium arsenide. Depending on the quality of different materials, the manufactured semiconductor components also have different performance and uses.

[0003] Due to factors such as materials and processing technology, some wafer substrates will be warped. When the warped wafer substrate is adsorbed and fixed using the existing test chuck, there is a defect of poor adsorption and fixing effect, resulting in poor electrical parameter test stability and result consistency. Utility Model Content

[0004] The utility model provides a warped wafer substrate test chuck to solve the problem that the existing test chuck has a poor adsorption and fixing effect when adsorbing and fixing the warped wafer substrate, resulting in poor stability and consistency of electrical parameter tests. The utility model redesigns the position and connection relationship of the exhaust channel, the annular negative pressure groove, and the negative pressure adsorption hole on the panel, so that at least two annular negative pressure adsorption areas can be formed from the center of the negative pressure adsorption surface to the edge direction, and each annular negative pressure adsorption area is independently controlled by the corresponding exhaust channel, so that the warped wafer substrate can be gradually adsorbed from the inside to the outside or from the outside to the inside when placed on the negative pressure adsorption surface, until the wafer substrate is completely flatly adsorbed on the negative pressure adsorption surface, and the stability and consistency of the subsequent electrical parameter tests are guaranteed.

[0005] The technical solution adopted by the utility model is:

[0006] A warped wafer substrate testing chuck, comprising:

[0007] A panel, one side surface of the panel is a negative pressure adsorption surface; a plurality of annular negative pressure grooves arranged in a concentric circle manner are provided on the back of the panel; a plurality of negative pressure adsorption holes are provided at the bottom of each annular negative pressure groove; each of the negative pressure adsorption holes penetrates to the negative pressure adsorption surface; starting from the circumferential side wall of the panel, there are at least two exhaust channels in the panel; the exhaust channels, as well as the exhaust channels and the annular negative pressure grooves and the negative pressure adsorption holes do not directly intersect; from the center of the back of the panel to the edge, one or a plurality of adjacent annular negative pressure grooves are connected to one or more exhaust channels through a connecting hole; at least two annular negative pressure adsorption areas can be formed from the center of the negative pressure adsorption surface to the edge, and each annular negative pressure adsorption area is independently controlled by the corresponding exhaust channel;

[0008] A sealing plate, the sealing plate being located on the back of the panel; the sealing plate is detachably connected to the panel and closes the annular negative pressure groove;

[0009] A connecting plate, the connecting plate is located on the back of the panel and is detachably connected to the panel;

[0010] A bottom plate is detachably connected to the connecting plate.

[0011] Furthermore, an annular oil drain groove is provided near the edge of the negative pressure adsorption surface.

[0012] Furthermore, the air extraction channel is in a straight line shape.

[0013] Furthermore, the panel has four exhaust channels; the negative pressure adsorption surface has four annular negative pressure adsorption areas; each exhaust channel controls a corresponding annular negative pressure adsorption area.

[0014] Furthermore, at least two annular installation grooves arranged in a concentric circle are provided on the back side of the panel; the bottom of each annular installation groove is provided with the annular negative pressure groove, and is matched with the sealing plate.

[0015] Furthermore, each of the annular mounting grooves corresponds to one of the annular negative pressure adsorption areas.

[0016] Furthermore, the negative pressure adsorption hole is in the form of a stepped hole, and the diameter of the portion close to the negative pressure adsorption surface is smaller than the diameter of the remaining portion.

[0017] The beneficial effects of the utility model are:

[0018] In the utility model, the positions and connection relationships of the exhaust channel, the annular negative pressure groove and the negative pressure adsorption holes on the panel are redesigned, so that at least two annular negative pressure adsorption areas can be formed from the center of the negative pressure adsorption surface to the edge direction, and each annular negative pressure adsorption area is independently controlled by the corresponding exhaust channel, so that when the warped wafer substrate is placed on the negative pressure adsorption surface, it can be gradually adsorbed from the inside to the outside or from the outside to the inside until the wafer substrate is completely flatly adsorbed on the negative pressure adsorption surface, and the stability of subsequent electrical parameter tests and the consistency of results can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 FIG. 4 is a front view of a warped wafer substrate test chuck according to an embodiment.

[0021] Figure 2 FIG. 1 is a top view of a warped wafer substrate test chuck according to an embodiment.

[0022] Figure 3 Schematic diagram of the three-dimensional structure of the warped wafer substrate test chuck in the embodiment.

[0023] Figure 4 for Figure 1 Schematic diagram of the cross-sectional structure along the AA axis.

[0024] Figure 5 for Figure 1 Schematic diagram of the cross-sectional structure along the BB axis.

[0025] Figure 6 Schematic diagram of the three-dimensional structure of the panel in this embodiment.

[0026] Figure 7 Schematic diagram of the combined structure of the panel and the sealing plate in this embodiment.

[0027] Figure 8 A schematic diagram of the operation of placing a smiley face warped wafer substrate (the middle part of the wafer substrate is concave) on a test chuck.

[0028] Fig. 9 A schematic diagram of the working process of placing a crying face warped wafer substrate (the middle part of the wafer substrate is raised) on a test chuck.

[0029] The accompanying drawings are marked as follows:

[0030] 100- panel, 200- connection plate, 300- base plate, 400- wafer substrate, 500- sealing plate;

[0031] 110 - negative pressure adsorption surface, 111 - annular oil drain groove, 120 - annular negative pressure groove, 121 - negative pressure adsorption hole, 130 - air extraction channel, 131 - communicating hole, 132 - air extraction port, 140 - annular mounting groove. DETAILED DESCRIPTION

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] The disclosure below provides many different embodiments or examples to implement different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present invention.

[0034] The embodiments of the utility model are described in detail below with reference to the accompanying drawings.

[0035] Figure 1 FIG. 4 is a front view of a warped wafer substrate test chuck according to an embodiment. Figure 2 FIG. 1 is a top view of a warped wafer substrate test chuck according to an embodiment. Figure 3 3D schematic diagram of the warped wafer substrate test chuck in the embodiment. Figures 1 to 3 As shown in , the warped wafer substrate test chuck includes a panel 100, a connecting plate 200 and a base plate 300. Along the thickness direction of the warped wafer substrate test chuck, the panel 100, the connecting plate 200 and the base plate 300 are detachably connected in sequence to form a whole. Among them, the panel 100 is mainly used to fix the wafer substrate 400. The connecting plate 200 is used to ensure the flatness of the panel 100 and the fixed wafer substrate 400. The base plate 300 is mainly used to connect with other equipment.

[0036] Figure 6 3D structure diagram of the panel in this embodiment. Figure 2 and attached Figure 6As shown in , the panel 100 is roughly in the shape of a circular plate, and one side surface of the panel 100 is a negative pressure adsorption surface 110. The negative pressure adsorption surface 110 is mainly used to carry the wafer substrate 400. An annular oil drain groove 111 is provided near the edge of the negative pressure adsorption surface 110. A plurality of annular negative pressure grooves 120 arranged in a concentric manner are provided on the back side of the panel 100 (i.e., the side opposite to the negative pressure adsorption surface 110). A plurality of roughly evenly arranged negative pressure adsorption holes 121 are provided at the bottom of each annular negative pressure groove 120 along the circumferential direction. Each negative pressure adsorption hole 121 is connected to the negative pressure adsorption surface 110. Therefore, a group of annular negative pressure adsorption holes arranged in a concentric manner can also be seen from the negative pressure adsorption surface 110. Figure 5 for Figure 1 Schematic diagram of the cross-sectional structure along the BB axis. Figure 7 100 is a schematic diagram of the combined structure of the panel and the sealing plate in this embodiment. A sealing plate 500 is also provided on the back of the panel 100. Figure 5 and attached Figure 7 As shown in . The sealing plate 500 is detachably connected to the panel 100 by countersunk screws or the like. After the sealing plate 500 is combined with the panel 100, the notch of the annular negative pressure groove 120 is closed. At least two straight through exhaust channels 130 are provided on the circumferential side wall of the panel 100 in a direction parallel to the diameter direction of the panel 100. The exhaust channel 130 does not directly intersect with any negative pressure adsorption hole 121 or any annular negative pressure groove 120 (not directly connected to each other). The exhaust channels 130 also do not directly intersect with each other (not directly connected to each other). From the center of the back side of the panel 100 to the edge, one or multiple adjacent annular negative pressure grooves 120 are connected to one or more exhaust channels 130 through a connecting hole 131. Therefore, a plug is used to seal one end of the exhaust channel 130, and then the exhaust port 132 of the exhaust channel 130 is used to exhaust air, which will cause negative pressure to be generated in the corresponding annular negative pressure groove 120 and the negative pressure adsorption hole 121. After the warped wafer liner 400 is placed on the negative pressure adsorption surface 110, the corresponding part of the wafer liner 400 is adsorbed. When the exhaust channel 130 is connected with different annular negative pressure grooves 120, at least two annular negative pressure adsorption areas can be formed from the center of the negative pressure adsorption surface 110 to the edge direction, and each annular negative pressure adsorption area is independently controlled by the corresponding exhaust channel 130. Among them, the innermost annular negative pressure adsorption area is circular, and is collectively referred to as annular negative pressure adsorption area together with the rest.

[0037] As attached Figure 6 As shown in FIG, 14 annular negative pressure grooves 120 are provided on the back of the panel 100, which are numbered K1, K2, K3, K4, K5, K6, K7, K8, K9, K10, K11, K12, K13 and K14 from the center. Figure 4 for Figure 1 AA section structure diagram. Figure 4 As shown in the figure, there are four exhaust channels 130 on the panel 100, which are numbered Q1, Q2, Q3 and Q4. Among them, Q1 is connected with K1, K2, K3, K4, K5 and K6. Q2 is connected with K7 and K8. Q3 is connected with K9 and K10. Q4 is connected with K11, K12, K13 and K14. As a result, four annular negative pressure adsorption areas with outer diameters of 4 inches, 5 inches, 6 inches and 8 inches are formed from the center of the negative pressure adsorption surface 110 to the edge. Figure 8 The following is a schematic diagram of the working process of placing a smiley face warped wafer substrate (the middle part of the wafer substrate is concave) on a test chuck. Figure 8 As shown in the figure, when the smiley face warped wafer substrate is placed on the negative pressure adsorption surface 110, the exhaust channel 130 numbered Q1 corresponding to the 4-inch annular negative pressure adsorption area starts to evacuate, and then the corresponding annular negative pressure grooves 120 and negative pressure adsorption holes 121 numbered K1~K4 generate negative pressure and suck the middle area of ​​the wafer substrate 400, and then the exhaust channels 130 numbered Q2~Q4 are exhausted in turn, and the 5-inch, 6-inch and 8-inch annular negative pressure adsorption areas gradually adsorb the corresponding parts of the wafer substrate 400 until the wafer substrate 400 is completely flatly adsorbed on the negative pressure adsorption surface 110, and the stability of subsequent electrical parameter tests and the consistency of results are guaranteed. Fig. 9 This is a schematic diagram of the work of placing a crying face warped wafer substrate (the middle part of the wafer substrate is raised) on a test chuck. Fig. 9 As shown in the figure, the edge portion of the wafer substrate 400 is first adsorbed by the 8-inch annular negative pressure adsorption area, and then the corresponding portion of the wafer substrate 400 is gradually adsorbed by the 6-inch, 5-inch and 4-inch annular negative pressure adsorption areas in sequence, until the wafer substrate 400 is completely flatly adsorbed on the negative pressure adsorption surface 110, and the stability of subsequent electrical parameter tests and the consistency of results are guaranteed.

[0038] In this embodiment, the position and connection relationship of the vacuum channel, annular negative pressure groove and negative pressure adsorption holes on the panel are redesigned, so that at least two annular negative pressure adsorption areas can be formed from the center of the negative pressure adsorption surface to the edge direction, and each annular negative pressure adsorption area is independently controlled by the corresponding vacuum channel, so that when the warped wafer substrate is placed on the negative pressure adsorption surface, it can be gradually adsorbed from the inside to the outside or from the outside to the inside until the wafer substrate is completely flatly adsorbed on the negative pressure adsorption surface, and the stability of subsequent electrical parameter tests and the consistency of results can be guaranteed.

[0039] In this embodiment, at least two annular mounting grooves 140 arranged in a concentric manner are provided on the back side of the panel 100. Among them, the innermost annular mounting groove 140 can be annular or circular, and are collectively referred to as annular mounting grooves 140. An annular negative pressure groove 120 arranged in a concentric manner is provided on the bottom of each annular mounting groove 140. The number of sealing plates 500 is the same as the number of annular mounting grooves 140, and the shapes are similar. A sealing plate 500 is detachably provided in each annular mounting groove 140. The inner diameter, outer diameter and thickness of the sealing plate 500 are the same as or slightly smaller than the inner diameter, outer diameter and groove depth of the corresponding annular mounting groove 140. As shown in the attached figure Figure 5 As shown in , four annular mounting grooves 140 are provided on the back of the panel 100. Correspondingly, the number of the sealing plates 500 is also four. The sealing plate 500 is detachably arranged in the corresponding annular mounting groove 140 to close the notch of the annular negative pressure groove 120 therein. Compared with the method in which a single sealing plate seals all the annular negative pressure grooves as a whole, the sealing plate is decomposed into multiple parts in this embodiment, and the annular negative pressure groove in each annular mounting groove is sealed separately, thereby overcoming the defects of poor sealing effect caused by overall deformation of the sealing plate, and improving the sealing performance. Furthermore, each annular mounting groove 140 corresponds to an annular negative pressure adsorption area, and the annular negative pressure groove 120 in the annular mounting groove 140 is connected to one or more exhaust channels 130, so as to avoid mutual interference between the exhaust channels and between the annular negative pressure grooves and between the annular negative pressure adsorption areas.

[0040] In this embodiment, each negative pressure adsorption hole 121 is in the form of a step hole, and the diameter of the portion close to the negative pressure adsorption surface 110 is smaller than the diameter of the remaining portion. In this embodiment, the negative pressure adsorption hole in the form of a step hole can improve the adsorption effect. For example, the negative pressure adsorption hole 121 is designed to be composed of two cylindrical channels with different diameters.

[0041] In this embodiment, the connecting plate 200 and the bottom plate 300 are roughly in the shape of circular plates with the same diameter as the panel 100, and can be detachably connected by countersunk screws or the like.

[0042] It should be noted that the air extraction channel in this embodiment is designed to be linear in order to reduce processing costs and processing difficulty. If cost and processing difficulty are not considered, air extraction channels of other shapes, such as an "S"-shaped air extraction channel, may also be applicable.

Claims

1. A warped wafer substrate test chuck, characterized in that: include: A panel, one side surface of the panel is a negative pressure adsorption surface; a plurality of annular negative pressure grooves arranged in a concentric circle are provided on the back of the panel; a plurality of negative pressure adsorption holes are provided at the bottom of each annular negative pressure groove; each of the negative pressure adsorption holes penetrates the negative pressure adsorption surface; the panel has at least two exhaust channels starting from the circumferential side wall; the exhaust channels, and the exhaust channels, the annular negative pressure grooves, and the negative pressure adsorption holes do not directly intersect each other; From the center of the back of the panel to the edge, one or more adjacent annular negative pressure grooves are connected to one or more exhaust channels through a connecting hole; at least two annular negative pressure adsorption areas can be formed from the center of the negative pressure adsorption surface to the edge, and each annular negative pressure adsorption area is independently controlled by the corresponding exhaust channel; A sealing plate, the sealing plate being located on the back of the panel; the sealing plate is detachably connected to the panel and closes the annular negative pressure groove; A connecting plate, the connecting plate is located on the back of the panel and is detachably connected to the panel; A bottom plate is detachably connected to the connecting plate.

2. The warped wafer substrate test chuck according to claim 1, characterized in that: An annular oil drain groove is provided near the edge of the negative pressure adsorption surface.

3. The warped wafer substrate test chuck according to claim 1, characterized in that: The air extraction channel is in a straight line shape.

4. The warped wafer substrate test chuck according to claim 1, characterized in that: The panel is provided with four said air extraction channels; the negative pressure adsorption surface is provided with four said annular negative pressure adsorption areas; each said air extraction channel controls a corresponding said annular negative pressure adsorption area.

5. The warped wafer substrate test chuck according to any one of claims 1 to 4, characterized in that: At least two annular installation grooves arranged in a concentric circle are provided on the back of the panel; the bottom of each annular installation groove is provided with the annular negative pressure groove and is matched with the sealing plate.

6. The warped wafer substrate test chuck according to claim 5, characterized in that: Each of the annular mounting grooves corresponds to one of the annular negative pressure adsorption areas.

7. The warped wafer substrate test chuck according to any one of claims 1 to 4 and 6, characterized in that: The negative pressure adsorption hole is in the form of a step hole, and the diameter of the portion close to the negative pressure adsorption surface is smaller than the diameter of the remaining portion.

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