Wafer box water gap cutting machine

Abstract

The utility model discloses a wafer box water gap cutting machine which comprises a machine cabinet, the top of the machine cabinet is connected with a table board in a bolting mode, the top of the table board is connected with an electric sliding table A in a bolting mode, and the top of the electric sliding table A is connected with a supporting plate in a bolting mode. A user can start the electric sliding table A, so that the electric sliding table A drives the laser cutting head to move longitudinally through the supporting plate. And then the electric sliding table B is started, so that the electric sliding table B drives the laser cutting head to transversely move. And then the electric sliding table C is started, the electric sliding table B drives the laser cutting head to move up and down, and therefore the laser cutting head can be effectively and conveniently driven to move in the three-axis mode. A user can place the wafer box between the two barrier strips, and then the air cylinder A is started, so that the air cylinder A drives the mounting block and the rubber pad to clamp the wafer box. And meanwhile, the air cylinder B can be started to drive the clamping blocks to clamp the wafer box again, so that the clamping stability of the wafer box can be effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of cutting machines, in particular to a wafer box nozzle cutting machine. Background Art

[0002] Wafer cassettes play a vital role in semiconductor production and are mainly used to place and transport wafers.

[0003] At present, the Chinese utility model with the announcement number CN217258096U discloses a high-efficiency water nozzle cutting machine, including a base, a fixed blade head, a movable blade head, a rotating rod, a mobile rod, a shaft rod and a reference block; the rotating rod is connected to the shaft rod; the rotating rod is perpendicular to the shaft rod; the reference block is provided with a through hole; the mobile rod is inserted in the through hole; the movable blade head is fixedly arranged at the bottom end of the mobile rod; the fixed blade head is provided with convex positions on both sides; the movable blade head is provided with grooves matching the convex positions on both sides. The device has advantages that existing products do not have, such as high positioning accuracy, high processing efficiency and low defective rate of processed products.

[0004] However, the existing wafer box nozzle cutting machine cannot effectively drive the laser cutting head to move in three axes, and cannot effectively improve the stability of wafer box clamping. In order to solve the above problems, we provide a wafer box nozzle cutting machine. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer box nozzle cutting machine to solve the problems raised by the above-mentioned background technology.

[0006] The above technical purpose of the utility model is achieved through the following technical scheme: a wafer box nozzle cutting machine, including a cabinet, a table top bolted to the top of the cabinet, an electric slide A bolted to the top of the table top, a support plate bolted to the top of the electric slide A, a cross plate bolted to one side of the support plate, an electric slide B bolted to the front of the cross plate, an electric slide C bolted to the front of the electric slide B, and a laser cutting head is provided on the front of the electric slide C.

[0007] Adopting the above technical solution: the user can start the electric slide A, so that the electric slide A drives the laser cutting head to move longitudinally through the support plate. Then start the electric slide B, so that the electric slide B drives the laser cutting head to move horizontally. Then start the electric slide C, so that the electric slide B drives the laser cutting head to move up and down, so as to effectively drive the laser cutting head to move in three axes. The user can place the wafer box between the two baffles, and then start the cylinder A, so that the cylinder A drives the mounting block and the rubber pad to clamp the wafer box. At the same time, the cylinder B can also be started, so that the cylinder B drives the clamping block to clamp the wafer box again, so as to effectively improve the stability of the wafer box clamping.

[0008] The utility model is further configured that brackets are bolted to both sides of the top of the table top, a cylinder A is bolted to the top of the bracket, and a mounting block is bolted to the telescopic end of the cylinder A.

[0009] By adopting the above technical solution, the rubber pad can be effectively installed by providing the installation block.

[0010] The utility model is further configured that a cylinder B is bolted inside the bracket, and a clamping block is bolted at the telescopic end of the cylinder B.

[0011] By adopting the above technical solution, the wafer box can be effectively clamped by providing a clamping block.

[0012] The utility model is further configured that a rubber pad is provided on one side of the mounting block, and one side of the rubber pad is bolted to the mounting block.

[0013] By adopting the above technical solution, the rubber pad is provided to effectively protect the wafer box.

[0014] The utility model is further configured that a side plate is bolted to one side of the transverse plate, and a sliding block is bolted to the bottom of the side plate.

[0015] By adopting the above technical solution, the horizontal plate can be effectively supported by arranging the side plates.

[0016] The utility model is further configured that the bottom of the sliding block is slidably connected to a sliding rail, and the bottom of the sliding rail is bolted to the table top.

[0017] By adopting the above technical solution, the slide rail is provided so as to be effectively used in conjunction with the slider.

[0018] The utility model is further configured that baffles are provided on both sides of the top of the cabinet, and the bottom of the baffles is bolted to the table top.

[0019] By adopting the above technical solution, the blocking bar can be effectively used in conjunction with the wafer box.

[0020] The utility model is further configured such that a cabinet door A is hingedly connected to the front of the cabinet via a hinge, and a cabinet door B is hingedly connected to one side of the cabinet via a hinge.

[0021] By adopting the above technical solution: by providing cabinet door A and cabinet door B, it is possible to effectively facilitate the maintenance of the device.

[0022] The utility model is further configured that universal wheels are bolted to both sides of the bottom of the cabinet, and the universal wheels are equipped with lockers.

[0023] By adopting the above technical solution, the device can be easily moved by arranging universal wheels.

[0024] The utility model is further configured that a mounting frame is bolted to the front of the electric slide C, and the interior of the mounting frame is sleeved with the laser cutting head.

[0025] By adopting the above technical solution, the laser cutting head can be effectively installed by providing a mounting frame.

[0026] In summary, the utility model has the following beneficial effects:

[0027] 1. The user can start the electric slide A, so that the electric slide A drives the laser cutting head to move longitudinally through the support plate. Then start the electric slide B, so that the electric slide B drives the laser cutting head to move horizontally. Then start the electric slide C, so that the electric slide B drives the laser cutting head to move up and down, so as to effectively drive the laser cutting head to move in three axes;

[0028] 2. The user can place the wafer box between the two baffles, and then start cylinder A, so that cylinder A drives the mounting block and rubber pad to clamp the wafer box. At the same time, cylinder B can also be started, so that cylinder B drives the clamping block to clamp the wafer box again, thereby effectively improving the stability of the wafer box clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0030] Figure 2 This utility model Figure 1 A partial enlarged view of point A in the middle.

[0031] Figure numerals: 1. cabinet; 2. table top; 3. electric slide A; 4. support plate; 5. cross plate; 6. electric slide B; 7. electric slide C; 8. laser cutting head; 9. bracket; 10. cylinder A; 11. mounting block; 12. cylinder B; 13. clamping block; 14. rubber pad; 15. side panel; 16. slider; 17. slide rail; 18. stop bar; 19. cabinet door A; 20. cabinet door B; 21. universal wheel; 22. mounting frame. DETAILED DESCRIPTION

[0032] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0033] Embodiment 1:

[0034] refer to Figure 1 and Figure 2A wafer box nozzle cutting machine includes a cabinet 1, a table board 2 is bolted to the top of the cabinet 1, an electric slide A3 is bolted to the top of the table board 2, a support plate 4 is bolted to the top of the electric slide A3, a cross plate 5 is bolted to one side of the support plate 4, an electric slide B6 is bolted to the front of the cross plate 5, an electric slide C7 is bolted to the front of the electric slide B6, and a laser cutting head 8 is arranged on the front of the electric slide C7. The user can start the electric slide A3 to drive the laser cutting head 8 to move longitudinally through the support plate 4. Then start the electric slide B6 to drive the laser cutting head 8 to move horizontally. Then start the electric slide C7 to drive the laser cutting head 8 to move up and down, so that it can effectively drive the laser cutting head 8 to move in three axes.

[0035] refer to Figure 1 , brackets 9 are bolted to both sides of the top of the table top 2, a cylinder A10 is bolted to the top of the bracket 9, and a mounting block 11 is bolted to the telescopic end of the cylinder A10. By providing the mounting block 11, the rubber pad 14 can be effectively installed.

[0036] refer to Figure 1 The inside of the support 9 is bolted with a cylinder B12, and the telescopic end of the cylinder B12 is bolted with a clamping block 13. By providing the clamping block 13, the wafer box can be effectively clamped.

[0037] refer to Figure 1 A rubber pad 14 is provided on one side of the mounting block 11, and one side of the rubber pad 14 is bolted to the mounting block 11. By providing the rubber pad 14, the wafer box can be effectively protected.

[0038] refer to Figure 1 A side plate 15 is bolted to one side of the transverse plate 5, and a slider 16 is bolted to the bottom of the side plate 15. By arranging the side plate 15, the transverse plate 5 can be effectively supported.

[0039] refer to Figure 1 The bottom of the slide block 16 is slidably connected with a slide rail 17, and the bottom of the slide rail 17 is bolted to the table top 2. By arranging the slide rail 17, the slide block 16 can be effectively used.

[0040] Brief description of the use process: The user can start the electric slide A3, so that the electric slide A3 drives the laser cutting head 8 to move longitudinally through the support plate 4. Then start the electric slide B6, so that the electric slide B6 drives the laser cutting head 8 to move horizontally. Then start the electric slide C7, so that the electric slide B6 drives the laser cutting head 8 to move up and down, so that it can effectively drive the laser cutting head 8 to move in three axes.

[0041] Embodiment 2:

[0042] refer to Figure 1and Figure 2 , brackets 9 are bolted to both sides of the top of the table 2, cylinder A10 is bolted to the top of the bracket 9, and mounting blocks 11 are bolted to the telescopic end of cylinder A10. The user can place the wafer box between the two baffles 18, and then start the cylinder A10, so that the cylinder A10 drives the mounting blocks 11 and the rubber pads 14 to clamp the wafer box. At the same time, the cylinder B12 can also be started, so that the cylinder B12 drives the clamping block 13 to clamp the wafer box again, thereby effectively improving the stability of the wafer box clamping.

[0043] refer to Figure 1 , both sides of the top of the cabinet 1 are provided with baffles 18, and the bottom of the baffles 18 is bolted to the table 2. By providing the baffles 18, the wafer box can be effectively used.

[0044] refer to Figure 1 The front of the cabinet 1 is hinged with a cabinet door A19, and one side of the cabinet 1 is hinged with a cabinet door B20. By providing the cabinet door A19 and the cabinet door B20, it is possible to effectively facilitate the maintenance of the device.

[0045] refer to Figure 1 Universal wheels 21 are bolted to both sides of the bottom of the cabinet 1, and lockers are installed on the universal wheels 21. By providing the universal wheels 21, the device can be easily moved.

[0046] refer to Figure 1 The front of the electric slide C7 is bolted with a mounting frame 22, and the interior of the mounting frame 22 is sleeved with the laser cutting head 8. By providing the mounting frame 22, the laser cutting head 8 can be effectively installed.

[0047] Brief description of the use process: The user can place the wafer box between the two stop bars 18, and then start the cylinder A10, so that the cylinder A10 drives the mounting block 11 and the rubber pad 14 to clamp the wafer box. At the same time, the cylinder B12 can be started, so that the cylinder B12 drives the clamping block 13 to clamp the wafer box again, thereby effectively improving the stability of the wafer box clamping.

[0048] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A wafer box nozzle cutting machine, comprising a cabinet (1), characterized in that: The top of the cabinet (1) is bolted to a table top (2), the top of the table top (2) is bolted to an electric slide A (3), the top of the electric slide A (3) is bolted to a support plate (4), one side of the support plate (4) is bolted to a cross plate (5), the front of the cross plate (5) is bolted to an electric slide B (6), the front of the electric slide B (6) is bolted to an electric slide C (7), and the front of the electric slide C (7) is provided with a laser cutting head (8).

2. The wafer box nozzle cutting machine according to claim 1, characterized in that: Brackets (9) are bolted to both sides of the top of the table top (2), a cylinder A (10) is bolted to the top of the bracket (9), and a mounting block (11) is bolted to the telescopic end of the cylinder A (10).

3. A wafer box nozzle cutting machine according to claim 2, characterized in that: The interior of the bracket (9) is bolted with a cylinder B (12), and the telescopic end of the cylinder B (12) is bolted with a clamping block (13).

4. The wafer box nozzle cutting machine according to claim 2, characterized in that: A rubber pad (14) is provided on one side of the mounting block (11), and one side of the rubber pad (14) is bolted to the mounting block (11).

5. The wafer box nozzle cutting machine according to claim 1, characterized in that: A side plate (15) is bolted to one side of the transverse plate (5), and a sliding block (16) is bolted to the bottom of the side plate (15).

6. The wafer box nozzle cutting machine according to claim 5, characterized in that: The bottom of the sliding block (16) is slidably connected to a sliding rail (17), and the bottom of the sliding rail (17) is bolted to the table top (2).

7. The wafer box nozzle cutting machine according to claim 1, characterized in that: Baffles (18) are provided on both sides of the top of the cabinet (1), and the bottom of the baffles (18) is bolted to the table top (2).

8. The wafer box nozzle cutting machine according to claim 1, characterized in that: The front of the cabinet (1) is hingedly connected to a cabinet door A (19) via a hinge, and one side of the cabinet (1) is hingedly connected to a cabinet door B (20) via a hinge.

9. The wafer box nozzle cutting machine according to claim 1, characterized in that: Universal wheels (21) are bolted to both sides of the bottom of the cabinet (1), and the universal wheels (21) are equipped with locks.

10. The wafer box nozzle cutting machine according to claim 1, characterized in that: A mounting frame (22) is bolted to the front of the electric slide C (7), and the interior of the mounting frame (22) is sleeved with the laser cutting head (8).

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