Backlight module capable of improving diffusivity
By setting up an elongated transparent packaging box and diffusion layer on the LED light of the backlight module and using a green quantum dot film, the problem of uneven light and darkness of traditional backlight modules is solved, achieving uniform diffusion of light and improving product competitiveness.
Patent Information
- Application Number
- CN202420415445.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-04
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-03-04
AI Technical Summary
Traditional backlight modules have uneven light and darkness due to the concentration of LED lights, which reduces the competitiveness of the product.
By setting an elongated transparent packaging box on the LED lamp and setting a diffusion layer and a green quantum dot film on the outer surface of the packaging box, the light of the LED lamp is evenly diffused by using the diffusion layer and the quantum dot film.
It realizes uniform diffusion of LED lights, avoids the problem of uneven light and darkness, and improves the display effect and competitiveness of the product.
Smart Images
Figure CN222672102U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to a backlight module with improved diffusion capability. Background Art
[0002] The traditional backlight module provides light source by setting multiple LED lamps on the light incident side of the light guide plate. However, since the light emission of the LED lamp is more concentrated, the emitted light is brighter near the light source of the LED lamp and dimmer between adjacent LED lamps, resulting in uneven brightness during display, which reduces the competitiveness of the product. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to improve the diffusion effect of LED lights and avoid the occurrence of uneven brightness and darkness.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] In order to solve the above technical problems, the utility model provides a backlight module with improved diffusion capability, which includes a lower frame, a reflective sheet, a light guide plate and an optical film group which are sequentially stacked from bottom to top, the lower frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is arranged on the side wall, a plurality of sequentially arranged LED lamps are arranged on the FPC, the LED lamps are blue light LED lamps, the blue light LED lamps are encapsulated by an encapsulation colloid, the encapsulation colloid is filled with KSF phosphor, a plurality of the LED lamps are aligned with the light incident side of the light guide plate, a long strip transparent encapsulation box is arranged on the plurality of the LED lamps, the long strip transparent encapsulation box completely covers all the LED lamps, a diffusion layer is arranged on the outer surface of the encapsulation box, and a green quantum dot film is arranged on the diffusion layer.
[0006] As a preferred implementation of the backlight module with improved diffusion capability provided by the utility model, the packaging box is a lampshade.
[0007] As a preferred implementation of the backlight module with improved diffusion capability provided by the utility model, the diffusion layer is a diffusion film.
[0008] As a preferred embodiment of the backlight module with improved diffusion capability provided by the utility model, the FPC includes a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.
[0009] As a preferred embodiment of the backlight module with improved diffusion capability provided by the utility model, the FPC also includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a thermal conductive layer in contact with the circuit layer and the metal heat dissipation layer.
[0010] As a preferred implementation of the backlight module with improved diffusion capability provided by the utility model, a heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
[0011] As a preferred implementation of the backlight module with improved diffusion capability provided by the utility model, the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wavy structure or a honeycomb structure.
[0012] As a preferred embodiment of the backlight module with improved diffusion capability provided by the utility model, a two-dimensional code laser area is provided on the upper surface of the FPC, and a black ink layer and a white ink layer provided on the black ink layer are provided on the upper surface of the FPC located on the two-dimensional code laser area, and a two-dimensional code is formed on the white ink layer by laser.
[0013] As a preferred embodiment of the backlight module with improved diffusion capability provided by the utility model, the thickness of the black ink layer is 30 μm. ～ 40μm.
[0014] As a preferred embodiment of the backlight module with improved diffusion capability provided by the utility model, the thickness of the white ink layer is 10 μm. ～ 20μm.
[0015] The utility model has the following beneficial effects:
[0016] Since a long transparent packaging box is provided on multiple LED lamps, the long transparent packaging box completely covers all the LED lamps, and a diffusion layer is provided on the outer surface of the packaging box, the light emitted by the LED lamp first passes through the long transparent packaging box and then diffuses through the diffusion layer, so that the emitted light is uniform before entering the light guide plate, thereby making the emitted light more uniform, thereby improving the competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1A schematic structural diagram of a backlight module with improved diffusion capability provided by the utility model.
[0019] Figure 2 for Figure 1 Top view of the FPC and LED lights.
[0020] Figure 3 This is a schematic diagram of the structure of Example 2.
[0021] Figure 4 This is a schematic diagram of the structure of Example 3.
[0022] Description of Figure Numbers:
[0023] Lower frame 1; reflector 2; light guide plate 3; optical film group 4; bottom plate 11; side wall 12; FPC 5; LED lamp 6; packaging box 7; diffusion layer 8;
[0024] Base material layer 51; circuit layer 52; metal heat dissipation layer 53; through hole 54;
[0025] Black ink layer 501; white ink layer 502. DETAILED DESCRIPTION
[0026] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0028] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0029] The utility model provides a backlight module with improved diffusion capability, which comprises a lower frame, a reflective sheet, a light guide plate and an optical film group which are sequentially stacked from bottom to top, the lower frame comprises a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is arranged on the side wall, a plurality of sequentially arranged LED lamps are arranged on the FPC, the LED lamps are blue light LED lamps, the blue light LED lamps are encapsulated by an encapsulation colloid, KSF phosphor is filled in the encapsulation colloid, a plurality of the LED lamps are aligned with the light incident side of the light guide plate, a long strip transparent encapsulation box is arranged on the plurality of the LED lamps, the long strip transparent encapsulation box completely covers all the LED lamps, a diffusion layer is arranged on the outer surface of the encapsulation box, and a green quantum dot film is arranged on the diffusion layer.
[0030] Since a long transparent packaging box is provided on multiple LED lamps, the long transparent packaging box completely covers all the LED lamps, and a diffusion layer is provided on the outer surface of the packaging box, the light emitted by the LED lamp first passes through the long transparent packaging box and then diffuses through the diffusion layer, so that the emitted light is uniform before entering the light guide plate, thereby making the emitted light more uniform, thereby improving the competitiveness of the product.
[0031] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0032] Example 1
[0033] See also Figure 1 and Figure 2, a backlight module with improved diffusion capability provided by the utility model, comprising a lower frame 1, a reflective sheet 2, a light guide plate 3 and an optical film group 4 which are sequentially stacked from bottom to top, the lower frame 1 comprising a bottom plate 11 and a side wall 12 extending upward from the edge of the bottom plate 11, an FPC 5 is arranged on the side wall 12, a plurality of sequentially arranged LED lamps 6 are arranged on the FPC 5, the LED lamp 6 is a blue light LED lamp 6, the blue light LED lamp 6 is encapsulated by an encapsulating colloid, the encapsulating colloid is filled with KSF phosphor, the plurality of LED lamps 6 are aligned with the light incident side of the light guide plate 3, a long strip transparent encapsulating box 7 is arranged on the plurality of LED lamps 6, the long strip transparent encapsulating box 7 completely covers all the LED lamps 6, a diffusion layer 8 is arranged on the outer surface of the encapsulating box 7, and a green quantum dot film is arranged on the diffusion layer 8. Since a long transparent packaging box 7 is arranged on the multiple LED lamps 6, the long transparent packaging box 7 completely covers all the LED lamps 6, and a diffusion layer 8 is arranged on the outer surface of the packaging box 7, the light emitted by the LED lamp 6 first passes through the long transparent packaging box 7 and then diffuses through the diffusion layer 8, so that the emitted light is uniform before entering the light guide plate 3, thereby making the emitted light more uniform, thereby improving the competitiveness of the product.
[0034] The blue light emitted by the blue LED lamp 6 passes through the KSF phosphor to produce red light. The emitted light enters the green quantum dot film after passing through the diffusion layer 8, thereby exciting the green light. All the light can be mixed to produce white light. Since only the green quantum dot film is used, the green light it excites will not be absorbed, and its luminous efficiency is higher, which increases its brightness by more than 20% compared with the ordinary quantum dot backlight module; and because of the high luminous efficiency, the green powder content in the green quantum dot film can be set lower, and the particle size of the green quantum dot film is smaller than that of the red quantum dot film, so the cadmium content can meet the EU standard of 100ppm; the green quantum dot film is set on the diffusion layer 8, and its manufacturing process is mature, the manufacturing cost is low, and the yield is high. The distribution of the green quantum dot film can be intermittent, and it can be set as needed according to actual conditions.
[0035] Furthermore, the packaging box 7 is a lampshade. Preferably, the lampshade can also be used to package each LED lamp 6 separately.
[0036] Furthermore, the diffusion layer 8 is a diffusion membrane.
[0037] Example 2
[0038] See also Figure 3As a further optimization scheme of Example 1, in this embodiment, the FPC5 includes a substrate layer 51, a circuit layer 52 arranged on the upper surface of the substrate layer 51, and a metal heat dissipation layer 53 arranged on the lower surface of the substrate layer 51. The arrangement method can be that the circuit layer 52 and the metal heat dissipation layer 53 are respectively attached to the substrate layer 51 by double-sided adhesive. Since the thickness of the substrate layer 51 is relatively thin, the heat on the FPC5 can be diffused to the metal heat dissipation layer 53 through the substrate layer 51. The metal heat dissipation layer 53 can effectively increase the heat dissipation area of the FPC5 and play a role in uniform heat dissipation, thereby improving the heat dissipation efficiency of the FPC5. The substrate layer 51 can be any one of polyimide, polyester, polysulfone or polytetrafluoroethylene, the double-sided adhesive is any one of an acrylic adhesive layer or an epoxy resin adhesive layer, and the metal heat dissipation layer 53 can be a copper foil layer.
[0039] Furthermore, the FPC 5 further includes at least one through-hole 54 penetrating the substrate layer 51, the circuit layer 52 and the metal heat dissipation layer 53, and the inner wall of the through-hole 54 is provided with a heat-conducting layer in contact with the circuit layer 52 and the metal heat dissipation layer 53. By utilizing the good thermal conductivity of the through-hole 54, the circuit layer 52 and the metal heat dissipation layer 53 on both sides of the substrate layer 51 can be electrically connected to play a good thermal conductivity function, and the thermal conductive layer can provide a thermal conductive function to achieve a good heat dissipation effect. Among them, the thermal conductive layer can be a copper glue conductive ink layer.
[0040] Furthermore, a heat conductor connected to an external heat-conducting structure is disposed in the through hole 54. The heat conductor is connected to the external heat-conducting structure from one side of the circuit layer 52 and is also in contact with the heat-conducting layer in the through hole 54, so that the circuit layer 52 and the metal heat dissipation layer 53 can be connected to the external heat-conducting structure through the through hole 54, so that the heat in the FPC 5 is diffused to the external heat-conducting structure through the heat conductor in the through hole 54, so as to further improve the heat dissipation efficiency of the FPC 5. Preferably, in order to enable the through hole 54 to be connected to the external heat-conducting structure, the through hole 54 is disposed at the edge of the FPC 5.
[0041] Furthermore, the metal heat dissipation layer 53 is a uniform heat dissipation structure, and its structure can be any one of a mesh structure, a strip structure, a wavy structure or a honeycomb structure. Through the uniform heat dissipation structure, the heat dissipation effect can be better improved.
[0042] Example 3
[0043] See also Figure 4As a further optimization scheme of Example 1, in this embodiment, a two-dimensional code laser area is further provided on the upper surface of FPC5, and a black ink layer 501 and a white ink layer 502 provided on the black ink layer 501 are provided on the upper surface of FPC5 located on the two-dimensional code laser area, and a two-dimensional code is formed on the white ink layer 502 by laser. Since two layers of ink are provided, the black ink layer 501 and the white ink layer 502, the surface white ink layer 502 is lasered off by laser, exposing the bottom black ink layer 501, and the area where the laser is lasered is displayed as black. The two-dimensional code generated in this way has a good contrast effect and is easy to scan. At the same time, the two-dimensional code will not fall off and be damaged, which prevents the two-dimensional code from being invalid, and greatly reduces the labor cost.
[0044] Furthermore, the thickness of the black ink layer 501 is 30 μm. ～ 40μm. The thickness of the white ink layer 502 is 10μm ～ 20μm. This thickness is the thickness that the commonly used ultraviolet laser can just penetrate, and there is no dust around after the laser irradiation, which has the advantages of high rhythm and efficiency. The reason why the thickness of the lower black ink layer 501 is thicker than the thickness of the upper white ink layer 502 is to avoid laser power energy fluctuations and prevent the black ink layer 501 from being penetrated by the laser and causing damage to the internal layer of FPC5.
[0045] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0046] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A backlight module with improved diffusion capability, characterized in that: It includes a lower frame, a reflective sheet, a light guide plate and an optical film group which are stacked in sequence from bottom to top, the lower frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is arranged on the side wall, a plurality of sequentially arranged LED lamps are arranged on the FPC, the LED lamps are blue light LED lamps, the blue light LED lamps are encapsulated by an encapsulation colloid, the encapsulation colloid is filled with KSF fluorescent powder, a plurality of the LED lamps are aligned with the light incident side of the light guide plate, a long strip transparent encapsulation box is arranged on the plurality of LED lamps, the long strip transparent encapsulation box completely covers all the LED lamps, a diffusion layer is arranged on the outer surface of the encapsulation box, and a green quantum dot film is arranged on the diffusion layer.
2. The backlight module with improved diffusion capability according to claim 1, characterized in that: The packaging box is a lampshade.
3. The backlight module with improved diffusion capability according to claim 1, characterized in that: The diffusion layer is a diffusion membrane.
4. The backlight module with improved diffusion capability according to claim 1, characterized in that: The FPC includes a substrate layer, a circuit layer disposed on an upper surface of the substrate layer, and a metal heat dissipation layer disposed on a lower surface of the substrate layer.
5. The backlight module with improved diffusion capability according to claim 4, characterized in that: The FPC further includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and an inner wall of the through-hole is provided with a heat-conducting layer in contact with the circuit layer and the metal heat dissipation layer.
6. The backlight module with improved diffusion capability according to claim 5, characterized in that: A heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
7. The backlight module with improved diffusion capability according to claim 4, characterized in that: The structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.
8. The backlight module with improved diffusion capability according to claim 1, characterized in that: A two-dimensional code laser area is arranged on the upper surface of the FPC, a black ink layer and a white ink layer arranged on the black ink layer are arranged on the upper surface of the FPC located on the two-dimensional code laser area, and a two-dimensional code is formed on the white ink layer by laser.
9. The backlight module with improved diffusion capability according to claim 8, characterized in that: The thickness of the black ink layer is 30 μm ～ 40μm.
10. The backlight module with improved diffusion capability according to claim 8, characterized in that: The thickness of the white ink layer is 10 μm ～ 20μm.