Electronic device

By designing the connection part and colloid in electronic devices, connecting the folded circuit board with the target edge of the frame together, the problem of damage to the flexible circuit board during impact is solved, and a more stable connection and stronger overall strength of the equipment is achieved.

CN222672554UActive Publication Date: 2025-03-25LENOVO (BEIJING) LTD
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Patent Information

Application Number
CN202421238535.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-31
Publication Date
2025-03-25
Estimated Expiration
2034-05-31

AI Technical Summary

Technical Problem

In existing electronic devices, flexible circuit boards are susceptible to impact and squeeze by the frame when the device falls or impacts, resulting in damage to the wiring layer in the screen and affecting the display function.

Method used

An electronic device is designed, which includes a frame, a display screen, a connection portion and a colloid. The receptacle cavity is formed by a connecting part between the circuit board and the target edge of the frame, and a colloid is provided in the accommodating cavity, and the folded circuit board, the display screen, the target edge of the frame and the glass cover plate are connected together to avoid the mutual force under impact and provide a buffering effect.

Benefits of technology

It effectively avoids damage to the display screen by the flexible circuit board under impact, improves the connection stability between the circuit board and the surrounding structure, enhances the overall strength of the electronic equipment, and ensures the display effect of the display screen.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a frame body, a display screen, a connecting part and colloid, the display screen comprises a glass cover plate, a screen body and a circuit board, a first surface of the screen body is fixed to the glass cover plate, and the screen body is in lap joint with the edge of the frame body through the glass cover plate; the circuit board extends out of the screen body and is folded to a second surface, opposite to the first surface, of the screen body; the connecting part is located between the circuit board and a target edge of the frame body, and the connecting part, the target edge and one end, extending out of the circuit board, of the glass cover plate form an accommodating cavity; and the colloid is positioned in the accommodating cavity and is used for fixing the folded circuit board and the display screen.
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Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] Electronic products such as mobile phones and tablets are becoming increasingly thinner and lighter, and their borders are becoming narrower and narrower.

[0003] At present, the flexible circuit board of the screen in the device is led out from the wiring layer of the screen to the inside of the device and connected to the driver IC. Once the device falls, the flexible circuit board will be impacted and squeezed by the frame, which will exert force on the screen, causing damage to the wiring layer in the screen and affecting the display function. Utility Model Content

[0004] The present application provides an electronic device, which includes

[0005] Frame;

[0006] A display screen, the display screen comprising a glass cover plate, a screen body and a circuit board, wherein a first surface of the screen body is fixed to the glass cover plate, and the screen body is overlapped with an edge of the frame through the glass cover plate; the circuit board extends out of the screen body and is folded to a second surface of the screen body opposite to the first surface;

[0007] A connecting portion, the connecting portion is located between the circuit board and the target edge of the frame, and the connecting portion, the target edge, and an end of the glass cover extending out of the circuit board form a receiving cavity;

[0008] A colloid is located in the accommodating cavity and is used to fix the folded circuit board and the display screen.

[0009] In some modified implementations of the first aspect of the present application, in the aforementioned electronic device, the target edge of the frame includes:

[0010] a first step, wherein the first step is used to overlap with the glass cover plate;

[0011] a target platform, the target platform being used to connect with the connecting portion;

[0012] or,

[0013] The target edge of the frame includes:

[0014] A top surface, the top surface is used for overlapping the glass cover plate;

[0015] A target platform is used to connect with the connecting part.

[0016] In some modified implementations of the first aspect of the present application, the aforementioned electronic device, wherein the folded circuit board is fixed by the colloid, and the width of the target shielding area on the glass cover corresponding to the target edge is close to the width of the shielding area on the glass cover corresponding to the non-target edge;

[0017] or,

[0018] The folded circuit board is fixed by the colloid, and the width of the target shielding area on the glass cover corresponding to the target edge is equal to the width of the shielding area on the glass cover corresponding to the non-target edge.

[0019] In some modified implementations of the first aspect of the present application, in the aforementioned electronic device, the colloid comprises:

[0020] A first colloid, the first colloid is located in a first space between the upper surface of the folded circuit board and the lower surface of the glass cover plate, and a second space formed by turning over the lower surface of the folded circuit board;

[0021] a second colloid, the second colloid is located in the remaining space of the accommodating cavity except the first space and the second space, the first colloid is different from the second colloid, the first colloid is used to fix the folded circuit board, and the second colloid is used to provide a buffer for the fixed folded circuit board; or

[0022] The colloid includes a third colloid, and the third colloid is located in the containing cavity.

[0023] In some modified implementations of the first aspect of the present application, in the aforementioned electronic device, the second colloid can change from a liquid state to a semi-solid state, and when the second colloid is in a semi-solid state, it has elasticity;

[0024] The third colloid can change from a liquid state to a semi-solid state. When the third colloid is in the semi-solid state, it has elasticity.

[0025] In some modified implementations of the first aspect of the present application, in the aforementioned electronic device, the second colloid and the third colloid are silicone gels.

[0026] In some modified implementations of the first aspect of the present application, in the aforementioned electronic device, the target platform has a glue injection hole, and the glue injection hole corresponds to and is connected to the accommodating cavity;

[0027] The electronic device further comprises a sealing member, and the sealing member seals the glue injection hole.

[0028] In some modified implementations of the first aspect of the present application, in the aforementioned electronic device, the connecting portion is a frame structure, and the circumferential periphery of the connecting portion cooperates with the frame to form an annular accommodating cavity.

[0029] In some modified implementations of the first aspect of the present application, in the aforementioned electronic device, the accommodating cavity is annular and arranged around the circumference of the frame; or,

[0030] The accommodating cavity includes a first cavity, a second cavity and a third cavity, wherein the first cavity and the second cavity extend from two ends of the third cavity to the same side of the third cavity respectively, so as to at least surround the edge of the folded circuit board toward the outside of the frame.

[0031] In some modified implementations of the first aspect of the present application, in the aforementioned electronic device, an edge of the glass cover is sealed and bonded to an edge of the frame.

[0032] Compared with the prior art, the electronic device provided by the present application forms a receiving cavity by setting a connecting portion between the circuit board and the target edge of the frame, and sets a colloid in the receiving cavity to connect the folded circuit board, the display screen, the target edge of the frame and the cover plate together, so as to avoid the mutual force generated under the impact, and at the same time can also play a buffering role to ensure the intact function of the display screen; thereby solving the problem of the flexible circuit board in the existing equipment being affected by the impact or extrusion and affecting the function of the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0034] Figure 1 A partial cross-sectional view of the electronic device provided by this embodiment is schematically shown;

[0035] Figure 2 Another partial cross-sectional view of the electronic device provided by this embodiment is schematically shown;

[0036] Figure 3 Schematically shows Figure 2 A bottom view of the electronic device;

[0037] Figure 4 Another partial cross-sectional view of the electronic device provided by this embodiment is schematically shown;

[0038] Figure 5 The structure coordination diagram of the frame and the connecting part in the electronic device provided by this embodiment is schematically shown;

[0039] Figure 6 The structure explosion diagram of the electronic device adopted in this embodiment is schematically shown;

[0040] Description of the accompanying drawings: frame 1, partition 11, target edge 12, first step 13, target platform 14, top surface 15, glue injection hole 16, display screen 2, glass cover 21, screen body 22, circuit board 23, connecting part 3, colloid 4, first colloid 41, second colloid 42, third colloid 43, caulking glue 5, accommodating cavity 6. DETAILED DESCRIPTION

[0041] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0042] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0043] The technical solution of the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:

[0044] Example 1

[0045] Reference Figure 1 The electronic device provided in the embodiment of the present application includes a frame 1, a display screen 2, a connecting portion 3 and a colloid 4; the display screen 2 includes a glass cover plate 21, a screen body 22 and a circuit board 23, the first surface of the screen body 22 is fixed to the glass cover plate 21, and the screen body 22 is overlapped with the edge of the frame 1 through the glass cover plate 21; the circuit board 23 extends out of the screen body 22 and is folded to a second surface of the screen body 22 opposite to the first surface; the connecting portion 3 is located between the circuit board 23 and the target edge of the frame 1, and the connecting portion 3, the target edge, and one end of the glass cover plate 21 extending out of the circuit board 23 form a receiving cavity 6; the colloid 4 is located in the receiving cavity 6, and is used to fix the folded circuit board 23 and the display screen 2.

[0046] Specifically, in order to solve the problem that the flexible circuit board in the existing equipment is impacted or squeezed to affect the function of the display screen, the electronic device provided in this embodiment forms a accommodating cavity 6 between the target edge of the frame 1 below the display screen 2 and the connecting portion 3, and fills the accommodating cavity 6 with a colloid 4, which can not only fix the folded circuit board 23 in the accommodating cavity 6, but also bond the display screen 2, the connecting portion 3 and the frame 1 to each other to form an integrated structure, greatly improving the connection stability between the circuit board 23 and the surrounding structure, ensuring that no relative vibration or displacement occurs during vibration or falling, thereby improving the overall strength of the electronic device and ensuring the display effect of the display screen 2.

[0047] Among them, the frame 1 is a rigid frame structure. In this embodiment, the frame 1 can be, but is not limited to, a frame arranged around its circumferential edge in the thickness direction of the electronic device, and at least part of its interior is provided with a partition 11 connected to the frame 1. One side of the partition 11 is used to support and install the display screen 2 or other electronic components, and the other side is used to set electronic components such as the motherboard (not shown in the figure). This setting can be easily understood by those skilled in the art and will not be described in detail here. The target edge of the frame 1 described in this embodiment can be, but is not limited to, the bottom edge.

[0048] The display screen 2 may be, but is not limited to, an OLED display screen or a Plastic OLED display screen; Figure 1 The display screen 2 includes a stacked glass cover plate 21, a screen body 22 and a circuit board 23; the glass cover plate 21 faces the outermost side of the electronic device and serves as a protective cover plate for the screen body 22; the screen body 22 is a white screen formed by a multi-layer glass structure, and its upper surface is in contact with the glass cover plate 21. The glass cover plate 21 can overlap with the edge or edge of the frame 1 so that the screen body 22 is placed in the frame 1; the circuit board 23 is an FPC board, which is arranged in the screen body 22 as a structural layer of the screen body 22, and one end of the FPC board extending out of the screen body 22 is flipped to the second surface of the screen body for connecting to the main board or the display chip to obtain the display signal. It can be understood that the circuit board 23 is provided with relevant wiring required for display, such as: gate line (Gate line, scan line) and source line (Source line, data line). In this embodiment, the circuit board 23 of the folded part can be set corresponding to the bottom of the electronic device, that is, the bottom of the screen body 22, that is, the position below the hand after the user holds it when using it. That is, it can be understood that the target edge of the frame 1 described in this embodiment can be but is not limited to the bottom edge.

[0049] Among them, the folded part of the circuit board 23 exists independently outside the screen body 22. When the electronic device falls or vibrates, the folded part of the circuit board 23 is easy to collide with the frame 1, affecting the transmission of the display signal. Therefore, in this embodiment, a connecting part 3 is provided. The connecting part 3 has a certain buffering property and can be but not limited to foam. Figure 1 The connecting portion 3 is arranged between the display screen 2 and the target edge, so that the end of the display screen 2 facing the target edge, the connecting portion 3, the target edge of the frame 1 and the glass cover plate 21 form a receiving cavity 6, and the folded circuit board 23 is received in the receiving cavity 6.

[0050] Among them, the colloid 4 can be an elastic colloid or a hard colloid. In this embodiment, the colloid 4 is filled in the accommodating cavity 6, so that the folded circuit board 23 can be bonded to the end of the display screen 2 facing the target edge, the connecting part 3, the target edge of the frame 1 and the glass cover 21 to form an integrated structure. Therefore, no matter whether the electronic device falls or vibrates, the folded circuit board 23 will not collide or rub against other structural parts, thereby effectively ensuring the stability of the folded circuit board 23.

[0051] According to the above, the electronic device provided by the present application forms a receiving cavity 6 by setting a connecting portion 3 between the circuit board 23 and the target edge of the frame 1, and setting a colloid 4 in the receiving cavity 6 to connect the folded circuit board 23, the display screen 2, the target edge of the frame 1 and the cover plate together, so as to avoid the mutual force generated under the impact, and at the same time can also play a buffering role to ensure the intact function of the display screen; thereby solving the problem of the flexible circuit board in the existing equipment being affected by the impact or extrusion and affecting the function of the display screen.

[0052] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B, which is specifically understood as: A and B may be included at the same time, A may exist alone, or B may exist alone, and any of the above three situations may exist.

[0053] Furthermore, in the specific implementation of the electronic device provided in this embodiment, the target edge 12 of the frame 1 has at least the following configuration modes:

[0054] The first one, refer to the attached Figure 1 The target edge 12 includes a first step 13 and a target platform 14 , wherein the first step 13 is used to overlap with the glass cover plate 21 ; and the target platform 14 is used to connect with the connecting portion 3 .

[0055] Specifically, in order to achieve the overlap between the glass cover plate 21 and the frame body 1 to ensure the installation of the display screen 2 and the formation of the accommodating cavity 6, in this embodiment, a first step 13 is provided on the target edge 12 of the frame body 1 on the side facing the inside of the frame body 1, so that the edge of the glass cover plate 21 can overlap on the first step 13, and the connection is performed by bonding, which can not only increase the contact area between the glass cover plate 21 and the frame body 1 during the connection process, but also reduce the overall thickness of the device to a certain extent; the target platform 14 can be a rigid plate body in the frame body 1 that at least connects the target edge 12 and the edge adjacent thereto, and the target platform 14 can cover The entire area within the cover frame 1 may also cover a partial area, and can be designed and adjusted according to actual needs. The target platform 14 can separate the frame 1 in the thickness direction to form an upper and lower space. In this embodiment, the display screen 2, the connecting part 3 and the colloid 4 are all arranged in the space above the target platform 14. The target platform 14 serves as a carrier for the display screen 2, the connecting part 3 and the colloid 4, that is, the display screen 2 and the connecting part 3 are arranged in sequence, and the connecting part 3 is connected or fitted to the target platform 14, so that the target platform 14 and the glass cover plate 21 can cooperate between the target edge 12 and the connecting part 3 to form the aforementioned accommodating cavity 6.

[0056] In the second case, the target edge 12 of the frame 1 includes a top surface 15 and a target platform 14 , wherein the top surface 15 is used for overlapping the glass cover plate 21 ; and the target platform 14 is used for connecting with the connecting portion 3 .

[0057] Specifically, in order to simplify the structural design and installation, in this embodiment, the glass cover plate 21 is set to directly overlap the top surface of the target edge 12, and the connection method can also be bonding, which eliminates the design and processing of the first step 13, simplifies the structure, and can also expand the layout space in the frame 1. Correspondingly, the target platform 14 is the same as the aforementioned target platform 14, and will not be described in detail here.

[0058] Furthermore, in the specific implementation of the electronic device provided by this embodiment, the folded circuit board 23 is fixed by the colloid 4, and the width of the target shielding area corresponding to the target edge 12 on the glass cover plate 21 is close to the width of the shielding area corresponding to the non-target edge on the glass cover plate 21; or, the folded circuit board 23 is fixed by the colloid 4, and the width of the target shielding area corresponding to the target edge 12 on the glass cover plate 21 is equal to the width of the shielding area corresponding to the non-target edge on the glass cover plate 21.

[0059] Specifically, part of the accommodating cavity 6 appears to be a blocked area on the outside of the electronic device, and no picture is displayed. The glass cover plate 21 will also appear blocked when it cooperates with other non-target edges of the frame 1. The accommodating cavity 6 may also be formed by overlapping steps or overlapping areas. The blocked area will affect the screen-to-body ratio, that is, the display area. In order to improve the screen-to-body ratio, in this embodiment, when the folded circuit board 23 is fixed by the colloid 4, the width of the target blocked area on the glass cover plate 21 corresponding to the target edge 12 is designed to be close to or equal to the width of the blocked area on the glass cover plate 21 corresponding to the non-target edge, thereby ensuring that the circumferential frame around the display screen 2 on the electronic device is of equal width, satisfying the visual effect of ultra-narrow frame width.

[0060] Furthermore, in the specific implementation of the electronic device provided in this embodiment, the colloid is arranged in at least the following ways:

[0061] The first one, refer to the attached Figure 1 The colloid 4 includes a first colloid 41 and a second colloid 42. The first colloid 41 is located in a first space between the upper surface of the folded circuit board 23 and the lower surface of the glass cover plate 21, and a second space formed by flipping the lower surface of the folded circuit board 23; the second colloid 42 is located in the remaining space in the accommodating cavity 6 except the first space and the second space. The first colloid 41 is different from the second colloid 42. The first colloid 41 is used to fix the folded circuit board 23, and the second colloid 42 is used to provide a buffer for the fixed folded circuit board 23.

[0062] Specifically, in this embodiment, the colloid 4 can be configured to include a first colloid 41 and a second colloid 42. The first colloid 41 can be a solid hard gel, and the second colloid 42 can be a semi-solid gel with elasticity. For example, the second colloid 42 can change from a liquid state to a semi-solid state. When the second colloid is in a semi-solid state, it has elasticity and can be, but is not limited to, an organic silicone gel. The first colloid 41 can be bonded during the manufacturing process of the display screen 2. For example, before the circuit board 23 is folded, the first colloid 41 in the second space is set, and then the circuit board 23 is folded to connect with the first colloid 41 in the second space, and the folded state is maintained. Then, the first colloid 41 in the first space is set, and the fully folded circuit board 23 is fixed relative to the entire display screen 2. Then, during the overall assembly process of the electronic device, the second colloid 42 is set in the frame 1 and the display screen 2 is assembled with the frame 1. The good fluidity of the second colloid 42 when in a liquid state can fully fill the remaining space in the first space, and provide a certain elasticity to achieve buffering.

[0063] The second type, refer to the attached Figure 2The colloid 4 includes a third colloid 43 , and the third colloid 43 is located in the accommodating cavity 6 .

[0064] Specifically, in order to simplify the design and assembly, in this embodiment, the colloid 4 can be set to include only one colloid, namely the third colloid 43. The third colloid 43 can be, but is not limited to, a colloid that can be changed from a liquid state to a semi-solid state. When the third colloid 43 is in a semi-solid state, it has elasticity, for example: silicone gel; the third colloid 43 has good fluidity when in a liquid state, and can fully fill the accommodating cavity 6, including the aforementioned first space and second space. The third colloid 43 can still maintain elasticity after solidification, providing a buffer for the folded circuit board 23.

[0065] It can be understood that the second colloid 42 and the third colloid 43 can be arranged around the display screen 2 or can be arranged separately corresponding to the first space.

[0066] Furthermore, corresponding to the arrangement of the colloid 4 cooperating with the frame 1 and the connecting portion 3, this embodiment has at least the following modes:

[0067] The first one, refer to the attached Figure 2 and attached Figure 4 In the electronic device provided in this embodiment, in a specific implementation, the target platform 14 has a glue injection hole 16, and the glue injection hole 16 corresponds to and is connected to the accommodating cavity 6; the electronic device also includes a sealing member 17, and the sealing member 17 seals the glue injection hole 16.

[0068] Specifically, the target platform 14 is provided with a glue injection hole 16, and the size, shape and number of the glue injection hole 16 can be designed and adjusted according to actual needs, for example: Figure 3 , a glue injection hole 16 can be set at both ends of the corresponding target edge 12; after the display screen 2 is overlapped and bonded to the frame 1, the target platform 14 injects glue into the accommodating cavity 6, which neither affects the overlap of the display screen 2 and the frame 1, nor produces a cavity defect outside the device. At the same time, in order to ensure the stable arrangement of the colloid 4 in the accommodating cavity 6, a sealing member 17 can also be set in this embodiment to block the glue injection hole 16, that is, the glue injection hole 16 on the side of the target platform 14 away from the accommodating cavity 6 is blocked and sealed. The sealing member 17 can be, but is not limited to, a tape, a Mylar film, etc.

[0069] The second type: refer to the attached Figure 5 and attached Figure 6 The connection 3 is a frame structure, and the circumferential periphery of the connection part 3 cooperates with the frame 1 to form an annular accommodating cavity 6.

[0070] Specifically, in this setting mode, the connection part 3 is arranged around the display screen 2. When the display screen 2 and the frame 1 are assembled, the colloid 4 can be directly set at the position of the frame 1 corresponding to the accommodating cavity 6, and then the display screen 2 is directly bonded to the frame 1 as a whole. In this process, the display screen 2 is glued at the four corners and the edges, and the colloid 4 is used to achieve connection installation with the frame 1 and reinforce shock absorption. In this setting mode, the connection part 3 can cooperate with the colloid 4 to achieve shock absorption.

[0071] Furthermore, in the electronic device provided in this embodiment, in a specific implementation, the accommodating cavity 6 is annular, and the accommodating cavity 6 is arranged around the circumference of the frame body 1; or the accommodating cavity 6 includes a first cavity (not shown in the figure), a second cavity (not shown in the figure) and a third cavity (not shown in the figure), and the first cavity and the second cavity respectively extend from two ends of the third cavity to the same side of the third cavity, so as to at least surround the edge of the folded circuit board 23 toward the outside of the frame body 1.

[0072] Specifically, in order to improve the strength of the electronic device and ensure that the folded circuit board 23 will not be damaged when it falls, the accommodating cavity 6 formed by the connecting portion 3, the frame 1 and the glass cover 21 in this embodiment can be set for the folded circuit board 23 alone, or can be set indiscriminately for the entire electronic device. For example, when it is set only for the folded circuit board 23, the connecting portion 3 can be set only parallel to the target edge 12 of the frame 1 and extend to a position completely flush with both ends of the target edge 12. At this time, it can be understood that the accommodating cavity 6 only includes the third cavity; the connecting portion 3 can also be kept parallel to the target On the premise of the edge 12, it extends in the direction away from the target edge 12, thereby forming a U-shaped distribution, and cooperates with the frame 1 to form a U-shaped accommodating cavity 6, that is, the first cavity, the second cavity and the third cavity exist at the same time; of course, when the connecting part 3 is set only for the folded circuit board 23, it is necessary to cooperate with the setting of the sealing cut-off position to ensure the integrity and sealing of the accommodating cavity 6, and then in this embodiment, the connecting part 3 can also be set as a circumferentially closed frame, and then cooperate with the frame 1 to form a circumferentially closed accommodating cavity 6, which can reduce the difficulty of setting the accommodating cavity 6 on the premise of fixing the folded circuit board 23.

[0073] Further, see Attachment Figure 6 In the electronic device provided in this embodiment, in a specific implementation, the edge of the glass cover plate 21 is sealed and bonded to the edge of the frame 1 .

[0074] Specifically, in order to ensure the appearance and service life of the whole device, in this embodiment, the edge of the glass cover plate 21 and the edge of the frame body 1 are set to be sealed and bonded, that is, a sealant is set on the first step 13 or the top surface 15 to seal and bond with the glass cover plate 21, and the sealant forms a caulking glue 5 after curing; for example, a colloid is used to seal and bond the two to achieve caulking, and the caulking glue 5 can be a full circle around the display screen 2, or it can be as follows Figure 6 As shown, the camera module is avoided to form a U-shaped caulking adhesive bonding form.

[0075] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: Frame; A display screen, the display screen comprising a glass cover plate, a screen body and a circuit board, wherein a first surface of the screen body is fixed to the glass cover plate, and the screen body is overlapped with an edge of the frame through the glass cover plate; the circuit board extends out of the screen body and is folded to a second surface of the screen body opposite to the first surface; A connecting portion, the connecting portion is located between the circuit board and the target edge of the frame, and the connecting portion, the target edge, and an end of the glass cover extending out of the circuit board form a receiving cavity; A colloid is located in the accommodating cavity and is used to fix the folded circuit board and the display screen.

2. The electronic device according to claim 1, characterized in that: The target edge of the frame includes: a first step, wherein the first step is used to overlap with the glass cover plate; a target platform, the target platform being used to connect with the connecting portion; or, The target edge of the frame includes: A top surface, the top surface is used for overlapping the glass cover plate; A target platform is used to connect with the connecting part.

3. The electronic device according to claim 2, characterized in that: The folded circuit board is fixed by the colloid, and the width of the target shielding area on the glass cover corresponding to the target edge is close to the width of the shielding area on the glass cover corresponding to the non-target edge; or, The folded circuit board is fixed by the colloid, and the width of the target shielding area on the glass cover corresponding to the target edge is equal to the width of the shielding area on the glass cover corresponding to the non-target edge.

4. The electronic device according to claim 1, characterized in that: The colloid comprises: A first colloid, the first colloid is located in a first space between the upper surface of the folded circuit board and the lower surface of the glass cover plate, and a second space formed by turning over the lower surface of the folded circuit board; a second colloid, the second colloid is located in the remaining space of the accommodating cavity except the first space and the second space, the first colloid is different from the second colloid, the first colloid is used to fix the folded circuit board, and the second colloid is used to provide a buffer for the fixed folded circuit board; or The colloid includes a third colloid, and the third colloid is located in the containing cavity.

5. The electronic device according to claim 4, characterized in that: The second colloid can change from a liquid state to a semi-solid state, and when the second colloid is in the semi-solid state, it has elasticity; The third colloid can change from a liquid state to a semi-solid state. When the third colloid is in the semi-solid state, it has elasticity.

6. The electronic device according to claim 5, characterized in that: The second colloid and the third colloid are organic silicon gel.

7. The electronic device according to claim 2, characterized in that: The target platform has a glue injection hole, and the glue injection hole corresponds to and is connected with the accommodating cavity; The electronic device further comprises a sealing member, which seals the glue injection hole.

8. The electronic device according to claim 1, characterized in that: The connecting portion is a frame structure, and the circumferential periphery of the connecting portion cooperates with the frame to form an annular accommodating cavity.

9. The electronic device according to claim 1 or 8, characterized in that: The accommodating cavity is annular and arranged around the circumference of the frame; or, The accommodating cavity includes a first cavity, a second cavity and a third cavity, wherein the first cavity and the second cavity extend from two ends of the third cavity to the same side of the third cavity respectively, so as to at least surround the edge of the folded circuit board toward the outside of the frame.

10. The electronic device according to claim 1, characterized in that: The edge of the glass cover plate is sealed and bonded to the edge of the frame.