Chip testing device and system

Abstract

The utility model provides a chip testing device and system, and relates to the technical field of chip testing, the chip testing device comprises a chip screening machine and a chip testing machine, the chip screening machine and the chip testing machine are in communication connection through a communication cable, the chip screening machine is provided with a plurality of chip clamps, and the chip clamps are connected with the chip testing machine. A plurality of chip testing stations are arranged on the chip testing machine, the chip clamps and the chip testing stations are arranged in a one-to-one correspondence mode and are in communication connection through testing cables, the chip clamps are used for fixing target chips, and the chip testing stations are used for testing the target chips. Compared with the prior art, the test cable and the communication cable are respectively and independently arranged, on one hand, different test schemes in the market can be compatible, on the other hand, distinguishing is easy, the cable dismounting and connecting process is simpler and more reliable, meanwhile, connection errors are not prone to occurring, verification is easy, and the accuracy of the test result is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and in particular to a chip testing device and system. Background Art

[0002] In the semiconductor chip finished product testing industry, chip testing machines and chip screening machines are usually set up as two independent devices, and the two are connected by cables for testing and communication. However, the existing test system has messy cable connections, is difficult to be compatible with different test schemes, and is prone to connection errors, affecting the test results. Utility Model Content

[0003] The purpose of the utility model is to provide a chip testing device and system, which has simple cable connection, is compatible with different testing schemes, is not prone to connection errors, is easy to verify, and ensures the accuracy of the test results.

[0004] The embodiment of the utility model is achieved as follows:

[0005] In the first aspect, the utility model provides a chip testing device, including a chip screening machine and a chip testing machine, the chip screening machine and the chip testing machine are communicatively connected via a communication cable, the chip screening machine is provided with a plurality of chip fixtures, the chip testing machine is provided with a plurality of chip testing stations, the plurality of chip fixtures are arranged in one-to-one correspondence with the plurality of chip testing stations, and are communicatively connected via test cables respectively, wherein the chip fixture is used to fix the target chip, and the chip testing station is used to test the target chip.

[0006] In an optional embodiment, the chip screening machine includes a screening machine platform and a grabbing robot arm. The screening machine platform is arranged on one side of the chip testing machine. A plurality of the chip fixtures are spaced apart on the table of the screening machine platform. The grabbing robot arm is arranged on the screening machine platform and is communicatively connected to the chip testing machine via the communication cable, so as to place the target chip into or take out the corresponding chip fixture during verification and testing.

[0007] In an optional embodiment, the chip screening machine also includes multiple recycling bucket groups, which are all located on a side of the screening machine away from the chip testing machine and are arranged one-to-one with the multiple chip fixtures. The grabbing robot arm is located between the recycling bucket group and the chip fixture, and is used to place the target chip after the test is completed into the recycling bucket group.

[0008] In an optional embodiment, each of the recycling bucket groups includes a defective bucket and a good bucket, and the defective bucket and the good bucket are both located on a side of the screening machine away from the chip testing machine, and the grabbing robot arm is also used to place the target chip tested as good into the good bucket, and place the target chip tested as defective into the defective bucket.

[0009] In an optional embodiment, the multiple chip fixtures include a first fixture and a second fixture, the multiple test stations include a first test station and a second test station, the test cables include a first cable and a second cable, the first fixture and the second fixture are arranged in parallel on the screening machine, the first fixture and the first test station are connected via the first cable, the second fixture and the second test station are connected via the second cable, and the grabbing robot arm is also used to convey the target chip to the first fixture during the verification process, and to convey the target chip to the second fixture after the target chip in the first fixture is determined to be a good product.

[0010] In an optional embodiment, the multiple chip fixtures also include a third fixture, the multiple test stations also include a third test station, the test cable also includes a third cable, the first fixture, the second fixture and the third fixture are arranged in parallel on the screening machine, the third fixture and the third test station are connected by the third cable, and the grabbing robot arm is also used to transport the target chip to the first fixture and the second fixture during the verification process, and to transport the target chip to the third fixture after the target chip in the second fixture is determined to be a good product.

[0011] In an optional embodiment, the multiple chip fixtures also include a fourth fixture, the multiple test stations also include a fourth test station, the test cable also includes a fourth cable, the first fixture, the second fixture, the third fixture and the fourth fixture are arranged in parallel on the screening machine in sequence, the fourth fixture and the fourth test station are connected through the fourth cable, and the grabbing robot arm is also used to transport the target chip to the first fixture, the second fixture and the third fixture during the verification process, and to transport the target chip to the fourth fixture after the target chip in the third fixture is determined to be a good product.

[0012] In an optional embodiment, the chip testing machine includes a testing machine and a communication module, a plurality of the testing stations are arranged in parallel on the table of the testing machine, the communication module is arranged on the testing machine and is communicatively connected with the plurality of the testing stations at the same time, and the communication module is communicatively connected with the chip screening machine via the communication cable.

[0013] In a second aspect, the utility model provides a chip testing system, comprising a packaging device and the chip testing device as described in the aforementioned embodiment, wherein the packaging device is connected to the chip screening machine and is used to package the target chip after testing.

[0014] In an optional embodiment, the packaging device includes a shipping packaging machine and a scrap packaging machine, both of which are connected to the chip screening machine, the shipping packaging machine is used to package the target chip determined to be a good product, and the scrap packaging machine is used to package the target chip determined to be a defective product.

[0015] The beneficial effects of the embodiments of the utility model include:

[0016] The chip testing device and system provided by the utility model connect the test cable and the communication cable separately, that is, the chip screening machine and the chip testing machine are communicatively connected via an external communication cable, while the multiple chip fixtures on the chip testing machine and the multiple chip testing stations on the chip testing machine are communicatively connected via the test cable. The test cable and the communication cable are set separately and independently, which can be compatible with different testing schemes on the market on the one hand, and can be easily distinguished on the other hand, so that the cable removal and connection process is simpler and more reliable, and at the same time, it is not easy to make connection errors and is easy to verify, thereby ensuring the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of the structure of a chip testing device provided by an embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of a chip testing device provided by an embodiment of the utility model in a wiring error state.

[0020] icon:

[0021] 100-chip testing device; 110-chip screening machine; 111-screening machine; 113-grabbing robot arm; 115-recovery bucket group; 130-chip testing machine; 150a-first test station; 150b-second test station; 150c-third test station; 150d-fourth test station; 170a-first clamp; 170b-second clamp; 170c-third clamp; 170d-fourth clamp; 180a-first cable; 180b-second cable; 180c-third cable; 180d-fourth cable; 190-communication cable. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0025] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0026] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0027] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] As disclosed in the background technology, the existing semiconductor chip finished product testing industry usually uses cables to communicate with chip testing machines and chip screening machines. When making specific connections, the same type of cables are usually used for connection, and multiple test stations, chip installation positions, and control devices are involved, which makes it difficult to distinguish between cables, especially for test information and control information. As a result, the existing test system is incompatible with different test solutions on the market and can only be replaced. Furthermore, the confusion of cable connections can easily lead to connection errors, and when the number of test stations is large, verification is very difficult, and it is difficult to ensure the accuracy of the test results.

[0029] In order to solve the above problems, the utility model provides a novel chip testing device and system. The specific structure and verification method of the chip testing device are introduced in detail below.

[0030] The utility model embodiment provides

[0031] Please refer to Figure 1 The present embodiment provides a chip testing device 100, which has simple cable connection, is compatible with different testing schemes, is not prone to connection errors, is easy to verify, and ensures the accuracy of the test results.

[0032] The chip testing device 100 provided in this embodiment includes a chip screening machine 110 and a chip testing machine 130, which are communicatively connected via a communication cable 190, a plurality of chip fixtures are arranged on the chip screening machine 110, and a plurality of chip testing stations are arranged on the chip testing machine 130, and the plurality of chip fixtures and the plurality of chip testing stations are arranged in a one-to-one correspondence and are communicatively connected via test cables, respectively, wherein the chip fixtures are used to fix the target chip, and the chip testing station is used to test the target chip.

[0033] It should be noted that in this embodiment, the test cable and the communication cable 190 are connected separately, that is, the chip screening machine 110 and the chip testing machine 130 are communicatively connected through the external communication cable 190, while the multiple chip fixtures on the chip testing machine 130 and the multiple chip testing stations on the chip testing machine 130 are communicatively connected through the test cable. The test cable and the communication cable are set separately and independently. On the one hand, they can be compatible with different testing schemes on the market, and on the other hand, they are easy to distinguish, making the cable removal and connection process simpler and more reliable. At the same time, it is not easy to make connection errors and is easy to verify, thereby ensuring the accuracy of the test results.

[0034] The chip screening machine 110 includes a screening machine platform 111 and a grabbing mechanical arm 113. The screening machine platform 111 is arranged on one side of the chip testing machine 130. A plurality of chip fixtures are spaced apart on the table of the screening machine platform 111. The grabbing mechanical arm 113 is arranged on the screening machine platform 111 and is connected to the chip testing machine 130 through a communication cable 190 for placing or removing the target chip from the corresponding chip fixture during the verification and testing process. Specifically, the grabbing mechanical arm 113 can realize the grabbing and placement of the target chip, and its basic structure and principle can refer to the mechanical arm structure in the prior art.

[0035] It should be noted that in this embodiment, a single grabbing robot arm 113 can be used, and the movement can be achieved through a slide rail, so that multiple chip fixtures can be adapted. Alternatively, multiple grabbing robot arms 113 can also be used here, and multiple grabbing robot arms 113 are correspondingly arranged with multiple chip fixtures, so as to respectively realize the grabbing and placement of the target chip on the corresponding chip fixture.

[0036] Furthermore, the chip screening machine 110 further includes a plurality of recycling bucket groups 115, which are all located on the side of the screening machine 111 away from the chip testing machine 130 and are arranged one-to-one with the plurality of chip fixtures, and the grabbing mechanical arm 113 is located between the recycling bucket group 115 and the chip fixture, and is used to put the target chip after the test into the recycling bucket group 115. Specifically, the recycling bucket group 115 is integrally arranged at the far end of the screening machine 111, which can avoid interference with the cable and realize the recycling of the target chip.

[0037] In this embodiment, each recycling bucket group 115 includes a defective bucket and a good bucket, both of which are located on the side of the screening machine 111 away from the chip tester 130, and the grabbing robot 113 is also used to put the target chip tested as good into the good bucket, and put the target chip tested as defective into the defective bucket. Specifically, the good bucket can also be replaced by a production tape, which can directly transport the good chips to the packaging device at the rear for packaging.

[0038] In this embodiment, the plurality of chip fixtures include a first fixture 170a, a second fixture 170b, a third fixture 170c and a fourth fixture 170d, the plurality of test stations include a first test station 150a, a second test station 150b, a third test station 150c and a fourth test station 150d, the test cable includes a first cable 180a, a second cable 180b, a third cable 180c and a fourth cable 180d, the first fixture 170a, the second fixture 170b, the third fixture 170c and the fourth fixture 170d. The first fixture 170a and the fourth fixture 170d are sequentially arranged in parallel on the screening machine 111, the first fixture 170a and the first test station 150a are connected by the first cable 180a, the second fixture 170b and the second test station 150b are connected by the second cable 180b, and the grabbing robot 113 is also used to transport the target chip to the first fixture 170a during the verification process, and transport the target chip to the second fixture 170b after the target chip in the first fixture 170a is determined to be a good product. The third fixture 170c and the third test station 150c are connected by the third cable 180c, and the grabbing robot 113 is also used to transport the target chip to the first fixture 170a and the second fixture 170b during the verification process, and transport the target chip to the third fixture 170c after the target chip in the second fixture 170b is determined to be a good product. The fourth fixture 170d and the fourth test station 150d are connected via a fourth cable 180d. The grabbing robot 113 is also used to transport the target chip to the first fixture 170a, the second fixture 170b and the third fixture 170c during the verification process, and to transport the target chip to the fourth fixture 170d after the target chip in the third fixture 170c is determined to be a good product.

[0039] In this embodiment, the chip testing machine 130 includes a testing machine and a communication module. Multiple testing stations are arranged in parallel on the table of the testing machine. The communication module is arranged on the testing machine and is communicated with multiple testing stations at the same time. The communication module is communicated with the chip screening machine 110 through a communication cable 190.

[0040] It is worth noting that the chip testing device 100 provided in this embodiment has the same testing method as conventional testing equipment. However, in actual operation, due to the need for equipment electrical performance calibration, maintenance, product transformation, etc., the test cables may not be connected as required, that is, the cable connection is wrong, resulting in abnormal test results, and unqualified materials are packed into the packaging of qualified materials and shipped to customers, thus causing serious quality problems. Figure 2 As shown, when the connection positions of the second cable 180b and the third cable 180c are incorrect, the results detected by the second test station 150b and the third test station 150c will always be defective. Therefore, the system of this embodiment needs to be verified and tested before use.

[0041] The following describes the inspection process of the chip testing device 100 in detail. Through the inspection process, the correctness of the cable connection can be verified to ensure that the connection positions of both ends of the test cable are correct. The specific process is as follows:

[0042] 1. Place a target chip with qualified appearance in the first fixture 170a. The chip tester 130 uses the first test station 150a to perform electrical performance testing, and the other test stations are closed. If and only if the test result of the first test station 150a is a good product, proceed to step 2. When the result of the first test station 150a is a defective product, the next target chip can be automatically replaced and step 1 can be repeated. The number of repeated chip replacement tests can be customized, such as 10-20 times. Because the overall yield of the finished product electrical performance test after chip packaging is greater than 90%, if the result measured by the first test station 150a is always a defective product, it means that the current first cable 180a is connected and a new test cable needs to be replaced. The defective products detected by this test step will be placed in the defective product bucket, and the good products will enter the good product bucket.

[0043] 2. Place the other two target chips with qualified appearance in the first fixture 170a and the second fixture 170b. The chip tester 130 uses the first test station 150a and the second test station 150b to perform electrical performance testing, and the other test stations are closed. If and only if the result of the second test station 150b is a good product, the third step is performed. The good products detected by the first test station 150a are placed in the good product bucket, and the defective products are placed in the defective product bucket. When the result of the second test station 150b is a defective product, the chip tester 130 automatically replaces two untested target chips and repeats the second step. The number of repeated chip replacements for testing can be customized, such as 10-20 times. Because the overall yield of the finished product electrical performance test after chip packaging is greater than 90%, if the result measured by the second test station 150b is always a defective product, it means that the current cable connection is wrong and a test cable needs to be replaced. The defective products produced by this test step will be placed in the defective product bucket, and the good products produced by the test will enter the good product bucket.

[0044] 3. Place the other three target chips with qualified appearance in the first fixture 170a, the second fixture 170b and the third fixture 170c. The chip tester 130 uses the first test station 150a, the second test station 150b and the third test station 150c to perform electrical performance testing, and the other test stations are closed. If and only if the result of the third test station 150c is a good product, perform step 4. If the result of the third test station 150c is a defective product, the chip tester 130 automatically replaces the three untested target chips and repeats step 3. The number of repeated chip replacements for testing can be customized, such as 10-20 times. Because the overall yield of the finished product electrical performance test after chip packaging is greater than 90%, if the result measured by the third test station 150c is always a defective product, it means that the current cable connection is wrong and a new test cable needs to be replaced. The defective products produced by this test step will be placed in the defective bucket, and the good products produced by the test will enter the good bucket.

[0045] 4. Place the other four untested chips with qualified appearance in the first fixture 170a, the second fixture 170b, the third fixture 170c and the fourth fixture 170d, and the chip tester 130 uses the first test station 150a, the second test station 150b, the third test station 150c and the fourth test station 150d to perform electrical performance testing. The entire foolproofing verification process ends when and only when the result of the fourth test station 150d is a good product. When the result of the fourth test station 150d is a defective product, the chip tester 130 automatically replaces the four untested chips and repeats step 4. The number of repetitions can be customized, such as 10-20 times. Because the overall yield of the finished product electrical performance test after chip packaging is greater than 90%, if the result measured by the fourth test station 150d is always a defective product, it means that the current cable connection is wrong and a new test cable needs to be replaced. The defective products produced by this test step will be placed in the defective product bucket, and the good products produced by the test will enter the good product bucket.

[0046] Through the above inspection process, when the equipment is restarted after shutdown, the cable installation status can be quickly inspected and verified, replacing the original solution of using the same single chip to inspect each station. The inspection time is greatly reduced, and the problem of verification failure caused by the original use of the same single chip for inspection is solved.

[0047] The embodiment of the utility model also provides a chip testing system, including an encapsulation device and the aforementioned chip testing device 100, the chip testing device 100, including a chip screening machine 110 and a chip testing machine 130, the chip screening machine 110 and the chip testing machine 130 are connected to each other through a communication cable 190, the chip screening machine 110 is provided with a plurality of chip fixtures, the chip testing machine 130 is provided with a plurality of chip testing stations, the plurality of chip fixtures are arranged in a one-to-one correspondence with the plurality of chip testing stations, and are respectively connected to each other through test cables, wherein the chip fixtures are used to fix the target chip, and the chip testing stations are used to test the target chip. The encapsulation device is connected to the chip screening machine 110, and is used to package the target chip after the test.

[0048] In this embodiment, the packaging device includes a shipping packaging machine and a scrap packaging machine, both of which are connected to the chip screening machine 110. The shipping packaging machine is used to package target chips determined to be good products, and the scrap packaging machine is used to package target chips determined to be defective products.

[0049] In summary, the chip testing device 100 and system provided in this embodiment connect the test cable and the communication cable 190 separately, that is, the chip screening machine 110 and the chip testing machine 130 are communicatively connected through the external communication cable 190, while the multiple chip fixtures on the chip testing machine 130 and the multiple chip testing stations on the chip testing machine 130 are communicatively connected through the test cable. The test cable and the communication cable are set separately and independently. On the one hand, they can be compatible with different testing schemes on the market, and on the other hand, they are easy to distinguish, so that the cable removal and connection process is simpler and more reliable. At the same time, it is not easy to make connection errors and is easy to verify, thereby ensuring the accuracy of the test results.

[0050] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A chip testing device, characterized in that: It includes a chip screening machine and a chip testing machine, the chip screening machine and the chip testing machine are communicatively connected via a communication cable, the chip screening machine is provided with a plurality of chip fixtures, the chip testing machine is provided with a plurality of chip testing stations, the plurality of chip fixtures are arranged in one-to-one correspondence with the plurality of chip testing stations, and are communicatively connected via test cables respectively, wherein the chip fixtures are used to fix the target chip, and the chip testing station is used to test the target chip.

2. The chip testing device according to claim 1, characterized in that: The chip screening machine includes a screening platform and a grabbing robot arm. The screening platform is arranged on one side of the chip testing machine. A plurality of chip fixtures are distributed on the table of the screening platform at intervals. The grabbing robot arm is arranged on the screening platform and is communicatively connected with the chip testing machine through the communication cable, so as to place or take out the target chip from the corresponding chip fixture during the verification and testing process.

3. The chip testing device according to claim 2, characterized in that: The chip screening machine also includes multiple recycling bucket groups, which are all located on the side of the screening machine away from the chip testing machine and are arranged one-to-one with the multiple chip fixtures. The grabbing robot arm is located between the recycling bucket group and the chip fixture, and is used to place the target chip after the test is completed into the recycling bucket group.

4. The chip testing device according to claim 3, characterized in that: Each of the recycling bucket groups includes a defective bucket and a good bucket, and the defective bucket and the good bucket are both located on the side of the screening machine away from the chip testing machine. The grabbing robot arm is also used to put the target chip tested as good into the good bucket, and put the target chip tested as defective into the defective bucket.

5. The chip testing device according to any one of claims 2 to 4, characterized in that: The multiple chip fixtures include a first fixture and a second fixture, the multiple test stations include a first test station and a second test station, the test cables include a first cable and a second cable, the first fixture and the second fixture are arranged in parallel on the screening machine, the first fixture and the first test station are connected through the first cable, the second fixture and the second test station are connected through the second cable, and the grabbing robot arm is also used to convey the target chip to the first fixture during the verification process, and convey the target chip to the second fixture after the target chip in the first fixture is determined to be a good product.

6. The chip testing device according to claim 5, characterized in that: The multiple chip fixtures also include a third fixture, the multiple test stations also include a third test station, the test cable also includes a third cable, the first fixture, the second fixture and the third fixture are arranged in parallel on the screening machine, the third fixture and the third test station are connected through the third cable, and the grabbing robot arm is also used to transport the target chip to the first fixture and the second fixture during the verification process, and transport the target chip to the third fixture after the target chip in the second fixture is determined to be a good product.

7. The chip testing device according to claim 6, characterized in that: The multiple chip fixtures also include a fourth fixture, the multiple test stations also include a fourth test station, the test cable also includes a fourth cable, the first fixture, the second fixture, the third fixture and the fourth fixture are arranged in parallel on the screening machine in sequence, the fourth fixture and the fourth test station are connected through the fourth cable, and the grabbing robot arm is also used to transport the target chip to the first fixture, the second fixture and the third fixture during the verification process, and to transport the target chip to the fourth fixture after the target chip in the third fixture is determined to be a good product.

8. The chip testing device according to claim 1, characterized in that: The chip testing machine includes a testing machine and a communication module. Multiple testing stations are arranged in parallel on the table of the testing machine. The communication module is arranged on the testing machine and is communicatively connected with the multiple testing stations at the same time. The communication module is communicatively connected with the chip screening machine through the communication cable.

9. A chip testing system, characterized in that: It comprises a packaging device and the chip testing device as claimed in claim 1, wherein the packaging device is connected to the chip screening machine and is used to package the target chip after testing.

10. The chip testing system according to claim 9, characterized in that: The packaging device includes a shipping packaging machine and a scrap packaging machine, both of which are connected to the chip screening machine. The shipping packaging machine is used to package the target chips determined to be good products, and the scrap packaging machine is used to package the target chips determined to be defective products.

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