Sound production device with active heat dissipation function and intelligent monitoring equipment

By setting up a through hole and retaining wall structure at the bottom of the housing of the smart audio, and using the speaker's sound leakage air to drive heat dissipation, the problem of poor heat dissipation effect of existing smart audio is solved, and an efficient and concise active heat dissipation effect is achieved.

CN222674479UActive Publication Date: 2025-03-25XIAMEN LEELEN TECH CO LTD
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Patent Information

Application Number
CN202421411989.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-19
Publication Date
2025-03-25
Estimated Expiration
2034-06-19

AI Technical Summary

Technical Problem

The cooling effect of existing smart speakers is difficult to meet the needs of installing communication modules, and adding a fan will make the device larger.

Method used

A sound generating device for active heat dissipation is designed. By setting a circle of through holes at the bottom of the shell and setting a retaining wall structure inside, the bottom of the rear case is turned into a heat dissipation zone and a pronunciation zone, and the sound leakage hole of the speaker drives air flow, realizing active heat dissipation to the control motherboard.

Benefits of technology

The number of appearance openings is effectively reduced, and efficient heat dissipation is achieved through active air flow. The simple mechanism design improves reliability and reduces costs.

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Abstract

The utility model relates to an active heat dissipation sounding device and intelligent monitoring equipment, comprising a housing, the housing is provided with a circle of through hole, and the through hole is divided into a heat dissipation area and a sound output area through an enclosing wall; the sound production mechanism comprises a rear sound cavity and a loudspeaker, the rear sound cavity is arranged in the shell, the rear sound cavity is provided with a sound outlet hole and a sound leakage hole, the sound leakage hole is communicated to the heat dissipation area, the sound outlet hole is communicated to the sound outlet area, and the sound outlet end of the loudspeaker is arranged in the sound outlet hole in a sealed mode; and the control main board is arranged at the position, corresponding to the sound leakage hole, of the rear sound cavity. Sound leakage holes are formed in the end face of the rear sound cavity, the control mainboard is arranged on the rear sound cavity, passive heat dissipation of the control mainboard is achieved through the heat dissipation area of the shell, air is driven to flow among the sound leakage holes through sound leakage in the operation process of the loudspeaker, and active heat dissipation of the control mainboard is achieved.
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Description

Technical Field

[0001] The utility model relates to the field of sound-generating devices, and in particular to a sound-generating device with active heat dissipation and intelligent monitoring equipment. Background Art

[0002] With the continuous development and progress of current technology, smart homes have been widely used in life, and smart speaker terminal products have also entered the daily life of the public. Smart speakers can play music, voice intercom, emergency rescue and other functions. At present, smart speakers need to be connected to the Internet for voice control, voice Q&A and other functions. In order to connect to the Internet outdoors, it is necessary to place a communication module inside the sound device to access WIFI or 4G, 5G and other networks.

[0003] Since the communication module is a heat source, higher requirements are placed on the heat dissipation effect of the sound-generating device. The prior art generally uses passive heat dissipation, that is, the heat generated by the smart speaker is dissipated through the outside air or the shell. For example, the existing patent with application number CN202020030191.7 mainly uses a circuit board to be set at the upper end of the integrated circuit board through a number of fixed spaces to leave a first heat dissipation gap. A 4G interface is provided on the circuit board, and a pad is protruding upward at one end of the circuit board away from the 4G interface. When the 4G module is plugged into the 4G interface, the end of the 4G module away from the 4G interface and the pad are detachably arranged. At this time, a second heat dissipation gap is left between the 4G module and the circuit board. The playback box effectively improves heat dissipation, thereby extending the service life. The passive heat dissipation method is difficult to meet the heat dissipation requirements of smart speakers equipped with communication modules. If a fan is added, the volume of the smart speaker will increase.

[0004] The purpose of the present invention is to design a sound-generating device and intelligent monitoring equipment with active heat dissipation in view of the above-mentioned problems in the prior art. Utility Model Content

[0005] In view of the problems existing in the above-mentioned prior art, the present invention provides a sound-generating device and intelligent monitoring equipment with active heat dissipation, which can effectively solve at least one problem existing in the above-mentioned prior art.

[0006] The technical solution of the utility model is:

[0007] A sound-generating device with active heat dissipation, comprising:

[0008] A shell, wherein the shell is provided with a circle of through holes, and the through holes are divided into a heat dissipation area and a sound output area by a surrounding wall;

[0009] The sound-generating mechanism comprises a rear sound cavity and a speaker, wherein the rear sound cavity is arranged in the shell, the rear sound cavity is provided with a sound outlet hole and a sound leakage hole, the sound leakage hole is connected to the heat dissipation area, the sound outlet hole is connected to the sound output area, and the sound output end of the speaker is sealed at the sound outlet hole;

[0010] The control main board is arranged at a position on the rear sound cavity corresponding to the sound leakage hole.

[0011] Furthermore, the shell is a cylindrical structure, the enclosure is an arc-shaped structure cocentric with the shell, the through holes corresponding to the enclosure at the bottom end of the enclosure form the heat dissipation zone, and the top end of the enclosure opens the heat dissipation zone.

[0012] Furthermore, the rear sound cavity is sealed in the space within the shell corresponding to the wall.

[0013] Furthermore, a foot pad is provided at the bottom end of the shell, and the foot pad raises the rear sound cavity so that a gap is provided between the bottom surface of the rear sound cavity and the bottom surface of the shell.

[0014] Furthermore, the sound leakage hole is arranged on the upper end surface of the rear sound cavity.

[0015] Furthermore, the outer periphery of the bottom end of the shell is chamfered, and the outer periphery of the bottom end of the rear sound cavity is chamfered.

[0016] Furthermore, the control main board is provided with a communication module.

[0017] Furthermore, the communication module is one or more of a WIFI module, a 4G module, and a 5G module.

[0018] Furthermore, the communication module is arranged above the sound leakage hole.

[0019] Furthermore, the shell includes an upper shell and a lower shell, the upper shell closes the upper end surface of the lower shell, the upper shell is provided with a button, and the lower shell is provided with a power supply port.

[0020] An active heat dissipation intelligent monitoring device is further provided, comprising the active heat dissipation sound-generating device.

[0021] Therefore, the utility model provides the following effects and / or advantages:

[0022] The present application sets a circle of through holes at the bottom of the shell of the smart speaker, and makes a retaining wall structure inside the shell, dividing the bottom of the rear shell into two parts: a heat dissipation area and a sound-producing area. The speaker with a rear sound cavity is placed in the enclosure structure of the shell and sealed at the end face. A sound leakage hole is set on the end face of the rear sound cavity, and the control motherboard is set on the rear sound cavity. The passive heat dissipation of the control motherboard is achieved through the heat dissipation area of ​​the shell, and the sound leakage during the operation of the speaker drives the air to flow between the sound leakage holes, thereby realizing active heat dissipation of the control motherboard.

[0023] The present invention can greatly reduce the opening of the appearance by integrating the sound outlet area and the heat dissipation area at the bottom of the shell. The heat dissipation can be effectively achieved by actively driving the air flow, with a simple structure, high reliability and low cost.

[0024] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the invention. The purpose and other advantages of the invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0025] It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of an embodiment of the utility model.

[0027] Figure 2 It is a cross-sectional view of an embodiment of the present utility model.

[0028] Figure 3 It is a schematic diagram of an explosion of an embodiment of the utility model.

[0029] Figure 4 It is a structural diagram of the sound-generating mechanism.

[0030] Figure 5 It is a bottom schematic diagram of the sound-generating mechanism.

[0031] Figure 6 It is a schematic diagram of the structure of the shell.

[0032] Figure 7 Schematic diagram of air flow when the generating mechanism is working. DETAILED DESCRIPTION

[0033] In order to facilitate understanding by those skilled in the art, the structure of the present invention is further described in detail with reference to the accompanying drawings:

[0034] Embodiment 1

[0035] refer to Figure 1-6 , a sound-generating device with active heat dissipation, comprising:

[0036] A housing 1, wherein the housing 1 is provided with a circle of through holes, and the through holes are divided into a heat dissipation area 102 and a sound output area 103 by a surrounding wall 101;

[0037] The sound-generating mechanism 2 includes a rear sound cavity 201 and a speaker 202. The rear sound cavity 201 is disposed in the housing 1. The rear sound cavity is provided with a sound outlet 2011 and a sound leakage hole 2012. The sound leakage hole 2012 is connected to the heat dissipation area 102. The sound outlet 2011 is connected to the sound outlet area 103. The sound outlet end of the speaker 202 is sealed in the sound outlet 2011.

[0038] The control main board 3 is arranged at a position on the rear sound cavity 201 corresponding to the sound leakage hole 2012 .

[0039] In this embodiment, the rear sound cavity 201 and the surrounding wall 101 jointly separate the through holes, and the heat dissipation area 102 and the sound output area 103 are separated and cannot be connected.

[0040] The sound outlet 2011, the speaker 202, and the sound outlet area 103 are connected in sequence. When the speaker 202 is working, the sound is transmitted from the sound outlet area 103 to the outside. Figure 7 The sound leakage hole 2012 allows air to flow in and out of the rear sound cavity 201, which can prevent pressure accumulation in the rear sound cavity 201; the rear sound cavity 201, the sound leakage hole 2012, and the heat dissipation area 102 are connected, and the flowing air generated by the speaker 202 through the sound leakage hole 2012 can actively take away the heat generated by the control motherboard 3 and discharge it from the heat dissipation area 102.

[0041] Furthermore, the shell 1 is a cylindrical structure, the enclosure 101 is an arc-shaped structure cocentric with the shell 1 , the through holes corresponding to the bottom enclosure of the enclosure 101 form the heat dissipation area 102 , and the top of the enclosure 101 opens the heat dissipation area 102 .

[0042] In this embodiment, the heat dissipation area 102 and the sound production area 103 are separated by an arc-shaped wall 101, and the upper end of the heat dissipation area 102 is not blocked and is in an open state, so that air can flow back and forth between the heat dissipation area 102, the control main board 3, the sound leakage hole 2012, and the inside of the rear sound cavity 201, and take away the heat generated by the control main board 3.

[0043] Furthermore, the rear sound cavity 201 is sealed in the space within the housing 1 corresponding to the surrounding wall 101 .

[0044] In this embodiment, the rear sound cavity 201 is sealed in the space within the housing 1 corresponding to the wall 101 by means of glue, thereby isolating the heat dissipation area 102 and the sound production area 103 so that the air flows will not interfere with each other.

[0045] Furthermore, a foot pad 104 is provided at the bottom end of the shell 1 , and the foot pad 104 raises the rear sound cavity 201 so that a gap is provided between the bottom surface of the rear sound cavity 201 and the bottom surface of the shell 1 .

[0046] The foot pad 104 can prevent the bottom of the housing 1 from blocking the sound outlet area 103 , and can also prevent the vibration of the speaker 202 from being disturbed by the bottom of the housing 1 .

[0047] Furthermore, the sound leakage hole 2012 is arranged on the upper end surface of the rear sound cavity 201 .

[0048] Through this structure, the upper end surface of the rear sound cavity 201 can be used to place the control main board 3, and the air flow generated by the sound leakage hole 2012 can directly blow toward the control main board 3, thereby taking away the heat thereof.

[0049] Furthermore, the outer periphery of the bottom end of the shell 1 is chamfered, and the outer periphery of the bottom end of the rear sound cavity 201 is chamfered.

[0050] Furthermore, the control main board 3 is provided with a communication module.

[0051] Furthermore, the communication module is one or more of a WIFI module, a 4G module, and a 5G module.

[0052] Furthermore, the communication module is arranged above the sound leakage hole 2012 .

[0053] Furthermore, the housing 1 comprises an upper housing and a lower housing, the upper housing closes the upper end surface of the lower housing, the upper housing is provided with buttons, and the lower housing is provided with a power supply port.

[0054] The upper shell seals the upper end surface of the lower shell, which can limit the air flow generated by the sound leakage hole 2012 to only flow to the heat dissipation area 102, thereby improving the heat dissipation effect.

[0055] An active heat dissipation intelligent monitoring device is further provided, comprising the active heat dissipation sound-generating device.

[0056] It should be noted that in the claims, any reference signs placed between brackets shall not be constructed as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claims. The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The utility model can be implemented with the aid of hardware comprising several different components and with the aid of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by the same hardware item. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0057] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0058] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

Claims

1. An active heat dissipation sound-generating device, characterized in that: include: A shell, wherein the shell is provided with a circle of through holes, and the through holes are divided into a heat dissipation area and a sound output area by a surrounding wall; The sound-generating mechanism comprises a rear sound cavity and a speaker, wherein the rear sound cavity is arranged in the shell, the rear sound cavity is provided with a sound outlet hole and a sound leakage hole, the sound leakage hole is connected to the heat dissipation area, the sound outlet hole is connected to the sound output area, and the sound output end of the speaker is sealed at the sound outlet hole; The control main board is arranged at a position on the rear sound cavity corresponding to the sound leakage hole.

2. The active heat dissipation sound-generating device according to claim 1, characterized in that: The shell is a cylindrical structure, the enclosure is an arc-shaped structure with the same center as the shell, the bottom end of the enclosure is surrounded by corresponding through holes to form the heat dissipation area, and the top end of the enclosure is open to the heat dissipation area.

3. The active heat dissipation sound-generating device according to claim 2, characterized in that: The rear sound cavity is sealed in the space within the enclosure corresponding to the shell.

4. The active heat dissipation sound-generating device according to claim 1, characterized in that: A foot pad is arranged at the bottom end of the shell, and the foot pad raises the rear sound cavity so that a gap is arranged between the bottom surface of the rear sound cavity and the bottom surface of the shell.

5. The active heat dissipation sound-generating device according to claim 1, characterized in that: The sound leakage hole is arranged on the upper end surface of the rear sound cavity.

6. The active heat dissipation sound-generating device according to claim 1, characterized in that: The outer periphery of the bottom end of the shell is chamfered, and the outer periphery of the bottom end of the rear sound cavity is chamfered.

7. The active heat dissipation sound-generating device according to claim 1, characterized in that: The control mainboard is provided with a communication module, and the communication module is one or more of a WIFI module, a 4G module, and a 5G module.

8. The active heat dissipation sound-generating device according to claim 7, characterized in that: The communication module is arranged above the sound leakage hole.

9. The active heat dissipation sound-generating device according to claim 1, characterized in that: The shell comprises an upper shell and a lower shell, the upper shell closes the upper end surface of the lower shell, the upper shell is provided with buttons, and the lower shell is provided with a power supply port.

10. An intelligent monitoring device with active heat dissipation, characterized in that: A sound-generating device with active heat dissipation comprising the one described in any one of claims 1-9.

Citation Information

Patent Citations

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    CN211509210U