Multi-layer composite heat-conducting gasket

Abstract

The utility model discloses a multi-layer composite heat-conducting gasket, which comprises a heat-conducting protective layer and a second radiating fin arranged at the bottom of the heat-conducting protective layer, when the multi-layer composite heat-conducting gasket is used, a multi-layer material composite structure of the first stainless steel layer, the second stainless steel layer, the first cooling fin, the second cooling fin and the alloy layer improves heat transfer stability, the heat-conducting fins are made of silica gel materials so as to provide flexibility, the heat-conducting fins make full contact with elements and protect the elements, and the service life of the elements is prolonged. The stainless steel layer is arranged to provide high thermal conductivity and rigidity, so that the installation is convenient, the alloy layer is subjected to phase change when being heated and is softened into a semi-liquid state from an original solid state, so that the thermal conductivity is improved, the thermal conductive protective layer is used for packaging the five thermal conductive layers, the stability is improved, the five thermal conductive layers are prevented from being stripped and scattered during use, and the service life is prolonged. A compression spring is installed on the inner side of the stainless steel layer and can exert continuous compression force on the heat-conducting fin, so that the heat-conducting fin is in full contact with the element, and heat resistance is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field related to thermal management, and specifically relates to a multi-layer composite thermal conductive pad. Background Art

[0002] A multi-layer composite thermally conductive gasket is a material used for the transfer interface between an electronic device and a heat sink or a product casing. Its main function is to complete the heat transfer between the heating part and the heat dissipation part. This gasket is usually composed of multiple materials to achieve better thermal conductivity. The utility model multi-layer composite thermally conductive gasket is mainly composed of a thermally conductive protective layer, a first heat sink, a thermally conductive plate, a first stainless steel layer, a second stainless steel layer, a second heat sink, a heat dissipation support plate, a heat dissipation groove, an alloy layer and other components. The existing multi-layer composite thermally conductive gasket has certain defects in contact performance and thermal conductivity when used, so a multi-layer composite thermally conductive gasket is indispensable. Utility Model Content

[0003] The utility model aims to provide a multi-layer composite thermally conductive pad to solve the problem in the background art that the contact performance and thermal conductivity of the existing multi-layer composite thermally conductive pads are defective when in use.

[0004] To achieve the above purpose, the utility model provides the following technical solution: a multi-layer composite thermal conductive pad, comprising

[0005] A heat-conducting protective layer and a second heat sink arranged at the bottom of the heat-conducting protective layer;

[0006] A second stainless steel layer is disposed at the upper end of the second heat sink, and an alloy layer is installed at the upper end of the second stainless steel layer;

[0007] A first stainless steel layer is installed at the upper end of the alloy layer, and a first heat sink is arranged at the upper end of the first stainless steel layer;

[0008] A heat conducting sheet is installed at the upper end of the first heat sink and at the inner side of the heat conducting protective layer;

[0009] The upper end of the first heat sink and the lower end of the second heat sink are both connected to heat sinks, and heat sinks are provided at the inner sides of the heat sinks.

[0010] The first stainless steel layer, the second stainless steel layer and the alloy layer are connected via a spring;

[0011] The heat dissipation effect of the multi-layer composite thermal conductive pad is enhanced by arranging the first heat sink, the second heat sink, the heat dissipation support, the heat dissipation groove, the first stainless steel layer, the second stainless steel layer, the spring and the alloy layer.

[0012] Preferably, a card slot is provided at an inner position of the first stainless steel layer and the second stainless steel layer, and a card block is provided inside the card slot and at a lower end of the first heat sink and an upper end of the second heat sink.

[0013] Preferably, the card block, the first heat sink and the second heat sink are an integrated structure, and the card block is connected to the card slot by plugging.

[0014] Preferably, a placement groove is provided at an inner position of the block, and a magnet plate is inlaid at an inner position of the placement groove.

[0015] Preferably, the magnet plate is connected to the first stainless steel layer and the second stainless steel layer by magnetic adsorption. The provision of the magnet plate enhances the stability between the first stainless steel layer and the first heat sink, and between the second stainless steel layer and the second heat sink.

[0016] Preferably, the first stainless steel layer, the second stainless steel layer and the alloy layer are all a solid rectangular parallelepiped structure, and the thickness of the alloy layer is greater than the thickness of the first stainless steel layer and the second stainless steel layer.

[0017] Preferably, the alloy layer undergoes a phase change when heated, softening from an original solid to a semi-liquid state.

[0018] Preferably, the alloy layer is made of 75% gallium and 25% indium. The provision of the alloy layer improves the thermal conductivity of the multi-layer composite thermally conductive gasket, while the provision of the first stainless steel layer and the second stainless steel layer enhances the stability of the multi-layer composite thermally conductive gasket.

[0019] Compared with the prior art, the utility model provides a multi-layer composite thermal conductive pad, which has the following beneficial effects:

[0020] 1. The utility model improves a multi-layer composite thermally conductive gasket. When the multi-layer composite thermally conductive gasket is used, the multi-layer material composite structure of the first stainless steel layer, the second stainless steel layer, the first heat sink, the second heat sink, and the alloy layer improves the heat transfer stability. The thermally conductive plate is made of silicone material to provide flexibility, so that the thermally conductive plate is in full contact with the component and protects the component. The setting of the stainless steel layer provides high thermal conductivity and rigidity, making installation convenient. When the alloy layer is heated, it undergoes a phase change, softening from the original solid to a semi-liquid state, thereby improving the thermal conductivity. The thermal conductive protection layer encapsulates the five thermally conductive layers, improves the stability, and prevents the five thermally conductive layers from peeling off and scattering when used. A compression spring is installed on the inner side of the stainless steel layer, which can apply continuous compression force to the thermally conductive plate, so that the thermally conductive plate is in full contact with the component, reducing thermal resistance, so that the multi-layer composite thermally conductive gasket can be better used. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The utility model is a schematic diagram of the overall structure of the multi-layer composite thermal conductive gasket.

[0022] Figure 2 It is a schematic diagram of the enlarged structure of the alloy layer of the multi-layer composite thermal conductive gasket of the utility model.

[0023] In the figure: 1. first heat sink; 2. heat conducting plate; 3. first stainless steel layer; 4. clamping block; 5. second stainless steel layer; 6. spring; 7. thermal conductive protective layer; 8. second heat sink; 9. heat dissipation support plate; 10. heat dissipation slot; 11. alloy layer; 12. placement slot; 13. clamping slot; 14. magnet plate. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The utility model provides Figure 1-2 The multi-layer composite heat-conductive gasket shown is a multi-layer composite heat-conductive gasket, comprising a heat-conductive protective layer 7 and a second heat sink 8 arranged at the bottom position of the heat-conductive protective layer 7; a second stainless steel layer 5 is arranged at the upper end position of the second heat sink 8, and an alloy layer 11 is installed at the upper end position of the second stainless steel layer 5; a first stainless steel layer 3 is installed at the upper end position of the alloy layer 11, and a first heat sink 1 is arranged at the upper end position of the first stainless steel layer 3; a heat-conductive plate 2 is installed at the upper end of the first heat sink 1 and at the inner side position of the heat-conductive protective layer 7; a heat sink 9 is connected to the upper end of the first heat sink 1 and the lower end position of the second heat sink 8, and a heat sink groove 10 is arranged at the inner side position of the heat sink 9; the first stainless steel layer 3 and the second stainless steel layer 5 are connected to the alloy layer 11 through a spring 6; the heat dissipation effect of the multi-layer composite heat-conductive gasket is enhanced by the arrangement of the first heat sink 1, the second heat sink 8, the heat sink 9, the heat sink groove 10, the first stainless steel layer 3, the second stainless steel layer 5, the spring 6 and the alloy layer 11.

[0026] like Figure 1 and Figure 2As shown, in order to enhance the heat dissipation effect of the multi-layer composite thermally conductive gasket, when using the multi-layer composite thermally conductive gasket, the multi-layer material composite structure of the first stainless steel layer 3, the second stainless steel layer 5, the first heat sink 1, the second heat sink 8, and the alloy layer 11 improves the heat transfer stability, wherein the thermally conductive sheet 2 is made of silicone material to provide flexibility, so that the thermally conductive sheet is in full contact with the component and protects the component, and the setting of the stainless steel layer provides high thermal conductivity and rigidity, making installation convenient, and the alloy layer 11 undergoes a phase change when heated, softening from the original solid to a semi-liquid state, thereby improving the thermal conductivity, and the thermal conductive protection layer encapsulates the five-layer thermally conductive layer 7 to improve the stability, and prevent the above-mentioned five-layer thermally conductive layer 7 from peeling off and scattering during use, and a compression spring 6 is installed on the inner side of the stainless steel layer, which can apply continuous compression force to the thermally conductive sheet 2, so that the thermally conductive sheet 2 is in full contact with the component, reducing thermal resistance, so that the multi-layer composite thermally conductive gasket can be better used.

[0027] A card slot 13 is provided at the internal position of the first stainless steel layer 3 and the second stainless steel layer 5, and a card block 4 is provided inside the card slot 13 and at the lower end of the first heat sink 1 and the upper end of the second heat sink 8. The card block 4 is an integrated structure with the first heat sink 1 and the second heat sink 8, and the card block 4 is connected to the card slot 13 by plugging. A placement groove 12 is provided at the internal position of the card block 4, and a magnet plate 14 is inlaid at the internal position of the placement groove 12. The magnet plate 14 is connected to the first stainless steel layer 3 and the second stainless steel layer 5 by magnetic adsorption. The setting of the magnet plate 14 enhances the stability between the first stainless steel layer 3 and the first heat sink 1, the second stainless steel layer 5 and the second heat sink 8.

[0028] like Figure 1 and Figure 2 As shown, in order to enhance the stability between the first stainless steel layer 3 and the first heat sink 1, the second stainless steel layer 5 and the second heat sink 8, when using the multi-layer composite thermal conductive gasket, the magnet plate 14 is first embedded in the placement groove 12, so that the magnet plate 14 is installed in the inside of the card block 4, and then the first heat sink 1 and the second heat sink 8 are inserted into the card slot 13 through the card block 4. When the card block 4 enters the card slot 13, the magnet plate 14 inside the card block 4 will be adsorbed by the first stainless steel layer 3 and the second stainless steel layer 5, so that the first heat sink 1 and the first stainless steel layer 3, the second heat sink 8 and the second stainless steel layer 5 are connected together. Through the setting of the magnet plate 14, the stability between the first stainless steel layer 3 and the first heat sink 1, the second stainless steel layer 5 and the second heat sink 8 is enhanced, thereby enhancing the stability of the multi-layer composite thermal conductive gasket.

[0029] The first stainless steel layer 3, the second stainless steel layer 5 and the alloy layer 11 are all a solid rectangular structure. The thickness of the alloy layer 11 is greater than that of the first stainless steel layer 3 and the second stainless steel layer 5. When heated, the alloy layer 11 undergoes a phase change, softening from the original solid to a semi-liquid state. The alloy layer 11 is made of 75% gallium and 25% indium. Through the setting of the alloy layer 11, the thermal conductivity of the multi-layer composite thermally conductive gasket is improved, and the setting of the first stainless steel layer 3 and the second stainless steel layer 5 enhances the stability of the multi-layer composite thermally conductive gasket.

[0030] like Figure 1 and Figure 2 As shown, in order to improve the thermal conductivity of the multi-layer composite thermally conductive gasket, when using the multi-layer composite thermally conductive gasket, the alloy layer 11 is first connected to the first stainless steel layer 3 and the second stainless steel layer 5 through the spring 6, and then the thermal conductive sheet 2 is fully contacted with the electronic component. When the electronic component heats up, the alloy layer 11 is heated. When the alloy layer 11 is heated, it undergoes a phase change and softens from the original solid to a semi-liquid state, thereby playing a heat dissipation role. The thermal conductivity of the multi-layer composite thermally conductive gasket is improved by the arrangement of the alloy layer 11, and the stability of the multi-layer composite thermally conductive gasket is enhanced by the arrangement of the first stainless steel layer 3 and the second stainless steel layer 5.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-layer composite thermally conductive pad, characterized in that: include A heat-conducting protective layer (7) and a second heat sink (8) arranged at the bottom of the heat-conducting protective layer (7); A second stainless steel layer (5) is provided at the upper end of the second heat sink (8), and an alloy layer (11) is installed at the upper end of the second stainless steel layer (5); A first stainless steel layer (3) is installed at the upper end of the alloy layer (11), and a first heat sink (1) is provided at the upper end of the first stainless steel layer (3); A heat conducting sheet (2) is installed at the upper end of the first heat sink (1) and at a position inside the heat conducting protective layer (7); The upper end of the first heat sink (1) and the lower end of the second heat sink (8) are both connected to heat sink supports (9), and heat sink grooves (10) are provided at the inner sides of the heat sink supports (9); The first stainless steel layer (3) and the second stainless steel layer (5) are connected to the alloy layer (11) via a spring (6); The heat dissipation effect of the multi-layer composite heat conductive pad is enhanced by providing the first heat dissipation fin (1), the second heat dissipation fin (8), the heat dissipation support fin (9), the heat dissipation groove (10), the first stainless steel layer (3), the second stainless steel layer (5), the spring (6) and the alloy layer (11).

2. The multi-layer composite thermally conductive gasket according to claim 1, characterized in that: A clamping groove (13) is provided at an internal position of the first stainless steel layer (3) and the second stainless steel layer (5), and a clamping block (4) is provided inside the clamping groove (13) and at a position located at the lower end of the first heat sink (1) and the upper end of the second heat sink (8).

3. The multi-layer composite thermally conductive gasket according to claim 2, characterized in that: The card block (4) and the first heat sink (1) and the second heat sink (8) are an integrated structure, and the card block (4) and the card slot (13) are connected by plugging.

4. The multi-layer composite thermally conductive gasket according to claim 3, characterized in that: A placement groove (12) is provided at an inner position of the card block (4), and a magnet plate (14) is embedded at an inner position of the placement groove (12).

5. The multi-layer composite thermally conductive gasket according to claim 4, characterized in that: The magnet plate (14) is connected to the first stainless steel layer (3) and the second stainless steel layer (5) by magnetic adsorption. The provision of the magnet plate (14) enhances the stability between the first stainless steel layer (3) and the first heat sink (1), the second stainless steel layer (5) and the second heat sink (8).

6. The multi-layer composite thermally conductive gasket according to claim 5, characterized in that: The first stainless steel layer (3), the second stainless steel layer (5) and the alloy layer (11) are all solid rectangular parallelepiped structures, and the thickness of the alloy layer (11) is greater than the thickness of the first stainless steel layer (3) and the second stainless steel layer (5).

7. The multi-layer composite thermally conductive gasket according to claim 6, characterized in that: When heated, the alloy layer (11) undergoes a phase change, softening from an original solid to a semi-liquid state.

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