Auxiliary forming device for injection mold

Abstract

The utility model belongs to the technical field of injection molds, and particularly relates to an injection mold auxiliary former which comprises a first mold and a second mold, the second mold is movably arranged on one side of the first mold, mounting grooves are formed in inner cavities of the first mold and the second mold, and cooling liquid storage tanks are mounted at the bottoms of inner cavities of the mounting grooves. A first mold cavity and a second mold cavity extend out of the surface of the cooling liquid storage box, circulating cooling pipes are arranged in inner cavities of the mounting grooves, contact plates are integrally formed on the surfaces of the circulating cooling pipes, and the contact plates abut against the surfaces of the inner cavities of the first mold and the second mold; cooling liquid is continuously circulated, meanwhile, cold energy generated by the semiconductor chilling plate can be transmitted to an inner cavity of the cooling liquid storage box, the cooling liquid can be rapidly cooled, the cooling forming speed of a workpiece is increased, the cooling liquid circulation structure is integrated in the inner cavity of the mold, the size is small, and use is more convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of injection molds, in particular to an injection mold auxiliary former. Background Art

[0002] Injection molding, also known as injection molding, is a molding method that combines injection and molding. The advantages of the injection molding method are fast production speed, high efficiency, automated operation, a wide variety of colors, shapes from simple to complex, sizes from large to small, and precise product size. The product is easy to update and can be made into parts with complex shapes. Injection molding is suitable for mass production and molding processing fields such as complex-shaped products. When the workpiece is injected, the workpiece can be quickly cooled and formed by accelerating the cooling of the mold.

[0003] The existing cooling device of the injection mold requires an external coolant circulation structure, which is large in size and very inconvenient to use. After the coolant absorbs a certain amount of heat, the temperature of the coolant will increase, resulting in a decrease in the cooling and molding speed of the workpiece. In order to solve the above problems, an injection mold auxiliary molding device is proposed in this application. Utility Model Content

[0004] (I) Purpose of the utility model

[0005] In order to solve the technical problems existing in the background technology, the utility model proposes an injection mold auxiliary molding device, which can quickly cool the coolant by continuously circulating the coolant, and the cold amount generated by the semiconductor refrigeration plate can be transferred to the inner cavity of the coolant storage box, so as to improve the cooling and molding speed of the workpiece. The coolant circulation structure is integrated in the inner cavity of the mold, with a small size and more convenient use, so as to solve the problems raised in the background technology.

[0006] (II) Technical solution

[0007] In order to solve the above technical problems, the utility model provides an injection mold auxiliary molding device, including a No. 1 mold and a No. 2 mold, wherein the No. 2 mold is movably arranged on one side of the No. 1 mold, and the inner cavities of the No. 1 mold and the No. 2 mold are both provided with mounting grooves, and the bottom of the inner cavities of the mounting grooves are both provided with coolant storage tanks, and the surfaces of the coolant storage tanks extend the No. 1 mold and the No. 2 mold cavities respectively;

[0008] The inner cavities of the installation grooves are all provided with circulating cooling pipes, and the surfaces of the circulating cooling pipes are integrally formed with contact plates, and the contact plates abut against the inner cavities of the No. 1 mold and the No. 2 mold. The end surfaces of the cooling liquid storage tanks are all provided with circulating water pumps, and the liquid outlet ends of the circulating water pumps are respectively connected to one end of the circulating cooling pipes, and the ends of the circulating cooling pipes away from the circulating water pumps are all conductively connected to the bottom of the side wall of the cooling liquid storage tank;

[0009] Semiconductor refrigeration sheets are movably installed on the surface of the cooling liquid storage box.

[0010] Preferably, the surface of the coolant storage tank is coated with thermal grease, and the cooling surface of the semiconductor refrigeration plate is in contact with the surface of the thermal grease.

[0011] Preferably, a plurality of groups of through-holes are equidistantly provided on a surface of one side of the coolant storage tank, and heat-conducting rods are inserted into the inner cavities of the through-holes.

[0012] Preferably, one end of the heat-conducting rod abuts against the cooling surface of the semiconductor refrigeration plate, and the other end of the heat-conducting rod is inserted into the inner cavity of the coolant storage tank.

[0013] Preferably, the side walls of the coolant storage tank are embedded with liquid level observation windows, and the liquid level observation windows are respectively connected to one side of the surface of the No. 1 mold and the No. 2 mold.

[0014] Preferably, the top of the coolant storage tank is connected to a liquid injection pipe, and the top of the liquid injection pipe is threadedly connected to a sealing cap.

[0015] Preferably, the heating surface of the semiconductor refrigeration plate is installed with a cooling fan, and the two side surfaces of the coolant storage tank are rotatably provided with fixing buckles, and the fixing buckles are buckled on the two end surfaces of the semiconductor refrigeration plate.

[0016] The above technical solution of the utility model has the following beneficial technical effects:

[0017] 1. The utility model can take away the heat in the mold cavities of mold No. 1 and mold No. 2 through the coolant by continuously circulating the coolant, so as to realize the rapid cooling and molding of the workpiece. The cooling surface of the semiconductor refrigeration plate is in contact with the surface of the coolant storage tank through the thermal grease. The cold amount generated by the semiconductor refrigeration plate can be transferred to the inner cavity of the coolant storage tank, and the coolant can be quickly cooled to improve the cooling speed of the workpiece. The coolant circulation structure is respectively integrated in the inner cavity of mold No. 1 and mold No. 2, with a compact size and more convenient use.

[0018] 2. In the utility model, the heat-conducting rod is plugged into the through-hole, and one end of the heat-conducting rod abuts against the cooling surface of the semiconductor refrigeration plate, and the other end is plugged into the inner cavity of the coolant storage box, which can accelerate the transfer of cold and enhance the cooling effect on the coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of an injection mold auxiliary molding device of the utility model;

[0020] Figure 2 This is a schematic diagram of the internal structure of a mold of an injection mold auxiliary molding device of the utility model;

[0021] Figure 3 This is a schematic diagram of the structure of a coolant storage tank for an injection mold auxiliary molding device of the utility model;

[0022] Figure 4 The utility model is a schematic diagram of the exploded structure of a coolant storage box of an injection mold auxiliary forming device.

[0023] Reference numerals:

[0024] 1. Mold No. 1; 2. Mold No. 2; 3. Coolant storage tank; 4. Circulating water pump; 5. Circulating cooling pipe; 6. Contact plate; 7. Semiconductor cooling plate; 8. Cooling fan; 9. Heat conducting rod; 10. Through-hole; 11. Thermal grease; 12. Liquid level observation window; 13. Liquid filling pipe; 14. Fixing buckle. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the utility model. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the utility model.

[0026] like Figure 1-4 As shown, the utility model proposes an injection mold auxiliary molding device, including a No. 1 mold 1 and a No. 2 mold 2, wherein the No. 2 mold 2 is movably arranged on one side of the No. 1 mold 1, and the inner cavities of the No. 1 mold 1 and the No. 2 mold 2 are both provided with mounting grooves, and the bottom of the inner cavities of the mounting grooves are both provided with coolant storage tanks 3, and the surfaces of the coolant storage tanks 3 extend the cavities of the No. 1 mold 1 and the No. 2 mold 2 respectively;

[0027] The inner cavity of the installation groove is provided with a circulating cooling pipe 5, and the surface of the circulating cooling pipe 5 is integrally formed with a contact plate 6, and the contact plate 6 abuts against the inner cavity surface of the No. 1 mold 1 and the No. 2 mold 2. The end surface of the coolant storage tank 3 is installed with a circulating water pump 4, and the liquid outlet end of the circulating water pump 4 is respectively connected to one end of the circulating cooling pipe 5, and the end of the circulating cooling pipe 5 away from the circulating water pump 4 is conductively connected to the bottom of the side wall of the coolant storage tank 3;

[0028] Semiconductor cooling plates 7 are movably mounted on the surface of the cooling liquid storage box 3 .

[0029] It should be noted that after mold No. 1 and mold No. 2 are molded together, the circulating water pump 4 is controlled to extract the coolant in the coolant storage tank 3, and the coolant is injected into the circulating cooling pipe 5, and the coolant then flows back into the coolant storage tank 3 from the other end of the circulating cooling pipe 5. The surface of the circulating cooling pipe 5 contacts the inner wall surface of mold No. 1 and mold No. 2 through the contact plate 6, which can increase the contact area between the circulating cooling pipe 5 and the inner wall of mold No. 1 and mold No. 2. By continuously circulating the coolant, the heat in the mold cavity of mold No. 1 and mold No. 2 can be taken away by the coolant, so as to realize rapid cooling and molding of the workpiece. The cooling surface of the semiconductor refrigeration plate 7 contacts the surface of the coolant storage tank 3 through the thermal grease 11, and the cold energy generated by the semiconductor refrigeration plate 7 can be transferred to the inner cavity of the coolant storage tank 3, so as to quickly cool the coolant and improve the cooling speed of the workpiece.

[0030] In this embodiment, if Figure 3 and Figure 4 As shown, the surface of the coolant storage tank 3 is coated with thermal grease 11, the cooling surface of the semiconductor refrigeration plate 7 is in contact with the surface of the thermal grease 11, and a plurality of groups of through-plug holes 10 are equidistantly provided on the surface of one side of the coolant storage tank 3. The inner cavities of the through-plug holes 10 are all plugged with thermal rods 9, one end of the thermal rod 9 abuts against the cooling surface of the semiconductor refrigeration plate 7, and the other end of the thermal rod 9 is plugged into the inner cavity of the coolant storage tank 3.

[0031] It should be noted that the heat conducting rod 9 is plugged into the through-hole 10, and one end abuts against the cooling surface of the semiconductor refrigeration plate 7, and the other end is plugged into the inner cavity of the coolant storage tank 3, which can accelerate the transfer of cold to enhance the cooling effect on the coolant.

[0032] In this embodiment, if Figure 3 and Figure 4 As shown, the side walls of the coolant storage tank 3 are embedded with liquid level observation windows 12, and the liquid level observation windows 12 are respectively connected to one side of the surface of the No. 1 mold 1 and the No. 2 mold 2. The top of the coolant storage tank 3 is connected with a liquid injection pipe 13, and the top of the liquid injection pipe 13 is threadedly connected with a sealing cap.

[0033] It should be noted that the liquid level observation window 12 can penetrate the height of the coolant liquid level, and the coolant can be quickly replenished through the injection pipe 13 after the coolant is consumed.

[0034] In this embodiment, if Figure 3 and Figure 4 As shown, the heating surface of the semiconductor refrigeration sheet 7 is installed with a cooling fan 8, and the two side surfaces of the coolant storage tank 3 are rotatably provided with fixing buckles 14, and the fixing buckles 14 are buckled on the two end surfaces of the semiconductor refrigeration sheet 7.

[0035] It should be noted that the semiconductor cooling sheet 7 is fixed by a fixing buckle 14, so that the semiconductor cooling sheet 7 can be easily disassembled.

[0036] The working principle and use process of the utility model are as follows: after the No. 1 mold 1 and the No. 2 mold 2 are molded together, the coolant in the coolant storage tank 3 is extracted by controlling the circulating water pump 4 respectively, and the coolant is injected into the circulating cooling pipe 5, and the coolant flows back into the coolant storage tank 3 from the other end of the circulating cooling pipe 5, and the surface of the circulating cooling pipe 5 contacts the inner wall surface of the No. 1 mold 1 and the No. 2 mold 2 through the contact plate 6, which can increase the contact area between the circulating cooling pipe 5 and the inner wall of the No. 1 mold 1 and the No. 2 mold 2. By continuously circulating the coolant, the heat in the mold cavity of the No. 1 mold 1 and the No. 2 mold 2 can be taken away by the coolant, so that the workpiece can be quickly cooled and formed. The cooling surface of the semiconductor cooling plate 7 contacts the surface of the coolant storage tank 3 through the thermal grease 11, and the heat generated by the semiconductor cooling plate 7 The cold amount can be transferred to the inner cavity of the coolant storage tank 3, and the coolant can be quickly cooled to increase the cooling speed of the workpiece. The heat conducting rod 9 is plugged into the through plug hole 10, and one end is abutted against the cooling surface of the semiconductor refrigeration plate 7, and the other end is plugged into the inner cavity of the coolant storage tank 3, which can accelerate the cold transfer to improve the cooling effect of the coolant. The cooling fan 8 can cool the heating surface of the semiconductor refrigeration plate 7. The semiconductor refrigeration plate 7 is fixed by a fixing buckle 14, which can be convenient for disassembly of the semiconductor refrigeration plate 7. The liquid level observation window 12 can penetrate the coolant liquid level height. After the coolant is lost, the coolant can be quickly replenished through the injection pipe 13. The coolant circulation structure is respectively integrated in the inner cavity of the No. 1 mold 1 and the No. 2 mold 2. It is compact and more convenient to use.

[0037] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation on the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the claims attached to the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the attached claims or the equivalent forms of such scope and boundaries.

Claims

1. An injection mold auxiliary molding device, comprising a first mold (1) and a second mold (2), wherein the second mold (2) is movably arranged on one side of the first mold (1), characterized in that: The inner cavities of the No. 1 mold (1) and the No. 2 mold (2) are both provided with mounting grooves, the bottoms of the inner cavities of the mounting grooves are both provided with cooling liquid storage boxes (3), and the surfaces of the cooling liquid storage boxes (3) respectively extend out of the cavities of the No. 1 mold (1) and the No. 2 mold (2); The inner cavity of the installation groove is provided with a circulating cooling pipe (5), and the surface of the circulating cooling pipe (5) is integrally formed with a contact plate (6), and the contact plate (6) abuts against the inner cavity surface of the No. 1 mold (1) and the No. 2 mold (2). The end surface of the cooling liquid storage tank (3) is installed with a circulating water pump (4), and the liquid outlet end of the circulating water pump (4) is respectively connected to one end of the circulating cooling pipe (5), and the end of the circulating cooling pipe (5) away from the circulating water pump (4) is conductively connected to the bottom of the side wall of the cooling liquid storage tank (3); Semiconductor cooling plates (7) are movably mounted on the surface of the cooling liquid storage box (3).

2. An injection mold auxiliary forming device according to claim 1, characterized in that: The surface of the cooling liquid storage box (3) is coated with thermally conductive silicone grease (11), and the cooling surface of the semiconductor cooling sheet (7) is in contact with the surface of the thermally conductive silicone grease (11).

3. An injection mold auxiliary forming device according to claim 2, characterized in that: A plurality of groups of through-holes (10) are equidistantly provided on a surface of one side of the coolant storage box (3), and heat-conducting rods (9) are inserted into the inner cavities of the through-holes (10).

4. The injection mold auxiliary forming device according to claim 3, characterized in that: One end of the heat-conducting rod (9) abuts against the cooling surface of the semiconductor cooling plate (7), and the other end of the heat-conducting rod (9) is inserted into the inner cavity of the cooling liquid storage tank (3).

5. The injection mold auxiliary forming device according to claim 4, characterized in that: The side walls of the cooling liquid storage box (3) are each embedded with a liquid level observation window (12), and the liquid level observation window (12) is respectively adjacent to one side of the surface of the No. 1 mold (1) and the No. 2 mold (2).

6. The injection mold auxiliary forming device according to claim 5, characterized in that: The top of the cooling liquid storage tank (3) is connected to a liquid injection pipe (13), and the top of the liquid injection pipe (13) is threadedly connected to a sealing cap.

7. The injection mold auxiliary forming device according to claim 6, characterized in that: The heating surface of the semiconductor refrigeration plate (7) is equipped with a heat dissipation fan (8), and the two side surfaces of the coolant storage box (3) are rotatably provided with fixing buckles (14), and the fixing buckles (14) are buckled on the two end surfaces of the semiconductor refrigeration plate (7).

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