Duct type air conditioner

Abstract

The utility model discloses a duct type air conditioner, which comprises a shell, a fan and a fan, the fan is close to the air return opening and is arranged in the shell; the heat exchanger is arranged in the shell and mounted between the air outlet side of the fan and the air outlet; the water pan is installed in the shell, located below the heat exchanger and used for containing condensate water generated when cold air flows through the heat exchanger during air conditioner refrigeration operation of the duct type air conditioner; the water storage area is concavely formed in the water receiving bottom surface of the water receiving disc and is positioned between the air outlet side of the fan and the air inlet side of the heat exchanger; the semiconductor refrigeration module is provided with a cold end and a hot end which are arranged up and down, the semiconductor refrigeration module is arranged in the water storage area, the heat dissipation part is in contact with condensate water in the water storage area, and the bottom surface of the cold end is higher than the water receiving bottom surface. The cold energy generated by the cold end of the semiconductor refrigeration module can be utilized to supplement the cold energy generated by the air conditioner, the hot end utilizes the cold energy in the condensate water to achieve the purpose of heat dissipation, and the purpose of transferring and recycling the cold energy of the condensate water is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of household appliances, in particular to a duct air conditioner. Background Art

[0002] Duct air conditioner is the abbreviation of hidden air conditioner, which can also be called air conditioner duct air conditioner or duct air conditioner. Since duct air conditioner solves the problem of wall mounted and cabinet air conditioner exposed outside and affecting the appearance, its demand is also increasing.

[0003] When the ducted air conditioner is in cooling mode, the water vapor in the air hits the low-temperature evaporator, forming condensed water that flows into the water tray.

[0004] A float switch and a drain pump are provided in the water collection pan. When the duct air conditioner is cooling or defrosting, the drain pump is controlled to start draining water. In this way, the cold energy in the condensed water will be discharged together with the condensed water, resulting in a waste of cold energy.

[0005] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0006] In response to the problems pointed out in the background technology, the present application provides a ducted air conditioner, which arranges a semiconductor refrigeration module in the water storage area of ​​the water receiving tray, uses the cold energy generated by the cold end of the semiconductor refrigeration module to supplement the cold energy generated by the air conditioner, and uses the cold energy in the condensed water at the hot end to achieve the purpose of heat dissipation, thereby realizing the purpose of transferring and reusing the cold energy of the condensed water.

[0007] In order to achieve the above-mentioned utility model purpose, the utility model adopts the following technical solutions:

[0008] The present application relates to a duct air conditioner, comprising:

[0009] A housing having an air return port and an air outlet, wherein a ventilation path is formed between the air return port and the air outlet;

[0010] A fan, which is arranged in the housing near the return air port;

[0011] a heat exchanger, which is disposed in the housing and installed between the air outlet side of the fan and the air outlet;

[0012] A water receiving tray, which is installed in the shell and located below the heat exchanger, and is used to receive condensed water generated when the cold air flows through the heat exchanger during the refrigeration operation of the duct air conditioner;

[0013] A water storage area, the depression of which is formed on the water receiving bottom surface of the water receiving tray and is located between the air outlet side of the fan and the air inlet side of the heat exchanger;

[0014] A semiconductor refrigeration module, which has a cold end and a hot end arranged up and down, a cooling portion attached to the top of the cold end, a heat dissipation portion attached to the bottom of the hot end, the semiconductor refrigeration module is placed in the water storage area, the heat dissipation portion is kept in contact with the condensed water in the water storage area, and the bottom surface of the cold end is higher than the water receiving bottom surface;

[0015] A control unit is connected to the fan and the semiconductor refrigeration module respectively.

[0016] The duct air conditioner involved in the present application, when the duct air conditioner is in cooling mode, the fan and the semiconductor refrigeration module also work, and the cold energy generated by the cold end of the semiconductor refrigeration module is blown to the heat exchanger via the fan, thereby increasing the cold energy of the heat exchanger.

[0017] At the same time, the heat generated by the hot end keeps in contact with the condensed water in the water receiving pan. Since the condensed water in the water receiving pan flows down from the low-temperature heat exchanger, the condensed water in the water receiving pan has a certain amount of coldness. Therefore, when the hot end is in contact with the water receiving pan, the hot end can exchange heat with the coldness in the condensed water in the water receiving pan, effectively utilizing the coldness in the condensed water to dissipate the heat from the hot end, thereby also improving the cooling efficiency of the semiconductor refrigeration module.

[0018] In addition, since the semiconductor refrigeration module is located between the fan and the heat exchanger, when the fan blows the cold energy generated by the cold end to the heat exchanger, a small amount of

[0019] In some embodiments of the present application, the upper portion of the heat exchanger is tilted away from the air inlet side of the fan toward the air outlet.

[0020] The inclined heat exchanger can facilitate condensed water to flow into the water receiving pan when condensed water is generated thereon.

[0021] In some embodiments of the present application, the water receiving tray comprises:

[0022] The slope portion is located on one side of the water storage area close to the air outlet, and is arranged in a downward slope from the air outlet to the return air outlet. The heat exchanger is located above the slope portion, the bottom surface of the cold end is higher than the lowest edge of the slope portion, and the lowest edge of the slope portion is higher than the water receiving bottom surface.

[0023] The sloped surface is provided to facilitate the condensed water to flow to the water storage area, thereby facilitating contact with the cold end of the semiconductor refrigeration module and improving the heat dissipation efficiency of the hot end.

[0024] In some embodiments of the present application, the bottom end of the heat exchanger abuts against the lowest point of the slope surface.

[0025] The inclined setting of the heat exchanger and the setting of the bottom end close to the water storage area both facilitate the condensed water on the heat exchanger to flow to the water storage area, thereby improving the heat dissipation efficiency of the hot end.

[0026] In some embodiments of the present application, the duct air conditioner further comprises:

[0027] a two-position float switch, which is placed in the water storage area and is capable of detecting a first water level and a second water level, the first water level being lower than the second water level;

[0028] A drainage pump, the water suction port of which faces the water receiving bottom surface and is arranged on one side of the water storage area close to the return air outlet;

[0029] When the control unit receives the first signal of the first water level detected by the two-position float switch, the semiconductor refrigeration module and the drainage pump are controlled to work; when the control unit receives the second signal of the second water level detected by the two-position float switch, the duct air conditioner is controlled to shut down.

[0030] The first water level of the double-position float switch is used to ensure heat exchange between the hot end and the water storage area and to control the operation of the drainage pump.

[0031] As the amount of condensed water increases, the drain pump can drain the excess condensed water from the water tray.

[0032] The small amount of heat and moisture generated by the semiconductor refrigeration module when it is working can be blown to the heat exchanger under the action of the fan, and will be reabsorbed and condensed again by the heat exchanger. It will not be blown out from the air outlet to increase the indoor temperature and humidity.

[0033] In some embodiments of the present application, the duct air conditioner further comprises:

[0034] An alarm unit is connected to the control unit and is used to control the alarm unit to issue an alarm prompt when the control unit receives the second signal.

[0035] The second water level in the double-position float switch serves as the alarm water level. When the water level reaches the second water level, it indicates that there may be a risk of overflow. At this time, the ducted air conditioner will shut down to avoid further condensation.

[0036] When there is a risk of water overflow, the alarm unit will sound an alarm to remind the user to deal with the water tray in time.

[0037] In some embodiments of the present application, the alarm unit is a light alarm circuit, a sound alarm circuit, or a sound and light alarm circuit.

[0038] In some embodiments of the present application, the cooling portion includes:

[0039] A cooling plate, which is arranged close to the cold end;

[0040] A plurality of cooling fins are arranged in parallel and at intervals on a side surface of the cooling plate away from the cold end.

[0041] The plurality of cooling fins on the cooling part involved in the present application can more efficiently transfer the cooling energy generated by the semiconductor refrigeration module.

[0042] In some embodiments of the present application, the heat dissipation unit includes:

[0043] A heat sink, which is arranged close to the hot end;

[0044] A plurality of heat dissipation fins are arranged in parallel and at intervals on a side surface of the heat dissipation plate away from the hot end.

[0045] The plurality of heat dissipation fins on the heat conducting part involved in the present application can more efficiently transfer the heat generated by the hot end of the semiconductor refrigeration module, thereby enabling heat exchange with the condensed water in the water storage area.

[0046] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0048] Figure 1 It is a principle block diagram of an existing air conditioner embodiment;

[0049] Figure 2 A schematic diagram of the refrigerant flow direction of a conventional air conditioner embodiment during cooling operation;

[0050] Figure 3 A schematic diagram of the refrigerant flow direction of a conventional air conditioner embodiment during heating operation;

[0051] Figure 4 It is a structural layout diagram of the duct air conditioner proposed in this application;

[0052] Figure 5 for Figure 4 A magnified view of part A;

[0053] Figure 6 It is a structural diagram of a semiconductor refrigeration module in an embodiment of a duct air conditioner proposed in this application;

[0054] Figure 7 A top view of the water receiving pan in the embodiment of the duct air conditioner proposed in the present application;

[0055] Figure 8 A side view of a water receiving tray in an embodiment of a duct air conditioner proposed in the present application;

[0056] Fig. 9 A circuit diagram of an acoustic alarm circuit in an embodiment of a duct air conditioner proposed in the present application;

[0057] Fig.10 A circuit diagram of a light alarm circuit in an embodiment of a duct air conditioner proposed in the present application;

[0058] Fig.11 This is a schematic diagram of the connection between the control unit and the water pump driver chip in the duct air conditioner embodiment proposed in this application.

[0059] Reference numerals:

[0060] 100, duct air conditioner; 110, housing; 111, return air outlet; 112, air outlet; 120, fan; 130, heat exchanger; 140, water collection tray; 141, water storage area; 142, slope portion; 143, water collection bottom surface; 150, semiconductor refrigeration module; 151, cold end; 151', cooling portion; 152, hot end; 152', heat dissipation portion; 160, drain pump; 170, double-position float switch; 180, control unit. DETAILED DESCRIPTION

[0061] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0062] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0063] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0064] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0065] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0066] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0067] <Basic working principle of air conditioner>

[0068] See also Figure 1 , the air conditioner performs the refrigeration cycle of the air conditioner by using a compressor, condenser, expansion valve and evaporator. The refrigeration cycle includes a series of processes involving compression, condensation, expansion and evaporation to cool or heat the indoor space.

[0069] The low-temperature and low-pressure refrigerant enters the compressor, which compresses it into high-temperature and high-pressure refrigerant gas and discharges the compressed refrigerant gas. The discharged refrigerant gas flows into the condenser. The condenser condenses the compressed refrigerant into a liquid phase, and the heat is released to the surrounding environment through the condensation process.

[0070] The expansion valve expands the high-temperature and high-pressure liquid refrigerant condensed in the condenser into a low-pressure liquid refrigerant. The evaporator evaporates the refrigerant expanded in the expansion valve and returns the low-temperature and low-pressure refrigerant gas to the compressor. The evaporator can achieve a cooling effect by utilizing the latent heat of evaporation of the refrigerant to exchange heat with the material to be cooled. In the entire cycle, the air conditioner can adjust the temperature of the indoor space.

[0071] The outdoor unit of the air conditioner refers to a portion of a refrigeration cycle including a compressor and an outdoor heat exchanger, the indoor unit of the air conditioner includes an indoor heat exchanger, and an expansion valve may be provided in the indoor unit or the outdoor unit.

[0072] The indoor heat exchanger and the outdoor heat exchanger function as a condenser or an evaporator. When the indoor heat exchanger functions as a condenser, the air conditioner functions as a heater in a heating mode, and when the indoor heat exchanger functions as an evaporator, the air conditioner functions as a cooler in a cooling mode.

[0073] See also Figure 2 , which shows the refrigerant flow direction when the air conditioner is in cooling operation.

[0074] The compressor compresses the low-temperature and low-pressure refrigerant into a high-temperature and high-pressure state, which enters the outdoor heat exchanger. After heat exchange in the outdoor heat exchanger, it condenses and releases heat to become liquid refrigerant. The refrigerant then passes through the throttling element and enters the indoor side.

[0075] The refrigerant entering the indoor heat exchanger on the indoor side evaporates and absorbs heat, turning into gas. The refrigerant coming out of the indoor heat exchanger is finally sucked into the compressor for compression, completing the refrigeration cycle.

[0076] See also Figure 3 , which shows the refrigerant flow direction when the air conditioner is in heating operation.

[0077] The compressor compresses the low-temperature and low-pressure refrigerant into a high-temperature and high-pressure state and enters the indoor heat exchanger.

[0078] After heat exchange inside the indoor heat exchanger, it condenses and releases heat to become liquid refrigerant. The refrigerant is then throttled to a low-temperature and low-pressure gas-liquid state through a throttling element. The two-phase refrigerant enters the outdoor heat exchanger, evaporates, absorbs heat, and becomes gaseous.

[0079] The refrigerant coming out of the outdoor heat exchanger is finally sucked into the compressor for compression, completing the heating cycle.

[0080] The duct air conditioner 100 is a type of air conditioner, and its refrigeration system is the same as that of a common air conditioner.

[0081] See also Figure 4 , which gives a structural schematic diagram of the duct air conditioner 100.

[0082] The duct air conditioner 100 includes a housing 110 , which is hidden in the ceiling and has an air return port 111 and an air outlet 112 .

[0083] The return air port 111 is used to return indoor airflow, and after heat exchange with the heat exchanger 130 (ie, the indoor heat exchanger as described above) in the duct air conditioner 100 , the return air port 111 is blown out to the room from the air outlet 112 .

[0084] In some embodiments of the present application, the return air port 111 and the air outlet 112 are arranged opposite to each other, and a gap is formed between the return air port 111 and the air outlet 112. Figure 4 The ventilation path is shown by the arrows.

[0085] The fan 120 is disposed in the housing 110 and close to the return air port 111 .

[0086] The duct air conditioner 100 further includes a heat exchanger 130 . When the duct air conditioner 100 is in a cooling mode, the heat exchanger 130 is used as an evaporator. When the duct air conditioner 100 is in a heating mode, the heat exchanger 130 is used as a condenser.

[0087] The heat exchanger 130 is arranged between the air outlet side of the fan 120 and the air outlet 112, that is, the fan 120 and the heat exchanger 130 are arranged in sequence along the ventilation path between the return air outlet 111 and the air outlet 112, so as to draw out the return air at the return air outlet 111 through the fan 120, and send it out from the air outlet 112 after heat exchange through the heat exchanger 130.

[0088] In some embodiments of the present application, see Figure 4 The upper portion of the heat exchanger 130 is tilted toward the air outlet 112 to increase the heat exchange area with the return air flow.

[0089] When the ducted air conditioner 100 is in cooling operation, the return airflow will generate condensed water on the surface of the heat exchanger 130 used as an evaporator. Generally, a water receiving pan 140 is arranged below the heat exchanger 130 to receive the condensed water (see Figure 4 ), which is used to receive condensed water generated when the airflow passes through the low-temperature surface of the heat exchanger 130 during the cooling operation of the duct air conditioner 100.

[0090] The inclined heat exchanger 130 makes it easier for condensed water thereon to flow to the water receiving pan 140 below the heat exchanger 130 .

[0091] The drain pump 160 may be installed in the water receiving pan 140 to guide the condensed water in the water receiving pan 140 to the outside when the drain pump 160 is started.

[0092] Generally, the water receiving bottom surface 143 at the bottom of the water receiving tray 140 is horizontal. In order to ensure that the hot end 152 of the semiconductor refrigeration module 150 can always keep in contact with the condensed water in the water receiving tray 140, see Figure 4 , Figure 5 , Figure 7 and Figure 8 The water receiving bottom surface 143 of the water receiving tray 140 is recessed to form a water storage area 141 .

[0093] Since the water storage area 141 is recessed compared to the water receiving bottom surface 143 of the water receiving tray 140 , when condensed water first exists in the water receiving tray 140 , it will flow into the water storage area 141 first.

[0094] In some embodiments of this application, see Figure 4 and Figure 5 The water storage area 141 is located between the air outlet side of the fan 120 and the air inlet side of the heat exchanger 130, and the semiconductor refrigeration module 150 is arranged in the water storage area 141, so that the fan 120 blows the cold energy generated by the upper cold end 151 of the semiconductor refrigeration module 150 to the heat exchanger 130.

[0095] See also Figure 6 The semiconductor refrigeration module 150 as described above includes a cold end 151 and a hot end 152 arranged up and down, the cooling portion 151 ′ is attached to the top of the cold end 151 and the heat dissipation portion 152 ′ is attached to the bottom of the hot end 152 .

[0096] The cooling portion 151' is used to conduct the cold energy generated by the cold end 151, and the heat dissipation portion 152' is used to conduct the heat generated by the hot end 152. When the semiconductor refrigeration module 150 is placed in the water storage area 141, the heat dissipation portion maintains contact with the condensed water in the water storage area 141, and is used to perform heat exchange with the heat of the condensed water, that is, the hot end 152 is dissipated by utilizing the cold energy in the condensed water, which helps to improve the refrigeration efficiency of the semiconductor refrigeration module 150 and achieve the purpose of recycling the cold energy in the condensed water.

[0097] See also Figure 5 The bottom surface of the cold end 151 is higher than the water receiving bottom surface 143 , so as to prevent the cold energy generated by the cold end 151 from being transferred to the condensed water in the water receiving pan 140 .

[0098] In some embodiments of the present application, in order to more effectively transfer the cold generated by the cold end 151 and the heat generated by the hot end 152, see Figure 6 The cooling portion 151 ′ includes a cooling plate (not marked) and a plurality of cooling fins (not marked).

[0099] The cooling plate is attached to the top surface of the cold end 151 , and a plurality of cooling fins are arranged in parallel and at intervals on a side surface of the cooling plate away from the cold end 151 .

[0100] The cold energy generated by the cold end 151 is transferred to the cooling plate, and then to a plurality of cooling fins. Since the plurality of cooling fins are arranged in parallel and spaced apart, the cooling area is increased and the cooling energy transfer speed is improved.

[0101] Similarly, the heat dissipation portion 152 ′ includes a heat dissipation sheet (not labeled) and a plurality of heat dissipation fins (not labeled).

[0102] The heat sink is attached to the bottom surface of the hot end 152 , and a plurality of heat sink fins are arranged in parallel and at intervals on a side surface away from the hot end 152 .

[0103] The heat generated by the hot end 152 is transferred to the heat sink, and the heat sink is then transferred to a plurality of heat sink fins. Since the plurality of heat sink fins are arranged in parallel and spaced apart, the heat dissipation area is increased, thereby improving the heat exchange rate between the heat and the condensed water in the water storage area 141.

[0104] In some embodiments of the present application, see Figures 4 to 8 In order to conveniently and quickly introduce the condensed water into the water storage area 141 , the water receiving tray 140 includes a slope portion 142 .

[0105] The slope portion 142 is located on a side of the water storage area 141 close to the air outlet 112 , and is arranged in a downward slope from the air outlet 112 to the air return port 111 .

[0106] The heat exchanger 130 is tilted above the slope portion 142, the bottom surface of the cold end 151 is higher than the lowest edge of the slope portion 142, and the lowest edge of the slope portion 142 is higher than the water receiving bottom surface 143 of the water receiving tray 140, so as to prevent the cold end 151 from contacting the condensed water in the water storage area 141.

[0107] The slope design of the slope portion 142 facilitates the rapid guidance of condensed water generated on the heat exchanger 130 into the water storage area 141 , thereby improving the water storage efficiency.

[0108] The downslope plane of the slope portion 142 is configured as an arc-shaped buffer surface, which guides the condensed water and buffers the impact of the condensed water on the condensed water in the water storage area 141 .

[0109] In some embodiments of the present application, the bottom end of the heat exchanger 130 abuts against the lowest point of the slope portion 142 .

[0110] A portion of the condensed water generated on the heat exchanger 130 can flow directly into the water storage area 141 through the inclined heat exchanger 130 , and a portion of the condensed water can drip onto the slope portion 142 and be guided into the water storage area 141 through the slope portion 142 .

[0111] In some embodiments of the present application, in order to ensure that the heat dissipation portion 152' maintains contact with the condensed water in the water storage area 141 and effectively utilize the coldness of the condensed water, it is necessary to ensure the water level in the water storage area 141 so that the water in the water storage area 141 can maintain contact with the heat dissipation portion 152' during the operation of the semiconductor refrigeration module 150.

[0112] See also Figure 4 and Figure 5 The duct air conditioner 100 further includes a double-position float switch 170, which is disposed in the water storage area 141 and is capable of detecting a first water level and a second water level, wherein the first water level is lower than the second water level.

[0113] Both the first water level and the second water level can be preset water levels.

[0114] The first water level may be a water level that ensures that the heat dissipation portion 152 ′ maintains contact with the condensed water in the water storage area 141 , and the second water level is a warning water level in the water receiving tray 140 .

[0115] A drainage pump 160 is also provided in the water receiving tray 140 , and the drainage pump 160 is provided on one side of the water storage area 141 close to the return air outlet 111 .

[0116] The water suction port of the drain pump 160 faces the water receiving bottom surface 143 of the water receiving tray 140 , that is, when the water in the water storage area 141 overflows, the water receiving bottom surface 143 begins to accumulate condensed water.

[0117] When the water level in the water receiving tray 140 reaches the second water level, it indicates that there may be a risk of overflow or the water level is high enough to contact the cold end 151 of the semiconductor refrigeration module 150. At this time, an early warning reminder is issued and the duct air conditioner 100 is controlled to shut down to check whether the drain pump 160 is damaged.

[0118] In some embodiments of the present application, the first water level may be set to a water level corresponding to the water in the water storage area 141 exceeding half the height of the heat dissipation portion 152 ′.

[0119] When the duct air conditioner 100 is in heating operation or air supply operation, the semiconductor refrigeration module 150 does not work, and the heat exchanger 130 is used as a condenser, and condensed water is basically not generated in the water receiving tray 140.

[0120] When the duct air conditioner 100 is in cooling operation, the semiconductor refrigeration module 150 is in operation, and the heat exchanger 130 is used as an evaporator, and condensed water is generated in the water receiving pan 140 .

[0121] In the initial stage of cooling operation of the duct air conditioner 100, less condensed water is generated, and at this time, the double-position float switch 170 does not operate.

[0122] As the refrigeration operation time increases, the amount of condensed water generated continues to increase, and the condensed water first accumulates in the water storage area 141 .

[0123] When the control unit 180 receives the first signal that the double-position float switch 170 detects the first water level, it indicates that the water level in the current water storage area 141 has reached the first water level. At this time, the semiconductor refrigeration module 150 starts to work, and the condensed water in the water storage area 141 can dissipate heat to the hot end 152 to prevent the hot end 152 from being overheated.

[0124] When the control unit 180 receives the first signal corresponding to the first water level, the drainage pump 160 is also turned on.

[0125] As the condensed water continues to increase, when the water in the water storage area 141 is full and overflows to the water receiving bottom surface 143, since the drainage pump 160 has started to work, the excess condensed water can be discharged to the outside to avoid excessive condensed water in the water receiving tray 140.

[0126] During the operation of the semiconductor refrigeration module 150, the condensed water generated by the heat exchanger 130 first flows through the slope portion 142 to the water storage area 141. After the condensed water in the water storage area 141 exchanges heat with the hot end 152, it overflows from the water storage area 141 to the water receiving bottom surface 143 and is discharged to the outside by the drainage pump 160, thereby avoiding waste of cooling capacity in the condensed water.

[0127] Since the semiconductor refrigeration module 150 is located between the fan 120 and the heat exchanger 130 , the cold energy generated by the cold end 151 of the semiconductor refrigeration module 150 can be blown to the heat exchanger 130 through the fan 120 for heat exchange and then sent to the air outlet 112 , thereby supplementing the cold energy generated by the heat exchanger 130 .

[0128] At the same time, if a small amount of heat and moisture is generated when the semiconductor refrigeration module 150 is working, the heat and moisture will also be absorbed by the heat exchanger 130, and the water vapor will re-condense and flow back to the water receiving tray 140, and will not be brought into the indoor environment to affect the temperature and humidity of the indoor environment.

[0129] When the control unit 180 receives the second signal corresponding to the second water level, the control unit 180 controls the duct air conditioner 100 to shut down to avoid further generation of condensed water.

[0130] In some embodiments of the present application, the duct air conditioner 100 may include an alarm unit, which is connected to the control unit 180 and is used to issue an alarm prompt when the control unit 180 receives a second signal corresponding to the second water level, to remind the user to drain the water manually in time.

[0131] In some embodiments of the present application, see Fig. 9The alarm unit may be a sound alarm circuit, which outputs a sound alarm reminder when the control unit 180 receives the second signal corresponding to the second water level.

[0132] The alarm unit may include a switch unit and a buzzer BZ1 to warn the user through the buzzing sound of the buzzer BZ1.

[0133] The switch unit is controlled by the control unit 180 (eg, a single-chip microcomputer chip), and the switch unit may also be an NPN transistor Q1.

[0134] One end of the base current limiting resistor R3 is connected to the output port of the microcontroller chip, and the other end is connected to the base of the NPN transistor Q1. The emitter is grounded, and the collector is connected to the power supply +5VDC through the pull-up resistor R2. The power supply end of the buzzer BZ1 is connected to the power supply +5VDC, and the ground end of the buzzer BZ1 is connected to the collector of the NPN transistor Q1.

[0135] When the control unit 180 receives the second signal corresponding to the second water level, the output port outputs the signal BUZ to control the NPN transistor Q1 to be turned on, so that the power supply +5VDC supplies power to the buzzer BZ1, and at this time the buzzer BZ1 is controlled to emit a buzzing sound.

[0136] In some embodiments of the present application, see Fig.10 The alarm unit may be a light alarm circuit, which outputs a light alarm reminder when the control unit 180 receives the second signal corresponding to the second water level.

[0137] The alarm unit may include a current limiting resistor R1 and an indicator light D1 connected in series.

[0138] The anode of the indicator light D1 is connected to the power supply +5VDC, the cathode is connected to one end of the current limiting resistor R1, and the other end of the current limiting resistor R1 is connected to the output port of the single-chip microcomputer chip.

[0139] When the control unit 180 receives the second signal corresponding to the second water level, the corresponding output port outputs a signal LED to control the indicator light D1 to light up.

[0140] In this way, the user can obtain the alarm information by observing the lighting condition of the indicator light D1.

[0141] In some embodiments of the present application, a first float switch and a second float switch may also be provided.

[0142] The first float switch is disposed in the water storage area 141 and is used to detect a first water level.

[0143] The second float switch is disposed in the water receiving tray 140 and is used to detect a third water level, which is the difference between the second water level and the first water level as described above.

[0144] When the first float switch is actuated, it indicates that the water level in the water storage area 141 has reached the first water level.

[0145] When the water level in the water storage area 141 is full and overflows to the water receiving bottom surface 143 and the second float switch is actuated, it indicates that the water level in the water receiving tray 140 has reached the warning water level.

[0146] In some embodiments of the present application, the duct air conditioner 100 also includes a water pump drive unit (not shown), which is connected to the control unit 180 and is used to receive a PWM pulse drive signal issued by the control unit 180, and control the operation of the drainage pump 160 based on the PWM pulse drive signal.

[0147] See also Fig.11 The water pump driving unit includes a water pump driving chip having a PWM pin, and the PWM pin is used to receive a PWM pulse driving signal.

[0148] The water pump driving chip also has an overcurrent protection function, and an overcurrent protection circuit is set on its periphery to achieve current limiting protection for the drain pump 160 motor.

[0149] The water pump driving chip has a first pin, a second pin and a third pin, and the overcurrent protection circuit is arranged between the first pin, the second pin and the third pin.

[0150] The overcurrent protection circuit includes a first resistor R11, a second resistor R21 and a third resistor R31.

[0151] The first pin is grounded through a first resistor R11 , the second pin is grounded through a second resistor R21 , and the third pin is connected to a connection point where the second pin and the second resistor R21 are connected through a third resistor R31 .

[0152] The overcurrent protection limit of the motor of the drain pump 160 can be set by setting the values ​​of each resistor, and different overcurrent protection limit values ​​can be set by changing the values ​​of each resistor.

[0153] The water pump driving chip also has a speed feedback pin, which is connected to the input pin of the control unit 180, and is used for the control unit 180 to detect the speed of the drainage pump 160 in real time and perform closed-loop control on the speed to achieve stable and controllable speed.

[0154] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0155] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited to this. Any changes or substitutions that can be easily thought of by technicians familiar with the technical field within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A duct air conditioner, characterized in that: include: A housing having an air return port and an air outlet, wherein a ventilation path is formed between the air return port and the air outlet; A fan, which is arranged in the housing near the return air port; a heat exchanger, which is disposed in the housing and installed between the air outlet side of the fan and the air outlet; A water receiving tray, which is installed in the shell and located below the heat exchanger, and is used to receive condensed water generated when the cold air flows through the heat exchanger during the refrigeration operation of the duct air conditioner; A water storage area, the depression of which is formed on the water receiving bottom surface of the water receiving tray and is located between the air outlet side of the fan and the air inlet side of the heat exchanger; A semiconductor refrigeration module, which has a cold end and a hot end arranged up and down, a cooling portion attached to the top of the cold end, a heat dissipation portion attached to the bottom of the hot end, the semiconductor refrigeration module is placed in the water storage area, the heat dissipation portion is kept in contact with the condensed water in the water storage area, and the bottom surface of the cold end is higher than the water receiving bottom surface; A control unit is connected to the fan and the semiconductor refrigeration module respectively.

2. The duct air conditioner according to claim 1, characterized in that: The upper portion of the heat exchanger is arranged to be inclined away from the air inlet side of the fan and toward the air outlet.

3. The duct air conditioner according to claim 1, characterized in that: The water receiving tray comprises: The slope portion is located on one side of the water storage area close to the air outlet, and is arranged in a downward slope from the air outlet to the return air outlet. The heat exchanger is located above the slope portion, the bottom surface of the cold end is higher than the lowest edge of the slope portion, and the lowest edge of the slope portion is higher than the water receiving bottom surface.

4. The duct air conditioner according to claim 3, characterized in that: The bottom end of the heat exchanger abuts against the lowest point of the slope surface.

5. The duct air conditioner according to claim 3, characterized in that: The duct air conditioner also includes: a two-position float switch, which is placed in the water storage area and is capable of detecting a first water level and a second water level, the first water level being lower than the second water level; A drainage pump, whose water suction port faces the water receiving bottom surface and is arranged on one side of the water storage area close to the return air outlet; When the control unit receives the first signal of the first water level detected by the two-position float switch, the semiconductor refrigeration module and the drainage pump are controlled to work; when the control unit receives the second signal of the second water level detected by the two-position float switch, the duct air conditioner is controlled to shut down.

6. The duct air conditioner according to claim 5, characterized in that: The duct air conditioner also includes: An alarm unit is connected to the control unit and is used to control the alarm unit to issue an alarm prompt when the control unit receives the second signal.

7. The duct air conditioner according to claim 6, characterized in that: The alarm unit is a light alarm circuit, a sound alarm circuit or a sound and light alarm circuit.

8. The duct air conditioner according to claim 1, characterized in that: The cooling part comprises: A cooling plate, which is arranged close to the cold end; A plurality of cooling fins are arranged in parallel and at intervals on a side surface of the cooling plate away from the cold end.

9. The duct air conditioner according to claim 1, characterized in that: The heat dissipation unit comprises: A heat sink, which is arranged close to the hot end; A plurality of heat dissipation fins are arranged in parallel and at intervals on a side surface of the heat dissipation plate away from the hot end.

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