Vehicle-mounted chip reliability effectiveness testing device

Abstract

The utility model belongs to the field of testing, particularly relates to a vehicle-mounted chip reliability effectiveness testing device, and aims to solve the problems that a chip is inconvenient to fix, place and take out due to the fact that a position for placing the chip is located in the device and the chip is easy to collide, so that the chip is not easy to be damaged before and after being detected when the chip is detected in the prior art. In order to solve the problems that in the prior art, a large amount of time is wasted, a chip is easily damaged, and the detection efficiency of the chip is reduced, the following scheme is provided, the device comprises a bottom plate, a supporting column and a top box, the top box is provided with a display screen used for displaying data, and the top of the top box is provided with a placement groove used for chip testing; according to the vehicle-mounted chip reliability testing device, the reliability effectiveness test of the vehicle-mounted chip can be realized, meanwhile, the chip is more convenient to place, clamp and fix, the testing efficiency and accuracy are improved, the collision damage to the chip can be reduced when the chip is taken out and placed, and the normal test of the chip is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of testing, in particular to a reliability effectiveness testing device for a vehicle-mounted chip. Background Art

[0002] Automotive chips are also known as vehicle-grade chips. There are four levels of chips: military grade, automotive grade, industrial grade, and civilian / commercial grade. Mainly due to the influence of safety and working environment, the production standards of automotive chips are higher than those of industrial and civilian-grade chips. Their temperatures are between minus 40 degrees Celsius and 125 degrees Celsius. The circuit design adopts multi-level lightning protection design, dual transformer design, anti-interference technology, multiple short circuits, multiple thermal protections, ultra-high voltage protection, etc. Effectiveness analysis is part of product reliability work. Simply put, effectiveness analysis is to analyze the product and find out under what factors the automotive chip will be damaged.

[0003] After searching, the patent with announcement number CN218181031U discloses a vehicle-mounted chip reliability failure test device, including a fixed bracket, the upper end face of the fixed bracket is fixedly connected to a test bench, the lower end face of the fixed bracket is fixedly connected to a base, a control panel is provided at the center of one side of the upper end face of the test bench, a flip cover is provided at the center of the test bench, a test chamber is provided at the center of the test bench, a main control processing circuit is provided on one side of the test chamber, an environmental simulation device is provided inside the test bench and the fixed bracket, and a sealed temperature insulation device is provided inside the test bench and the test chamber. In the present utility model, the working conditions of the vehicle-mounted chip under high and low temperature and vehicle driving vibration conditions are tested by the provided environmental simulation device, which solves the problem of single detection environment and improves the diversity of vehicle-mounted chip effectiveness failure tests.

[0004] However, the above technical solution has the following problems: when the chip is tested, the chip is placed inside the device, which makes it inconvenient to fix and place it, and it is also inconvenient to take it out. It is also easy to cause bumps on the chip, which wastes a lot of time before and after the test and is easy to cause damage to the chip, reducing the detection efficiency of the chip. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art that when testing chips, the position where the chip is placed is located inside the device, which makes it inconvenient to fix and place the chip, and it is also inconvenient to take it out, and it is easy to cause bumps to the chip, resulting in a lot of time wasted before and after the chip is tested and the chip is easily damaged, thereby reducing the detection efficiency of the chip. A vehicle-mounted chip reliability effectiveness test device is proposed to solve the shortcomings of the prior art that the chip is placed inside the device, which makes it inconvenient to fix and place the chip, and it is also inconvenient to take it out, and it is easy to cause bumps to the chip, resulting in a lot of time wasted before and after the chip is tested and it is easy to cause damage to the chip, thereby reducing the detection efficiency of the chip.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A vehicle-mounted chip reliability effectiveness test device comprises a bottom plate, a support column and a top box, wherein the top box is provided with a display screen for displaying data, the top of the top box is provided with a placement slot for chip testing, the inner walls on both sides of the placement slot are respectively provided with an electric infrared heating device and a semiconductor cooling sheet for testing the chip, the top of the support column is fixedly connected to the bottom of the top box, the bottom of the support column is fixedly connected to the top of the bottom plate, and the bottom of the bottom plate is fixedly connected with a locking universal wheel for facilitating movement of the device;

[0008] A lifting mechanism is arranged inside the placement slot to facilitate the placement and removal of the chip;

[0009] A clamping mechanism, which is arranged on the lifting mechanism to facilitate clamping of the chip;

[0010] The fixing mechanism is arranged on the clamping mechanism to facilitate fixing of different chips.

[0011] In a possible design, the lifting mechanism includes an electric telescopic rod, a placement plate and four vertical poles. The fixed end of the electric telescopic rod extends to the bottom inner wall of the placement groove and is fixedly connected to the top box. The telescopic end of the electric telescopic rod is fixedly connected to the bottom of the placement plate. One ends of the four vertical poles are fixedly connected to the bottom inner wall of the same placement groove. The other ends of the four vertical poles are fixedly provided with anti-collision pads. The tops of the four anti-collision pads are respectively attached to the four corners of the bottom of the same placement plate.

[0012] In a possible design, the clamping mechanism includes a bidirectional screw rod, a No. 1 rotating handle, two clamping plates, four moving rods and four moving blocks, the placement plate is provided with two rectangular holes, the two ends of the bidirectional screw rod are respectively rotatably connected to the inner wall on one side away from the two rectangular holes, one end of the bidirectional screw rod is fixedly connected to a No. 1 column, one end of the No. 1 column passes through an inner wall on one side of the rectangular hole and is fixedly connected to one side of the No. 1 rotating handle, the No. 1 column is rotatably connected to the placement plate, two moving nuts are threadedly connected to the bidirectional screw rod, the two clamping plates are respectively arranged on the two moving nuts, the two clamping plates are shaped into an L-shape for convenient clamping of the chip, the four moving rods are respectively movably arranged on both sides of the bottom of the two clamping plates, the tops of the four moving blocks are respectively fixedly connected to the bottoms of the four moving rods, and the bottoms of the four moving blocks are all slidably connected to the top of the same placement plate.

[0013] In a possible design, the fixing mechanism includes two No. 2 rotating handles, two threaded columns and two connecting blocks, the bottoms of the two No. 2 rotating handles are respectively fixedly connected to the tops of the two threaded columns, the two threaded columns are respectively threadedly connected to the two connecting blocks, the sides of the two connecting blocks that are close to each other are respectively fixedly connected to the sides of the two clamping plates that are far away from each other, the bottoms of the two threaded columns are respectively fixedly connected to the outer sides of the two moving nuts, sliding grooves are provided on both sides of the bottoms of the two clamping plates, and the outer sides of the four moving rods are respectively slidably connected to the inner walls of the four sliding grooves.

[0014] In a possible design, the bottoms of the two clamping plates are fixedly connected with soft pads to reduce compression damage to the chip.

[0015] In a possible design, the placement plate is provided with an arc-shaped notch for facilitating the placement and holding of the chip.

[0016] In the present application, when in use, the cover on the device is opened, and then the electric telescopic rod is started through the controller, and the telescopic end of the electric telescopic rod drives the placement plate to rise, and then the chip to be tested is placed on the placement plate, and the bidirectional screw is driven to rotate by the No. 1 rotating handle, and the bidirectional screw drives the moving nut, and the moving nut drives the two clamping plates to clamp the chip, and then the threaded column is driven to rotate by the No. 2 rotating handle, and the threaded column drives the two connecting plates to descend, and then drives the two clamping plates to clamp the chip, and the pressure damage to the chip is reduced by the soft pad. When the clamping plate descends, the vertical rod and the sliding groove slide against each other to prevent the clamping plate from rotating, and then the chip and the placement plate are lowered into the placement groove through the electric telescopic rod, and then the chip is temperature tested by the electric infrared heating equipment and semiconductor refrigeration plate on the device to ensure the reliability and effectiveness of the chip, and then the test data is displayed on the display screen on the device.

[0017] The beneficial effects of the utility model are:

[0018] In the utility model, the reliability and effectiveness test of the vehicle-mounted chip can be realized through the lifting mechanism, the clamping mechanism and the fixing mechanism. At the same time, the placement, clamping and fixing of the chip are more convenient, the efficiency and accuracy of the test are improved, and the damage to the chip can be reduced when the chip is taken out and placed, thereby ensuring the normal testing of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0020] Figure 2 It is a top view of the utility model;

[0021] Figure 3 It is a partial cross-sectional schematic diagram of the utility model;

[0022] Figure 4 It is a partial exploded view of the utility model.

[0023] In the figure: 1. top box; 2. support column; 3. bottom plate; 4. locking universal wheel; 5. placement slot; 6. placement plate; 7. electric telescopic rod; 8. vertical rod; 9. clamping plate; 10. cushion; 11. two-way screw; 12. No. 1 rotating handle; 13. No. 2 rotating handle; 14. threaded column; 15. connecting block; 16. moving rod; 17. moving block. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Embodiment 1

[0026] Reference Figure 1 -

[0027] Figure 4 A testing device includes a base plate 3, a support column 2, a top box 1, and a lifting mechanism, a clamping mechanism and a fixing mechanism for chip testing.

[0028] The overall structure of the device is supported by a base plate 3, to which a top box 1 is fixedly connected via a support column 2. A display screen is provided on the top of the top box 1 for displaying test data. A placement slot 5 is also provided on the top of the top box 1 for chip testing. Electric infrared heating equipment and semiconductor cooling sheets are provided on the inner walls on both sides of the placement slot 5 for temperature simulation testing of the chip. A locking universal wheel 4 is fixed to the bottom of the base plate 3 to facilitate the overall movement of the device.

[0029] The lifting mechanism includes an electric telescopic rod 7, a placement plate 6 and four vertical rods 8. The fixed end of the electric telescopic rod 7 is installed inside the bottom inner wall of the placement groove 5 and is fixedly connected to the top box 1. The telescopic end of the electric telescopic rod 7 is fixedly connected to the bottom of the placement plate 6. The placement plate 6 is lifted and lowered by the telescopic action of the electric telescopic rod 7, thereby facilitating the placement and removal of chips. One end of the four vertical rods 8 is fixedly connected to the bottom inner wall of the placement groove 5, and the other end is fixedly provided with an anti-collision pad to prevent the placement plate 6 from colliding with the bottom inner wall of the placement groove 5 during the lifting process.

[0030] The clamping mechanism includes a bidirectional screw rod 11, a No. 1 rotating handle 12, two clamping plates 9, four moving rods 16 and four moving blocks 17. Two rectangular holes are provided on the placement plate 6. The two ends of the bidirectional screw rod 11 are respectively rotatably connected to the inner wall of one side away from the two rectangular holes. One end of the bidirectional screw rod 11 is fixedly connected to a No. 1 column. One end of the No. 1 column passes through the inner wall of one side of the rectangular hole and is fixedly connected to one side of the No. 1 rotating handle 12. The No. 1 column is rotatably connected to the placement plate 6. Two moving nuts are threadedly connected to the bidirectional screw rod 11. The two clamping plates 9 are respectively arranged on the two moving nuts. The shape of the two clamping plates 9 is set to L-shape, which is convenient for clamping the chip. The four moving rods 16 are respectively movably arranged on both sides of the bottom of the two clamping plates 9. The tops of the four moving blocks 17 are respectively fixedly connected to the bottoms of the four moving rods 16, and the bottoms of the four moving blocks 17 are all slidably connected to the top of the same placement plate 6 to ensure stable movement of the clamping plate 9.

[0031] The fixing mechanism includes two No. 2 rotating handles 13, two threaded columns 14 and two connecting blocks 15. The bottoms of the two No. 2 rotating handles 13 are fixedly connected to the tops of the two threaded columns 14, respectively. The two threaded columns 14 are threadedly connected to the two connecting blocks 15, respectively. The sides of the two connecting blocks 15 that are close to each other are fixedly connected to the sides of the two clamping plates 9 that are away from each other, and the bottoms of the two threaded columns 14 are fixedly connected to the outer sides of the two movable nuts, respectively. By rotating the No. 2 rotating handle 13, the height of the clamping plate 9 can be adjusted to facilitate adapting to chips of different sizes. Sliding grooves are provided on both sides of the bottom of the two clamping plates 9, and the outer sides of the four moving rods 16 are slidably connected to the inner walls of the four sliding grooves, respectively, to ensure the stability of the clamping plate 9 during movement.

[0032] The present application can be used in the field of chip testing, and can also be used in other fields applicable to the present application.

[0033] Embodiment 2

[0034] refer to Figure 1 -

[0035] Figure 4 , based on the improvement of the first embodiment, a vehicle-mounted chip reliability effectiveness testing device comprises:

[0036] In order to reduce the compression damage to the chip, the bottoms of the two clamping plates 9 are fixedly connected with soft pads 10 .

[0037] The placement plate 6 is also provided with an arc-shaped notch to facilitate the placement and holding of the chip.

[0038] However, as is well known to those skilled in the art, the working principles and wiring methods of the electric telescopic rod 7, display screen, electric infrared heating device and semiconductor cooling plate are commonplace, and are all conventional means or common knowledge, and will not be elaborated here. Those skilled in the art can make any optional selections according to their needs or convenience. The working principles of the display screen, electric infrared heating device and semiconductor cooling plate are the same as those of the patent with announcement number CN218181031U, so they will not be elaborated in this article.

[0039] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A reliability effectiveness testing device for a vehicle-mounted chip, characterized in that: The device comprises a bottom plate (3), a support column (2) and a top box (1), wherein the top box (1) is provided with a display screen for displaying data, the top of the top box (1) is provided with a placement groove (5) for chip testing, the inner walls on both sides of the placement groove (5) are respectively provided with an electric infrared heating device and a semiconductor cooling sheet for testing the chip, the top of the support column (2) is fixedly connected to the bottom of the top box (1), the bottom of the support column (2) is fixedly connected to the top of the bottom plate (3), and the bottom of the bottom plate (3) is fixedly connected with a locking universal wheel (4) for facilitating movement of the device; A lifting mechanism, the lifting mechanism being arranged inside the placement slot (5) to facilitate placement and removal of the chip; A clamping mechanism, which is arranged on the lifting mechanism to facilitate clamping of the chip; The fixing mechanism is arranged on the clamping mechanism to facilitate fixing of different chips.

2. The reliability effectiveness testing device for a vehicle-mounted chip according to claim 1, characterized in that: The lifting mechanism comprises an electric telescopic rod (7), a placement plate (6) and four vertical rods (8); the fixed end of the electric telescopic rod (7) extends to the inside of the bottom inner wall of the placement groove (5) and is fixedly connected to the top box (1); the telescopic end of the electric telescopic rod (7) is fixedly connected to the bottom of the placement plate (6); one end of the four vertical rods (8) is fixedly connected to the bottom inner wall of the same placement groove (5); the other ends of the four vertical rods (8) are fixedly provided with anti-collision pads; the tops of the four anti-collision pads are respectively attached to the four corners of the bottom of the same placement plate (6).

3. The reliability effectiveness testing device for a vehicle-mounted chip according to claim 2, characterized in that: The clamping mechanism comprises a bidirectional screw rod (11), a first rotating handle (12), two clamping plates (9), four moving rods (16) and four moving blocks (17); two rectangular holes are provided on the placement plate (6); two ends of the bidirectional screw rod (11) are respectively rotatably connected to inner walls of one side away from the two rectangular holes; one end of the bidirectional screw rod (11) is fixedly connected to a first column; one end of the first column passes through an inner wall of one side of the rectangular hole and is fixedly connected to one side of the first rotating handle (12); the first column is rotatably connected to the placement plate (6) The two-way screw rod (11) is threadedly connected with two movable nuts, and the two clamping plates (9) are respectively arranged on the two movable nuts. The shapes of the two clamping plates (9) are both arranged in an L shape for facilitating the clamping of the chip. The four movable rods (16) are respectively movably arranged on both sides of the bottom of the two clamping plates (9), and the tops of the four movable blocks (17) are respectively fixedly connected to the bottoms of the four movable rods (16), and the bottoms of the four movable blocks (17) are all slidably connected to the top of the same placement plate (6).

4. The reliability effectiveness testing device for a vehicle-mounted chip according to claim 3, characterized in that: The fixing mechanism comprises two No. 2 rotating handles (13), two threaded columns (14) and two connecting blocks (15); the bottoms of the two No. 2 rotating handles (13) are respectively fixedly connected to the tops of the two threaded columns (14); the two threaded columns (14) are respectively threadedly connected to the two connecting blocks (15); the sides of the two connecting blocks (15) that are close to each other are respectively fixedly connected to the sides of the two clamping plates (9) that are far away from each other; the bottoms of the two threaded columns (14) are respectively fixedly connected to the outer sides of the two moving nuts; sliding grooves are provided on both sides of the bottoms of the two clamping plates (9); and the outer sides of the four moving rods (16) are respectively slidably connected to the inner walls of the four sliding grooves.

5. The reliability effectiveness testing device for a vehicle-mounted chip according to claim 3, characterized in that: The bottoms of the two clamping plates (9) are fixedly connected with soft pads (10) for reducing compression damage to the chip.

6. The reliability effectiveness testing device for a vehicle-mounted chip according to claim 2, characterized in that: The placement plate (6) is provided with an arc-shaped notch for facilitating the placement and holding of the chip.

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