Electrostatic chuck exposure machine for semiconductor

Abstract

The utility model discloses an electrostatic chuck exposure machine for a semiconductor, which comprises a main support assembly, an auxiliary support assembly arranged on the side part of the main support assembly, an air supply assembly arranged at the top of the main support assembly, an exposure assembly arranged inside the main support assembly, a table frame movement control assembly arranged on the auxiliary support assembly, and an exposure assembly arranged on the table frame movement control assembly. A table frame module is arranged at the moving part of the table frame moving control assembly, and a control module is arranged on the outer side wall of the main supporting assembly. According to the technical scheme, the electrostatic chuck exposure machine for the semiconductor is ingenious in structural design and high in practicability, can be used for exposing working objects with different appearance sizes and adjusting the placement of the working objects to a proper exposure station, solves the limitation that the conventional exposure machine can only carry out exposure operation on regular and thin products, and can be used for greatly improving the exposure efficiency of the semiconductor. And the LED scanning type exposure lamp source is adopted, so that the power consumption of equipment is reduced, the equipment is low-carbon and environment-friendly, and the production cost of a terminal can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor industry, in particular to an electrostatic chuck exposure machine for semiconductors. Background Art

[0002] At present, the shapes of workpieces in the semiconductor industry are becoming more and more diverse. When the semiconductor workpiece is exposed, if some workpieces with special shapes are encountered and the original conventional machines cannot meet their process requirements, it is necessary to develop a special device for pin electrostatic chuck film application.

[0003] The existing exposure equipment is mainly used to expose some workpieces with regular shapes and thin thickness. It is not suitable for exposing some workpieces with complex shapes and thick thickness. It is necessary to develop an electrostatic chuck exposure device for semiconductors. Utility Model Content

[0004] The utility model aims to solve the above problems and designs an electrostatic chuck exposure machine for semiconductors.

[0005] To achieve the above-mentioned purpose, the technical solution of the utility model is a semiconductor electrostatic chuck exposure machine, comprising a main support assembly, an auxiliary support assembly is arranged on the side of the main support assembly, an air supply assembly is arranged on the top of the main support assembly, an exposure assembly is arranged inside the main support assembly, a stage frame movement control assembly is arranged on the auxiliary support assembly, a stage frame module is arranged on the moving part of the stage frame movement control assembly, and a control module is arranged on the outer side wall of the main support assembly.

[0006] As a further description of the technical solution, the main support assembly includes a main support frame module, an air supply assembly is arranged on the top of the main support frame module, and a control module is arranged on the outer side wall of the main support frame module.

[0007] As a further description of the technical solution, the auxiliary support assembly includes an auxiliary support frame arranged on the side of the main support assembly, the auxiliary support frame is provided with a table frame movement control assembly, and the auxiliary support frame (9) is provided with a frame forward button (20).

[0008] As a further description of the present technical solution, the air supply assembly includes a dust-free air supply unit arranged on the top of the main support assembly.

[0009] As a further description of the technical solution, the interior of the main support assembly is an exposure chamber, and the exposure assembly includes an exposure light source arranged inside the main support assembly.

[0010] As a further description of the technical solution, the table frame movement control assembly includes a table frame movement control module arranged on the auxiliary support assembly, and the moving part of the table frame movement control module is provided with a table frame module.

[0011] As a further description of the present technical solution, the table frame module includes a lower frame module arranged at the moving position of the table frame movement control component, a workpiece electrostatic chuck is arranged in the lower frame module, an upper frame module is arranged on the lower frame module, and the upper frame module is connected to the lower frame module through a hydraulic connecting rod.

[0012] As a further description of the technical solution, a polyester polymer film is arranged on the inner wall of the upper frame module, and an upper bottom film is arranged on the polyester polymer film.

[0013] As a further description of the technical solution, the control module includes a control screen arranged on the outer side wall of the main support component, a power indicator button is arranged on one side of the control screen, and a start button is arranged below the power indicator button.

[0014] As a further description of the technical solution, a plurality of balance adjustment feet are provided at the bottom of the main support assembly and the auxiliary support assembly.

[0015] The beneficial effect is that the electrostatic chuck exposure machine for semiconductors of the technical solution has an ingenious structural design and is highly practical. It can expose workpieces of different appearance sizes and adjust the placement of the workpieces to suitable exposure positions, solving the limitation that conventional exposure machines can only perform exposure operations on more regular and thinner products. In addition, this design uses an LED scanning exposure light source, which reduces the power consumption of the equipment, is low-carbon and environmentally friendly, and can reduce terminal production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the installation structure of the exposure assembly of the utility model;

[0018] Figure 3 This is a schematic diagram of the installation structure of the table frame movement control component of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the table frame module of the utility model.

[0020] In the figure, 1. main support assembly; 2. auxiliary support assembly; 3. air supply assembly; 4. exposure assembly; 5. table frame movement control assembly; 6. table frame module; 7. control module; 8. main support frame module; 9. auxiliary support frame; 10. dust-free air supply unit; 11. exposure light source; 12. table frame movement control module; 13. lower frame module; 14. workpiece electrostatic chuck; 15. upper frame module; 16. hydraulic connecting rod; 17. control screen; 18. power indicator button; 19. start button; 20. balance adjustment foot; 21. frame forward button. DETAILED DESCRIPTION

[0021] First of all, the design intention of the utility model is explained. At present, the shapes of workpieces made in the semiconductor industry are becoming more and more diversified. The existing exposure equipment is mainly used to expose some workpieces with regular shapes and thin thicknesses. It is not suitable for exposing some workpieces with more complex shapes and thicker thicknesses. Therefore, the utility model designs an electrostatic chuck exposure machine for semiconductors.

[0022] The utility model is described in detail below in conjunction with the accompanying drawings. Figure 1-Figure 4 As shown, an electrostatic chuck exposure machine for semiconductors includes a main support assembly 1. The main support assembly 1 will be described in detail below. The main support assembly 1 includes a main support frame module 8. The top of the main support frame module 8 is provided with an air supply assembly 3, and the outer side wall of the main support frame module 8 is provided with a control module 7.

[0023] An auxiliary support assembly 2 is arranged on the side of the main support assembly 1. The auxiliary support assembly 2 will be described in detail below. The auxiliary support assembly 2 includes an auxiliary support frame 9 arranged on the side of the main support assembly 1, a table frame movement control assembly 5 is arranged on the auxiliary support frame 9, and a frame forward button 21 is arranged on the auxiliary support frame 9.

[0024] In order to facilitate air supply to the interior of the main support assembly 1 , an air supply assembly 3 is provided at the top of the main support assembly 1 . The air supply assembly 3 will be described in detail below. The air supply assembly 3 includes a dust-free air supply unit 10 provided at the top of the main support assembly 1 .

[0025] In order to facilitate exposure, an exposure component 4 is arranged inside the main support component 1. The interior of the main support component 1 is an exposure chamber. The exposure component 4 will be described in detail below. The exposure component 4 includes an exposure light source 11 arranged inside the main support component 1.

[0026] In order to facilitate the control of the movement of the table frame module 6, a table frame movement control component 5 is arranged on the auxiliary support component 2. The table frame movement control component 5 will be described in detail below. The table frame movement control component 5 includes a table frame movement control module 12 arranged on the auxiliary support component 2, and the moving part of the table frame movement control module 12 is provided with the table frame module 6.

[0027] A table frame module 6 is arranged at the moving part of the table frame movement control component 5. The table frame module 6 will be described in detail below. The table frame module 6 includes a lower frame module 13 arranged at the moving part of the table frame movement control component 5, and a workpiece electrostatic chuck 14 is arranged in the lower frame module 13. An upper frame module 15 is arranged on the lower frame module 13, and the upper frame module 15 is connected to the lower frame module 13 through a hydraulic connecting rod 16.

[0028] A polyester polymer film is disposed on the inner wall of the upper frame module 15 , and an upper bottom film is disposed on the polyester polymer film.

[0029] In order to facilitate the operation of the exposure machine, a control module 7 is arranged on the outer wall of the main support assembly 1. The control module 7 will be described in detail below. The control module 7 includes a control screen 17 arranged on the outer wall of the main support assembly 1, a power indicator button 18 is arranged on one side of the control screen 17, and a start button 19 is arranged below the power indicator button 18.

[0030] In order to ensure the stability of the main support assembly 1 and the auxiliary support assembly 2 during the working process, a plurality of balance adjustment feet 20 are arranged at the bottom of the main support assembly 1 and the auxiliary support assembly 2.

[0031] The above describes in detail the specific structure of the utility model. The working principle of the utility model will be described below: the workpiece electrostatic chuck 14 is placed on the workpiece electrostatic chuck 14 of the lower frame module 13, and the upper frame module 15 is closed downward. At this time, a closed space is formed between the upper and lower frame modules 13, and vacuum suction is performed. Under the action of atmospheric pressure, the polyester polymer film of the upper frame module 15 carries the upper film and fits with the workpiece electrostatic chuck 14 to facilitate subsequent exposure operations. After the vacuum suction reaches the set value, the start button 19 is pressed. At this time, the frame module 6 is transported into the exposure chamber under the action of the frame movement control component 5. After the frame module 6 reaches the set position, the exposure light source 11 performs left and right scanning exposure. After the exposure is completed, the frame module 6 is transplanted out of the exposure chamber to the front side of the machine, the upper frame module 15 is opened, and the workpiece electrostatic chuck 14 is taken out. During normal production, the above steps are repeated.

[0032] The electrostatic chuck exposure machine for semiconductors of the present technical solution has an ingenious structural design and is highly practical. It can expose workpieces of different appearance sizes and adjust the placement of the workpieces to suitable exposure positions, thus overcoming the limitation that conventional exposure machines could only perform exposure operations on relatively regular and thinner products. In addition, this design uses an LED scanning exposure light source 11, which reduces the power consumption of the equipment, is low-carbon and environmentally friendly, and can reduce terminal production costs.

[0033] The above technical solutions only reflect the preferred technical solutions of the technical solutions of the utility model. Some changes that may be made to certain parts thereof by technicians in this technical field all reflect the principles of the utility model and fall within the protection scope of the utility model.

Claims

1. An electrostatic chuck exposure machine for semiconductors, characterized in that: The invention comprises a main support component (1), an auxiliary support component (2) is arranged on the side of the main support component (1), an air supply component (3) is arranged on the top of the main support component (1), an exposure component (4) is arranged inside the main support component (1), a stage frame movement control component (5) is arranged on the auxiliary support component (2), a stage frame module (6) is arranged at the moving part of the stage frame movement control component (5), and a control module (7) is arranged on the outer side wall of the main support component (1).

2. The electrostatic chuck exposure machine for semiconductor according to claim 1, characterized in that: The main support assembly (1) comprises a main support frame module (8), an air supply assembly (3) is arranged on the top of the main support frame module (8), and a control module (7) is arranged on the outer side wall of the main support frame module (8).

3. The electrostatic chuck exposure machine for semiconductor according to claim 1, characterized in that: The auxiliary support assembly (2) comprises an auxiliary support frame (9) arranged on the side of the main support assembly (1), the auxiliary support frame (9) is provided with a table frame movement control assembly (5), and the auxiliary support frame (9) is provided with a frame forward button (21).

4. The electrostatic chuck exposure machine for semiconductor according to claim 1, characterized in that: The air supply assembly (3) comprises a dust-free air supply unit (10) arranged on the top of the main support assembly (1).

5. The electrostatic chuck exposure machine for semiconductor according to claim 1, characterized in that: The interior of the main support component (1) is an exposure chamber, and the exposure component (4) comprises an exposure light source (11) arranged inside the main support component (1).

6. The electrostatic chuck exposure machine for semiconductor according to claim 1, characterized in that: The table frame movement control component (5) comprises a table frame movement control module (12) arranged on the auxiliary support component (2), and a table frame module (6) is arranged at a moving part of the table frame movement control module (12).

7. The electrostatic chuck exposure machine for semiconductor according to claim 1, characterized in that: The table frame module (6) comprises a lower frame module (13) arranged at a moving position of the table frame movement control component (5), a workpiece electrostatic chuck (14) is arranged in the lower frame module (13), an upper frame module (15) is arranged on the lower frame module (13), and the upper frame module (15) is connected to the lower frame module (13) via a hydraulic connecting rod (16).

8. The electrostatic chuck exposure machine for semiconductor according to claim 7, characterized in that: A polyester polymer film is arranged on the inner wall of the upper frame module (15), and an upper bottom film is arranged on the polyester polymer film.

9. The electrostatic chuck exposure machine for semiconductor according to claim 1, characterized in that: The control module (7) comprises a control screen (17) arranged on the outer side wall of the main support component (1), a power indicator button (18) is arranged on one side of the control screen (17), and a start button (19) is arranged below the power indicator button (18).

10. The electrostatic chuck exposure machine for semiconductor according to claim 1, characterized in that: A plurality of balance adjustment feet (20) are provided at the bottom of the main support assembly (1) and the auxiliary support assembly (2).

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