Novel core module with improved structure
Through the stamp hole module motherboard using ten-layer HDI gold sinking process, integrating RF connectors and multiple sets of antennas, and realizing IC-free design through external expansion interfaces, the existing core module has been solved, and a high-integration, stable and reliable core module design is achieved.
Patent Information
- Application Number
- CN202421516627.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-29
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-29
AI Technical Summary
The existing core module has single integrated functions, complicated peripheral circuits, average electrical and anti-interference characteristics, unstable work, cumbersome external expansion connection operation, and high processing costs.
The stamp hole module motherboard adopts ten-layer HDI gold sinking process, integrates RF connector interface and multiple sets of antennas, and realizes a high-integration IC-free design through external expansion interface, comes with a variety of communication functions, and integrates charging circuits, audio amplifiers and backlight circuits.
It improves electrical characteristics and anti-interference characteristics, achieves stable and reliable work, leads to more functional interfaces, has high integration, is compact and simple in design, and reduces operating costs.
Smart Images

Figure CN222690156U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of core modules, in particular to a novel core module with an improved structure. Background Art
[0002] The core module is an electronic stamp hole module motherboard that encapsulates the core functions, integrating CPU, power management IC, NFC function chip, wireless communication IC (WiFi+Bluetooth+GPS+radio), LCD backlight IC, memory and power amplifier devices, etc.; and provides a module with standard interfaces, the interfaces mainly include LCD circuit, Camera circuit, USB circuit, SIM circuit, keyboard circuit, etc.; built-in main control chip and memory and communication module, various terminals use the module to achieve different functions such as communication or positioning. The core module is widely used in POS, PDA, smart home, Internet of Vehicles, medical equipment, video surveillance, food traceability and other industrial control fields.
[0003] After searching, the patent with application number CN202021459356.9 discloses a new core module, including a core module body, the core module body including a PCB substrate, a MINI-USB interface is fixedly provided on the right side of the upper surface of the PCB substrate, a MINI-JTAG interface is fixedly provided on the left side of the upper surface of the PCB substrate, a power indicator light is fixedly provided at one edge of the upper surface of the PCB substrate, a status indicator light is fixedly provided at the other edge of the upper surface of the PCB substrate, double rows of equidistantly distributed pins are fixedly provided on both sides of the lower surface of the PCB board, a main control chip is fixedly provided in the middle of the upper surface of the PCB substrate, a GND test port and an external power input port are fixedly provided on the upper surface of the PCB substrate, a TF card holder is fixedly provided on the right side of the lower surface of the PCB substrate, and a TVS, a high-frequency crystal oscillator, an LDO and a fuse are fixedly provided in the middle of the lower surface of the PCB substrate. The utility model has a reasonable structure, complete functions and good secondary development performance.
[0004] At present, ordinary core modules have single integrated functions, complex peripheral circuits, average electrical characteristics and anti-interference characteristics, are not stable and reliable when working, and the operation of the module is relatively cumbersome when connecting external expansion, and the processing cost is high. Therefore, we need to propose a new core module with improved structure to solve this shortcoming of similar modules in the market. Summary of the invention
[0005] The purpose of the utility model is to provide a new core module with improved structure, good electrical characteristics and anti-interference characteristics, stable and reliable operation, capable of leading to more functional interfaces, high integration, compact and simple design, and reduced operating costs, so as to solve the problems raised in the above-mentioned background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a new core module with improved structure, including a stamp hole module motherboard P100 with 162 pins, a radio frequency connector interface is provided on the stamp hole module motherboard P100, three groups of antennas are connected to the radio frequency connector interface, the three groups of antennas are respectively a main antenna, a diversity antenna and a three-in-one antenna, the main antenna includes a wiring terminal J1 and a wiring terminal J11, pin 1 of the wiring terminal J1 is connected to the wiring terminals of pins 2, 3 and 4 of the wiring terminal J11, and pin 1 of the wiring terminal J11 is connected to the wiring terminals of pins 2, 3 and 4 of the wiring terminal J11. An inductor L400 is connected, and two ends of the inductor L400 are respectively connected to a grounded inductor L401 and an inductor L402; the diversity antenna includes a wiring terminal J2 and a wiring terminal J22, and pin 1 of the wiring terminal J2 is connected to the wiring terminals of pins 2, 3, and 4 of the wiring terminal J22, and pin 1 of the wiring terminal J22 is connected to an inductor L548, and two ends of the inductor L548 are respectively connected to a grounded inductor L554 and an inductor L553; the three-in-one antenna includes a wiring terminal J3, and pin 1 of the wiring terminal J3 is connected to an inductor L602;
[0007] The 4-7 pins of the stamp hole module mainboard P100 are connected to a debuggable and matching communication module NFC, the 12-15 pins of the stamp hole module mainboard P100 are connected to the bus API0, the 26-29 pins of the stamp hole module mainboard P100 are connected to the display screen CTP, the 96-101 pins of the stamp hole module mainboard P100 are connected to a three-in-one sensor, the 102-105 pins of the stamp hole module mainboard P100 are connected to the bus SPI2, the 106-116 pins of the stamp hole module mainboard P100 are connected to a button, the 117-128 pins of the stamp hole module mainboard P100 are connected to a front camera, the 145-150 pins of the stamp hole module mainboard P100 are connected to a soft barcode, and the 151-162 pins of the stamp hole module mainboard P100 are connected to a rear camera.
[0008] Preferably, pins 1-3 of the stamp hole module mainboard P100 are connected to a three-color light, pins 8-11 of the stamp hole module mainboard P100 are connected to two serial ports, pins 16-21 of the stamp hole module mainboard P100 are connected to a bus I²C, and pins 34-41 of the stamp hole module mainboard P100 are connected to two hot-swappable SIM cards.
[0009] Preferably, pins 43-48 of the stamp hole module main board P100 are connected to a hot-swappable T card, pins 49-65 of the stamp hole module main board P100 are connected to a programmable high and low voltage LCM, pins 68-78 of the stamp hole module main board P100 are connected to audio headphones, and pin 136 of the stamp hole module main board P100 is connected to a flash light.
[0010] Preferably,: a processor U100-C is installed on the stamp hole module mainboard P100, the front camera is connected to the CSI-0 interface of the processor U100-C, the soft barcode is connected to the CSI-1 interface of the processor U100-C, the rear camera is connected to the CSI-2 interface of the processor U100-C, the display screen is connected to the DSI-0 interface of the processor U100-C, and the bus API0, bus API2, button, and three-in-one sensor are connected to the GPIO interface of the processor U100-C.
[0011] Preferably, the communication module NFC includes a chip U1, a grounded resistor R912 is connected to the H1 pin of the chip U1, a grounded capacitor C912 is connected to the D2 pin of the chip U1, a capacitor C913 and a capacitor C914 arranged in parallel are connected between the D7 pin and the C7 pin of the chip U1, a grounded capacitor C911 is connected to the D6 pin of the chip U1, a grounded capacitor C910 is connected to the H4 pin of the chip U1, a capacitor C908 and a capacitor C909 arranged in parallel are connected to the G7 pin of the chip U1, a capacitor C907 is connected between the B4 pin and the B8 pin of the chip U1, and capacitors C905 and C906 arranged in parallel and connected to the power supply are connected to the E8 and H3 pins of the chip U1.
[0012] Preferably, the size of the stamp hole module mainboard P100 is 50mm*42mm*3.0mm.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] 1. This utility model PCB adopts ten-layer HDI immersion gold process, has good electrical characteristics and anti-interference characteristics, works stably and reliably, can lead to more functional interfaces, has high integration, and is compact and simple in design, reducing operating costs;
[0015] 2. This utility model has an external expansion interface and high integration to achieve a completely IC-free peripheral design. It has built-in WIFI, Bluetooth, GPS, USB, UART, SPI, I2C, GPIO, and NFC functions, and is rich in functions;
[0016] 3. The utility model adopts stamp hole technology to reduce the difficulty and cost of production. It not only integrates the usual communication functions, but also integrates the charging circuit, audio amplifier and backlight circuit. It can realize a completely IC-free peripheral design. Only the connector needs to be added. It has high integration and simple design. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1It is a schematic diagram of the stamp hole module mainboard P100 of the utility model;
[0018] Figure 2 It is a schematic diagram of the connection between the front and rear cameras, soft barcode, display screen, bus SPIO / 2, buttons, and three-in-one sensor and processor U100-C of the utility model;
[0019] Figure 3 This is the circuit diagram of the main antenna of the utility model;
[0020] Figure 4 This is a circuit diagram of the diversity antenna of the utility model;
[0021] Figure 5 This is a circuit diagram of the three-in-one antenna of the utility model;
[0022] Figure 6 This is a circuit diagram of the NFC communication module of the present utility model. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] See also Figure 1-6 The utility model provides a technical solution: a new core module with improved structure, including a stamp hole module motherboard P100 with 162 pins, a radio frequency connector interface is provided on the stamp hole module motherboard P100, three groups of antennas are connected to the radio frequency connector interface, the three groups of antennas are respectively a main antenna, a diversity antenna and a three-in-one antenna, the main antenna includes a wiring terminal J1 and a wiring terminal J11, pin 1 of the wiring terminal J1 is connected to the wiring terminals of pins 2, 3 and 4 of the wiring terminal J11, and pin 1 of the wiring terminal J11 is connected to the wiring terminals of pins 1, 2 and 3 of the wiring terminal J11, and the wiring terminals of pins 2, 3 and 4 of the wiring terminal J11 are connected to the wiring terminals of pins 1, 2 and 3 of the wiring terminal J11 are connected to the wiring terminals of pins 2, 3 and 4 of the wiring terminal J11, and the wiring terminals of pins 1 and 3 of the wiring terminal J11 are connected to the wiring terminals of pins 1 and 3 of the wiring terminal J11. Inductor L400, two ends of the inductor L400 are respectively connected to grounded inductor L401 and inductor L402; the diversity antenna includes a wiring terminal J2 and a wiring terminal J22, pin 1 of the wiring terminal J2 is connected to the wiring terminals of pins 2, 3 and 4 of the wiring terminal J22, pin 1 of the wiring terminal J22 is connected to an inductor L548, two ends of the inductor L548 are respectively connected to grounded inductor L554 and inductor L553; the three-in-one antenna includes a wiring terminal J3, and pin 1 of the wiring terminal J3 is connected to an inductor L602;
[0025] The stamp hole module motherboard P100 provides functional support through the external stamp hole. The high integration can realize the peripheral completely IC-free design. It has built-in WIFI, Bluetooth, GPS, USB, UART, SPI, I2C, GPIO, NFC functions, and rich functions. The stamp hole module motherboard P100 integrates 4G (LTE) 3G (WCDMA), GSM, GPS, WIFI, Bluetooth, audio management, and low-power power management functions. It is equipped with Android 11 / 12 operating system and can work as long as the battery is connected. It is the only choice for realizing the ideal solution for portable mobile devices. In addition, the module not only integrates the usual communication functions, but also integrates the charging circuit, audio amplifier and backlight circuit, which can realize the peripheral completely IC-free design, with high integration and simple design.
[0026] The 4-7 pins of the stamp hole module mainboard P100 are connected to a debuggable and matching communication module NFC, the 12-15 pins of the stamp hole module mainboard P100 are connected to the bus API0, the 26-29 pins of the stamp hole module mainboard P100 are connected to the display screen CTP, the 96-101 pins of the stamp hole module mainboard P100 are connected to a three-in-one sensor, the 102-105 pins of the stamp hole module mainboard P100 are connected to the bus SPI2, the 106-116 pins of the stamp hole module mainboard P100 are connected to a button, the 117-128 pins of the stamp hole module mainboard P100 are connected to a front camera, the 145-150 pins of the stamp hole module mainboard P100 are connected to a soft barcode, and the 151-162 pins of the stamp hole module mainboard P100 are connected to a rear camera.
[0027] Pins 1-3 of the stamp hole module mainboard P100 are connected to a three-color light, pins 8-11 of the stamp hole module mainboard P100 are connected to two serial ports, pins 16-21 of the stamp hole module mainboard P100 are connected to a bus I²C, and pins 34-41 of the stamp hole module mainboard P100 are connected to two hot-swappable SIM cards.
[0028] A hot-swappable T card is connected to pins 43-48 of the stamp hole module mainboard P100, a programmable high and low voltage LCM is connected to pins 49-65 of the stamp hole module mainboard P100, an audio headset is connected to pins 68-78 of the stamp hole module mainboard P100, and a flash light is connected to pin 136 of the stamp hole module mainboard P100.
[0029] The three-color light, NFC, two serial ports, bus SPI0, bus I²C, and display screen CTP are distributed on the left side of the stamp hole module motherboard P100;
[0030] Two-way SIM cards, T-card, LCM, and audio headset are located on the lower side of the stamp hole module motherboard P100;
[0031] The three-in-one sensor, bus SPI2, and buttons are distributed on the right side of the stamp hole module motherboard P100;
[0032] The front camera, flash, soft barcode, and rear camera are distributed on the right side of the stamp hole module motherboard P100.
[0033] The stamp hole module motherboard P100 adopts a ten-layer HDI immersion gold process, has good electrical and anti-interference characteristics, and works stably and reliably.
[0034] A processor U100-C is installed on the stamp hole module mainboard P100, the front camera is connected to the CSI-0 interface of the processor U100-C, the soft barcode is connected to the CSI-1 interface of the processor U100-C, the rear camera is connected to the CSI-2 interface of the processor U100-C, the display screen is connected to the DSI-0 interface of the processor U100-C, and the bus API0, bus API2, button, and three-in-one sensor are connected to the GPIO interface of the processor U100-C.
[0035] The processor model of U100-C is MT6765 octa-core processor, with 4G full network access.
[0036] The communication module NFC includes a chip U1, a grounded resistor R912 is connected to the H1 pin of the chip U1, a grounded capacitor C912 is connected to the D2 pin of the chip U1, capacitors C913 and C914 are connected in parallel between the D7 pin and the C7 pin of the chip U1, a grounded capacitor C911 is connected to the D6 pin of the chip U1, a grounded capacitor C910 is connected to the H4 pin of the chip U1, capacitors C908 and C909 are connected in parallel to the G7 pin of the chip U1, a capacitor C907 is connected between the B4 pin and the B8 pin of the chip U1, and capacitors C905 and C906 are connected in parallel and connected to the power supply to the E8 and H3 pins of the chip U1.
[0037] The size of the stamp hole module mainboard P100 is 50mm*42mm*3.0mm.
[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A new core module with improved structure, characterized by: The invention comprises a stamp hole module motherboard P100 with 162 pins, wherein a radio frequency connector interface is provided on the stamp hole module motherboard P100, and three groups of antennas are connected to the radio frequency connector interface, wherein the three groups of antennas are respectively a main antenna, a diversity antenna and a three-in-one antenna, wherein the main antenna comprises a wiring terminal J1 and a wiring terminal J11, wherein pin 1 of the wiring terminal J1 is connected to the wiring terminals of pins 2, 3 and 4 of the wiring terminal J11, and an inductor L400 is connected to pin 1 of the wiring terminal J11, wherein the inductor L400 is connected to the inductor L400. 0 are respectively connected to grounded inductors L401 and L402; the diversity antenna includes a wiring terminal J2 and a wiring terminal J22, pin 1 of the wiring terminal J2 is connected to the wiring terminals of pins 2, 3 and 4 of the wiring terminal J22, pin 1 of the wiring terminal J22 is connected to an inductor L548, and the two ends of the inductor L548 are respectively connected to grounded inductors L554 and L553; the three-in-one antenna includes a wiring terminal J3, and pin 1 of the wiring terminal J3 is connected to an inductor L602; The 4-7 pins of the stamp hole module mainboard P100 are connected to a debuggable and matching communication module NFC, the 12-15 pins of the stamp hole module mainboard P100 are connected to the bus API0, the 26-29 pins of the stamp hole module mainboard P100 are connected to the display screen CTP, the 96-101 pins of the stamp hole module mainboard P100 are connected to a three-in-one sensor, the 102-105 pins of the stamp hole module mainboard P100 are connected to the bus SPI2, the 106-116 pins of the stamp hole module mainboard P100 are connected to a button, the 117-128 pins of the stamp hole module mainboard P100 are connected to a front camera, the 145-150 pins of the stamp hole module mainboard P100 are connected to a soft barcode, and the 151-162 pins of the stamp hole module mainboard P100 are connected to a rear camera.
2. The novel core module with improved structure according to claim 1 is characterized in that: Pins 1-3 of the stamp hole module mainboard P100 are connected to a three-color light, pins 8-11 of the stamp hole module mainboard P100 are connected to two serial ports, pins 16-21 of the stamp hole module mainboard P100 are connected to a bus I²C, and pins 34-41 of the stamp hole module mainboard P100 are connected to two hot-swappable SIM cards.
3. The novel core module with improved structure according to claim 1 is characterized in that: A hot-swappable T card is connected to pins 43-48 of the stamp hole module mainboard P100, a programmable high and low voltage LCM is connected to pins 49-65 of the stamp hole module mainboard P100, an audio headset is connected to pins 68-78 of the stamp hole module mainboard P100, and a flash light is connected to pin 136 of the stamp hole module mainboard P100.
4. The novel core module with improved structure according to claim 1 is characterized in that: A processor U100-C is installed on the stamp hole module mainboard P100, the front camera is connected to the CSI-0 interface of the processor U100-C, the soft barcode is connected to the CSI-1 interface of the processor U100-C, the rear camera is connected to the CSI-2 interface of the processor U100-C, the display screen is connected to the DSI-0 interface of the processor U100-C, and the bus API0, bus API2, button, and three-in-one sensor are connected to the GPIO interface of the processor U100-C.
5. The novel core module with improved structure according to claim 1 is characterized in that: The communication module NFC includes a chip U1, a grounded resistor R912 is connected to the H1 pin of the chip U1, a grounded capacitor C912 is connected to the D2 pin of the chip U1, capacitors C913 and C914 are connected in parallel between the D7 pin and the C7 pin of the chip U1, a grounded capacitor C911 is connected to the D6 pin of the chip U1, a grounded capacitor C910 is connected to the H4 pin of the chip U1, capacitors C908 and C909 are connected in parallel to the G7 pin of the chip U1, a capacitor C907 is connected between the B4 pin and the B8 pin of the chip U1, and capacitors C905 and C906 are connected in parallel and connected to the power supply to the E8 and H3 pins of the chip U1.
6. The novel core module with improved structure according to claim 1 is characterized in that: The size of the stamp hole module mainboard P100 is 50mm*42mm*3.0mm.
Citation Information
Patent Citations
Novel core module
CN212965904U