High-stiffness RFID tag and processing device

Abstract

The utility model discloses a high-stiffness RFID tag and a processing device. Relates to the technical field of RFID tags. Comprising a plane material, a Dry inlay and a substrate which are sequentially arranged, a PUR glue layer is arranged between the plane material and the Dry inlay, and a PUR glue layer is arranged between the Dry inlay and the substrate; the Dry inlay comprises an RFID tag antenna, a conductive adhesive and an RFID chip, and the RFID chip is connected with the RFID tag antenna through the conductive adhesive. The surface material is made of coated paper, cardboard paper or synthetic paper. The substrate is made of coated paper, cardboard paper or synthetic paper. And the thicknesses of the surface material and the substrate are 20-150 microns. The thickness of the Dry inlay ranges from 30 micrometers to 60 micrometers. The thickness of the PUR glue layer ranges from 10 micrometers to 20 micrometers. According to the utility model, the traditionally used glue (such as water glue, oil glue and the like) is abandoned, and the stiffness of the label is better than that of a thicker label made of a stiff material.

Description

Technical Field

[0001] The utility model relates to the technical field of RFID tags, in particular to a high-stiffness RFID tag and a processing device. Background Art

[0002] Radio Frequency Identification (RFID) technology is a contactless wireless identification technology that automatically identifies the target object and obtains relevant data through spatial coupling (alternating magnetic field or electromagnetic field) to achieve the purpose of target identification and data exchange. The passive tag does not require batteries and has an identification distance of more than 10 meters. It has been widely used in the delivery and receipt of clothing, rapid inventory and checkout of stores, greatly improving the operating efficiency of each link. It has also been widely used in various industries such as aviation etiquette, retail, consumer electronics, electricity and medical care.

[0003] In order for RFID technology to be used in all walks of life, the RFID tag needs to be covered with glue to make it sticky and can be attached to different media surfaces. Its preparation process draws on the process of traditional self-adhesive labels. The structure of traditional RFID is to cover the front and back of the packaged RFIDDry inlay with a layer of glue. The front is covered with a surface material to facilitate printing of information for interaction with customers, and the bottom is made of release paper to facilitate lifting and attachment when in use.

[0004] When preparing traditional RFID tags, both the surface material and the base material are made of self-adhesive tape (which can be acrylic water-based adhesive, pressure-sensitive hot melt adhesive or oil-based adhesive). After unwinding, the light release layer material is peeled off and rolled up. The encapsulated Dry inlay is unrolled, cut and transferred to the adhesive bottom material according to different cost sizes, and compounded with the front adhesive material. It is die-cut into the size and shape required by the customer with a die-cutting knife. The waste after die-cutting is recycled, and the finished product is rolled up and tested to become a finished RFID label.

[0005] The preparation process of traditional RFID tags has great advantages in efficiency and yield, but the most important problem needs to be solved, which is how to ensure that the flexible RFID tags have high stiffness. At present, the general operation method in the industry is: first, find suitable glue to solve the problem that ordinary glue is too soft, and use a hard glue that can be melted and coated at high temperature but is solid at room temperature, that is, PO glue. The second is to add a very thick layer of PET to the label to further increase the stiffness. However, although PO glue is a hard glue, it is still a pressure-sensitive glue. As the temperature rises, it will still soften and cannot meet customer needs. Adding a PET layer makes the structure complex and increases the difficulty of manufacturing. Utility Model Content

[0006] In view of the above problems, the utility model provides a high-stiffness RFID tag and a processing device which are simple in structure and easy to process.

[0007] The technical solution of the utility model is: a high-stiffness RFID tag, comprising a surface material, a Dry inlay and a base material arranged in sequence, a PUR glue layer is provided between the surface material and the Dry inlay,

[0008] A PUR glue layer is provided between the Dry inlay and the substrate;

[0009] The Dry inlay comprises an RFID tag antenna, conductive adhesive and an RFID chip, and the RFID chip is connected to the RFID tag antenna via the conductive adhesive.

[0010] The surface material is made of coated paper, cardboard or synthetic paper.

[0011] The base material is made of coated paper, cardboard or synthetic paper.

[0012] The thickness of the surface material and the base material is 20um-150um.

[0013] The thickness of the Dry inlay is 30-60 um.

[0014] The thickness of the PUR glue layer is 10-20 um.

[0015] A processing device for high-stiffness RFID tags, comprising a glue discharging component,

[0016] The glue discharging assembly includes a sealing glue pot, a glue discharging pump, a glue discharging main pipe and a pair of glue discharging branch pipes.

[0017] The sealant pot is used to place PUR glue, one end of the glue pump is connected to the sealant pot, and the other end is connected to the glue outlet pipe, and the glue outlet pipe is connected to a pair of glue outlet branch pipes;

[0018] A pair of glue outlet pipes correspond to the surface material and the bottom material respectively.

[0019] The glue outlet branch pipe is connected with a glue coating head.

[0020] During operation, the utility model provides a PUR glue layer (i.e., moisture-curing reactive polyurethane hot melt adhesive) between the surface material and the dry inlay and between the dry inlay and the base material, and abandons the traditional glue (such as water glue, oil glue, etc.), so as to achieve better stiffness than thicker labels made of stiffer materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In the drawings, each part is not necessarily drawn according to the actual scale.

[0022] Figure 1 It is a structural schematic diagram of the utility model.

[0023] Figure 2 It is a processing schematic diagram of the utility model;

[0024] In the figure, 1 is the surface material, 2 is the Dry inlay, 3 is the base material, 4 is the PUR glue layer, 5 is the sealant pot, 6 is the glue outlet main pipe, 7 is the glue outlet branch pipe, and 8 is the glue coating head. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] The utility model Figure 1 As shown, a high stiffness RFID tag comprises a surface material 1, a Dry inlay 2 and a base material 3 arranged in sequence, wherein a PUR glue layer is provided between the surface material and the Dry inlay.

[0029] A PUR glue layer 4 is provided between the Dry inlay and the substrate;

[0030] The Dry inlay comprises an RFID tag antenna, conductive adhesive and an RFID chip, and the RFID chip is connected to the RFID tag antenna via the conductive adhesive.

[0031] In operation, the utility model provides a PUR glue layer (i.e., moisture-curing reactive polyurethane hot melt adhesive) between the surface material and the Dry inlay (i.e., dry label) and between the Dry inlay and the base material, abandoning the conventional glue (such as water-based glue, oil-based glue, etc.), thereby achieving better stiffness than thicker labels made of stiffer materials. The Dry inlay is a conventional component.

[0032] Because PUR glue contains isocyanate groups and active hydrogen, it has better adhesion than ordinary hot melt adhesive. The most obvious difference between PUR glue and ordinary hot melt adhesive is that the former is irreversible, while the latter is reversible. After bonding, PUR glue will not melt even if heated. Therefore, PUR glue is more resistant to high and low temperatures.

[0033] The surface material is made of coated paper, cardboard or synthetic paper.

[0034] The base material is made of coated paper, cardboard or synthetic paper.

[0035] Materials commonly used for labels, both bottom and surface materials are applicable, generally coated paper, cardboard, synthetic paper, bright white PET, BOPP, PE, etc.

[0036] In the application, the thickness of the bottom and surface materials ranges from 20um to 150um, the thickness of the Dry inlay ranges from 30-60um, and the thickness of the PUR glue layer ranges from 10-20um.

[0037] A processing device for high-stiffness RFID tags, comprising a glue discharging component,

[0038] The glue discharging assembly includes a sealing glue pot 5, a glue discharging pump, a glue discharging main pipe 6 and a pair of glue discharging branch pipes 7.

[0039] The sealant pot is used to store PUR glue, one end of the glue pump is connected to the sealant pot, and the other end is connected to the glue outlet pipe, and the glue outlet pipe is connected to a pair of glue outlet branch pipes; the glue pump is not shown in the figure.

[0040] A pair of glue outlet pipes correspond to the surface material and the bottom material respectively.

[0041] During the preparation of the utility model, after the bottom and surface materials are unrolled, PUR glue is coated on the surface of the material by high-temperature scraping or rolling. After the Dry inlay is unrolled and cut, it is transferred to the bottom and surface materials according to the finished product size, and then composite die-cutting is performed to the size, appearance and winding form required by the final customer.

[0042] Because PUR glue reacts with water vapor in the air to form a harder solid, the chemical reaction is irreversible. The RFID tags made with it have super high stiffness and will not soften or deform due to different temperatures.

[0043] PUR glue itself is a hot-coating reactive glue. During the coating process, it is necessary to ensure sealing. Therefore, the sealant pot and hose used must ensure sealing.

[0044] When the glue discharging component is working, the glue discharging pump is operated to pump the PUR glue in the sealant pot to the glue discharging main pipe, and then the glue is discharged from the glue discharging main pipe through a pair of glue discharging branch pipes.

[0045] like Figure 2 As shown, the label processing process (including compounding, die cutting, tearing and rewinding, etc.) in the utility model is a conventional operation. Since PUR glue is used, the glue needs to be sealed.

[0046] The glue outlet branch pipe is connected to a glue coating head 8 .

[0047] By setting the glue coating head, the reliability of glue dispensing is guaranteed and the processing is convenient.

[0048] The RFID tag processed by the utility model has super high stiffness when used, is irreversible, and will not change with the ambient temperature.

[0049] Regarding the contents disclosed in this case, there are a few points that need to be explained:

[0050] (1) The drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design;

[0051] (2) In the absence of conflict, the embodiments and features of the embodiments disclosed in this case may be combined with each other to obtain new embodiments;

[0052] The above are only specific implementation methods disclosed in this case, but the protection scope of the present disclosure is not limited thereto. The protection scope disclosed in this case should be based on the protection scope of the claims.

Claims

1. A high stiffness RFID tag, comprising a surface material, a dry inlay and a base material arranged in sequence, characterized in that: A PUR glue layer is provided between the surface material and the Dry inlay. A PUR glue layer is provided between the Dry inlay and the substrate; The Dry inlay comprises an RFID tag antenna, conductive adhesive and an RFID chip, and the RFID chip is connected to the RFID tag antenna via the conductive adhesive.

2. The high stiffness RFID tag according to claim 1, characterized in that: The surface material is made of coated paper, cardboard or synthetic paper.

3. The high stiffness RFID tag according to claim 1, characterized in that: The base material is made of coated paper, cardboard or synthetic paper.

4. The high stiffness RFID tag according to claim 1, characterized in that: The thickness of the surface material and the base material is 20um-150um.

5. The high stiffness RFID tag according to claim 1, characterized in that: The thickness of the Dry inlay is 30-60 um.

6. The high stiffness RFID tag according to claim 1, characterized in that: The thickness of the PUR glue layer is 10-20 um.

7. A processing device for high-stiffness RFID tags according to any one of claims 1 to 6, characterized in that: Including glue discharging components, The glue discharging assembly includes a sealing glue pot, a glue discharging pump, a glue discharging main pipe and a pair of glue discharging branch pipes. The sealant pot is used to place PUR glue, one end of the glue pump is connected to the sealant pot, and the other end is connected to the glue outlet pipe, and the glue outlet pipe is connected to a pair of glue outlet branch pipes; A pair of glue outlet pipes correspond to the surface material and the bottom material respectively.

8. The high-stiffness RFID tag processing device according to claim 7, characterized in that: The glue outlet branch pipe is connected with a glue coating head.

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