Power distribution cabinet capable of automatically dissipating heat

Abstract

The utility model discloses a power distribution cabinet capable of automatically dissipating heat, which comprises a cabinet body, a temperature sensor and a controller are arranged on the inner wall of the cabinet body, an accommodating chamber is arranged at the bottom of the cabinet body, a water tank is arranged in the accommodating chamber, a lower semiconductor chilling plate is mounted on the side wall of the accommodating chamber in an embedded manner, and the cold end of the lower semiconductor chilling plate is attached to the water tank. The hot end is horizontally connected with a plurality of lower cooling fins extending out of the containing cavity from top to bottom, the lower semiconductor chilling plate is electrically connected with a temperature sensor and a controller, one end of the water tank is connected with a water outlet pipe, the water outlet pipe is connected with a circulating pump electrically connected with the controller, and the tail end of the water outlet pipe communicates with a plurality of cooling branch pipes. The cooling branch pipes surround and cling to the outer wall of the cabinet body, and the tail ends of the cooling branch pipes are communicated with the water tank. Cooling water circulation is adopted for cooling, the cooling speed is high, the cooling effect is good, the possibility of spontaneous combustion of components is reduced, and the service life of the power distribution cabinet can be prolonged.

Description

Technical Field

[0001] The utility model relates to the field of power distribution cabinets, in particular to a power distribution cabinet capable of automatically dissipating heat. Background Art

[0002] The power distribution cabinet is a general term for the power control center. It is the final equipment of the power distribution system. The power distribution cabinet is a massive parameter on the data. Generally, it constitutes a low-voltage forest according to the electrical wiring. It requires that the switchgear, measuring instruments, protective electrical appliances and auxiliary equipment be assembled in a closed or semi-closed metal cabinet or on a screen to form a low-voltage power distribution cabinet. During normal operation, the circuit can be connected or disconnected with the help of manual or automatic switches. The power distribution cabinet has the characteristics of small size, easy installation, special technical performance, fixed position, unique configuration function, no site restrictions, relatively common application, stable and reliable operation, high space utilization, small footprint and environmental protection effect.

[0003] In the prior art, most distribution cabinets are made of iron sheets, and only vents are opened on both sides of the distribution cabinet for heat dissipation. When exposed to the sun in summer, due to the high temperature, the high temperature is directly transmitted from the iron sheet to the cabinet body, and the wind entering from the vents is also hot air. When the cooling rate in the cabinet body is lower than the heating rate, it is easy to cause the temperature in the cabinet body to be too high, resulting in the components in the cabinet being scalded, causing the possibility of spontaneous combustion to increase, affecting the normal operation of the entire distribution cabinet, reducing work efficiency, and shortening service life. Utility Model Content

[0004] The purpose of the utility model is to provide an automatic heat dissipation distribution cabinet to address the deficiencies of the prior art. The utility model adopts cooling water circulation for cooling, has a faster cooling rate and better effect, reduces the possibility of spontaneous combustion of components, and can extend the service life of the distribution cabinet.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An automatic heat dissipation distribution cabinet comprises a cabinet body, a protective baffle is connected to the top of the cabinet body, an insulating cavity is arranged inside the protective baffle, a temperature sensor and a controller are arranged on the inner wall of the cabinet body, a accommodating chamber is arranged at the bottom of the cabinet body, a water tank is arranged in the accommodating chamber, a lower semiconductor refrigeration plate is embedded on the side wall of the accommodating chamber, the cold end of the lower semiconductor refrigeration plate is arranged in contact with the water tank, a plurality of lower heat dissipation fins extending to the outside of the accommodating chamber are horizontally connected to the hot end from top to bottom, the lower semiconductor refrigeration plate is electrically connected to the temperature sensor and the controller, one end of the water tank is connected to a water outlet pipe, a circulating pump electrically connected to the controller is connected to the water outlet pipe, a plurality of cooling branches are connected to the ends of the water outlet pipes, the cooling branches are arranged around and close to the outer wall of the cabinet body, and the ends of the cooling branches are connected to the water tank.

[0007] In an optional embodiment, a connecting plate is connected to one side of the lower heat dissipating fin on the outer wall of the accommodating chamber, and a plurality of lower heat dissipating fans are connected at intervals from top to bottom on the side wall of the connecting plate close to the lower heat dissipating fin, and the working surface of the lower heat dissipating fan is arranged toward the gap between two adjacent lower heat dissipating fins.

[0008] In an optional embodiment, the upper portion of the cabinet has a heat dissipation chamber, the bottom of the heat dissipation chamber is connected to the interior of the cabinet, an upper semiconductor refrigeration plate electrically connected to the controller is embedded and fixedly installed on the side wall of the heat dissipation chamber, the cold end of the upper semiconductor refrigeration plate is located in the heat dissipation chamber, and the hot end is located outside the heat dissipation chamber, a plurality of upper heat dissipation fins are connected to the hot end at intervals, and an upper heat dissipation fan with a working surface facing downward is connected to the top wall of the heat dissipation chamber.

[0009] In an optional embodiment, the outer wall of the cabinet is further provided with a heat insulation layer.

[0010] In an optional implementation, a heat dissipation port is provided on the door of the cabinet, and a dust filter is installed on the heat dissipation port.

[0011] In an optional embodiment, a heat insulation board layer is also installed on the inner side wall of the door.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model provides a protective baffle with an insulating cavity inside the top of the cabinet, so as to prevent heat from being directly transferred from the top of the cabinet to the cabinet when the sun shines directly on the top of the cabinet, thereby improving the thermal insulation effect of the protective baffle; and through the functions of the temperature sensor, the controller, the water tank, the lower semiconductor refrigeration plate, the circulating pump and the cooling branch pipe, when the temperature inside the cabinet is higher than the preset value, the controller can control the lower semiconductor refrigeration plate to work, cool the water in the water tank and then pump the cooling water in the water tank into the cooling branch pipe through the circulating pump, and because the cooling branch pipe is close to the outer wall of the cabinet, the heat in the cabinet will be transferred to the cooling water in the cooling branch pipe through the effect of heat transfer, and the cooling water in the cooling branch pipe will quickly absorb the heat in the cabinet, so as to achieve the purpose of rapid cooling, avoid the cooling rate in the cabinet being less than the heating rate, and when the heat accumulates to a certain amount, the components will spontaneously combust, the cooling rate is faster, the use is safer, and the components of the distribution cabinet are not prone to high temperature and stop working, the working efficiency is high, and the service life of the distribution cabinet can be further extended. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a front view cross-sectional structural schematic diagram of the utility model;

[0016] Figure 3 It is a right side structural schematic diagram of the accommodating chamber of the utility model;

[0017] Figure 4 This is a schematic diagram of the internal structure of the heat dissipation chamber of the utility model;

[0018] Figure 5 This is a schematic diagram of the structure of the left cooling branch pipe distribution of the utility model;

[0019] Wherein, the accompanying drawings are marked as follows:

[0020] 1. Cabinet; 11. Heat dissipation port; 12. Heat insulation layer; 2. Protective baffle; 21. Heat insulation cavity; 3. Accommodating chamber; 31. Water tank; 32. Water outlet pipe; 33. Circulation pump; 34. Cooling branch pipe; 35. Lower semiconductor cooling plate; 36. Connecting plate; 37. Lower cooling fan; 38. Lower cooling fins; 4. Heat dissipation chamber; 41. Upper semiconductor cooling plate; 42. Upper cooling fan. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] For easier understanding, please refer to Figure 1 , Figure 2 as well as Figure 3 The present embodiment provides an automatic heat dissipation power distribution cabinet, including a cabinet 1, a protective baffle 2 is connected to the top of the cabinet 1, and a heat insulation cavity 21 is arranged inside the protective baffle 2. The heat insulation cavity 21 can separate the protective baffle 2 from the top of the cabinet 1 to prevent the heat absorbed by the protective baffle 2 from being directly transferred to the cabinet 1, thereby further improving the heat insulation effect. A temperature sensor and a controller are arranged on the inner wall of the cabinet 1. The controller adopts a PLC control module. The temperature sensor is used to sense the temperature inside the cabinet 1. When the temperature is higher than the set range value, the signal is transmitted to the controller. A receiving chamber 3 is arranged at the bottom of the cabinet 1, and a water tank 31 is arranged in the receiving chamber 3.

[0023] A lower semiconductor refrigeration sheet 35 is embedded on the side wall of the accommodating chamber 3. The cold end of the lower semiconductor refrigeration sheet 35 is arranged in contact with the water tank 31. The hot end is horizontally connected to multiple lower heat dissipation fins 38 extending to the outside of the accommodating chamber 3 from top to bottom. The cold end cools the water in the water tank 31. The lower semiconductor refrigeration sheet 35 is electrically connected to the temperature sensor and the controller. When the temperature sensor senses that the temperature in the cabinet 1 is too high, the controller will start the lower semiconductor refrigeration sheet 35 to cool the water in the water tank 31.

[0024] See also Figure 2 and Figure 5 One end of the water tank 31 is connected to a water outlet pipe 32, and a circulating pump 33 electrically connected to the controller is connected to the water outlet pipe 32. The end of the water outlet pipe 32 is connected to four cooling branches 34. The four cooling branches 34 are arranged around and close to the outer wall of the cabinet 1, and the ends of the four cooling branches 34 are connected to the water tank 31. The circulating pump 33 is a high-pressure water pump, which can pump out the water in the water tank 31 and then transport it upward to the cooling branches 34. The semiconductor cooling sheet 35 in the water tank 31 After the water is cooled, the controller will control the circulation pump 33 to work, and the circulation pump 33 will extract the cooling water in the water tank 31, and the cooling water will be diverted to each cooling branch pipe 34 through the water outlet pipe 32. Since the cooling branch pipe 34 is arranged close to the side wall of the cabinet 1, the cooling water in the cooling branch pipe 34 can absorb the heat in the cabinet 1 during the circulation process, and the lower semiconductor refrigeration plate 35 continuously cools the circulating water, and continuously circulates back and forth to absorb the heat in the cabinet 1, thereby accelerating the heat loss inside the cabinet 1 and accelerating the cooling rate. In order to avoid the time from the water in the cooling branch pipe 34 being extracted to the water tank 31 being too short to absorb the heat inside the cabinet 1, two water inlet pipes can be respectively arranged at the position where the cooling branch pipe 34 returns to the water tank 31, each water inlet pipe is connected to the two cooling branch pipes 34, and a solenoid valve connected to the controller is installed on each water inlet pipe. When the circulation pump 33 extracts the water in the water tank 31, the solenoid valve is firstly discharged. The magnetic valve is closed and the circulation pump 33 is started. When the circulation pump 33 pumps a certain amount of water out of the water tank 31, it is closed first. After a period of time, the solenoid valve is opened to return the water in the cooling branch pipe 34 to the water tank 31 to mix with the water in the water tank 31 that has been cooled by the lower semiconductor refrigeration plate 35. Then, the circulation pump 33 is started again to pump the water in the water tank 31 out again. After a period of time, the solenoid valve is opened again to return the water to the water tank 31. In this way, water circulation cooling is carried out repeatedly.

[0025] Furthermore, a connecting plate 36 is connected to one side of the lower heat dissipation fins 38 on the outer wall of the accommodating chamber 3, and a plurality of lower heat dissipation fans 37 are connected from top to bottom on a side wall of the connecting plate 36 close to the lower heat dissipation fins 38. The working surface of the lower heat dissipation fan 37 is arranged toward the gap between two adjacent lower heat dissipation fins 38, that is, the connecting plate 36 is connected to one side of the lower heat dissipation fins 38, and the other side is in an open state. The wind blown out from the lower heat dissipation fan 37 will blow through the gaps between the lower heat dissipation fins 38, blow the heat on the lower heat dissipation fins 38 outwards, accelerate the heat dissipation efficiency of the lower heat dissipation fins 38, and thus improve the cooling effect.

[0026] For easier understanding, please continue to refer to Figure 2 and Figure 4 In order to further enhance the heat dissipation effect, in addition to cooling the cabinet 1 from the outside through the cooling water in the cooling branch pipe 34 as described above, this example also cools the cabinet 1 from the inside on the basis of the above embodiment. Specifically, a heat dissipation chamber 4 is provided at the upper part of the cabinet 1, and an air inlet is provided between the heat dissipation chamber 4 and the inside of the cabinet 1. Four cooling branch pipes 34 are respectively distributed on both sides of the air inlet in pairs. An upper semiconductor refrigeration sheet 41 electrically connected to the controller is embedded and fixedly installed on the side wall of the heat dissipation chamber 4. The cold end of the upper semiconductor refrigeration sheet 41 is located in the heat dissipation chamber 4, and the hot end is located at the heat dissipation chamber 4. Externally, a plurality of upper heat dissipation fins are connected at intervals on the hot end to dissipate heat from the hot end of the upper semiconductor refrigeration plate 41. The top wall of the heat dissipation chamber 4 is connected to an upper heat dissipation fan 42 with a working surface facing downward. The controller controls the upper semiconductor refrigeration plate 41 to work, and the upper semiconductor refrigeration plate 41 cools the gas in the heat dissipation chamber 4. Then the upper heat dissipation fan 42 blows the cold air in the heat dissipation chamber 4 downward, and blows the cold air in the heat dissipation chamber 4 into the cabinet 1 through the air inlet, so as to directly cool down the interior of the cabinet 1. The interior of the cabinet 1 is automatically cooled down by the cooling water on the outside of the cabinet 1 and the internal cold air, and the cooling effect is better.

[0027] Furthermore, in order to effectively suppress the heat from the sun and prevent heat from being transferred to the cabinet 1 in a high-temperature environment, an insulating layer 12 is provided on the outer wall of the cabinet 1 to isolate the high temperature outside and prevent heat from being radiated to the outer wall of the cabinet 1 and thus transferred to the interior of the cabinet 1. Furthermore, a heat dissipation port 11 is provided on the door of the cabinet 1, and a dust-proof filter is installed on the heat dissipation port 11. The heat dissipation port 11 plays a certain ventilation role, and the outside wind can flow into the cabinet 1 from the heat dissipation port 11 to further dissipate heat for the cabinet 1. An insulating board layer is also installed on the inner wall of the door, and the insulating board layer is used to prevent the heat from the door from radiating to the interior of the cabinet 1.

[0028] The working principle of the utility model is as follows: when the temperature sensor senses that the temperature inside the cabinet 1 is higher than the preset value, the signal is transmitted to the controller, and the controller simultaneously starts the upper semiconductor cooling plate 41, the lower semiconductor cooling plate 35, the circulation pump 33 and the upper cooling fan 42, the lower semiconductor cooling plate 35 cools the water in the water tank 31, and the circulation pump 33 draws the water in the water tank 31 outward and circulates it to each cooling branch pipe 34, cooling the cabinet 1 from the outside, absorbing the heat inside the cabinet 1, and the upper semiconductor cooling plate 41 The emitted cold air will fill the heat dissipation chamber 4, and the upper heat dissipation fan 42 will blow the cold air in the heat dissipation chamber 4 downward into the interior of the cabinet 1, further accelerating the absorption of heat inside the cabinet 1, thereby achieving the purpose of rapid cooling. When the temperature sensor senses that the temperature inside the cabinet 1 is lower than the preset temperature value, it will send a signal to the controller, and the controller will then control the upper semiconductor refrigeration plate 41, the lower semiconductor refrigeration plate 35, the circulation pump 33 and the upper heat dissipation fan 42 to stop working, and stop cooling the interior of the cabinet 1, so that the cabinet 1 can be cooled automatically in this reciprocating manner.

[0029] Although the present invention has been described using the above preferred embodiments, it is not intended to limit the scope of protection of the present invention. Any person skilled in the art may make various changes and modifications to the above embodiments without departing from the spirit and scope of the present invention, and the changes and modifications still fall within the scope of protection of the present invention.

Claims

1. Automatic heat dissipation distribution cabinet, characterized by: The utility model comprises a cabinet body, the top of which is connected with a protective baffle, an insulating cavity is arranged inside the protective baffle, a temperature sensor and a controller are arranged on the inner wall of the cabinet body, a accommodating chamber is arranged at the bottom of the cabinet body, a water tank is arranged in the accommodating chamber, a lower semiconductor refrigeration plate is embedded and installed on the side wall of the accommodating chamber, the cold end of the lower semiconductor refrigeration plate is arranged in contact with the water tank, a plurality of lower heat dissipation fins extending to the outside of the accommodating chamber are horizontally connected to the hot end from top to bottom, the lower semiconductor refrigeration plate is electrically connected to the temperature sensor and the controller, one end of the water tank is connected with a water outlet pipe, a circulating pump electrically connected to the controller is connected to the water outlet pipe, a plurality of cooling branches are connected to the ends of the water outlet pipes, the cooling branches are arranged around and close to the outer wall of the cabinet, and the ends of the cooling branches are connected to the water tank.

2. The automatic heat dissipation distribution cabinet according to claim 1, characterized in that: A connecting plate is connected to one side of the lower heat dissipating fin on the outer wall of the accommodating chamber, and multiple lower heat dissipating fans are connected to one side of the connecting plate close to the lower heat dissipating fin from top to bottom, and the working surface of the lower heat dissipating fan is arranged toward the gap between two adjacent lower heat dissipating fins.

3. The automatic heat dissipation distribution cabinet according to claim 1, characterized in that: The upper part of the cabinet is provided with a heat dissipation chamber, the bottom of the heat dissipation chamber is connected to the interior of the cabinet, an upper semiconductor refrigeration plate electrically connected to the controller is embedded and fixedly installed on the side wall of the heat dissipation chamber, the cold end of the upper semiconductor refrigeration plate is located in the heat dissipation chamber, and the hot end is located outside the heat dissipation chamber, and a plurality of upper heat dissipation fins are connected to the hot end at intervals, and an upper heat dissipation fan with a working surface facing downward is connected to the top wall of the heat dissipation chamber.

4. The automatic heat dissipation distribution cabinet according to claim 1, characterized in that: The outer wall of the cabinet is also provided with a heat insulation layer.

5. The automatic heat dissipation distribution cabinet according to claim 1, characterized in that: A heat dissipation port is provided on the door of the cabinet, and a dust filter is installed on the heat dissipation port.

6. The automatic heat dissipation distribution cabinet according to claim 1, characterized in that: The inner side wall of the box door is also equipped with a heat insulation board layer.

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