COB process vehicle-mounted camera module structure

Abstract

The utility model provides a COB (chip on board) process vehicle-mounted camera module structure which is characterized in that a chip is attached to a PCB (printed circuit board) substrate through second glue, a glass assembly is attached to a non-imaging area on the periphery of the chip through the second glue, and four sides of the top of the glass assembly are provided with glue grooves for injecting first glue to cover gold threads on the periphery of the chip; a non-imaging area on the periphery of a chip is coated with third glue, a glass assembly is attached to the third glue, pre-pasting of the glass assembly is completed, first glue is injected from a glue groove, and the glass assembly, a gold wire, the chip and a PCB substrate are connected and fixed into a whole through the first glue, so that reliability is improved; the glass assembly is prefabricated during production and processing, so that the processing time of the COB process can be greatly shortened during processing of the whole glass assembly, and glue brushing in the prior art can be replaced by a mode of injecting glue I from the glue groove through the arrangement of the glue groove, so that the process difficulty is reduced, and the processing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted camera modules, in particular to a COB process vehicle-mounted camera module structure. Background Art

[0002] With the prevalence of the new four modernizations of automobiles and the concept of intelligent driving, the vehicle perception sensor market is developing rapidly. The vehicle camera, which is likened to the eyes of autonomous driving, will become a new blue ocean industry in the industry. As the core sensing equipment in the field of autonomous driving, the imaging quality of the vehicle camera is related to the direct experience of intelligent driving. Therefore, only by continuously optimizing and exploring the technology can we meet the higher requirements of customers.

[0003] When the existing vehicle-mounted camera module is processed through the COB process, the chip, transparent glass, PCB substrate and gold wire are glued and fixed by brushing glue, and each attachment process requires brushing glue, and the brushing glue process is prone to overflow and uneven brushing. That is, the existing COB process vehicle-mounted camera module structure leads to complex process and low output when the COB process is carried out. Therefore, a COB process vehicle-mounted camera module structure is proposed. Utility Model Content

[0004] In order to solve at least one of the above-mentioned technical shortcomings, the utility model provides a COB process vehicle-mounted camera module structure, including: a chip is attached to a PCB substrate through glue 2, a glass component is attached to the non-imaging area outside the chip through glue 3, and glue grooves for injecting glue to cover the gold wire outside the chip are provided on the top four sides of the glass component.

[0005] Furthermore, a glass groove for attaching transparent glass through glue 2 is opened in the middle of the top of the glass component, and a connecting cavity and a chip cavity penetrating the glass groove are formed in sequence inside the glass component from top to bottom. The non-imaging area of ​​the chip is attached to the top wall of the chip cavity through glue 3, and glue grooves penetrating the chip cavity are opened on the four side edges of the top of the glass component, and the glue grooves are filled with glue 1 that covers the gold wire around the chip.

[0006] Furthermore, a step is formed at the connection between the glass groove and the chip cavity, and glue 2 is coated on the surface of the step close to the glass groove.

[0007] Furthermore, an inverted step is formed at the connection between the connection cavity and the chip cavity.

[0008] Furthermore, the surface of the steps are all concavely provided with glue-applying holes, and the inverted steps and the edges of the steps are all provided with glue dams.

[0009] Furthermore, the transparent glass adopts D263T white glass and is coated with an anti-reflection film.

[0010] Furthermore, the glass component is made of NTB material.

[0011] Furthermore, the second glue is a thermosetting glue, and the third glue is a UV glue.

[0012] Furthermore, the glue one is UV glue + thermosetting glue.

[0013] Furthermore, the four corners of the glass groove are all provided with protective grooves for absorbing the transparent glass. Beneficial Effects

[0014] First, glue 3 is applied to the non-imaging area outside the chip, and the glass component is attached to complete the pre-pasting of the glass component. Then, glue 1 is injected from the glue tank, and the glass component, gold wire, chip and PCB substrate are connected and fixed into one body by glue 1 to increase reliability. During production and processing, the glass component is prefabricated, so that the processing time of the COB process can be greatly shortened during the processing of the whole. Moreover, by setting the glue tank, the method of injecting glue 1 from the glue tank can replace the brushing method in the prior art, which reduces the process difficulty and improves the processing efficiency.

[0015] Apply glue 2 to the glass groove, and then attach transparent glass to make a glass component. First, attach the chip to the PCB substrate through glue 2, and then apply glue 3 to the non-imaging area around the chip. Then cover the glass component on the chip from top to bottom, so that the non-imaging area of ​​the chip is attached to the chip cavity, and then inject glue 1 into the glue groove. Use glue 1 to connect and fix the glass component, gold wire, chip and substrate into one body to increase reliability.

[0016] When applying glue 2 to the step, the step is set so that glue 2 can be applied directly to improve the efficiency of brushing glue. After the glue is applied, the transparent glass is attached to the glass groove so that the edge of the transparent glass is attached to the glue 2 on the step, completing the prefabrication installation of the transparent glass and the prefabrication of the glass assembly.

[0017] The realization of the purpose, functional features and advantages of the present invention will be further described in conjunction with embodiments and with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an overall axonometric drawing of the utility model.

[0019] Figure 2 It is an overall top view of the utility model.

[0020] Figure 3 It is a sectional view of the whole of the utility model.

[0021] exist Figures 1 to 3, the correspondence between the component names or lines and the figure numbers is: PCB substrate 1, chip 2, gold wire 3, glass component 4, glue groove 401, glass groove 402, connecting cavity 403, chip cavity 404, protection groove 405, glue one 5, transparent glass 6, glue two 7, glue three 8. DETAILED DESCRIPTION

[0022] Please refer to Figures 1 to 3 ;

[0023] This embodiment provides a COB process vehicle-mounted camera module structure, including: a chip 2 is attached to a PCB substrate 1 by means of a second glue 7, a glass component 4 is attached to a non-imaging area outside the chip 2 by means of a third glue 8, and a glue groove 401 for injecting a first glue 5 to cover the outer gold wire 3 of the chip 2 is provided on the top four sides of the glass component 4;

[0024] In the specific implementation, firstly, glue 3 8 is applied to the non-imaging area outside the chip 2, and the glass component 4 is attached to complete the pre-bonding of the glass component 4, and then glue 1 5 is injected from the glue tank 401, and the glass component 4, the gold wire 3, the chip 2 and the PCB substrate 1 are connected and fixed into one body by glue 1 5 to increase reliability;

[0025] During production and processing, the glass component 4 is prefabricated so that the COB process time can be greatly shortened during processing of the whole. Moreover, through the setting of the glue tank 401, the glue can be injected from the glue tank to replace the glue brushing in the prior art, thereby reducing the process difficulty and improving the processing efficiency.

[0026] Chip 2 is a bare chip;

[0027] COB: The abbreviation of Chip on Board, which means chip on board packaging technology.

[0028] For further reference, Figures 1 to 3 A glass groove 402 is provided in the middle of the top of the glass component 4 to which the transparent glass 6 is attached through the glue 2 7. A connecting cavity 403 and a chip cavity 404 are sequentially formed from top to bottom inside the glass component 4, and the non-imaging area of ​​the chip 2 is attached to the top wall of the chip cavity 404 through the glue 3 8. Glue grooves 401 are provided on the four side edges of the top of the glass component 4 to penetrate the chip cavity 404. The glue grooves 401 are filled with glue 1 5 to cover the gold wires 3 around the chip 2.

[0029] In the specific implementation, glue No. 2 7 is coated on the glass groove 402, and then the transparent glass 6 is attached to form the glass component 4. The chip 2 is first attached to the PCB substrate 1 through glue No. 2 7, and then glue No. 3 8 is coated on the non-imaging area around the chip 2, and then the glass component 4 is covered on the chip 2 from top to bottom, so that the non-imaging area of ​​the chip 2 is attached to the chip cavity 404, and then glue No. 1 5 is injected into the glue groove 401, and the glass component 4, gold wire 3, chip 2 and PCB substrate 1 are connected and fixed into one body through glue No. 1 5 to increase reliability.

[0030] For further reference, Figure 3 , a step is formed at the connection between the glass groove 402 and the chip cavity 404, and glue 7 is coated on the surface of the step close to the glass groove 402;

[0031] In the specific implementation, when the step is coated with glue 7, the step is set so that the glue 7 can be directly applied to improve the efficiency of brushing glue. After the glue is applied, the transparent glass 6 is attached to the glass groove 402 so that the edge of the transparent glass 6 is attached to the glue 7 on the step, thereby completing the prefabrication installation of the transparent glass 6.

[0032] For further reference, Figure 3 , an inverted step is formed at the connection between the connection cavity 403 and the chip cavity 404;

[0033] In the specific implementation, the chip 2 is attached to the PCB substrate 1 through the glue 2 7, and then the chip 2 is connected to the PCB substrate 1 through the gold wire, and then the glue 3 8 is drawn on the non-imaging area outside the chip 2, and then the glass component 4 is attached to the chip 2, and then the glue 1 5 is injected into the glue grooves 401 on the four sides of the glass component 4 to protect the gold wire 3;

[0034] The entire glass component 4 is attached to the non-imaging area of ​​the chip 2 by means of glue 8, which plays the role of pre-fixing the glass component 4 and at the same time forms a closed space to prevent the possibility of the gold wire protection glue from entering and contaminating the chip 2.

[0035] Furthermore, the surface of the steps are all concave with glue holes, and the edges of the steps and the steps are all provided with glue dams;

[0036] In specific implementation, by setting the glue dispensing grid, the adhesive area of ​​the glue can be increased and the stability of the glue during attachment can be improved. At the same time, by setting the glue dam, the glue can be prevented from flowing and overflowing.

[0037] Furthermore, the transparent glass 6 is made of D263T white glass and coated with an anti-reflection film.

[0038] Furthermore, the glass component 4 is made of NTB material.

[0039] Furthermore, glue 2 7 is a thermosetting glue, and glue 3 8 is a UV glue.

[0040] Furthermore, glue 15 is UV glue + thermosetting glue;

[0041] Among them, the materials of the transparent glass 6, the glass assembly 4, the glue 1 5, the glue 2 7 and the glue 3 8 can all be replaced by the same type.

[0042] Furthermore, the four corners of the glass groove 402 are provided with protection grooves 405 for clamping the transparent glass 6;

[0043] In a specific implementation, by providing the protection groove 405 , when the glass assembly 4 is prefabricated, the four glass corners of the transparent glass 6 can be protected from being bumped.

Claims

1. A COB process vehicle-mounted camera module structure, comprising: The chip (2) is attached to the PCB substrate (1) by means of glue (2) and is characterized in that: the glass component (4) is attached to the peripheral non-imaging area of ​​the chip (2) by means of glue (3) and glue grooves (401) for injecting glue (5) to cover the peripheral gold wires (3) of the chip (2) are provided on the top four sides of the glass component (4).

2. According to the COB process vehicle-mounted camera module structure of claim 1, it is characterized by: A glass groove (402) is provided in the middle of the top of the glass component (4) to which the transparent glass (6) is attached via glue 2 (7); a connecting cavity (403) and a chip cavity (404) are formed in sequence from top to bottom inside the glass component (4); a non-imaging area of ​​the chip (2) is attached to the top wall of the chip cavity (404) via glue 3 (8); glue grooves (401) are provided on the four side edges of the top of the glass component (4) to penetrate the chip cavity (404); and the glue grooves (401) are filled with glue 1 (5) to cover the gold wires (3) around the chip (2).

3. According to the COB process vehicle-mounted camera module structure of claim 2, it is characterized in that: A step is formed at the connection between the glass groove (402) and the chip cavity (404), and glue 2 (7) is coated on the surface of the step close to the glass groove (402).

4. According to claim 3, a COB process vehicle-mounted camera module structure is characterized in that: An inverted step is formed at the connection between the connection cavity (403) and the chip cavity (404).

5. According to claim 4, a COB process vehicle-mounted camera module structure is characterized in that: The surface of the steps are concave with glue holes, and the edges of the steps and the steps are provided with glue dams.

6. According to claim 5, a COB process vehicle-mounted camera module structure is characterized in that: The transparent glass (6) is made of D263T white glass and coated with an anti-reflection film.

7. A COB process vehicle-mounted camera module structure according to claim 6, characterized in that: The glass component (4) is made of NTB material.

8. According to claim 7, a COB process vehicle-mounted camera module structure is characterized in that: Glue 2 (7) is a thermosetting glue, and glue 3 (8) is a UV glue.

9. A COB process vehicle-mounted camera module structure according to claim 8, characterized in that: Glue 1 (5) is UV glue + thermosetting glue.

10. A COB process vehicle-mounted camera module structure according to claim 9, characterized in that: The four corners of the glass groove (402) are all provided with protection grooves (405) for facilitating the clamping of the transparent glass (6).

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