Edge trimmer for wafer production

Abstract

The utility model discloses an edge trimmer for wafer production, which relates to the field of wafer processing technology, including a horizontal plate, a U-shaped plate is installed at the lower end of the horizontal plate, a rotatable rotating plate is arranged at the right part of the upper end of the horizontal plate, a dust collecting component is installed at the middle left part of the upper end of the horizontal plate, a rotating component is installed inside the U-shaped plate, and two hollow columns symmetrically distributed on the upper end of the rotating plate are installed at the upper end of the rotating plate, and suction cups are arranged at the upper ends of the two hollow columns, and first motors are installed inside the two hollow columns, and the output ends of the two first motors are respectively movable through the upper ends of the two hollow columns and are respectively fixedly connected to the lower ends of the two suction cups. The utility model can improve work efficiency by arranging the rotating component, the rotating plate and the two suction cups to cooperate with each other, facilitate wafer processing, reduce time waste, and improve production capacity. By arranging the dust collecting component, the debris generated by processing can be collected to reduce the frequency of cleaning work.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to an edge trimming machine used for wafer production. Background Art

[0002] Semiconductors and chips are semi-finished products cut from wafers and are widely used in integrated circuits. Millions of transistors are etched on wafers, which are hundreds of times smaller than human hair. Semiconductors manage data by controlling current to form various text, numbers, sounds, images and colors. Wafers are widely used in daily devices such as computers, telecommunications and televisions, as well as advanced microwave transmission, laser conversion systems, medical diagnostic and treatment equipment, defense systems and NASA space shuttles.

[0003] The prior art (publication number: CN 219457545 U) discloses a wafer scraper, comprising an H-shaped seat, a motor is fixed to the lower surface of the H-shaped seat, a first positioning wheel is fixed to the outside of the driving shaft of the motor, an angled movable seat is arranged on the other side of the H-shaped seat, a shaft is connected to the angled movable seat through a bearing, a second positioning wheel is fixed to the outer surface of the shaft, wafers are clamped in the first positioning wheel and the second positioning wheel, a first cylinder is fixed to one side of the H-shaped seat, a support plate is arranged at the outer end of the first cylinder, and a scraper is fixed to the outer surface of the support plate.

[0004] Although the above patent uses positioning wheels for positioning, and its second positioning wheel can be retracted to control the spacing, and can be adjusted according to the size of the wafer to facilitate positioning and clamping, it has the following disadvantages: during processing, other operation steps cannot be carried out, and it is necessary to wait until the wafer edge is scraped before further operation steps can be carried out. It is not possible to complete operation steps such as loading and unloading during wafer processing, and the loading and unloading of the robot requires a certain amount of time, which can easily cause a waste of time and reduce production efficiency. Further improvement is needed. For this reason, we propose an edge trimming machine for wafer production. Utility Model Content

[0005] The main purpose of the utility model is to provide an edge trimmer for wafer production, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] An edge trimmer for wafer production comprises a horizontal plate, a U-shaped plate is installed at the lower end of the horizontal plate, a rotatable rotating plate is arranged at the right upper end of the horizontal plate, a dust suction component is installed at the middle left upper end of the horizontal plate, a rotating component is installed inside the U-shaped plate, two hollow columns symmetrically distributed on the left and right are installed at the upper end of the rotating plate, suction cups are arranged at the upper ends of the two hollow columns, first motors are installed inside the two hollow columns, and the output ends of the two first motors respectively movably penetrate the upper ends of the two hollow columns and are respectively fixedly connected to the lower ends of the two suction cups.

[0008] Preferably, the rotating component includes a second motor, which is mounted on the lower inner wall of the U-shaped plate, and the output end of the second motor is fixedly connected to a worm, which is meshingly connected to a worm wheel, and the internal fixed sleeve of the worm wheel is provided with a rotating rod.

[0009] Preferably, the right end of the worm is movably connected to the right inner wall of the U-shaped plate, the lower end of the rotating rod is movably connected to the lower inner wall of the U-shaped plate, and the upper end of the rotating rod movably passes through the upper end of the cross plate and is fixedly connected to the lower end of the rotating plate.

[0010] Preferably, the dust suction component includes a dust suction pump, which is installed on the horizontal plate. The dust suction end of the dust suction pump is connected to a collecting barrel, which is installed on the horizontal plate. A screen is provided on the upper inner cylindrical surface of the collecting barrel. The lower outer surface of the collecting barrel is connected to a dust suction head through a connecting pipe, and a plurality of through holes are provided at the right end of the dust suction head.

[0011] Preferably, a vertical plate is installed on the left part of the left end of the horizontal plate, an electric cylinder is installed on the upper part of the right end of the vertical plate, an output end of the electric cylinder is fixedly connected to a connecting plate, and a scraper is installed on the right end of the connecting plate.

[0012] Preferably, the vacuum cleaner head is fixedly sleeved on the connecting plate, and the scraper is located on the right side of the vacuum cleaner head.

[0013] Preferably, two L-shaped plates are installed on the left lower end and the right lower end of the transverse plate.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. The working efficiency can be improved by setting a rotating component, a rotating plate and two suction cups to cooperate with each other. When the wafer on the left is trimmed, the robot is controlled to place another wafer to be processed on the suction cup on the right. After the processing of the wafer on the left is completed, the output end of the second motor is controlled to drive the worm to rotate, and the worm drives the worm wheel to rotate. The worm wheel drives the rotating plate to rotate half a circle through the rotating rod, so that the processed wafer rotates to the right and the unprocessed wafer rotates to the left for processing. During processing, the robot removes the processed wafer and places the wafer to be processed, so that the wafers can be processed continuously, which reduces time waste and improves production capacity.

[0016] 2. By setting up a dust collection component, the debris generated by processing can be collected. During processing, the power of the dust collection pump is turned on, and the dust collection pump creates negative pressure in the dust collection head. The debris is sucked into the collection tube through the through hole, which can avoid the accumulation of debris in the working area, reduce the frequency of cleaning work, thereby saving time and labor costs and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the entire structure proposed in this embodiment;

[0018] Figure 2 is another perspective structural schematic diagram of this embodiment;

[0019] Figure 3 Schematic diagram of the internal structure of the hollow column in this embodiment;

[0020] Figure 4 Schematic diagram of the structure of the dust collection component in this embodiment.

[0021] Figure 5 Schematic diagram of the structure of the rotating component in this embodiment.

[0022] Figure 6 Schematic diagram of the structure of the connecting plate in this embodiment.

[0023] In the figure: 1. horizontal plate; 2. L-shaped plate; 3. vertical plate; 4. dust suction component; 5. electric cylinder; 6. connecting plate; 7. scraper; 8. rotating plate; 9. hollow column; 10. suction cup; 11. U-shaped plate; 12. rotating component; 13. first motor; 41. dust suction pump; 42. collecting cylinder; 43. screen; 44. dust suction head; 45. through hole; 121. second motor; 122. worm; 123. worm wheel; 124. rotating rod. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] like Figure 1-Figure 6 As shown, an edge trimmer for wafer production comprises a transverse plate 1, a U-shaped plate 11 is installed at the lower end of the transverse plate 1, the U-shaped plate 11 is detachably connected to the transverse plate 1 through a screw, a rotatable rotating plate 8 is arranged at the right upper end of the transverse plate 1, the lower end of the rotating plate 8 is in active contact with the upper end of the transverse plate 1, a dust suction component 4 is installed at the middle left part of the upper end of the transverse plate 1, a rotating component 12 is installed in the U-shaped plate 11, two hollow columns 9 symmetrically distributed on the upper end of the rotating plate 8 are installed, suction cups 10 are arranged at the upper ends of the two hollow columns 9, first motors 13 are installed inside the two hollow columns 9, the output ends of the two first motors 13 respectively movably penetrate the upper ends of the two hollow columns 9 and are respectively fixedly connected to the lower ends of the two suction cups 10, the first motor 13 is used to drive the suction cup 10 to rotate, and the first motor 13 is a servo motor.

[0028] In order to continuously process the wafer, the working efficiency can be improved by setting a rotating component 12, a rotating plate 8 and two suction cups 10 to cooperate with each other. The specific structure is as follows: the rotating component 12 includes a second motor 121, the second motor 121 is a servo motor, the second motor 121 is installed on the lower inner wall of the U-shaped plate 11, the second motor 121 is detachably connected to the U-shaped plate 11 through a screw, the output end of the second motor 121 is fixedly connected to a worm 122, the worm 122 is meshedly connected to a worm wheel 123, and the worm 122 is meshed with a worm wheel 123. The worm gears 123 are self-locking, and a rotating rod 124 is provided inside the worm gear 123. The worm gear 123 is connected to the rotating rod 124 through a key sleeve. The right end of the worm 122 is movably connected to the right inner wall of the U-shaped plate 11, and the worm 122 is movably connected to the U-shaped plate 11 through a bearing. The lower end of the rotating rod 124 is movably connected to the lower inner wall of the U-shaped plate 11, and the upper end of the rotating rod 124 movably passes through the upper end of the cross plate 1 and is fixedly connected to the lower end of the rotating plate 8. The rotating rod 124 is detachably connected to the rotating plate 8 through a screw.

[0029] During processing, debris is easily generated. In order to avoid the accumulation of debris in the working area and reduce the frequency of cleaning work, the dust suction component 4 can collect the debris generated by the processing. The specific structure is: the dust suction component 4 includes a dust suction pump 41, which is installed on the horizontal plate 1. The dust suction pump 41 is detachably connected to the horizontal plate 1 by bolts. The dust suction end of the dust suction pump 41 is connected to a collecting barrel 42, and the collecting barrel 42 is installed on the horizontal plate 1. A screen 43 is provided on the upper part of the inner cylindrical surface of the collecting barrel 42, and the screen 43 is detachably connected to the collecting barrel 42. The lower part of the outer surface of the collecting barrel 42 is connected to a dust suction head 44 through a connecting pipe. The dust suction head 44 is communicated with the collecting barrel 42, and a plurality of through holes 45 are opened at the right end of the dust suction head 44.

[0030] A vertical plate 3 is installed on the left end of the horizontal plate 1, and an electric cylinder 5 is installed on the upper right end of the vertical plate 3. The electric cylinder 5 is detachably connected to the vertical plate 3 by bolts. The output end of the electric cylinder 5 is fixedly connected to a connecting plate 6. The electric cylinder 5 is used to drive the scraper 7 to move left and right. A scraper 7 is installed on the right end of the connecting plate 6. The scraper 7 is detachably connected to the connecting plate 6 by bolts.

[0031] The dust collector head 44 is fixedly sleeved on the connecting plate 6 , and the dust collector head 44 is detachably connected to the connecting plate 6 via a screw. In order to facilitate the absorption of debris, the scraper 7 is located on the right side of the dust collector head 44 .

[0032] Two L-shaped plates 2 are installed at the left and right lower ends of the transverse plate 1 , and the L-shaped plates 2 are used to support the transverse plate 1 .

[0033] The edge trimming machine for wafer production proposed by the utility model, when in use, places the wafer to be processed above the suction cup 10 on the right side by the robot arm for fixing, controls the output end of the second motor 121 to drive the worm 122 to rotate, the worm 122 drives the worm wheel 123 to rotate, the worm wheel 123 drives the rotating plate 8 to rotate half a circle through the rotating rod 124, so that the unprocessed wafer rotates to the left side, controls the left side first motor 13 to drive the suction cup 10 and the wafer on the left side to rotate, controls the output end of the electric cylinder 5 to move rightward, drives the scraper to scrape the edge of the wafer, at this time, controls the robot arm to move the other A wafer to be processed is placed on the suction cup 10 on the right. After the processing of the wafer on the left is completed, the output end of the second motor 121 is controlled to drive the rotating plate 8 to rotate half a circle again, so that the processed wafer rotates to the right, and the unprocessed wafer rotates to the left for processing. During processing, the processed wafer is removed by a robot and the wafer to be processed is placed, so that the wafers can be processed continuously. During processing, the power supply of the dust pump 41 is turned on, and the dust pump 41 generates negative pressure in the dust head 44, and the debris is sucked into the collection tube 42 through the through hole 45, so as to avoid the accumulation of debris in the working area.

[0034] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. An edge trimming machine for wafer production, comprising a horizontal plate (1), characterized in that: A U-shaped plate (11) is installed at the lower end of the transverse plate (1), a rotatable rotating plate (8) is arranged at the right part of the upper end of the transverse plate (1), a dust suction component (4) is installed at the middle left part of the upper end of the transverse plate (1), a rotating component (12) is installed inside the U-shaped plate (11), two hollow columns (9) symmetrically distributed on the left and right are installed at the upper end of the rotating plate (8), suction cups (10) are arranged at the upper ends of the two hollow columns (9), first motors (13) are installed inside the two hollow columns (9), and the output ends of the two first motors (13) respectively movably penetrate the upper ends of the two hollow columns (9) and are respectively fixedly connected to the lower ends of the two suction cups (10).

2. The edge trimming machine for wafer production according to claim 1, characterized in that: The rotating component (12) comprises a second motor (121), the second motor (121) is mounted on the lower inner wall of the U-shaped plate (11), the output end of the second motor (121) is fixedly connected to a worm (122), the worm (122) is meshingly connected to a worm wheel (123), and a rotating rod (124) is fixedly sleeved inside the worm wheel (123).

3. The edge trimming machine for wafer production according to claim 2, characterized in that: The right end of the worm (122) is movably connected to the right inner wall of the U-shaped plate (11), the lower end of the rotating rod (124) is movably connected to the lower inner wall of the U-shaped plate (11), and the upper end of the rotating rod (124) movably passes through the upper end of the horizontal plate (1) and is fixedly connected to the lower end of the rotating plate (8).

4. The edge trimming machine for wafer production according to claim 1, characterized in that: The dust suction component (4) comprises a dust suction pump (41), the dust suction pump (41) is mounted on the horizontal plate (1), the dust suction end of the dust suction pump (41) is connected to a collecting cylinder (42), the collecting cylinder (42) is mounted on the horizontal plate (1), a screen (43) is arranged on the upper part of the inner cylindrical surface of the collecting cylinder (42), the lower part of the outer surface of the collecting cylinder (42) is connected to a dust suction head (44) through a connecting pipe, and a plurality of through holes (45) are opened at the right end of the dust suction head (44).

5. The edge trimming machine for wafer production according to claim 4, characterized in that: A vertical plate (3) is installed on the left side of the left end of the horizontal plate (1), an electric cylinder (5) is installed on the upper right end of the vertical plate (3), a connecting plate (6) is fixedly connected to the output end of the electric cylinder (5), and a scraper (7) is installed on the right end of the connecting plate (6).

6. The edge trimming machine for wafer production according to claim 5, characterized in that: The dust collector head (44) is fixedly sleeved on the connecting plate (6), and the scraper (7) is located on the right side of the dust collector head (44).

7. The edge trimming machine for wafer production according to claim 1, characterized in that: Two L-shaped plates (2) are installed on the left and right lower ends of the transverse plate (1).

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