Fully automatic wafer robot
By designing adjustment components and moving parts in fully automatic wafer robots, the automatic adjustment of the robot structure is realized and adapted to wafers of different sizes is solved, and the problem that robots in the prior art cannot adapt to wafers of different sizes is improved, and production efficiency and grabbing accuracy are improved.
Patent Information
- Application Number
- CN202420740210.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-04-11
AI Technical Summary
Existing wafer robots cannot adapt to wafers of different sizes, resulting in the need of manual intervention to adjust the position of the robot or replace the robots of different sizes, increasing production line downtime and labor costs, and reducing production efficiency.
A fully automatic wafer robot is designed. By setting adjustment components and moving components, the structure of the robot can be automatically adjusted to accommodate wafers of different sizes. The adjustment member adjusts the distance between the first support plate through the forward and reverse threaded rod and the moving block driven by the motor; the moving member adjusts the position of the second support plate through the gears and screws driven by the motor.
It realizes the capture of wafers of different sizes without manual intervention, reduces the downtime and labor costs of the production line, improves production efficiency, and improves the accuracy and accuracy of the capture.
Smart Images

Figure CN222697218U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of manipulators, in particular to a full-automatic wafer manipulator. Background Art
[0002] A wafer refers to a silicon chip used to make silicon semiconductor integrated circuits. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. Due to its round shape, it is called a wafer. During the manufacturing process, the wafer needs to be repositioned by a robotic arm, such as being moved from one location to another.
[0003] The prior art (publication number: CN 214238251 U) discloses a wafer robot device, comprising: a controller, a translation mechanism and a robot for picking up wafers; wherein the plane parallel to the plane on which the wafers are placed is a horizontal plane; the number of robots and translation mechanisms is at least two, each robot is transmission-connected to an action end of a translation mechanism, and is driven by the action end to perform translational motion on the horizontal plane; the controlled end of the translation mechanism is connected to the control end of the controller.
[0004] Although the above patent uses a translation mechanism to move the manipulator to pick up the wafer and realize the loading and unloading of wafers during the production process, it has the following disadvantages: the manipulator cannot grab wafers of different sizes during use. If the manipulator cannot adapt to the movement of wafers of different sizes, manual intervention may be required to adjust the position of the manipulator or replace manipulators of different sizes, which will increase the downtime and labor costs of the production line and reduce production efficiency. Further improvement is needed. For this reason, we propose a fully automatic wafer manipulator Utility Model Content
[0005] The main purpose of the utility model is to provide a fully automatic wafer robot, which can effectively solve the problems in the background technology.
[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:
[0007] A fully automatic wafer robot comprises a base plate, a rotating table is arranged at the upper end of the base plate, a robotic arm is installed at the output end of the rotating table, a placing table is arranged on the robotic arm, a through slot is opened at the right end of the placing table, an adjusting component is installed at the front end of the placing table, two first support plates symmetrically distributed front and back are arranged in the through slot, a second support plate is arranged at the right end of the two first support plates, a moving component is installed at the middle part of the lower end of the two first support plates, a slide slot is opened at the right part of the lower end of the two first support plates, and the two moving components extend into the two slide slots respectively.
[0008] Preferably, the adjusting component includes a first motor, which is installed at the front end of the placing table, the output of the first motor extends into the through slot and is fixedly connected to a forward and reverse threaded rod, the rear end of the forward and reverse threaded rod is movably connected to a bearing seat, the bearing seat is installed in the through slot, and the outer surface thread sleeve of the forward and reverse threaded rod is provided with two moving blocks symmetrically distributed front and back.
[0009] Preferably, the right ends of the two moving blocks are fixedly connected to the left ends of the two first support plates respectively, and the left ends of the two moving blocks are slidably connected to the left wall of the through slot.
[0010] Preferably, the moving component includes a second motor, which is installed at the lower end of the first support plate, the output end of the second motor is transmission-connected with the first gear, the first gear is meshingly connected with the second gear, the internal fixed sleeve of the second gear is provided with a screw, and the outer surface of the screw is threadedly sleeved with a moving plate.
[0011] Preferably, the left end of the screw rod is movably connected to the left wall of the slide groove, the right end of the movable plate is fixedly connected to the left end of the second support plate, the movable plate is slidably connected in the slide groove, and the outer surface of the second motor is movably sleeved with a shell, which is installed at the lower end of the first support plate.
[0012] Preferably, suction cups are provided at the upper ends of the first support plate and the second support plate.
[0013] Preferably, L-shaped plates are installed at the left and right ends of the base plate, and an electric cylinder is installed at the lower end of the base plate. The output end of the electric cylinder movably passes through the upper end of the base plate and is fixedly connected to the lower end of the rotating table. The internal movable sleeve of the base plate is provided with two guide rods, and the upper ends of the two guide rods are fixedly connected to the lower end of the rotating table.
[0014] Compared with the prior art, the utility model has the following beneficial effects:
[0015] 1. By setting an adjustment component, the distance between the two first support plates can be adjusted. When a larger wafer needs to be grabbed, the first motor is controlled to drive the positive and negative threaded rods to rotate, and the positive and negative threaded rods drive the two moving blocks to move away from each other. The two moving blocks respectively drive the two first support plates to move away from each other, so that the first support plate can be conveniently grasped for the larger wafer, without manually adjusting the position of the manipulator or replacing manipulators of different sizes, thereby reducing the downtime and labor costs of the production line and improving production efficiency;
[0016] 2. The position of the second support plate can be adjusted by setting a moving component. When the distance between the first support plates becomes larger, the output end of the second motor is controlled to drive the first gear to rotate, the first gear drives the second gear to rotate, the second gear drives the lead screw to rotate, the lead screw drives the moving plate to move to the right, and the moving plate drives the second support plate to move to the right. Adjusting the lateral size of the grasping part can align the clamping point of the manipulator with the center of the wafer, thereby improving the precision and accuracy of grasping and avoiding the wafer from being offset or tilted during the grasping process. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the entire structure proposed in this embodiment;
[0018] Figure 2 is another perspective structural schematic diagram of this embodiment;
[0019] Figure 3 This is a schematic diagram of the structure of the first support plate and the second support plate in this embodiment;
[0020] Figure 4 Schematic diagram of the structure of the adjusting component in this embodiment;
[0021] Figure 5 Schematic diagram of the structure of the moving parts in this embodiment.
[0022] In the figure: 1, bottom plate; 2, L-shaped plate; 3, rotating table; 4, mechanical arm; 5, placing table; 6, adjusting component; 7, through slot; 8, first support plate; 9, second support plate; 10, suction cup; 11, electric cylinder; 12, guide rod; 13, housing; 14, moving component; 15, slide slot; 61, first motor; 62, forward and reverse threaded rod; 63, moving block; 64, bearing seat; 141, second motor; 142, first gear; 143, second gear; 144, screw rod; 145, moving plate. DETAILED DESCRIPTION
[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.
[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0026] like Figure 1-Figure 4 As shown, the fully automatic wafer robot comprises a base plate 1, a rotating table 3 is arranged on the upper end of the base plate 1, the rotating table 3 is in active contact with the base plate 1, the rotating table 3 is used to drive the mechanical arm 4 to rotate, the output end of the rotating table 3 is installed with the mechanical arm 4, the mechanical arm 4 is composed of a plurality of joints and connecting parts, and can realize flexible movement and precise positioning, the mechanical arm 4 is detachably connected to the rotating end of the rotating table 3 through a screw, a placing table 5 is arranged on the mechanical arm 4, a through slot 7 is opened at the right end of the placing table 5, an adjusting part 6 is installed at the front end of the placing table 5, two first support plates 8 symmetrically distributed front and back are arranged in the through slot 7, the first support plate 8 is in active contact with the through slot 7, the right ends of the two first support plates 8 are respectively provided with a second support plate 9, the middle parts of the lower ends of the two first support plates 8 are respectively installed with a moving part 14, the right parts of the lower ends of the two first support plates 8 are respectively provided with a slide slot 15, and the two moving parts 14 extend into the two slide slots 15 respectively.
[0027] In order to grab larger wafers, there is no need to manually adjust the position of the robot or replace robots of different sizes, which reduces the downtime and labor costs of the production line. The distance between the two first support plates 8 is adjusted by setting an adjustment component 6. The specific structure is as follows: the adjustment component 6 includes a first motor 61, which is installed at the front end of the placement table 5. The first motor 61 is detachably connected to the placement table 5 through a screw. The output of the first motor 61 extends into the through slot 7 and is fixedly connected to a forward and reverse threaded rod 62. The rear end of the forward and reverse threaded rod 62 is movable A bearing seat 64 is dynamically connected, and the bearing seat 64 is detachably connected to the through slot 7 through a screw. The bearing seat 64 is installed in the through slot 7. The outer surface of the positive and negative threaded rod 62 is threadedly sleeved with two moving blocks 63 symmetrically distributed front and back. In order to drive the first support plate 8 to move, the right ends of the two moving blocks 63 are respectively fixedly connected to the left ends of the two first support plates 8. The moving blocks 63 are detachably connected to the first support plates 8 through a screw. The left ends of the two moving blocks 63 are both slidably connected to the left wall of the through slot 7. The moving blocks 63 are slidably connected to the through slot 7 through a slide rail.
[0028] In order to improve the precision and accuracy of grasping and avoid the wafer from being offset or tilted during the grasping process, the position of the second support plate 9 can be adjusted by the moving component 14. The specific structure is: the moving component 14 includes a second motor 141, which is installed at the lower end of the first support plate 8, and the second motor 141 is detachably connected to the first support plate 8 through a screw rod. The output end of the second motor 141 is transmission-connected with a first gear 142, and the first gear 142 is meshingly connected with a second gear 143. The internal fixed sleeve of the second gear 143 is provided with a screw rod 144, and the outer surface of the screw rod 144 is threadedly provided with a moving plate 145. The output end of the second motor 141 is controlled to drive the first gear 142 to rotate, the first gear 142 drives the second gear 143 to rotate, the second gear 143 drives the screw rod 144 to rotate, the screw rod 144 drives the moving plate 145 to move rightward, and the moving plate 145 drives the second support plate 9 to move rightward.
[0029] The left end of the screw rod 144 is movably connected to the left wall of the slide groove 15, the left side of the screw rod 144 is movably connected to the slide groove 15 through a bearing, the right end of the movable plate 145 is fixedly connected to the left end of the second support plate 9, the second support plate 9 is detachably connected to the movable plate 145 through a screw rod, the movable plate 145 is slidably connected in the slide groove 15, the outer surface of the second motor 141 is movably covered with a shell 13, the shell 13 is installed at the lower end of the first support plate 8, and the shell 13 is used to protect the second motor 141 and the first gear 142.
[0030] Suction cups 10 are disposed at the upper ends of the first support plate 8 and the second support plate 9. The suction cups 10 are used to adsorb the wafers. The first support plate 8, the second support plate 9 and the suction cups 10 cooperate with each other to grasp the wafers.
[0031] L-shaped plates 2 are installed at the left and right ends of the base plate 1, and an electric cylinder 11 is installed at the lower end of the base plate 1. The electric cylinder 11 is detachably connected to the lower end of the base plate 1 through a screw. The electric cylinder 11 is used to adjust the height of the rotating table 3. The output end of the electric cylinder 11 movably passes through the upper end of the base plate 1 and is fixedly connected to the lower end of the rotating table 3. The internal movable sleeve of the base plate 1 is provided with two guide rods 12, and the upper ends of the two guide rods 12 are fixedly connected to the lower end of the rotating table 3.
[0032] The fully automatic wafer manipulator proposed by the utility model, when in use, controls the mechanical arm 4 through the controller to drive the first support plate 8 and the second support plate 9 to approach the bottom of the wafer, and the wafer can be mechanically grasped by the suction cup 10, and the wafer can be driven to rotate by the rotating table 3, and the output end of the electric cylinder 11 can be controlled to extend or shorten, and the height of the grasped wafer can be adjusted. When it is necessary to grasp a wafer of a larger size, the first motor 61 is controlled to drive the positive and negative threaded rod 62 to rotate, and the positive and negative threaded rod 62 drives the two moving blocks 63 to move away from each other, and the two moving blocks 63 respectively drive the two first support plates 8 to move away from each other, so that the first support plate 8 can grasp the wafer of a larger size. At the same time, the output end of the second motor 141 is controlled to drive the first gear 142 to rotate, the first gear 142 drives the second gear 143 to rotate, the second gear 143 drives the screw rod 144 to rotate, the screw rod 144 drives the moving plate 145 to move rightward, and the moving plate 145 drives the second support plate 9 to move rightward. Adjusting the lateral size of the grasping part can align the clamping point of the manipulator with the center of the wafer.
[0033] It is worth noting that the entire device is connected to a power supply and a main control button, and it is controlled by the main control button. Since the device matched with the control button is a common device and belongs to the existing mature technology, its electrical connection relationship and specific circuit structure will not be described here.
[0034] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.
Claims
1. A fully automatic wafer robot, comprising a base plate (1), characterized in that: A rotating table (3) is arranged at the upper end of the base plate (1), a mechanical arm (4) is installed at the output end of the rotating table (3), a placing table (5) is arranged on the mechanical arm (4), a through slot (7) is opened at the right end of the placing table (5), an adjusting component (6) is installed at the front end of the placing table (5), two first support plates (8) symmetrically distributed front and back are arranged in the through slot (7), a second support plate (9) is arranged at the right end of the two first support plates (8), a moving component (14) is installed at the middle part of the lower end of the two first support plates (8), a slide slot (15) is opened at the right part of the lower end of the two first support plates (8), and the two moving components (14) extend into the two slide slots (15) respectively.
2. The fully automatic wafer robot according to claim 1, characterized in that: The adjusting component (6) comprises a first motor (61), which is mounted at the front end of the placing table (5); the output of the first motor (61) extends into the through slot (7) and is fixedly connected to a forward and reverse threaded rod (62); the rear end of the forward and reverse threaded rod (62) is movably connected to a bearing seat (64), which is mounted in the through slot (7); and the outer surface of the forward and reverse threaded rod (62) is threadedly sleeved with two moving blocks (63) symmetrically distributed front and rear.
3. The fully automatic wafer robot according to claim 2, characterized in that: The right ends of the two moving blocks (63) are respectively fixedly connected to the left ends of the two first support plates (8), and the left ends of the two moving blocks (63) are both slidably connected to the left wall of the through slot (7).
4. The fully automatic wafer robot according to claim 1, characterized in that: The moving component (14) comprises a second motor (141), the second motor (141) is mounted at the lower end of the first support plate (8), the output end of the second motor (141) is drivingly connected to a first gear (142), the first gear (142) is meshingly connected to a second gear (143), a screw rod (144) is fixedly sleeved inside the second gear (143), and a moving plate (145) is threadedly sleeved on the outer surface of the screw rod (144).
5. The fully automatic wafer robot according to claim 4, characterized in that: The left end of the screw rod (144) is movably connected to the left wall of the slide groove (15), the right end of the movable plate (145) is fixedly connected to the left end of the second support plate (9), the movable plate (145) is slidably connected in the slide groove (15), and the outer surface of the second motor (141) is movably covered with a shell (13), and the shell (13) is installed at the lower end of the first support plate (8).
6. The fully automatic wafer robot according to claim 1, characterized in that: Suction cups (10) are provided at the upper ends of the first support plate (8) and the second support plate (9).
7. The fully automatic wafer robot according to claim 1, characterized in that: An L-shaped plate (2) is installed at the left and right ends of the base plate (1); an electric cylinder (11) is installed at the lower end of the base plate (1); the output end of the electric cylinder (11) movably passes through the upper end of the base plate (1) and is fixedly connected to the lower end of the rotating platform (3); two guide rods (12) are movably sleeved inside the base plate (1); the upper ends of the two guide rods (12) are fixedly connected to the lower end of the rotating platform (3).
Citation Information
Patent Citations
Wafer manipulator device
CN214238251U