A quantitative feeding device for cooling solid materials

By using silicon carbide particles as cooling medium in solid material cooling equipment, and through temperature sensors and quantitative replacement mechanisms, the cooling effect reduction caused by cooling medium heating is solved, and the effect of efficient cooling and material surface polishing is achieved.

CN222699584UActive Publication Date: 2025-04-01HUNAN ZHONGLIAN INTELLIGENT MASCH EQUIP MFG CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202420971928.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-07
Publication Date
2025-04-01
Estimated Expiration
2034-05-07

AI Technical Summary

Technical Problem

In the process of cooling solid materials, the cooling medium gradually heats up, resulting in a decrease in cooling effect and affecting working efficiency.

Method used

A quantitative feeding equipment for cooling solid materials was designed, using silicon carbide particles as the cooling medium, and the cooling medium was monitored and quantitatively replaced by a temperature sensor to ensure the cooling effect.

Benefits of technology

Through quantitative replacement of silicon carbide particles and temperature monitoring, the low temperature state of the cooling medium is maintained, the cooling efficiency of solid materials is improved, and the surface of the material is polished during the cooling process to remove burrs and increase smoothness.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222699584U_ABST
    Figure CN222699584U_ABST
Patent Text Reader

Abstract

This utility model relates to the field of solid material cooling technology, and more particularly to a quantitative feeding device for solid material cooling. It includes a housing, inside which is a feeding assembly for quantitatively replacing and conveying the cooling medium. The feeding assembly includes a cooling chamber located inside the housing, a transfer frame at the top of the cooling chamber, a cavity at the top of the transfer frame, a discharge groove on the inner wall of the cooling chamber, a pipeline outside the discharge groove, a pump body and a sleeve outside the pipeline, and a guide groove on the inner wall of the sleeve. This utility model achieves heat absorption cooling of solid materials using silicon carbide particles as the cooling medium. During contact cooling, the material can be polished and deburred, the temperature of the cooling medium can be monitored, and the cooling medium can be quantitatively pre-stored for easy replacement, ensuring the cooling effect of the cooling medium.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of solid material cooling, in particular to quantitative feeding equipment for solid material cooling. Background Art

[0002] Solid material cooling is a key step in the industrial production process. It mainly reduces the temperature of solid materials through various means to prevent them from overheating during the production process. The purpose of solid material cooling is to ensure that the material remains within the appropriate temperature range during the processing, thereby ensuring product quality and improving production efficiency.

[0003] However, in the current existing technology, solid materials are generally cooled by water cooling, air cooling and contact cooling. Contact cooling is achieved by contacting with materials with lower thermal conductivity to transfer heat. However, during contact cooling, the cooling medium will gradually heat up after contacting the material, so the cooling effect will gradually decrease, resulting in an increase in the cooling time of subsequent batches of materials, affecting work efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a quantitative feeding device for cooling solid materials to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A quantitative feeding device for cooling solid materials comprises a shell, wherein a feeding assembly for quantitatively replacing and conveying a cooling medium is arranged inside the shell, wherein the feeding assembly comprises a cooling bin arranged inside the shell, wherein a transfer frame is arranged on the top of the cooling bin, wherein a cavity is arranged on the top of the transfer frame, wherein a discharge groove is arranged on the inner wall of the cooling bin, wherein a pipeline is arranged outside the discharge groove, wherein a pump body and a sleeve are arranged outside the pipeline, and wherein a guide groove is arranged on the inner wall of the sleeve.

[0007] As a preferred solution of the utility model, the transfer frame is connected to the top of the shell by bolts, the transfer frame is connected to the cooling bin through a solenoid valve, and an infrared sensor is arranged inside the transfer frame for detecting the material level height, and is electrically connected to the solenoid valve.

[0008] As a preferred solution of the utility model, the cavity is located at the top of the transfer frame and communicates with the inside of the transfer frame. Fan blades are arranged inside the cavity and can rotate to dissipate heat in the transfer frame.

[0009] As a preferred solution of the utility model, the cooling bin is communicated with each other through a solenoid valve discharge slot, and a temperature sensor is provided inside the cooling bin for detecting the temperature of the cooling medium and is electrically connected to the solenoid valve in the cooling bin.

[0010] As a preferred solution of the utility model, one end of the pipeline is located in the discharge groove, and the other end extends into the transfer frame. The pump body is located in the pipeline, and the output end and the input end are both connected to the pipeline. The sleeve is sleeved on the outside of the pipeline. The interior of the sleeve is a hollow structure due to the guide groove, and the guide groove is a curved structure. Both ends of the guide groove are connected to the cooling water tank through water pipes.

[0011] As a preferred solution of the utility model, a driving shaft is provided on the inner wall of the cooling bin, and a stirring blade is provided on the outside of the driving shaft. The driving shaft is rotatably connected to the inner wall of the cooling bin through a bearing, and can drive the stirring blade to rotate when powered on to make the cooling medium in the cooling bin flow.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows: in response to the problems raised in the background technology, the present application adopts a feeding assembly, which absorbs the heat of the solid material by injecting silicon carbide particles as a cooling medium into the cooling bin, thereby cooling the solid material. In addition, the flow of silicon carbide particles can polish the surface of the solid material, remove burrs on the surface of the material, and increase the smoothness of the surface of the material;

[0013] The temperature of the silicon carbide particles can be monitored by a temperature sensor. When the temperature rises to a specified value, the discharge can be controlled for cooling. At the same time, the silicon carbide particles required for replacement can be quantitatively prepared through the transfer bin, and when the cooling medium is replaced, the silicon carbide particles in the transfer bin are injected into the cooling bin, and then the cooled silicon carbide particles are transported to the transfer bin for quantitative replacement next time.

[0014] The utility model realizes endothermic cooling of solid materials by using silicon carbide particles as cooling medium, can polish and deburr the materials during contact cooling, can monitor the temperature of the cooling medium, and can pre-store the cooling medium in a quantitative manner for easy replacement, thereby ensuring the cooling effect of the cooling medium. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the appearance structure diagram of the shell of the utility model;

[0016] Figure 2 This is a cross-sectional view of the interior of the cooling bin of the utility model;

[0017] Figure 3 This is the appearance structure diagram of the casing of the utility model;

[0018] Figure 4 This is a structural diagram of the guide groove of the utility model.

[0019] In the figure: 1, shell; 2, cooling chamber; 201, drive shaft; 202, stirring blade; 3, transfer frame; 301, cavity; 4, discharge groove; 5, pipeline; 501, pump body; 6, sleeve; 601, guide groove. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the embodiments of the present invention.

[0021] Example

[0022] See also Figure 1-4 The utility model provides a technical solution: a quantitative feeding device for cooling solid materials, comprising a shell 1, wherein a feeding assembly for quantitatively replacing and conveying a cooling medium is arranged inside the shell 1, and the feeding assembly comprises a cooling bin 2 arranged inside the shell 1, for storing the cooling medium and the solid material, and silicon carbide particles are used as the cooling medium (silicon carbide particles have good thermal conductivity, which means that they can effectively transfer heat. Since the cooling of solid materials usually involves the transfer and absorption of heat, silicon carbide particles are a good choice; in addition, silicon carbide particles also have good chemical stability and high temperature resistance, so that they can maintain good performance in a high temperature environment. This is very important for some special industrial applications, such as cooling of solid materials in a high temperature environment), which can flow in the cooling bin 2, and achieve a cooling effect by absorbing heat from the material through contact with the solid material, and the flow of silicon carbide particles can grind and polish the material, thereby removing burrs on the surface of the solid material and improving the smoothness of the surface of the solid material. The top of the cooling bin 2 A transfer frame 3 is provided for quantitatively pre-storing the silicon carbide particles used for replacement, and the material level height of the silicon carbide particles is detected by the infrared sensor in the transfer frame 3, so as to quantitatively store the silicon carbide particles required for replacement. A cavity 301 is provided on the top of the transfer frame 3, and a fan blade is installed inside the cavity 301, which can rotate to dissipate heat in the transfer frame 3 and thus cool the silicon carbide particles. A discharge groove 4 is provided on the inner wall of the cooling bin 2 for discharging the used silicon carbide particles in the cooling bin 2. The cooling medium in the cooling bin 2 can be detected by the temperature sensor. The mass temperature is detected. When the temperature is higher than the set value, the solenoid valve is controlled to open to allow the cooling medium to fall into the discharge groove 4 and be discharged. The cooling medium is replaced. A pipeline 5 is arranged outside the discharge groove 4. The used cooling medium can be transported through the pump body 501. A pump body 501 and a sleeve 6 are arranged outside the pipeline 5. The inner wall of the sleeve 6 is provided with a guide groove 601. When the two ends of the guide groove 601 pass through the water pipe, the cooling water circulates. When the cooling medium passes through the sleeve 6, the cooling medium in the pipeline 5 can be cooled down to restore the cooling effect.

[0023] In this embodiment, all electrical components are controlled by conventional controllers.

[0024] For example, please refer to Figure 1-4 The transfer frame 3 is connected to the top of the shell 1 by bolts, and the transfer frame 3 is communicated with the cooling bin 2 through the electromagnetic valve. An infrared sensor is arranged inside the transfer frame 3 for detecting the material level height and is electrically connected to the electromagnetic valve. The cavity 301 is located at the top of the transfer frame 3 and communicates with the transfer frame 3. Fan blades are arranged inside the cavity 301, which can be rotated to dissipate heat in the transfer frame 3. The cooling bin 2 is communicated with the electromagnetic valve discharge slot 4. A temperature sensor is arranged inside the cooling bin 2 for detecting the temperature of the cooling medium and is electrically connected to the electromagnetic valve in the cooling bin 2. One end of the pipeline 5 is located in the discharge slot 4. , the other end extends into the transfer frame 3, the pump body 501 is located in the pipeline 5, and the output end and the input end are both connected to the pipeline 5, the sleeve 6 is sleeved on the outside of the pipeline 5, the inside of the sleeve 6 is a hollow structure due to the guide groove 601, and the guide groove 601 is a curved structure, both ends of the guide groove 601 are connected to the cooling water tank through a water pipe, the inner wall of the cooling bin 2 is provided with a driving shaft 201, and the outside of the driving shaft 201 is provided with a stirring blade 202, the driving shaft 201 is rotatably connected to the inner wall of the cooling bin 2 through a bearing, and can drive the stirring blade 202 to rotate after power is turned on to make the cooling medium in the cooling bin 2 flow. When in use, first put the cooling medium and solid material into the cooling bin 2, and then drive the silicon carbide particles to flow in the cooling bin 2 and contact the logistics through the driving shaft 201 and the stirring blades 202, so as to absorb heat and cool the material, and polish the material. During the contact cooling process, the temperature of the cooling medium is detected by the temperature sensor. When the temperature of the silicon carbide particles rises to a specified value, the material is taken out, and then the solenoid valve is controlled to open so that the silicon carbide particles fall into the discharge trough 4, and then the valve in the transfer frame 3 is opened to allow the pre-stored silicon carbide particles to be injected into the cooling bin 2. At the same time, the silicon carbide particles in the discharge trough 4 are transported through the pipeline 5 and pass through the casing 6. The silicon carbide particles are cooled by the water circulation in the casing 6, and the cooled silicon carbide particles are transported to the transfer frame 3 through the pipeline 5 for quantitative pre-storage to facilitate the next replacement and use.

[0025] The working process of the utility model is as follows: when in use, firstly, the cooling medium and the solid material are placed in the cooling bin 2, and then the driving shaft 201 and the stirring blade 202 are used to drive the silicon carbide particles to flow in the cooling bin 2 and contact with the logistics, so as to absorb heat and cool the material, and polish the material. During the contact cooling process, the temperature of the cooling medium is detected by the temperature sensor, and when the temperature of the silicon carbide particles rises to a specified value, the material is taken out, and then the solenoid valve is controlled to open so that the silicon carbide particles fall into the discharge trough 4, and then the valve in the transfer frame 3 is opened to allow the pre-stored silicon carbide particles to be injected into the cooling bin 2, and at the same time, the silicon carbide particles in the discharge trough 4 are transported through the pipeline 5 and pass through the sleeve 6, and the silicon carbide particles are cooled and cooled by the water circulation in the sleeve 6, and the cooled silicon carbide particles are transported to the transfer frame 3 through the pipeline 5 for quantitative pre-storage to facilitate the next replacement and use. The utility model realizes endothermic cooling of solid materials by using silicon carbide particles as cooling medium, can polish and deburr the materials during contact cooling, can monitor the temperature of the cooling medium, and can pre-store the cooling medium in a quantitative manner for easy replacement, thereby ensuring the cooling effect of the cooling medium.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A quantitative feeding device for solid material cooling, comprising a housing (1), wherein a feeding assembly for quantitatively replacing and conveying a cooling medium is arranged inside the housing (1), characterized in that: The feeding assembly comprises a cooling bin (2) arranged inside a shell (1), a transfer frame (3) being arranged on the top of the cooling bin (2), a cavity (301) being arranged on the top of the transfer frame (3), a discharge groove (4) being arranged on the inner wall of the cooling bin (2), a pipeline (5) being arranged outside the discharge groove (4), a pump body (501) and a sleeve (6) being arranged outside the pipeline (5), and a guide groove (601) being arranged on the inner wall of the sleeve (6).

2. The quantitative feeding equipment for solid material cooling according to claim 1, characterized in that: The transfer frame (3) is connected to the top of the shell (1) by bolts, and the transfer frame (3) is connected to the cooling bin (2) through a solenoid valve. An infrared sensor is arranged inside the transfer frame (3) for detecting the material level height, and is electrically connected to the solenoid valve.

3. The quantitative feeding equipment for solid material cooling according to claim 2, characterized in that: The cavity (301) is located at the top of the transfer frame (3) and communicates with the interior of the transfer frame (3); a fan blade is arranged inside the cavity (301) and can rotate to dissipate heat inside the transfer frame (3).

4. The quantitative feeding equipment for solid material cooling according to claim 1, characterized in that: The cooling bin (2) is in communication with the electromagnetic valve discharge groove (4); a temperature sensor is provided inside the cooling bin (2) for detecting the temperature of the cooling medium and is electrically connected to the electromagnetic valve in the cooling bin (2).

5. The quantitative feeding equipment for solid material cooling according to claim 1, characterized in that: One end of the pipeline (5) is located in the discharge groove (4), and the other end extends into the transfer frame (3); the pump body (501) is located in the pipeline (5), and the output end and the input end are both connected to the pipeline (5); the sleeve (6) is sleeved on the outside of the pipeline (5); the inside of the sleeve (6) is a hollow structure due to the guide groove (601), and the guide groove (601) is a curved structure; both ends of the guide groove (601) are connected to the cooling water tank through a water pipe.

6. The quantitative feeding equipment for solid material cooling according to claim 1, characterized in that: The inner wall of the cooling bin (2) is provided with a driving shaft (201), and the outside of the driving shaft (201) is provided with a stirring blade (202). The driving shaft (201) is rotatably connected to the inner wall of the cooling bin (2) via a bearing, and can drive the stirring blade (202) to rotate when powered on, so that the cooling medium in the cooling bin (2) flows.