A PCB production electroplating device

Abstract

The utility model discloses a PCB production electroplating device, relates to the technical field of PCB production, solves the technical problem that waste gas generated by volatilization of electroplating liquid in the prior art is easy to pollute the environment and increase the impact on the health of workers; comprises an electroplating box, an electroplating tank arranged in the electroplating box, a liquid injection port and a liquid outlet arranged on the electroplating tank; also comprises a gas purification mechanism, the gas purification mechanism comprises a purification box arranged on the side of the electroplating box, a centrifugal fan arranged on the electroplating box, a spray bin and a purification bin arranged in the purification box and connected by pipelines, a spray structure arranged in the spray bin, a purification filter arranged in the purification bin, a conduit arranged between the centrifugal fan and the spray bin, and an axial flow fan embedded in the side of the purification bin; the utility model can collect and process the waste gas generated by the volatilization of the electroplating liquid, can effectively reduce the pollution to the environment, and greatly reduce the impact on the health of workers.

Description

Technical Field

[0001] The utility model belongs to the technical field of PCB board production, and in particular relates to a PCB board production electroplating device. Background Art

[0002] Generally, in the production of PCB boards, the core board needs to be electroplated, and the plating is deposited on the core board by electrolysis.

[0003] For example: China's authorization announcement number is CN208965065U, a utility patent for a ceramic green body processing equipment that reduces cracks in green bodies. The patent includes an electroplating tank, a filter, a liquid inlet pipe and a liquid outlet pipe; the first end of the liquid inlet pipe is connected to the liquid outlet of the filter, and the second end is arranged at the top of the internal space of the electroplating tank; the first end of the liquid outlet pipe is connected to the liquid inlet of the filter, and the second end is connected to the bottom of the electroplating tank. The electroplating solution will flow along the liquid inlet pipe into the internal space of the electroplating tank. In this process, the bubbles in the electroplating solution can be fully released, thereby reducing the bubbles in the electroplating solution, thereby greatly reducing the concave holes on the surface of the PCB board and improving the electroplating quality.

[0004] However, in the above-mentioned prior art, when the PCB board is electroplated, the waste gas generated by the volatilization of the electroplating solution cannot be collected and treated, which is easy to cause environmental pollution and increase the impact on the health of the workers. Therefore, we designed a PCB board production electroplating device. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a PCB production electroplating device, which solves the problem in the prior art that when the PCB board is electroplated, the waste gas generated by the volatilization of the electroplating liquid cannot be collected and processed, which easily pollutes the environment and increases the impact on the health of the workers.

[0006] To achieve the above-mentioned purpose, according to the embodiment of the first aspect of the utility model, a PCB board production electroplating device is provided, comprising an electroplating box, an electroplating tank arranged in the electroplating box, a liquid injection port and a liquid outlet arranged on the electroplating tank;

[0007] It also includes a gas purification mechanism, which includes a purification box arranged on the side of the electroplating box, a centrifugal fan arranged on the electroplating box, a spray chamber and a purification chamber arranged in the purification box and connected by pipelines, a spray structure arranged in the spray chamber, a purification filter arranged in the purification chamber, a duct arranged between the centrifugal fan and the spray chamber, and an axial flow fan embedded in the side of the purification chamber.

[0008] A further improvement is that the spray structure includes slot plates symmetrically arranged on the inner walls of both sides of the spray bin, a plurality of spray ring pipes arranged in the two slot plates and connected by pipes, and a plurality of spray holes arranged at the bottom of each spray ring pipe.

[0009] A further improvement is that a purification channel is provided in the purification chamber, a mounting frame is connected to the port of the purification channel, a rubber ring is provided on the inner wall of the port of the mounting frame, the purification filter is installed in the mounting frame by fastening bolts, and the outer wall is in contact with the rubber ring, and the rubber ring is used to improve the sealing performance, so as to facilitate filtering and disassembly of the purification filter.

[0010] A further improvement is that an inlet and outlet groove is provided on the side of the electroplating box, and the electroplating tank is slidably arranged in the electroplating box. When the PCB board is placed, the electroplating liquid is injected into the electroplating tank by an external power pump, and the electroplating tank is pushed into the electroplating box after the PCB board is placed.

[0011] A further improvement is that exhaust ports are provided on the top surface of the electroplating box and the side surface of the purification box, and the centrifugal fan and the axial flow fan are respectively correspondingly clamped on the exhaust ports, and the exhaust ports are used for the introduction of exhaust gas.

[0012] A further improvement is that a purification filter element is arranged inside the purification filter, and the purification filter element is arranged in multiple layers, and the filter diameter of each layer of the purification filter element decreases successively in the exhaust direction, so that the generated exhaust gas can be filtered and purified at multiple stages to improve the purification effect.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The utility model starts a centrifugal fan during the electroplating process to draw in the waste gas generated by the electroplating work, and the waste gas is transported to the spray bin through a conduit, then an alkaline solution is extracted by a liquid extraction pump, and sprayed from a plurality of spray ring pipes and liquid spray holes, and the alkaline solution is used as an absorption liquid to absorb part of the waste gas; then the waste gas flows into the purification bin, and then passes through a purification filter element in the purification filter for purification and filtration, and then the purified waste gas is discharged by the axial flow fan, wherein the rubber ring is designed to improve the sealing performance, and the purification filter is installed by fastening bolts, which is convenient for disassembly and replacement of the filter element in the purification filter, and its practicality is effectively improved. This device can collect and treat the waste gas generated by the volatilization of the electroplating solution, which can effectively reduce the pollution to the environment, and the generated waste gas is purified through multi-stage filtration, thereby improving the purification effect and greatly reducing the impact on the health of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0017] Figure 3 It is a schematic diagram of the structure of the utility model from top view.

[0018] Markings in the figure:

[0019] 1. Electroplating box; 11. Liquid outlet; 12. Liquid injection port; 13. Electroplating tank;

[0020] 2. Gas purification mechanism; 21. Centrifugal fan; 22. Conduit; 23. Purification box; 24. Spray chamber; 25. Purification chamber; 251. Purification channel; 252. Mounting frame; 253. Rubber ring; 26. Purification filter; 261. Purification filter element; 27. Spray structure; 271. Slot plate; 272. Spray ring pipe; 273. Spray hole; 28. Axial flow fan;

[0021] 3. Exhaust port. DETAILED DESCRIPTION

[0022] The technical solution of the utility model will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figure 1 As shown, a PCB production electroplating device includes an electroplating box 1, an electroplating tank 13 arranged in the electroplating box 1, a liquid injection port 12 and a liquid outlet 11 arranged on the electroplating tank 13, an inlet and outlet slot is arranged on the side of the electroplating box 1, and the electroplating tank 13 is slidably arranged in the electroplating box 1. When the PCB board is placed, the electroplating liquid is injected into the electroplating tank 13 by using an external power pump, and the electroplating tank 13 is pushed into the electroplating box 1 after the PCB board is placed;

[0024] like Figure 2 As shown, it also includes a gas purification mechanism 2, which includes a purification box 23 arranged on the side of the electroplating box 1, a centrifugal fan 21 arranged on the electroplating box 1, a spray chamber 24 and a purification chamber 25 arranged in the purification box 23 and connected by pipelines, a spray structure 27 arranged in the spray chamber 24, a purification filter 26 arranged in the purification chamber 25, a duct 22 arranged between the centrifugal fan 21 and the spray chamber 24, and an axial flow fan 28 embedded in the side of the purification chamber 25.

[0025] like Figure 2 and Figure 3As shown, the spray structure 27 includes slot plates 271 symmetrically arranged on the inner wall surfaces on both sides of the spray bin 24, a plurality of spray ring tubes 272 arranged in the two slot plates 271 and connected by pipes, and a plurality of spray holes 273 arranged at the bottom of each spray ring tube 272; a purification channel 251 is arranged in the purification bin 25, a mounting frame 252 is connected to the port of the purification channel 251, a rubber ring 253 is arranged on the inner wall surface of the port of the mounting frame 252, the purification filter 26 is installed in the mounting frame 252 by fastening bolts, and the outer wall surface is in contact with the rubber ring 253, and the rubber ring 253 is used to improve the sealing performance to facilitate the filtering and disassembly of the purification filter 26.

[0026] Combination Figure 2 As shown, as a preferred embodiment, an exhaust port 3 is provided on the top surface of the electroplating box 1 and the side of the purification box 23, and the centrifugal fan 21 and the axial flow fan 28 are respectively correspondingly stuck on the exhaust port 3, and the exhaust port 3 is used for the introduction of exhaust gas.

[0027] Combination Figure 2 and Figure 3 As shown, as a preferred embodiment, a purification filter element 261 is arranged inside the purification filter 26, and the purification filter element 261 is provided with multiple layers, and the filter diameter of each layer of the purification filter element 261 decreases successively along the exhaust direction, so that the generated exhaust gas can be filtered and purified at multiple stages to improve the purification effect.

[0028] Combination Figures 1 to 3 As shown, it should be noted that the size of the application document is selected and installed according to the actual needs of the site; the applicant once again reminds that in addition to the above-mentioned gas purification mechanism 2, the electroplating box 1 is also equipped with other supporting equipment and mechanisms, which can be installed before implementation, not without settings, and the application document has been omitted, and only the waste gas treatment is improved; in addition, before implementation, the pipelines of each spray ring pipe 272 are connected to the external solution pool, and the alkaline solution or acidic solution is selected according to the site. The application document takes the alkaline solution as an example;

[0029] The working principle of this PCB production electroplating device is as follows:

[0030] When in use, the staff first uses an external power pump to inject the electroplating solution into the electroplating tank 13, then immerses the PCB board to be electroplated into the electroplating solution in the electroplating tank 13, and then pushes the electroplating tank 13 into the electroplating box 1 to start electroplating;

[0031] Then, during the electroplating process, the centrifugal fan 21 is started to draw in the waste gas generated by the electroplating work, and the waste gas is transported to the spray chamber 24 through the conduit 22. Then, the alkaline solution is drawn out by the liquid pump and sprayed from a plurality of spray ring pipes 272 and the liquid spray holes 273. The alkaline solution is first used as an absorption liquid to absorb part of the waste gas.

[0032] Then the exhaust gas flows into the purification chamber 25, and then passes through the purification filter element 261 in the purification filter 26 for purification and filtration, and then the purified exhaust gas is discharged by the axial flow fan 28, wherein the rubber ring 253 is designed to improve the sealing performance, and the purification filter 26 is installed by fastening bolts, which is convenient for disassembly and replacement of the purification filter element 261 in the purification filter 26, and effectively improves its practicality. This device can collect and treat the exhaust gas generated by the volatilization of the electroplating solution, which can effectively reduce the pollution to the environment, and the exhaust gas generated is filtered and purified at multiple stages, which improves the purification effect and greatly reduces the impact on the health of the staff.

[0033] The above embodiments are only used to illustrate the technical method of the utility model rather than to limit it. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical method of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the utility model.

Claims

1. A PCB production electroplating device, comprising an electroplating box (1), an electroplating tank (13) arranged in the electroplating box (1), and a liquid injection port (12) and a liquid outlet (11) arranged on the electroplating tank (13); It is characterized in that The invention also includes a gas purification mechanism (2), wherein the gas purification mechanism (2) includes a purification box (23) arranged on the side of the electroplating box (1), a centrifugal fan (21) arranged on the electroplating box (1), a spray chamber (24) and a purification chamber (25) arranged in the purification box (23) and connected by pipelines, a spray structure (27) arranged in the spray chamber (24), a purification filter (26) arranged in the purification chamber (25), a conduit (22) arranged between the centrifugal fan (21) and the spray chamber (24), and an axial flow fan (28) embedded in the side of the purification chamber (25).

2. A PCB production electroplating device according to claim 1, characterized in that: The spray structure (27) comprises groove plates (271) symmetrically arranged on the inner wall surfaces of both sides of the spray bin (24), a plurality of spray ring pipes (272) arranged in the two groove plates (271) and connected by pipes, and a plurality of spray holes (273) arranged at the bottom of each spray ring pipe (272).

3. A PCB production electroplating device according to claim 1, characterized in that: The purification chamber (25) is provided with a purification channel (251), the port of the purification channel (251) is connected to a mounting frame (252), the inner wall surface of the port of the mounting frame (252) is provided with a rubber ring (253), and the purification filter (26) is installed in the mounting frame (252) by means of fastening bolts, and the outer wall surface is in contact with the rubber ring (253).

4. A PCB production electroplating device according to claim 1, characterized in that: The side of the electroplating box (1) is provided with an entry and exit slot, and the electroplating slot (13) is slidably arranged in the electroplating box (1).

5. A PCB production electroplating device according to claim 1, characterized in that: An exhaust port (3) is provided on the top surface of the electroplating box (1) and the side surface of the purification box (23), and the centrifugal fan (21) and the axial flow fan (28) are respectively correspondingly clamped on the exhaust port (3).

6. A PCB production electroplating device according to claim 1, characterized in that: A purification filter element (261) is arranged inside the purification filter (26), and the purification filter element (261) is provided with multiple layers, and the filter diameter of each layer of the purification filter element (261) decreases in sequence along the exhaust direction.

Images