A circuit board electroplating tank

Abstract

The utility model relates to the technical field of electroplating devices, and discloses a circuit board electroplating tank, including an equipment main body, wherein the equipment main body comprises: a bottom plate, a plurality of supporting legs are fixedly connected to the bottom end of the bottom plate, a plurality of brackets are fixedly connected to the top end of the bottom plate, and a placement box is fixedly connected to the top end of the bracket; by arranging a variable speed motor and a rotating shaft, when the circuit board is placed, the variable speed motor is started, and the variable speed motor causes the rotating shaft to drive the upper electroplating plate to rotate slowly, so that the electroplating liquid flows; by arranging an electric telescopic rod, when the electroplating is completed, the electric telescopic rod is started, and the electric telescopic rod pushes the circuit board upward to expose the electroplating liquid surface, so as to facilitate the removal of the circuit board; by arranging a first limit tube, a second limit tube and a reset spring, circuit boards of different sizes can be placed, effectively expanding the applicability range of the equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating devices, in particular to a circuit board electroplating tank. Background Art

[0002] During the manufacturing process of a circuit board, the circuits formed on the circuit board and the jacks provided thereon must all undergo an electroplating process. Currently, most electroplating operations involve copper or gold plating on the manufactured circuit board.

[0003] The clamping structure of the existing circuit board electroplating tank is relatively simple and cannot be adjusted according to the size of the circuit board. In addition, the electroplating liquid is prone to liquid turbidity after long-term use, which affects the electroplating effect. Therefore, improvement is needed and a circuit board electroplating tank is proposed. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board electroplating tank to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a circuit board electroplating tank, comprising an equipment body, the equipment body comprising:

[0006] A bottom plate, the bottom end of which is fixedly connected to a plurality of supporting legs, the top end of which is fixedly connected to a plurality of brackets, and the top end of which is fixedly connected to a placement box.

[0007] Furthermore, a variable speed motor is fixedly connected to the bottom end of the base plate, a rotating shaft is fixedly connected to the output end of the variable speed motor, and the rotating shaft passes through the base plate.

[0008] Furthermore, a mounting plate is fixedly connected to the top of the rotating shaft, an electric telescopic rod is fixedly connected to the top of the mounting plate, and one end of the electric telescopic rod passes through the bottom of the placement box.

[0009] Furthermore, the top end of the electric telescopic rod is fixedly connected to a support column, and both sides of the support column are fixedly connected to a first position limiting tube.

[0010] Furthermore, a return spring is arranged inside the first limiting tube, and one end of the return spring is fixedly connected to the support column.

[0011] Furthermore, one end of the return spring is fixedly connected to a connecting plate, one side of the connecting plate is fixedly connected to a second position limiting tube, and the second position limiting tube is snap-connected to the first position limiting tube.

[0012] Furthermore, a top end of the connecting plate is fixedly connected to a limiting rod, and an inner wall of the limiting rod is fixedly connected to a plurality of protrusions.

[0013] Furthermore, a plurality of connecting rods are fixedly connected to the side surface of the limiting rod.

[0014] Furthermore, a placement rack is fixedly connected to the right side of the placement box, a filter box is fixedly connected to the upper end of the placement rack, a water inlet pipe is connected to the bottom end of the filter box, and one end of the water inlet pipe close to the water inlet is connected to the placement box.

[0015] Furthermore, the top of the filter box is connected to a water outlet pipe, a water pump is arranged in the middle of the water outlet pipe, the bottom end of the water pump is fixedly connected to the filter box, and one end of the water outlet pipe close to the water outlet is connected to the placement box.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] By setting a variable speed motor and a rotating shaft, when the circuit board is placed, the variable speed motor is started, and the variable speed motor causes the rotating shaft to drive the upper electroplating plate to rotate slowly, so that the electroplating liquid flows. By setting an electric telescopic rod, when the electroplating is completed, the electric telescopic rod is started, and the electric telescopic rod pushes the circuit board upward to expose the electroplating liquid surface, so that the circuit board is easy to take out. By setting a first limit tube, a second limit tube and a reset spring, circuit boards of different sizes can be placed, which effectively expands the applicability range of the equipment. By setting a convex point, the contact area between the circuit board and the circuit board can be reduced, and the influence of clamping on the electroplating effect of the circuit board is reduced. By setting a connecting rod, the side of the circuit board can be limited to prevent the circuit board from being thrown out during the rotation process. By setting a water inlet pipe, a placement plate, a filter box, a water outlet pipe and a water pump, when the electroplating liquid needs to be filtered, the water pump is started to draw the electroplating liquid from the water inlet pipe through the filter box and then flow into the placement box from the water outlet pipe. It can not only filter the electroplating liquid, but also save resources, and effectively enhance the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a front structural schematic diagram of the utility model;

[0021] Figure 3 It is a right side cross-sectional structural schematic diagram of the utility model;

[0022] Figure 4 It is a front cross-sectional structural schematic diagram of the utility model.

[0023] In the figure: 1. Equipment body; 101. First limit tube; 102. Return spring; 103. Connecting plate; 104. Second limit tube; 105. Limit rod; 106. Bump; 107. Connecting rod; 108. Placement plate; 109. Filter box; 110. Water inlet pipe; 111. Water outlet pipe; 112. Water pump; 11. Bottom plate; 12. Support leg; 13. Bracket; 14. Placement box; 15. Variable speed motor; 16. Rotating shaft; 17. Mounting plate; 18. Electric telescopic rod; 19. Support column. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-4The utility model provides a technical solution for a circuit board electroplating tank: a circuit board electroplating tank, including a device body 1, the device body 1 includes: a bottom plate 11, the bottom end of the bottom plate 11 is fixedly connected with a plurality of supporting legs 12, the top of the bottom plate 11 is fixedly connected with a plurality of brackets 13, the top of the bracket 13 is fixedly connected with a placement box 14, the bottom end of the bottom plate 11 is fixedly connected with a variable speed motor 15, by setting the variable speed motor 15 and the rotating shaft 16, when the circuit board is placed, the variable speed motor 15 is started, and the variable speed motor 15 makes the rotating shaft 16 rotate. 6 drives the upper electroplating plate to rotate slowly, so that the electroplating liquid flows. The output end of the variable speed motor 15 is fixedly connected with a rotating shaft 16, and the rotating shaft 16 passes through the bottom plate 11. The top of the rotating shaft 16 is fixedly connected with a mounting plate 17, and the top of the mounting plate 17 is fixedly connected with an electric telescopic rod 18. By setting the electric telescopic rod 18, when the electroplating is completed, the electric telescopic rod 18 is started, and the electric telescopic rod 18 pushes the circuit board upward to expose the electroplating liquid surface, so as to facilitate the removal of the circuit board. One end of the electric telescopic rod 18 passes through the bottom of the placement box 14;

[0028] The top of the electric telescopic rod 18 is fixedly connected with a support column 19, and both sides of the support column 19 are fixedly connected with a first limiting tube 101. By setting the first limiting tube 101, the second limiting tube 104 and the reset spring 102, circuit boards of different sizes can be placed, which effectively expands the applicability of the equipment. The first limiting tube 101 is provided with a reset spring 102 inside, one end of the reset spring 102 is fixedly connected to the support column 19, and one end of the reset spring 102 is fixedly connected to a connecting plate 103, and one side of the connecting plate 103 is fixedly connected with a second limiting tube 104, and the second limiting tube 104 is snap-connected with the first limiting tube 101. The top of the connecting plate 103 is fixedly connected with a limiting rod 105, and the inner wall of the limiting rod 105 is fixedly connected with a plurality of protrusions 106. By setting the protrusions 106, the contact area with the circuit board can be reduced, and the influence of clamping on the electroplating effect of the circuit board can be reduced. The side of the limiting rod 105 is fixedly connected with a plurality of connecting rods 107. By setting the connecting rod 107, the side of the circuit board can be limited to prevent the circuit board from being thrown out during the rotation process. The right side of the placement box 14 is fixedly connected with a placement rack, and the upper end of the placement rack is fixedly connected with a filter box 109. The bottom end of the filter box 109 is connected with a water inlet pipe 110. By setting the water inlet pipe 110, the placement plate 108, the filter box 109, the water outlet pipe 111 and the water pump 112, when the electroplating liquid needs to be filtered, the water pump 112 is started to pump the electroplating liquid from the water inlet pipe 110. The liquid passes through the filter box 109 and then flows into the storage box 14 through the outlet pipe 111, which can not only filter the electroplating liquid, but also save resources, effectively enhancing the practicality of the device. The end of the water inlet pipe 110 close to the water inlet is connected to the storage box 14, the top of the filter box 109 is connected to the outlet pipe 111, and a water pump 112 is arranged in the middle of the outlet pipe 111. The bottom end of the water pump 112 is fixedly connected to the filter box 109, and the end of the water outlet pipe 111 close to the water outlet is connected to the storage box 14.

[0029] The utility model is provided with a device body 1. When in use, when the circuit board is placed, the variable speed motor 15 is started, and the variable speed motor 15 makes the rotating shaft 16 drive the upper electroplating plate to rotate slowly, so that the electroplating liquid flows. When the electroplating is completed, the electric telescopic rod 18 is started, and the electric telescopic rod 18 pushes the circuit board upward to expose the electroplating liquid surface, and the circuit board is taken out. When the electroplating liquid needs to be filtered, the water pump 112 is started to draw the electroplating liquid from the water inlet pipe 110 through the filter box 109 and then flow into the placement box 14 through the water outlet pipe 111. By setting the variable speed motor 15 and the rotating shaft 16, when the circuit board is placed, the variable speed motor 15 is started, and the variable speed motor 15 makes the rotating shaft 16 drive the upper electroplating plate to rotate slowly, so that the electroplating liquid flows. By setting the electric telescopic rod 18, when the electroplating is completed, the electric telescopic rod 18 is started, and the electric telescopic rod 18 pushes the electric telescopic rod 18 upward. The circuit board is exposed to the electroplating liquid surface, which is convenient for taking out the circuit board. By setting the first limiting tube 101, the second limiting tube 104 and the reset spring 102, circuit boards of different sizes can be placed, which effectively expands the applicability of the equipment. By setting the convex point 106, the contact area with the circuit board can be reduced, and the influence of clamping on the electroplating effect of the circuit board is reduced. By setting the connecting rod 107, the side of the circuit board can be limited to prevent the circuit board from being thrown out during the rotation. By setting the water inlet pipe 110, the placement plate 108, the filter box 109, the water outlet pipe 111 and the water pump 112, when the electroplating liquid needs to be filtered, the water pump 112 is started to make the electroplating liquid be drawn out from the water inlet pipe 110 through the filter box 109 and then flow into the placement box 14 from the water outlet pipe 111, which can not only filter the electroplating liquid, but also save resources, effectively enhancing the practicality of the device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board electroplating tank, comprising an equipment body (1), characterized in that: The device body (1) comprises: A bottom plate (11), the bottom end of the bottom plate (11) is fixedly connected to a plurality of supporting legs (12), the top end of the bottom plate (11) is fixedly connected to a plurality of brackets (13), the top end of the brackets (13) is fixedly connected to a placement box (14), the bottom end of the bottom plate (11) is fixedly connected to a variable speed motor (15), the output end of the variable speed motor (15) is fixedly connected to a rotating shaft (16), the rotating shaft (16) passes through the bottom plate (11), the top end of the rotating shaft (16) is fixedly connected to a mounting plate (17), the top end of the mounting plate (17) is fixedly connected to an electric telescopic rod (18), one end of the electric telescopic rod (18) passes through the bottom of the placement box (14), the top end of the electric telescopic rod (18) is fixedly connected to a support column (19), and both sides of the support column (19) are fixedly connected to a first position limiting tube (101); A return spring (102) is arranged inside the first position limiting tube (101), one end of the return spring (102) is fixedly connected to the support column (19), one end of the return spring (102) is fixedly connected to a connecting plate (103), one side of the connecting plate (103) is fixedly connected to a second position limiting tube (104), the second position limiting tube (104) is snap-connected to the first position limiting tube (101), and the top end of the connecting plate (103) is fixedly connected to a position limiting rod (105). The inner wall of the limiting rod (105) is fixedly connected with a plurality of protrusions (106), the side of the limiting rod (105) is fixedly connected with a plurality of connecting rods (107), the right side of the placement box (14) is fixedly connected with a placement rack (108), the upper end of the placement rack (108) is fixedly connected with a filter box (109), the bottom end of the filter box (109) is connected with a water inlet pipe (110), and the end of the water inlet pipe (110) close to the water inlet is connected with the placement box (14).

2. A circuit board electroplating tank according to claim 1, characterized in that: The top end of the filter box (109) is connected to a water outlet pipe (111), a water pump (112) is arranged in the middle of the water outlet pipe (111), the bottom end of the water pump (112) is fixedly connected to the filter box (109), and the end of the water outlet pipe (111) close to the water outlet is connected to the placement box (14).

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