Electroplating liquid feeding device for electroplating

Abstract

The present application relates to the field of electroplating technology, and in particular to a plating liquid feeding device for electroplating, the plating liquid feeding device for electroplating comprising a plating liquid feeding device for electroplating, comprising a liquid tank, a feeding pipe and a filtering device, one end of the feeding pipe is fixedly connected to the liquid tank, the filtering device is fixedly connected to the inner wall of the feeding pipe, the filtering device is used to filter the electrolyte entering the liquid tank through the feeding pipe; the filtering device comprises a sleeve and a filter core, the sleeve is fixedly connected to the inner wall of the feeding pipe, the filter core is arranged in the sleeve, and the filter core is fixedly connected to the sleeve, so as to achieve the effect of filtering the plating liquid when the electroplating liquid feeding device is used.

Description

Technical Field

[0001] The present application relates to the technical field of electroplating, and in particular to a plating liquid feeding device for electroplating. Background Art

[0002] At present, electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. The electroplating solution refers to a liquid that can expand the cathode current density range of the metal, improve the appearance of the coating, and increase the anti-oxidation stability of the solution.

[0003] Conventionally, when adding plating solution to a plating material bath, a plating solution feeding device is usually used to directly add the plating solution to the plating material bath.

[0004] The above-mentioned prior art solutions have the following defects: when the existing electroplating liquid feeding device is in use, because the feeding device itself does not have a filtering function, once the electroplating liquid contains foreign particles, it will affect the electroplating effect of the object, thereby increasing the cost. Utility Model Content

[0005] In order to achieve the effect that the electroplating liquid feeding device can filter the electroplating liquid, the present application provides a electroplating liquid feeding device for electroplating.

[0006] The above technical objectives of this application are achieved through the following technical solutions:

[0007] A plating liquid feeding device for electroplating includes a liquid pool, a feeding pipe and a filtering device, one end of the feeding pipe is fixedly connected to the liquid pool, the filtering device is fixedly connected to the inner wall of the feeding pipe, and the filtering device is used to filter the electrolyte entering the liquid pool through the feeding pipe; the filtering device includes a sleeve and a filter core, the sleeve is fixedly connected to the inner wall of the feeding pipe, the filter core is arranged in the sleeve, and the filter core is fixedly connected to the sleeve.

[0008] By adopting the above scheme, the feeding pipe is fixedly connected to the liquid pool, the electroplating liquid flows into the liquid pool through the feeding pipe, and a filtering device is fixedly connected in the feeding pipe, the filtering device includes a sleeve and a filter element, the sleeve is fixedly connected to the feeding pipe, the filter element is arranged in the sleeve and fixedly connected to the sleeve, when the electroplating liquid enters the feeding pipe, it is first filtered by the filter element, and the electroplating liquid filtered by the filter element flows into the liquid pool, the filter element intercepts impurities in the electroplating liquid, so that the electroplating liquid entering the liquid pool is free of impurities, and through the above arrangement, the effect of the electroplating liquid feeding device being able to filter the electroplating liquid is achieved.

[0009] Furthermore, the filter element includes a filter plate and a filter net, the filter plate is located above the filter net, the filter hole diameter of the filter net is smaller than the filter hole diameter of the filter plate, and the filter plate and the filter net are fixedly connected to the inner wall of the sleeve.

[0010] By adopting the above scheme, the filter element is divided into two parts, the first part is the filter plate, and the second part is the filter net; the aperture of the filter hole on the filter plate is larger than the aperture of the filter hole on the filter net, and the filter plate is placed above the filter net; when the electroplating solution enters the liquid pool through the feeding pipe, it first passes through the filter plate for primary filtration. Since the aperture of the filter plate is large, it can be ensured that the filtrate can filter out larger impurities without affecting the flow rate of the filtrate. Then the filtrate is filtered through the filter net for secondary filtration. The aperture of the filter hole of the filter net is smaller than the aperture of the filter hole of the filter plate, so that fine impurities in the electroplating solution can be screened out. By setting the filter plate and the filter net, the impurities in the electroplating solution are screened out, and the electroplating solution entering the liquid pool does not contain impurities.

[0011] Furthermore, a spare bin and a receiving bin are fixedly connected on both sides of the feeding pipe, and both the spare bin and the receiving bin are fixedly arranged horizontally with the filtering device. Both the spare bin and the receiving bin are through-connected with the feeding pipe. A spare filtering device is placed in the spare bin. The spare filtering device is used to replace the filtering device when it is blocked, and the receiving bin is used to receive the replaced filtering device.

[0012] By adopting the above scheme, a spare bin is fixedly connected to one side of the feeding pipe, the spare bin and the side wall of the feeding pipe are connected, the spare bin and the filter device are horizontally arranged, and the spare filter device is placed in the spare bin; when the plating liquid is injected into the feeding pipe, when the filter device is blocked by impurities in the plating liquid so that the plating liquid cannot flow into the liquid tank through the feeding pipe, the spare filter device is pushed toward the filter device until the spare filter device pushes the filter device out. In order to avoid the pushed-out filter device from falling and being damaged, a receiving bin is connected to the side of the feeding pipe away from the spare bin, and the replaced filter device is temporarily stored in the receiving bin, so that the filter device can be replaced without stopping the plating liquid from flowing into the filter box through the feeding pipe.

[0013] Furthermore, the side walls of the filtering device close to the spare bin and the receiving bin are provided with bearing grooves, and a sealing device is arranged in each bearing groove. The feeding pipe is provided with a groove corresponding to the sealing device. When the feeding pipe is fixedly connected to the filtering device, the sealing device is plugged into and matched with the groove to seal the filtering device and the feeding pipe.

[0014] By adopting the above scheme, in order to increase the sealing between the filter device and the feeding pipe, a bearing groove is opened on the two side walls of the filter device close to the spare bin and the receiving bin, and a sealing device is placed in the bearing groove. A groove is opened on the feeding pipe corresponding to the bearing groove. When the filter device is fixedly connected to the feeding pipe, the sealing device is pushed, and the sealing device and the groove are snap-fitted together, thereby increasing the sealing between the filter device and the feeding pipe, and preventing part of the electroplating liquid from flowing out through the gap between the filter device and the feeding pipe during the process of the electroplating liquid flowing into the liquid tank through the feeding pipe.

[0015] Furthermore, each of the sealing devices includes a gear, a supporting rack and a sealing ring. The gear is rotatably connected to the groove, and both sides of the gear are meshed with a supporting rack. The two supporting racks move in opposite directions. A sealing ring is correspondingly connected to the two supporting racks. When the feeding pipe is fixedly connected to the filtering device, the sealing ring is plugged into the groove.

[0016] By adopting the above scheme, a gear is rotatably connected in the bearing groove, and a supporting rack is fixedly connected on both sides of the gear. The movement directions of the two supporting racks are opposite, and the two racks respectively point to the two side walls where the filter device and the feeding tube abut. Sealing rings are fixedly connected to the two supporting racks. When the filter device is fixedly connected to the feeding tube, the driving gear rotates, and the rotation of the gear drives the two supporting racks to move in opposite directions. The two sealing rings are engaged with the grooves under the drive of the supporting racks, thereby completing the sealing between the filter device and the feeding tube.

[0017] Furthermore, a through groove is provided on the inner wall of the feeding pipe, the through groove is fixedly connected to the filtering device, and the through groove is used to support the filtering device.

[0018] Furthermore, a slide groove is provided in the through groove, and a sliding bar is provided in the filtering device corresponding to the through groove, the slide groove and the sliding bar are slidably connected, and the spare bin and the receiving bin are both provided with slide grooves. When the spare bin and the receiving bin are both through-connected with the feeding pipe, the slide grooves are all through-connected.

[0019] By adopting the above scheme, a through groove is opened on the inner wall of the feeding pipe so that the filtering device abuts against the through groove, and then a sliding groove is opened on the side wall of the through groove, and the sliding groove is connected to the inner wall of the spare bin and the receiving bin. The filtering device is provided with a sliding groove corresponding to the sliding groove. When the spare device abuts against the through groove, the sliding groove is slidably connected with the sliding bar. Through the above arrangement, the filtering device can slide in the spare bin, the through groove and the receiving bin.

[0020] Furthermore, a driving member is fixedly connected to the spare filtering device, and the driving member is used to drive the filtering device in the spare bin to slide into the material pipe.

[0021] Furthermore, it is characterized in that: the outer wall of the sleeve is fixedly connected to a bearing plate, and the bearing plate is used to support the driving member.

[0022] By adopting the above scheme, a driving member is fixedly connected to the spare filter device, the driving member pushes the spare filter device to move into the through groove, the spare filter device pushes the filter device to move into the receiving bin, and then the filter device is replaced, and a bearing plate is fixedly connected to the sleeve, and the bearing plate is used to support the cylinder.

[0023] In summary, this application has the following technical effects:

[0024] 1. By setting a filtering device, the feeding pipe is fixedly connected to the liquid pool, the electroplating liquid flows into the liquid pool through the feeding pipe, and a filtering device is fixedly connected in the feeding pipe, the filtering device includes a sleeve and a filter element, the sleeve is fixedly connected to the feeding pipe, the filter element is arranged in the sleeve and fixedly connected to the sleeve, when the electroplating liquid enters the feeding pipe, it is first filtered by the filter element, and the electroplating liquid filtered by the filter element flows into the liquid pool, the filter element intercepts impurities in the electroplating liquid, so that the electroplating liquid entering the liquid pool is free of impurities, through the above settings, the effect of the electroplating liquid feeding device being able to filter the electroplating liquid is achieved;

[0025] 2. A blocking device is provided, a gear is rotatably connected in the bearing groove, a supporting rack is fixedly connected on both sides of the gear, the movement directions of the two supporting racks are opposite, the two racks point to the two side walls where the filter device and the feeding pipe abut, respectively, and sealing rings are fixedly connected to the two supporting racks. When the filter device and the feeding pipe are fixedly connected, the driving gear rotates, and the rotation of the gear drives the two supporting racks to move in opposite directions. The two sealing rings are engaged with the groove under the drive of the supporting rack, thereby completing the sealing between the filter device and the feeding pipe;

[0026] 3. A receiving bin is provided, a spare bin is fixedly connected to one side of the feeding pipe, the spare bin and the side wall of the feeding pipe are connected, the spare bin and the filter device are horizontally arranged, and a spare filter device is placed in the spare bin; when the plating liquid is injected into the feeding pipe, when the filter device is blocked by impurities in the plating liquid so that the plating liquid cannot flow into the liquid tank through the feeding pipe, the spare filter device is pushed toward the filter device until the spare filter device pushes the filter device out. In order to prevent the pushed-out filter device from falling and being damaged, a receiving bin is connected to the side of the feeding pipe away from the spare bin, and the replaced filter device is temporarily stored in the receiving bin, so that the filter device can be replaced without stopping the plating liquid from flowing into the filter box through the feeding pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of a plating liquid feeding device for electroplating in the present application;

[0028] Figure 2It is a structural schematic diagram of the present application from another angle;

[0029] Figure 3 It is a schematic diagram of the structure inside the filtering device of the present application;

[0030] Figure 4 It is a structural schematic diagram of the blocking device of the present application.

[0031] In the figure, 1, liquid pool; 2, feeding pipe; 21, groove; 211, slide; 3, filtering device; 31, sleeve; 311, slide bar; 312, bearing groove; 313, through groove; 32, filter element; 321, filter plate; 322, filter net; 323, frame; 4, support block; 5, blocking device; 51, sealing ring; 52, gear; 53, supporting rack; 6, spare bin; 7, receiving bin; 8, driving member; 9, bearing plate; 10 rotating rod. DETAILED DESCRIPTION

[0032] The present application is further described in detail below in conjunction with the accompanying drawings.

[0033] Reference Figure 1-3 The present embodiment provides a plating liquid feeding device for electroplating, comprising a liquid pool 1, a feeding pipe 2 and a filtering device 3, one end of the feeding pipe 2 is fixedly connected to the liquid pool 1, the filtering device 3 is fixedly connected to the inner wall of the feeding pipe 2, and the filtering device 3 is used to filter the plating liquid entering the liquid pool 1 through the feeding pipe 2; the filtering device 3 comprises a sleeve 31 and a filter core 32, the sleeve 31 is fixedly connected to the inner wall of the feeding pipe 2, the filter core 32 is arranged in the sleeve 31, and the filter core 32 is fixedly connected to the sleeve 31.

[0034] Reference Figure 3 The filter element 32 includes a filter plate 321 and a filter net 322. The filter net 322 is provided with a frame 323, and the frame 323 is used to support the filter net 322. The filter plate 321 is arranged above the filter net 322. The filter hole diameter of the filter plate 321 is larger than the filter hole diameter of the filter net 322. A support block 4 is fixedly connected to the inner wall of the sleeve 31. In this embodiment, a support block 4 is correspondingly arranged at the four corners of the filter plate 321 and the filter net 322, and the support block 4 is used to support the filter plate 321 and the filter net 322.

[0035] Reference Figure 2-Figure 4The feeding pipe 2 is provided with a through groove 313, and the two sides of the through groove 313 are respectively connected with the spare bin 6 and the receiving bin 7. The side wall of the through groove 313 is symmetrically provided with a slide groove 211, and the slide groove 211 penetrates the receiving bin 7 and the spare bin 6. The side wall of the sleeve 31 is fixedly connected with a slide bar 311 corresponding to the slide groove 211, and the slide groove 211 is plugged into the slide bar 311; a spare filter device 3 is slidably connected in the receiving bin 7, and the spare filter device 3 has the same structure as the filter device 3. When the electroplating liquid is injected into the upper feeding pipe 2, the filter device 3 filters the electroplating liquid and intercepts impurities in the electroplating liquid. When the filter device 3 is blocked by impurities and the electroplating liquid cannot flow into the liquid pool 1 through the filter device 3, the spare filter device 3 is pushed, and the spare filter device 3 moves along the slide groove 211 toward the through groove 313 until the filter device 3 is pushed to the receiving bin 7. The spare filter device 3 is fixedly connected to the through groove 313, and the replacement of the filter device 3 is completed.

[0036] Reference Figure 3-4 The sleeve 31 is provided with a bearing groove 312 in the side wall near the receiving bin 7, and a sealing device 5 is arranged in the bearing groove 312. The sealing device 5 comprises a sealing ring 51, a gear 52 and a supporting rack 53. The gear 52 is rotatably connected to the bearing groove 312. Both sides of the gear 52 are meshed with supporting racks 53. The two supporting racks 53 move in opposite directions. One end of the two supporting racks 53 away from each other is fixedly connected with a sealing ring 51. A groove 21 is provided in the side wall of the ring corresponding to the sealing ring 51. A rotating rod is provided on the side wall of the sleeve 31 near the receiving bin 7. The rotating rod passes through the side wall of the sleeve 31 and is fixedly connected with the gear 52. When the sleeve 31 is fully abutted with the through hole, the rotating rod is rotated, and the rotating rod rotates to drive the gear 52 to rotate. The gear 52 rotates and drives the two supporting racks 53 to move toward the groove 21 direction respectively until the sealing ring 51 is fully plugged and matched with the groove 21, thereby completing the sealing between the filter device 3 and the feed pipe.

[0037] Reference Figure 2 A supporting plate 9 is fixedly connected to the side wall of the feeding pipe 2 close to the spare bin 6, and a driving member 8 is fixedly connected to the end of the spare filtering device 3 away from the through groove 313. The driving member 8 abuts against the supporting plate 9, and the supporting plate 9 is used to carry the driving member 8. The driving member 8 is used to drive the spare filtering device 3 to move in the direction of the filtering device 3.

[0038] The implementation principle of the electroplating liquid feeding device for electroplating in the embodiment of the present application is as follows: when using the device, firstly slide the slide bar 311 and the slide groove 211 together, push the sleeve 31 until the filter device 3 and the through groove 313 are completely aligned, push the rotating rod, the rotating rod rotates to drive the gear 52 to rotate, the gear 52 rotates to drive the two supporting racks 53 to move toward the groove 21 respectively, until the sealing ring 51 and the groove 21 are completely plugged in and matched, thereby completing the sealing between the filter device 3 and the feeding pipe; then, the spare filter device 3 and the spare groove are connected. Sliding connection; then the plating liquid is injected into the feeding tube 2, and the plating liquid is filtered for the first time through the filter plate 321. At this time, the filter plate 321 intercepts some impurities, and then the plating liquid is filtered for the second time through the filter screen 322. Because the filter holes of the filter screen 322 are smaller than the filter holes of the filter plate 321, the filter screen 322 intercepts the remaining smaller impurities in the plating liquid; as the plating liquid is continuously injected, until the filter device 3 is blocked by impurities and cannot filter the plating liquid, then the rotating rod is rotated, and the rotating rod rotates to drive the two supporting racks 53 to move toward each other The drive member 8 is started at this time, and the drive member 8 drives the spare filter device 3, and the spare filter device 3 moves along the slide groove 211 in the direction of the through groove 313 until the filter device 3 is pushed to the receiving bin 7. When the positions of the spare filter device 3 and the through groove 313 are completely corresponding, the rotating rod is rotated at this time, and the rotation of the rotating rod drives the gear 52 to rotate, and the rotation of the gear 52 drives the two supporting racks 53 to move in the direction of the groove 21 respectively, until the sealing ring 51 is completely plugged into the groove 21. The filter device 3 is then separated from the receiving bin 7, and the filter plate 321 and the filter screen 322 are cleaned. After the cleaning is completed, the filter plate 321 and the filter screen 322 are abutted against the support block 4, and then the driving member 8 is removed from the spare filter device 3, and the driving member 8 is connected to one end of the filter device 3, and then the filter device 3 is slidably connected to the spare bin 6; repeat the above steps, and the device can be continuously used to filter the electroplating solution.

[0039] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A plating solution feeding device for electroplating, characterized in that: The invention comprises a liquid feed pool (1), a feeding pipe (2) and a filtering device (3), wherein one end of the feeding pipe (2) is fixedly connected to the liquid feed pool (1), the filtering device (3) is fixedly connected to the inner wall of the feeding pipe (2), and the filtering device (3) is used to filter the electrolyte entering the liquid feed pool (1) through the feeding pipe (2); the filtering device (3) comprises a sleeve (31) and a filter core (32), the sleeve (31) is fixedly connected to the inner wall of the feeding pipe (2), the filter core (32) is arranged in the sleeve (31), and the filter core (32) is fixedly connected to the sleeve (31).

2. The electroplating solution feeding device for electroplating according to claim 1, characterized in that: The filter element comprises a filter plate (321) and a filter screen (322); the filter plate (321) is located above the filter screen (322); the filter hole diameter of the filter screen (322) is smaller than the filter hole diameter of the filter plate (321); and the filter plate (321) and the filter screen (322) are both fixedly connected to the inner wall of the sleeve (31).

3. The electroplating solution feeding device for electroplating according to claim 1, characterized in that: The two sides of the feeding pipe (2) are respectively fixedly connected with a spare bin (6) and a receiving bin (7); the spare bin (6) and the receiving bin (7) are both fixedly arranged horizontally with the filtering device (3); the spare bin (6) and the receiving bin (7) are both connected to the feeding pipe (2); a spare filtering device (3) is placed in the spare bin (6); the spare filtering device (3) is used to replace the filtering device (3) when the filtering device (3) is blocked; the receiving bin (7) is used to receive the replaced filtering device (3).

4. The electroplating solution feeding device for electroplating according to claim 3, characterized in that: The filter device (3) is provided with a bearing groove (312) on the side wall close to the spare bin (6) and the receiving bin (7), and a sealing device (5) is arranged in each bearing groove (312). The feeding pipe (2) is provided with a groove (21) corresponding to the sealing device (5). When the feeding pipe (2) and the filter device (3) are fixedly connected, the sealing device (5) and the groove (21) are plugged and matched to seal the filter device (3) and the feeding pipe (2).

5. The electroplating solution feeding device for electroplating according to claim 4, characterized in that: Each of the blocking devices (5) comprises a gear (52), a supporting rack (53) and a sealing ring (51); the gear (52) is rotatably connected to the bearing groove (312); both sides of the gear (52) are meshedly connected to a supporting rack (53); the two supporting racks (53) move in opposite directions; and a sealing ring (51) is correspondingly connected to the two supporting racks (53); when the feeding pipe (2) is fixedly connected to the filtering device (3), the sealing ring (51) is plugged into and matched with the groove (21).

6. The electroplating solution feeding device for electroplating according to claim 3, characterized in that: A through groove (313) is provided on the inner wall of the feeding pipe (2), the through groove is fixedly connected to the filtering device (3), and the through groove (313) is used to carry the filtering device (3).

7. The electroplating solution feeding device for electroplating according to claim 6, characterized in that: The through groove (313) is provided with a slide groove (211), the filter device (3) is provided with a slide bar (311) corresponding to the through groove (313), the slide groove (211) and the slide bar (311) are slidably connected, the standby bin (6) and the receiving bin (7) are both provided with a slide groove (211), and when the standby bin (6) and the receiving bin (7) are both through-connected with the feeding pipe (2), the slide grooves (211) are both through-connected.

8. The electroplating solution feeding device for electroplating according to claim 7, characterized in that: The standby filter device (3) is fixedly connected to a driving member (8), and the driving member (8) is used to drive the filter device (3) in the standby bin (6) to slide into the material pipe.

9. The electroplating solution feeding device for electroplating according to claim 8, characterized in that: The outer wall of the sleeve (31) is fixedly connected to a bearing plate (9), and the bearing plate (9) is used to support the driving member (8).

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