A compression condensing unit with good heat dissipation effect

Abstract

The utility model discloses a compression condensing unit with good heat dissipation effect, which relates to the technical field of condensing units, including a box body, a compression condensing unit body fixedly connected to the bottom wall of the box body, a plurality of heat dissipation plates fixedly connected to the side walls of the compression condensing unit body, a plurality of semiconductor refrigeration sheets fixedly connected to the upper end of the compression condensing unit body, a servo motor fixedly connected to the upper end of the box body, a first gear fixedly connected to the output end of the servo motor, four second gears meshingly connected to the side walls of the first gear, a rotating column fixedly connected to the end of the second gear away from the servo motor, and a fan blade fixedly connected to one end of the rotating column. In the utility model, air cooling, heat dissipation plates and semiconductor refrigeration sheets are used to dissipate heat for the compression condensing unit body at the same time, thereby increasing the heat dissipation effect of the compression condensing unit body, and air cooling dissipates heat for the heat dissipation plates and the heating ends of the semiconductor refrigeration sheets at the same time, and secondly, quick disassembly and installation during filter cleaning are achieved, thereby increasing the cleaning efficiency of the filter.

Description

Technical Field

[0001] The utility model relates to the technical field of condensing units, in particular to a compression condensing unit with good heat dissipation effect. Background Art

[0002] The evaporator, compressor, throttling mechanism and condenser are indispensable components of the compression refrigeration system, collectively known as the four major parts of the refrigeration system; among them, the condensing unit cools the compressed high-temperature and high-pressure refrigerant into a high-temperature and low-pressure refrigerant that flows through the pipeline, while exchanging heat with the outside air to achieve a cooling effect. This is a heat dissipation process, and the heat dissipation effect of the condensing unit also directly affects the refrigeration effect of the refrigerant.

[0003] Chinese patent document CN219346843U discloses a refrigeration compression condensing unit with good heat dissipation effect, including a machine body, wherein a condensation heat dissipation chamber and a refrigeration compression chamber are respectively arranged in the machine body from top to bottom, two filter screen covers are symmetrically embedded on the inner side wall of the condensation heat dissipation chamber, and two fixing seats are symmetrically installed on the inner bottom wall of the condensation heat dissipation chamber, and an axle tube is rotatably inserted on each of the fixing seats, and the ends of the two axle tubes that are away from each other pass through the corresponding fixing seats and are installed with hollow sleeves, and two pressurized tubes are symmetrically installed on the side walls of each of the hollow sleeves. The above-mentioned refrigeration compression condensing unit with good heat dissipation effect has shortcomings. Although the device realizes the heat dissipation of the compression condensing unit, it has limitations. It only uses air cooling for heat dissipation, and the heat dissipation effect is poor. Secondly, the use of wind energy to clean the filter plate is easy to cause incomplete cleaning of the filter plate. Long-term use will still cause clogging of the filter plate, resulting in poor heat dissipation effect of the equipment.

[0004] Therefore, in order to solve such problems, we propose a compression condensing unit with good heat dissipation effect. Utility Model Content

[0005] The utility model aims to provide a compression condensing unit with good heat dissipation effect, aiming to solve the problem that the existing refrigeration compression condensing unit with good heat dissipation effect in the above-mentioned background technology adopts only air cooling for heat dissipation during use, and the heat dissipation effect is poor. Secondly, the filter plate is cleaned by wind energy, which easily causes incomplete cleaning of the filter plate, and the filter plate will still be blocked after long-term use.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a compression condensing unit with good heat dissipation effect, including a box body, the bottom wall of the box body is fixedly connected to the compression condensing unit body, the side wall of the compression condensing unit body is fixedly connected to a plurality of heat dissipation plates, the upper end of the compression condensing unit body is fixedly connected to a plurality of semiconductor refrigeration plates, the upper end of the box body is fixedly connected to a servo motor, the output end of the servo motor passes through the interior of the box body, the output end of the servo motor is fixedly connected to a first gear, the side wall of the first gear is meshingly connected to four second gears, the second gears are positioned and rotatably connected inside the box body, the angles between the second gears are all 90°, the end of the second gear away from the servo motor is fixedly connected to a rotating column, and the end of the rotating column away from the second gear is fixedly connected to a fan blade.

[0007] Preferably, the side wall of the box body is provided with a heat dissipation port, the upper and lower sides of the heat dissipation port are provided with installation grooves, an installation frame is arranged in the heat dissipation port, the upper and lower ends of the installation frame are slidably connected to the installation groove, and the inner side wall of the installation frame is fixedly connected with a filter.

[0008] Preferably, a mounting frame is fixedly connected to the upper end of the compression condensing unit body, and the semiconductor refrigeration plates are all located in the mounting frame.

[0009] Preferably, the refrigeration end of the semiconductor refrigeration plate is fixedly connected to the upper surface of the compression condensing unit body.

[0010] Preferably, the heat dissipation plates are perpendicular to the top wall of the box body.

[0011] Preferably, the mounting groove is L-shaped.

[0012] The utility model has the following beneficial effects:

[0013] In the utility model, air cooling, a heat sink and a semiconductor refrigeration sheet are used to dissipate heat for the compression condensing unit body at the same time, thereby increasing the heat dissipation effect of the compression condensing unit body, and the air cooling dissipates heat for the heat sink and the heating end of the semiconductor refrigeration sheet at the same time, thereby further increasing the heat dissipation capacity of the compression condensing unit body. Secondly, an installation groove, an installation frame and a filter plate are provided to realize quick disassembly and installation when cleaning the filter, thereby increasing the cleaning efficiency of the filter. The structure is simple, easy to operate and highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a three-dimensional schematic diagram of a compression condensing unit with good heat dissipation effect proposed by the utility model;

[0015] Figure 2 This is a three-dimensional exploded schematic diagram of a box in a compression condensing unit with good heat dissipation effect proposed by the utility model;

[0016] Figure 3It is a three-dimensional schematic diagram of a compression condensing unit body in a compression condensing unit with good heat dissipation effect proposed by the utility model;

[0017] Figure 4 This is a three-dimensional exploded schematic diagram of the internal structure of a box in a compression condensing unit with good heat dissipation effect proposed by the utility model.

[0018] Legend:

[0019] 1. Box body; 101. Heat dissipation port; 11. Mounting slot; 12. Mounting frame; 13. Filter; 2. Compression condensing unit body; 21. Heat dissipation plate; 22. Mounting frame; 23. Semiconductor refrigeration plate; 3. Servo motor; 31. First gear; 32. Second gear; 33. Rotating column; 34. Fan blade. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present utility model, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. The terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected, or indirectly connected through an intermediate medium, or it can be a communication between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] Reference Figure 1-4The utility model provides an embodiment: a compression condensing unit with good heat dissipation effect, including a box body 1, a compression condensing unit body 2 is fixedly connected to the bottom wall of the box body 1, a plurality of heat dissipation plates 21 are fixedly connected to the side wall of the compression condensing unit body 2, a plurality of semiconductor refrigeration plates 23 are fixedly connected to the upper end of the compression condensing unit body 2, a servo motor 3 is fixedly connected to the upper end of the box body 1, the output end of the servo motor 3 passes through the inside of the box body 1, a first gear 31 is fixedly connected to the output end of the servo motor 3, four second gears 32 are meshedly connected to the side wall of the first gear 31, the second gears 32 are positioned and rotatably connected inside the box body 1, the angles between the second gears 32 are all 90°, the end of the second gear 32 away from the servo motor 3 is fixedly connected to a rotating column 33, the end of the rotating column 33 away from the second gear 32 passes through the top wall of the box body 1, and the end of the rotating column 33 away from the second gear 32 is fixedly connected to a fan blade 34.

[0023] This arrangement dissipates heat to the compression condensing unit body 2 through the cooling end of the heat sink 21 and the semiconductor refrigeration sheet 23, and then starts the servo motor 3 to rotate, so that the servo motor 3 drives the first gear 31 to rotate, so that the first gear 31 drives the second gear 32 to rotate, so that the second gear 32 drives the rotating column 33 to rotate, so that the rotating column 33 drives the fan blades 34 to rotate, so that the fan blades 34 output wind energy, and then use the output wind energy to dissipate heat to the compression condensing unit body 2, the heat sink 21 and the heating end of the semiconductor refrigeration sheet 23, thereby increasing the heat dissipation effect of the heat sink 21 and the semiconductor refrigeration sheet 23 on the compression condensing unit body 2.

[0024] A heat dissipation port 101 is provided on the side wall of the box body 1, and mounting grooves 11 are provided on the upper and lower sides of the heat dissipation port 101. A mounting frame 12 is provided in the heat dissipation port 101, and the upper and lower ends of the mounting frame 12 are slidably connected to the mounting groove 11. A filter 13 is fixedly connected to the inner wall of the mounting frame 12, which is used to filter impurities such as dust through the filter 13, and then the mounting frame 12 directly slides out of the mounting groove 11, so that the filter 13 can be quickly disassembled and the filter 13 is easy to clean.

[0025] A mounting frame 22 is fixedly connected to the upper end of the compression condensing unit body 2, and the semiconductor refrigeration plates 23 are all located in the mounting frame 22, which is used to fix the semiconductor refrigeration plates 23 through the mounting frame 22 to increase the stability of the installation of the semiconductor refrigeration plates 23.

[0026] The cooling end of the semiconductor refrigeration sheet 23 is fixedly connected to the upper surface of the compression condensing unit body 2, so that the heating end of the semiconductor refrigeration sheet 23 is located below the fan blades 34, and then the heating end of the semiconductor refrigeration sheet 23 is dissipated by the fan blades 34, thereby increasing the heat dissipation effect of the semiconductor refrigeration sheet 23 on the compression condensing unit body 2.

[0027] The heat sinks 21 are perpendicular to the top wall of the box body 1 , so that the surfaces of the heat sinks 21 are in contact with the wind energy output by the fan blades 34 , thereby increasing the heat dissipation effect of the fan blades 34 on the heat sinks 21 .

[0028] The mounting groove 11 is L-shaped, and is used to limit the mounting frame 12 by using the L-shaped mounting groove 11 , so as to facilitate the rapid installation and removal of the mounting frame 12 .

[0029] Working principle: first, the compression condensing unit body 2 is cooled by the cooling end of the heat sink 21 and the semiconductor refrigeration sheet 23, and then the servo motor 3 is started to rotate, the servo motor 3 drives the first gear 31 to rotate, the first gear 31 drives the second gear 32 to rotate, the second gear 32 drives the rotating column 33 to rotate, the rotating column 33 drives the fan blades 34 to rotate, the fan blades 34 output wind energy, and then the output wind energy is used to dissipate the heat of the compression condensing unit body 2, the heat sink 21 and the heating end of the semiconductor refrigeration sheet 23, thereby increasing the heat dissipation effect of the heat sink 21 and the semiconductor refrigeration sheet 23 on the compression condensing unit body 2, and then the dust and other impurities are filtered through the filter 13, and then the L-shaped mounting groove 11 is directly slid out through the mounting frame 12, so as to realize the quick disassembly and installation of the filter 13 when cleaning, thereby increasing the cleaning efficiency of the filter 13.

[0030] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A compression condensing unit with good heat dissipation effect, comprising a housing (1), characterized in that: The inner bottom wall of the box body (1) is fixedly connected to a compression condensing unit body (2), the side wall of the compression condensing unit body (2) is fixedly connected to a plurality of heat dissipation plates (21), the upper end of the compression condensing unit body (2) is fixedly connected to a plurality of semiconductor refrigeration plates (23), the upper end of the box body (1) is fixedly connected to a servo motor (3), the output end of the servo motor (3) extends into the box body (1), the output end of the servo motor (3) is fixedly connected to a first gear (31), the side wall of the first gear (31) is meshingly connected to four second gears (32), the second gears (32) are positioned and rotatably connected inside the box body (1), the angles between the second gears (32) are all 90 degrees, the end of the second gear (32) away from the servo motor (3) is fixedly connected to a rotating column (33), and the end of the rotating column (33) away from the second gear (32) is fixedly connected to a fan blade (34).

2. A compression condensing unit with good heat dissipation effect according to claim 1, characterized in that: The side wall of the box body (1) is provided with a heat dissipation port (101), the upper and lower sides of the heat dissipation port (101) are provided with mounting grooves (11), a mounting frame (12) is arranged in the heat dissipation port (101), the upper and lower ends of the mounting frame (12) are slidably connected to the mounting groove (11), and a filter screen (13) is fixedly connected to the inner side wall of the mounting frame (12).

3. A compression condensing unit with good heat dissipation effect according to claim 1, characterized in that: The upper end of the compression condensing unit body (2) is fixedly connected to a mounting frame (22), and the semiconductor refrigeration sheets (23) are all located in the mounting frame (22).

4. A compression condensing unit with good heat dissipation effect according to claim 1, characterized in that: The refrigeration end of the semiconductor refrigeration sheet (23) is fixedly connected to the upper surface of the compression condensing unit body (2).

5. A compression condensing unit with good heat dissipation effect according to claim 1, characterized in that: The heat dissipation plates (21) are all perpendicular to the inner top wall of the box body (1).

6. A compression condensing unit with good heat dissipation effect according to claim 2, characterized in that: The mounting groove (11) is L-shaped.

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