A semiconductor element defect detection device

Abstract

The utility model provides a defect detection device for semiconductor components, which relates to the field of semiconductor technology, and includes a detection platform, wherein a moving mechanism is provided at the bottom of the detection platform, and two support plates are fixedly connected to the top of the detection platform, and a top plate is fixedly connected to the top of the two support plates, and an optical detection mechanism is provided at the bottom of the top plate, and two rotating shafts are rotatably connected to the opposite sides of the two support plates, and a fixed frame is fixedly connected to the opposite ends of the two rotating shafts. In the utility model, the semiconductor component is fixed to the inner side of the fixed frame by the provided fixing mechanism, and then the reduction motor is started, so that the reduction motor drives the driving wheel to rotate, and the driving wheel drives the belt to move, so that the driven wheel drives one of the rotating shafts to rotate, thereby driving the fixed frame to rotate, and then driving the fixed semiconductor component to turn over, so as to realize the detection of the front and back sides of the semiconductor component, and compared with the traditional manual turning, the labor intensity is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a defect detection device for semiconductor elements. Background Art

[0002] Defect detection usually refers to the detection of surface defects of objects. Surface defect detection uses machine vision detection technology to detect defects such as spots, pits, scratches, color differences and defects on the surface of workpieces. Visual inspection usually uses image signals. According to pixel distribution, brightness, color and other information, the system calculates and extracts target features, and then controls the operation of on-site equipment based on the judgment results.

[0003] However, when existing defect detection devices detect two sides of a single semiconductor component at the same time, the current common detection method is that one camera occupies one station to detect one side. If two or more sides need to be detected at the same time, multiple cameras are required to occupy multiple stations for detection, which increases the complexity of installation. Utility Model Content

[0004] The purpose of the utility model is to solve the problem in the prior art that when two surfaces of a single semiconductor component are detected simultaneously, the current common detection method is that one camera occupies one station to detect one surface. If two or more surfaces need to be detected simultaneously, multiple cameras need to occupy multiple stations for detection, which increases the complexity of installation. A defect detection device for semiconductor components is proposed to solve the problem.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a defect detection device for semiconductor components, comprising a detection platform, a moving mechanism is arranged at the bottom of the detection platform, two support plates are fixedly connected to the top of the detection platform, a top plate is fixedly connected to the top of the two support plates, an optical detection mechanism is arranged at the bottom of the top plate, two rotating shafts are rotatably connected to the opposite sides of the two support plates, a fixed frame is fixedly connected to the opposite ends of the two rotating shafts, a fixing mechanism is arranged on the inner side of the fixed frame, one end of one of the rotating shafts movably passes through one of the support plates, one end of one of the rotating shafts is fixedly connected to a driven wheel, a reduction motor is fixedly installed on one side of one of the support plates, a driving wheel is arranged at the output end of the reduction motor, and a belt is transmission-connected to the outer surface of the driving wheel and the driven wheel.

[0006] Preferably, the moving mechanism comprises a supporting leg, the supporting leg is fixedly connected to the bottom of the testing platform, and a placement groove is provided at the bottom of the supporting leg.

[0007] Preferably, a pressure cylinder is provided in the placement groove, an output end of the pressure cylinder is fixedly connected to a hydraulic rod, and a bottom end of the hydraulic rod is fixedly connected to a mounting plate.

[0008] Preferably, a universal wheel is provided at the bottom of the mounting plate, a limiting groove is provided on the inner side of the placement groove, a limiting block is slidably connected in the limiting groove, and one side of the limiting block is fixedly connected to the mounting plate.

[0009] Preferably, the fixing mechanism comprises a fixing rod, the fixing rod is fixedly connected to the inner side of the fixing frame, and a return spring is sleeved on the outer surface of the fixing rod.

[0010] Preferably, a clamping plate is sleeved on the outer surface of the fixing rod, one side of the clamping plate is fixedly connected to the return spring, and a handle is fixedly installed on the top of the clamping plate.

[0011] Preferably, a protective pad is fixedly mounted on one side of the splint, and the material of the protective pad is rubber.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] 1. In the utility model, the semiconductor element is fixed on the inner side of the fixed frame by means of a fixing mechanism, and then the reduction motor is started, so that the reduction motor drives the driving wheel to rotate, and the driving wheel drives the belt to move, so that the driven wheel drives one of the rotating shafts to rotate, thereby driving the fixed frame to rotate, and then driving the fixed semiconductor element to turn over, and then through the optical detection mechanism provided, wherein the optical detection mechanism includes a ring light source, a camera and a lens, the front and back sides of the semiconductor element are detected, which reduces the labor intensity and improves the detection rate compared with the traditional manual turning over.

[0014] 2. In the utility model, a moving mechanism is provided and the pressure cylinder is started, so that the hydraulic rod drives the mounting plate to move downward, and the mounting plate drives the limit block to slide downward in the limit groove synchronously, thereby driving the universal wheel to move downward, and when it moves to a certain position, the supporting leg is propped up, and the universal wheel is provided, so that the entire device can be moved to a suitable working position. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of the main structure of a semiconductor element defect detection device proposed by the utility model;

[0016] Figure 2 This is a bottom side structural stereogram of a semiconductor element defect detection device proposed by the utility model;

[0017] Figure 3 for Figure 1 Enlarged view of point A in the middle;

[0018] Figure 4 The utility model provides a three-dimensional cross-sectional structure diagram of a moving mechanism in a defect detection device for a semiconductor element.

[0019] Legend: 1. Inspection table; 2. Moving mechanism; 201. Support leg; 202. Placement slot; 203. Pressure cylinder; 204. Hydraulic rod; 205. Mounting plate; 206. Universal wheel; 207. Limiting slot; 208. Limiting block; 3. Support plate; 4. Top plate; 5. Optical inspection mechanism; 6. Rotating shaft; 7. Fixed frame; 8. Fixing mechanism; 801. Fixed rod; 802. Return spring; 803. Clamp; 804. Handle; 805. Protective pad; 9. Driven wheel; 10. Reduction motor; 11. Driving wheel; 12. Belt. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0022] Embodiment 1, as Figure 1 - Figure 4 As shown, the utility model provides a defect detection device for semiconductor components, including a detection platform 1, a moving mechanism 2 is arranged at the bottom of the detection platform 1, two support plates 3 are fixedly connected to the top of the detection platform 1, a top plate 4 is fixedly connected to the top of the two support plates 3, an optical detection mechanism 5 is arranged at the bottom of the top plate 4, two rotating shafts 6 are rotatably connected to the opposite sides of the two support plates 3, a fixing frame 7 is fixedly connected to the opposite ends of the two rotating shafts 6, a fixing mechanism 8 is arranged on the inner side of the fixing frame 7, one end of one of the rotating shafts 6 movably passes through one of the support plates 3, one end of one of the rotating shafts 6 is fixedly connected to a driven wheel 9, a reduction motor 10 is fixedly installed on one side of one of the support plates 3, a driving wheel 11 is arranged at the output end of the reduction motor 10, and a belt 12 is transmission-connected to the outer surface of the driving wheel 11 and the driven wheel 9.

[0023] The effect achieved by the entire embodiment 1 is that the semiconductor element is fixed on the inner side of the fixed frame 7 by the set fixing mechanism 8, and then the reduction motor 10 is started, so that the reduction motor 10 drives the driving wheel 11 to rotate, and the driving wheel 11 drives the belt 12 to move, so that the driven wheel 9 drives one of the rotating shafts 6 to rotate, thereby driving the fixed frame 7 to rotate, and then driving the fixed semiconductor element to turn over, and then through the set optical detection mechanism 5, wherein the optical detection mechanism 5 includes a ring light source, a camera and a lens, the front and back sides of the semiconductor element are detected, which reduces labor intensity and improves the detection rate compared with the traditional manual turning.

[0024] Embodiment 2, as Figure 1 - Figure 4 As shown, the mobile mechanism 2 includes a support leg 201, the support leg 201 is fixedly connected to the bottom of the test bench 1, a placement slot 202 is provided at the bottom of the support leg 201, a pressure cylinder 203 is provided in the placement slot 202, a hydraulic rod 204 is fixedly connected to the output end of the pressure cylinder 203, a mounting plate 205 is fixedly connected to the bottom end of the hydraulic rod 204, a universal wheel 206 is provided at the bottom of the mounting plate 205, a limiting slot 207 is provided on the inner side of the placement slot 202, and a limiting block 207 is slidably connected in the limiting slot 207. 8. One side of the limit block 208 is fixedly connected to the mounting plate 205. The fixing mechanism 8 includes a fixing rod 801. The fixing rod 801 is fixedly connected to the inner side of the fixing frame 7. A reset spring 802 is sleeved on the outer surface of the fixing rod 801. A splint 803 is sleeved on the outer surface of the fixing rod 801. One side of the splint 803 is fixedly connected to the reset spring 802. A handle 804 is fixedly installed on the top of the splint 803. A protective pad 805 is fixedly installed on one side of the splint 803. The material of the protective pad 805 is rubber.

[0025] The effect achieved by the entire embodiment 2 is that, by providing a moving mechanism 2, the pressure cylinder 203 is started, so that the hydraulic rod 204 drives the mounting plate 205 to move downward, and the mounting plate 205 drives the limit block 208 to slide downward synchronously in the limit groove 207, thereby driving the universal wheel 206 to move downward, and when it moves to a certain position, the supporting leg 201 is propped up, and the universal wheel 206 is provided, so that the entire device can be moved to a suitable working position, and then by providing a fixing mechanism 8, the two handles 804 are pulled to move towards each other, so that the two handles 804 drive the two clamping plates 803 to move towards each other, and at the same time, the reset spring 802 is squeezed and begins to shrink, and then the semiconductor element is placed between the two clamping plates 803, and then the two handles 804 are released, and under the elastic force of the reset spring 802, the semiconductor element is conveniently clamped and fixed, and the provided protective pad 805 plays a protective role to avoid damage to the semiconductor element.

[0026] Working principle: When in use, first start the pressure cylinder 203, so that the hydraulic rod 204 drives the mounting plate 205 to move downward, and the mounting plate 205 drives the limit block 208 to slide downward in the limit groove 207 synchronously, thereby driving the universal wheel 206 to move downward, and when it moves to a certain position, the support leg 201 is propped up, and the entire device is moved to a suitable working position through the set universal wheel 206, and then the two handles 804 are pulled to move in opposite directions, so that the two handles 804 drive the two clamping plates 803 to move in opposite directions, and at the same time the reset spring 802 is squeezed and begins to shrink, and then the semiconductor element is placed on the two clamping plates 803, then release the two handles 804, and under the elastic force of the reset spring 802, clamp and fix the semiconductor element to ensure the detection effect of the semiconductor element, and start the reduction motor 10, so that the reduction motor 10 drives the driving wheel 11 to rotate, and the driving wheel 11 drives the belt 12 to move, so that the driven wheel 9 drives one of the rotating shafts 6 to rotate, thereby driving the fixed frame 7 to rotate, and then driving the fixed semiconductor element to turn over, and then through the optical detection mechanism 5 set, wherein the optical detection mechanism 5 includes a ring light source, a camera and a lens, the front and back sides of the semiconductor element are detected.

[0027] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor element defect detection device, comprising a detection platform (1), characterized in that: A moving mechanism (2) is provided at the bottom of the detection platform (1); two support plates (3) are fixedly connected to the top of the detection platform (1); a top plate (4) is fixedly connected to the top of the two support plates (3); an optical detection mechanism (5) is provided at the bottom of the top plate (4); two rotating shafts (6) are rotatably connected to opposite sides of the two support plates (3); a fixing frame (7) is fixedly connected to opposite ends of the two rotating shafts (6); a fixing mechanism (8) is provided on the inner side of the fixing frame (7); one end of one of the rotating shafts (6) movably passes through one of the support plates (3); one end of one of the rotating shafts (6) is fixedly connected to a driven wheel (9); a reduction motor (10) is fixedly installed on one side of one of the support plates (3); a driving wheel (11) is provided at the output end of the reduction motor (10); and a belt (12) is connected to the outer surface of the driving wheel (11) and the driven wheel (9).

2. A semiconductor element defect detection device according to claim 1, characterized in that: The moving mechanism (2) comprises a supporting leg (201), wherein the supporting leg (201) is fixedly connected to the bottom of the detection platform (1), and a placement groove (202) is provided at the bottom of the supporting leg (201).

3. A semiconductor element defect detection device according to claim 2, characterized in that: A pressure cylinder (203) is arranged in the placement groove (202), the output end of the pressure cylinder (203) is fixedly connected to a hydraulic rod (204), and the bottom end of the hydraulic rod (204) is fixedly connected to a mounting plate (205).

4. A semiconductor element defect detection device according to claim 3, characterized in that: A universal wheel (206) is provided at the bottom of the mounting plate (205), a limiting groove (207) is provided on the inner side of the placement groove (202), a limiting block (208) is slidably connected in the limiting groove (207), and one side of the limiting block (208) is fixedly connected to the mounting plate (205).

5. The semiconductor element defect detection device according to claim 1, characterized in that: The fixing mechanism (8) comprises a fixing rod (801), the fixing rod (801) is fixedly connected to the inner side of the fixing frame (7), and a return spring (802) is sleeved on the outer surface of the fixing rod (801).

6. A semiconductor element defect detection device according to claim 5, characterized in that: The outer surface of the fixing rod (801) is sleeved with a clamping plate (803), one side of the clamping plate (803) is fixedly connected to the return spring (802), and a handle (804) is fixedly installed on the top of the clamping plate (803).

7. A semiconductor element defect detection device according to claim 6, characterized in that: A protective pad (805) is fixedly mounted on one side of the clamping plate (803), and the material of the protective pad (805) is rubber.

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