Cleaning device for wafer processing

Abstract

The utility model relates to a high-efficiency cleaning device for wafer processing, in particular to a cleaning device for wafer processing, which comprises a cleaning box, the upper surface of the cleaning box is attached to the lower surface of a cover plate, a wafer is placed in a lower side net box, and a rotating disc is rotated to drive a screw a and a screw b to rotate, so that the wafer is cleaned. A screw a and a screw b rotate to drive two threaded sleeves and two net boxes to get close to each other to store wafers, an air cylinder drives a placing plate and the wafers to move downwards, the wafers are immersed in cleaning liquid in a cleaning box, a servo motor drives a gear a and a gear b to rotate, and the gear b rotates to drive the placing plate, the net boxes and the wafers to rotate. The wafer cleaning device has the advantages that the wafer cleaning device is matched with cleaning liquid in the cleaning box to comprehensively wash the wafer, and the problems that an existing device can only clamp and clean a single wafer in the cleaning process, the wafer cannot be overturned in the cleaning process, only the cleaning surface can be cleaned, and the wafer cleaning efficiency is seriously affected are solved.

Description

Technical Field

[0001] The utility model relates to a cleaning device for round wafer processing, in particular to a high-efficiency cleaning device for round wafer processing. Background Art

[0002] A round wafer refers to a silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a round wafer. A round wafer is a carrier used in the production of integrated circuits. Generally speaking, a wafer refers to a single-crystal silicon wafer. A single-crystal silicon wafer is pulled and refined from ordinary silicon sand, and then made into a single-crystal silicon rod through a series of measures such as dissolution, purification, and distillation. After the single-crystal silicon rod is polished and sliced, it becomes a round wafer.

[0003] China Utility Model Patent Announcement No.: CN214336683U, discloses a cleaning device for round wafer processing, which places the round wafer in a placement groove, pulls the connecting rod downward to make the cleaning table contact with the operating table, the operating table is located in a groove in the cleaning table, so that the round wafer contacts the cleaning pad, pushes the limit plate located on one side of the guide column, and clamps the limit plate in the clamping groove set by the connecting rod, thereby fixing the cleaning table, opening the valve of the liquid medicine box, starting the water pump, the liquid medicine enters the cavity and is sprayed out through the liquid medicine nozzle to soak the cleaning pad, and at the same time, the motor is turned on, and the motor drive shaft drives the operating table During operation, the cleaning pad grinds the round wafer. During the grinding and washing process, due to the setting of the cleaning pad and sponge pad, less excess liquid is generated during the cleaning process, and it flows into the waste liquid tank through the gap between the groove and the operating table and the waste liquid filter provided on the operating table. After the liquid is ground and washed, the valve of the liquid tank is closed, and the valve of the clean water tank is opened to rinse the liquid on the surface of the round wafer. After cleaning, the valve is closed and the motor and the water pump are turned off at the same time, the limit plate is pulled out, and the spring in the guide groove moves upward to drive the connecting column to separate the cleaning table from the operating table, and the round wafer is turned over, and the back side is cleaned in the same manner as the front side. After cleaning is completed.

[0004] Although the device can clean the wafer, it can only clamp and clean a single wafer during the cleaning process, and the wafer cannot be turned over during the cleaning process and can only be cleaned on the cleaning surface, which seriously affects the cleaning efficiency of the wafer. Utility Model Content

[0005] In order to solve the problems raised in the above background technology, the utility model provides a cleaning device for round wafer processing.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cleaning device for round wafer processing, comprising a cleaning box, the upper surface of the cleaning box is fitted with the lower surface of the cover plate, a connecting column is installed in the bearing on the upper surface of the cover plate, the bottom end of the connecting column is fixedly connected to the upper surface of the placement plate, a rotating component is provided on the outer surface of the connecting column, a plurality of placement holes are symmetrically opened on the upper surface of the placement plate, a connecting frame is fixedly connected to the back side of the inner wall of the placement hole, the front side of the inner wall of the connecting frame is respectively slidably connected to the back sides of two mesh boxes, a fixing component is provided inside the connecting frame, two lifting frames are respectively fixedly connected to the left and right side surfaces of the inner wall of the cleaning box, a lifting component is provided inside the lifting frame, and the lower surface of the cleaning box is connected to the top end of the discharge pipe.

[0007] Preferably, the lifting assembly comprises a cylinder mounted on the upper surface of the inner wall of the lifting frame, the telescopic end of the cylinder is fixedly connected to the upper surface of the connecting block, and opposite sides of the two connecting blocks are respectively fixedly connected to the left and right side surfaces of the cover plate.

[0008] Preferably, a plurality of fans are symmetrically mounted on the upper surface of the cover plate.

[0009] Preferably, the fixing assembly includes a screw rod b rotatably connected to the lower surface of the inner wall of the connecting frame, the top end of the screw rod b is fixedly connected to the bottom end of the screw rod a, the top end of the screw rod a passes through the upper surface of the inner wall of the connecting frame and is fixedly connected to the lower surface of the turntable, the outer surfaces of the screw rod a and the screw rod b are both threadedly connected with a threaded sleeve, and the front side of the threaded sleeve is fixedly connected to a net box.

[0010] Preferably, the rotating assembly includes a gear b installed on the outer surface of the connecting column, the outer surface of the gear b is meshed with the outer surface of the gear a, the upper surface of the gear a is fixedly connected to the output shaft of the servo motor, and the servo motor is installed on the upper surface of the cover plate.

[0011] Preferably, a rubber pad is adhered to the inner wall of the net box.

[0012] Preferably, two scrapers are fixedly connected to the lower surface of the placement plate, and the two scrapers are slidably connected to the left and right side surfaces of the inner wall of the cleaning box respectively at their sides away from each other.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The utility model places the wafer inside the lower mesh box, rotates the turntable to drive the screw a and the screw b to rotate, the rotation of the screw a and the screw b drives the two threaded sleeves and the two mesh boxes to approach each other to store the wafer, the cylinder drives the placement plate and the wafer to move downward, and the wafer is immersed in the cleaning liquid inside the cleaning box, the servo motor drives the gear a and the gear b to rotate, the rotation of the gear b drives the placement plate, the mesh box and the wafer to rotate, and the cleaning liquid inside the cleaning box is used to fully rinse the wafer, thereby solving the problem that the existing device can only clamp and clean a single wafer during the cleaning process, and the wafer cannot be turned over during the cleaning process and can only be cleaned on the cleaning surface, which seriously affects the wafer cleaning efficiency.

[0015] The utility model drives the placement plate and the wafer to move upwards through the cylinder, and the fan draws external air and discharges it to the wafer through the exhaust end to dry the surface of the wafer. At the same time, the placement plate, the net box and the wafer are driven to rotate through the rotating component to drain the wafer, thereby accelerating the drying of the wafer and improving the cleaning efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model in the front view;

[0019] Figure 3 It is a schematic diagram of the three-dimensional exploded structure of the fixing component in the utility model;

[0020] In the figure: 1. cleaning box; 2. cover plate; 3. lifting frame;

[0021] Lifting assembly: 41, cylinder; 42, connecting block; 5, fan; 6, connecting column;

[0022] Rotating assembly: 71, servo motor; 72, gear a; 73, gear b; 8, placement plate; 9, discharge pipe; 10, placement hole; 11, scraper; 12, connecting frame;

[0023] Fixed components: 131, screw a; 132, screw b; 133, threaded sleeve; 134, turntable; 135, net box; 14, rubber pad. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Example

[0026] See also Figure 1-3 The utility model provides the following technical solutions: a cleaning device for round wafer processing, comprising a cleaning box 1, the upper surface of the cleaning box 1 is fitted with the lower surface of the cover plate 2, a connecting column 6 is installed in the bearing on the upper surface of the cover plate 2, the bottom end of the connecting column 6 is fixedly connected to the upper surface of the placement plate 8, a rotating component is provided on the outer surface of the connecting column 6, a plurality of placement holes 10 are symmetrically opened on the upper surface of the placement plate 8, a connecting frame 12 is fixedly connected to the back side of the inner wall of the placement hole 10, the front side of the inner wall of the connecting frame 12 is respectively slidably connected to the back side of two net boxes 135, a fixing component is provided inside the connecting frame 12, two lifting frames 3 are respectively fixedly connected to the left and right side surfaces of the inner wall of the cleaning box 1, a lifting component is provided inside the lifting frame 3, and the lower surface of the cleaning box 1 is connected to the top of the discharge pipe 9.

[0027] Specifically, the lifting assembly includes a cylinder 41 installed on the upper surface of the inner wall of the lifting frame 3, the telescopic end of the cylinder 41 is fixedly connected to the upper surface of the connecting block 42, and the opposite sides of the two connecting blocks 42 are respectively fixedly connected to the left and right side surfaces of the cover plate 2;

[0028] The cylinder 41 drives the connection block 42, the cover plate 2, the connection column 6 and the placement plate 8 to move upward, and the placement plate 8 drives the wafer upward to move upward, thereby unloading the wafer.

[0029] Specifically, a plurality of fans 5 are symmetrically mounted on the upper surface of the cover plate 2;

[0030] The fan 5 draws external air and discharges it to the wafer through the exhaust port to dry its surface. At the same time, the placement plate 8 rotates to drive the mesh box 135 and the wafer to rotate to drain the wafer.

[0031] Specifically, the fixing assembly includes a screw b132 rotatably connected to the lower surface of the inner wall of the connecting frame 12, the top of the screw b132 is fixedly connected to the bottom end of the screw a131, the top of the screw a131 passes through the upper surface of the inner wall of the connecting frame 12 and is fixedly connected to the lower surface of the rotating disk 134, the outer surfaces of the screw a131 and the screw b132 are both threadedly connected with a threaded sleeve 133, and the front of the threaded sleeve 133 is fixedly connected with a net box 135;

[0032] The wafer is placed inside the lower mesh box 135, and the turntable 134 is rotated to drive the screw a131 and the screw b132 to rotate. The rotation of the screw a131 and the screw b132 drives the two threaded sleeves 133 and the two mesh boxes 135 to approach each other to store the wafer.

[0033] Specifically, the rotating assembly includes a gear b73 mounted on the outer surface of the connecting column 6, the outer surface of the gear b73 is meshed with the outer surface of the gear a72, the upper surface of the gear a72 is fixedly connected to the output shaft of the servo motor 71, and the servo motor 71 is mounted on the upper surface of the cover plate 2;

[0034] The servo motor 71 drives the gear a72 and the gear b73 to rotate. The rotation of the gear b73 drives the connecting column 6, the placement plate 8, the net box 135 and the wafer to rotate, and cooperates with the cleaning liquid inside the cleaning box 1 to fully rinse the wafer.

[0035] Specifically, the inner wall of the net box 135 is provided with a rubber pad 14;

[0036] The rubber pad 14 can prevent the wafer from colliding with the inner wall of the mesh box 135 and causing damage when the rotating assembly drives the wafer to rotate.

[0037] Specifically, two scrapers 11 are fixedly connected to the lower surface of the placement plate 8, and the two scrapers 11 are slidably connected to the left and right side surfaces of the inner wall of the cleaning box 1 respectively.

[0038] The rotation of the placement plate drives the scraper 11 to rotate, so as to scrape off the impurities adhered to the inner wall of the cleaning box after being washed off the surface of the wafer, thereby reducing the difficulty of cleaning.

[0039] The working principle and use process of this utility model:

[0040] The utility model, when in use;

[0041] The wafer is placed inside the lower mesh box 135, and the turntable 134 is rotated to drive the screw a131 and the screw b132 to rotate. The rotation of the screw a131 and the screw b132 drives the two threaded sleeves 133 and the two mesh boxes 135 to approach each other to store the wafer. The cylinder 41 drives the connecting block 42, the cover plate 2, the connecting column 6, the placement plate 8 and the wafer to move downward, and the wafer is immersed in the cleaning liquid inside the cleaning box 1. The servo motor 71 drives the gear a72 and the gear b73 to rotate. The rotation of the gear b73 drives the connecting column 6, the placement plate 8, the mesh box 135 and the wafer to rotate, and the wafer is fully rinsed with the cleaning liquid inside the cleaning box 1. The cylinder 41 drives the placement plate 8 and the wafer to move upward, and the fan 5 draws external air and discharges it to the wafer through the exhaust end to dry its surface. At the same time, the rotating assembly drives the placement plate 8, the mesh box 135 and the wafer to rotate, drain the wafer, and accelerate the drying of the wafer.

[0042] The circuits, electronic components and modules involved are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by this utility model does not involve improvements to software and methods.

[0043] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A cleaning device for wafer processing, comprising a cleaning box (1), characterized in that: The upper surface of the cleaning box (1) is fitted with the lower surface of the cover plate (2), a connecting column (6) is installed in the bearing on the upper surface of the cover plate (2), the bottom end of the connecting column (6) is fixedly connected to the upper surface of the placement plate (8), the outer surface of the connecting column (6) is provided with a rotating component, the upper surface of the placement plate (8) is symmetrically provided with a plurality of placement holes (10), the back of the inner wall of the placement hole (10) is fixedly connected with a connecting frame (12), the front of the inner wall of the connecting frame (12) is respectively slidably connected to the back of the two net boxes (135), the interior of the connecting frame (12) is provided with a fixing component, the left and right side surfaces of the inner wall of the cleaning box (1) are respectively fixedly connected with two lifting frames (3), the interior of the lifting frame (3) is provided with a lifting component, and the lower surface of the cleaning box (1) is connected to the top of the discharge pipe (9).

2. A wafer processing cleaning device according to claim 1, characterized in that: The lifting assembly comprises a cylinder (41) mounted on the upper surface of the inner wall of the lifting frame (3), the telescopic end of the cylinder (41) is fixedly connected to the upper surface of the connecting block (42), and the opposite sides of the two connecting blocks (42) are respectively fixedly connected to the left and right side surfaces of the cover plate (2).

3. The cleaning device for wafer processing according to claim 1, characterized in that: A plurality of fans (5) are symmetrically mounted on the upper surface of the cover plate (2).

4. The wafer processing cleaning device according to claim 1, characterized in that: The fixing assembly comprises a screw rod b (132) rotatably connected to the lower surface of the inner wall of the connecting frame (12); the top end of the screw rod b (132) is fixedly connected to the bottom end of the screw rod a (131); the top end of the screw rod a (131) passes through the upper surface of the inner wall of the connecting frame (12) and is fixedly connected to the lower surface of the rotating disk (134); the outer surfaces of the screw rod a (131) and the screw rod b (132) are both threadedly connected to a threaded sleeve (133); and the front surface of the threaded sleeve (133) is fixedly connected to a net box (135).

5. The wafer processing cleaning device according to claim 1, characterized in that: The rotating assembly comprises a gear b (73) mounted on the outer surface of the connecting column (6), the outer surface of the gear b (73) meshing with the outer surface of the gear a (72), the upper surface of the gear a (72) being fixedly connected to the output shaft of the servo motor (71), and the servo motor (71) being mounted on the upper surface of the cover plate (2).

6. A wafer processing cleaning device according to claim 4, characterized in that: A rubber pad (14) is adhered to the inner wall of the net box (135).

7. The cleaning device for wafer processing according to claim 1, characterized in that: Two scrapers (11) are fixedly connected to the lower surface of the placement plate (8), and the two scrapers (11) are slidably connected to the left and right side surfaces of the inner wall of the cleaning box (1) respectively.

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