Liquid-cooled inverter device and photovoltaic inverter equipment

Abstract

The utility model relates to the technical field of inverter equipment, and provides a liquid-cooled inverter device and a photovoltaic inverter device. The liquid-cooled inverter device comprises an inverter module and a heat dissipation module. The inverter module comprises a box and an inverter circuit. The inverter circuit comprises an inductor device and a power device. The heat dissipation module comprises a condenser, a liquid cooling pipeline, a first liquid cooling structure and a second liquid cooling structure. The power device and the first liquid cooling structure are arranged in the box, the inductor device and the second liquid cooling structure are arranged in the box, the condenser is connected to the first liquid cooling structure and the second liquid cooling structure through the liquid cooling pipeline, and the first liquid cooling structure and the second liquid cooling structure are respectively connected to the power device and the inductor device; the condenser is arranged on the outer side wall of the box, and at least part of the liquid cooling pipeline is in the box; the utility model realizes heat dissipation and temperature reduction operations for the power device and the inductor device, and performs safety protection on the liquid cooling pipeline.

Description

Technical Field

[0001] The utility model relates to the technical field of inverter equipment, in particular to a liquid-cooled inverter device and a photovoltaic inverter device. Background Art

[0002] Inverter devices can be used in the field of photovoltaic power generation systems, for example, and are mainly used to convert direct current generated by photovoltaic panels into alternating current.

[0003] In the related art, the inverter device mainly includes an inverter module and a heat dissipation module, and the inverter module mainly includes a box and an inverter circuit arranged in the box, and the heat dissipation module mainly includes a condenser and an evaporator, and the condenser and the evaporator are arranged on different outer side walls of the box, and the two are connected by a liquid cooling pipeline, so that the coolant circulating in the liquid cooling pipeline absorbs heat from the inverter circuit in the box to dissipate heat and cool down.

[0004] However, since the liquid cooling pipeline is arranged outside the box, it is easy to be damaged by external impact, corrosion, aging and other environmental factors, thereby affecting the heat dissipation of the inverter circuit. Utility Model Content

[0005] The problem solved by the utility model is how to prevent the liquid cooling pipeline of the liquid cooling inverter device from being damaged by being placed outside the box, so as to ensure the heat dissipation operation of the inverter circuit.

[0006] To solve the above problems, the utility model provides a liquid-cooled inverter device, including an inverter module and a heat dissipation module, the inverter module includes a box and an inverter circuit, the inverter circuit includes an inductor and a power device, the heat dissipation module includes a condenser, a liquid cooling pipeline, a first liquid cooling structure and a second liquid cooling structure, the power device and the first liquid cooling structure are arranged in the box, the inductor and the second liquid cooling structure are arranged in the box, the condenser is connected to the first liquid cooling structure and the second liquid cooling structure through the liquid cooling pipeline, the first liquid cooling structure and the second liquid cooling structure are respectively connected to the power device and the inductor; the condenser is arranged on the outer wall of the box, and at least part of the liquid cooling pipeline is in the box.

[0007] Optionally, the condenser has a first end and a second end, and the liquid cooling pipeline includes a first liquid cooling tube, a connecting tube and a second liquid cooling tube. The first end is passed through the box body and is connected to one end of the second liquid cooling tube via the first liquid cooling tube, the first liquid cooling structure, the connecting tube, and the second liquid cooling structure in sequence. The other end of the second liquid cooling tube is connected to the second end passed through the box body, and at least a portion of the second liquid cooling tube is in the box body.

[0008] Optionally, the condenser has two first ends and two second ends, and the liquid cooling circuit includes two first liquid cooling tubes and two second liquid cooling tubes, each of the first ends is connected to the liquid inlet end of the first liquid cooling structure or the second liquid cooling structure through each of the first liquid cooling tubes, and the liquid outlet end of the first liquid cooling structure or the second liquid cooling structure is connected to each of the second ends through each of the second liquid cooling tubes.

[0009] Optionally, the condenser has a first end and a second end, and the liquid cooling circuit includes a first liquid cooling tube and a second liquid cooling tube, the first end is connected to the liquid inlet end of the first liquid cooling structure or the second liquid cooling structure through the first liquid cooling tube, and the liquid outlet end of the first liquid cooling structure or the second liquid cooling structure is connected to the second end through the second liquid cooling tube.

[0010] Optionally, the liquid cooling pipeline includes a first liquid cooling pipe, a connecting pipe and two second liquid cooling pipes, the condenser is connected to the first liquid cooling structure or the second liquid cooling structure through the first liquid cooling pipe and one of the second liquid cooling pipes, two ends of the connecting pipe are connected to the first liquid cooling structure and the second liquid cooling structure respectively, and the first liquid cooling structure or the second liquid cooling structure is connected to the condenser through another of the second liquid cooling pipes;

[0011] Alternatively, the liquid cooling circuit includes a first liquid cooling tube, a three-way joint and two second liquid cooling tubes, the condenser is connected to one end of the three-way joint through the first liquid cooling tube, the other two ends of the three-way joint are respectively connected to the liquid inlet ends of the first liquid cooling structure and the second liquid cooling structure, and the liquid outlet ends of the first liquid cooling structure and the second liquid cooling structure are respectively connected to the condenser through one of the second liquid cooling tubes.

[0012] Optionally, the heat dissipation module further includes a sealing joint, which is arranged at the connection between the condenser and the liquid cooling pipeline.

[0013] Optionally, the first liquid cooling structure includes a heat-conducting structure, a cover, a first water inlet and a first water outlet, the heat-conducting structure is in contact with the power device, the cover is arranged on the heat-conducting structure, and the cover is in contact with the heat-conducting structure, the cover and the heat-conducting structure are surrounded to form a first liquid cooling cavity, the first water inlet and the first water outlet are respectively connected to the first liquid cooling cavity, and the first water inlet and the first water outlet are respectively connected to the liquid cooling pipeline.

[0014] Optionally, the heat-conducting structure comprises a heat-conducting substrate and heat-conducting fins, the heat-conducting substrate is in contact with and connected to the power device, and the heat-conducting fins are arranged on a side of the heat-conducting substrate away from the power device.

[0015] Optionally, the cover shell is a shell structure which is hollow inside and open at one end, the heat-conducting structure cover is arranged at the opening of the cover shell, the shell structure has the first liquid cooling cavity, the heat-conducting fins are in the first liquid cooling cavity, and the edge of the cover shell is connected to the heat-conducting substrate.

[0016] Optionally, the inverter circuit also includes a PCB board arranged in the box body, the second liquid cooling structure has a second liquid cooling cavity, the inductor device includes an inductor body and an inductor pin, the inductor pin is connected to the inductor body, the inductor body is embedded in the second liquid cooling cavity, and at least a portion of the inductor pin extends out of the second liquid cooling cavity and is electrically connected to the PCB board.

[0017] Optionally, the second liquid cooling structure is disposed on an inner wall of the box body, or the second liquid cooling structure is disposed on an outer wall of the box body.

[0018] Optionally, the inverter circuit also includes a PCB board and electronic components arranged in the box, and the pins of the power device and the pins of the electronic components are electrically connected to the PCB board respectively; the first liquid cooling structure and the power device are on the same side of the PCB board.

[0019] Optionally, the pins of the power device and the pins of the electronic components are electrically connected to the same surface of the PCB board respectively.

[0020] Optionally, the power device and the electronic component are installed on the same side of the PCB board.

[0021] Optionally, the electronic components are mounted on the surface of the PCB along its own thickness direction, and the power devices are mounted on the end of the PCB along a direction perpendicular to the thickness direction.

[0022] Optionally, the power device and the electronic component are respectively located on opposite sides of the PCB board, and the pins of the power device and the pins of the electronic component are respectively electrically connected to opposite surfaces of the PCB board.

[0023] Compared with the prior art, the liquid-cooled inverter device of the utility model mainly includes an inverter module and a heat dissipation module, and the condenser is used to provide low-temperature coolant. When cooling the power devices and inductance devices of the inverter circuit, the low-temperature coolant can be output by the condenser, and the coolant enters the first liquid cooling structure and the second liquid cooling structure through the liquid cooling pipeline. For example, the low-temperature coolant can flow out from the condenser, enter the first liquid cooling structure and the second liquid cooling structure through the liquid cooling pipeline, and then flow back to the condenser through the liquid cooling pipeline to be cooled again, and the process is continuously circulated. In other words, the condenser continuously outputs low-temperature coolant and outputs the refluxed coolant again after cooling it. Since the first liquid cooling structure and the second liquid cooling structure are respectively connected to the power device and the inductance device, the heat generated during the operation of the power device and the inductance device can be taken away by the coolant circulating in the first liquid cooling structure and the second liquid cooling structure, so that the circulating coolant is used to heat the power device and the inductance device in a heat exchange manner.

[0024] Since the power device, the first liquid cooling structure and the second liquid cooling structure are arranged in the box, and the condenser is arranged on the outer wall of the box, the part of the liquid cooling pipeline connected to the condenser and close to the condenser is in the condenser, and the part of the liquid cooling pipeline far from the condenser is in the box, so that the liquid cooling pipeline is safely protected by the box, and the problem of easy damage of the liquid cooling pipeline due to being located on the outside of the box in the related technology is avoided, so as to ensure the heat dissipation and cooling operation of the inverter circuit.

[0025] The utility model also provides a photovoltaic inverter device, comprising the liquid-cooled inverter device as described above.

[0026] Since the photovoltaic inverter device includes a liquid-cooled inverter device, the photovoltaic inverter device at least has all the technical effects of the liquid-cooled inverter device, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is one of the structural schematic diagrams of the liquid-cooled inverter device in the embodiment of the utility model;

[0028] Figure 2 This is the second structural schematic diagram of the liquid-cooled inverter device in the embodiment of the utility model;

[0029] Figure 3 This is the third structural schematic diagram of the liquid-cooled inverter device in the embodiment of the utility model;

[0030] Figure 4 This is a schematic diagram of the axial structure of the first liquid cooling structure and the power device in the embodiment of the utility model;

[0031] Figure 5It is a schematic diagram of the cross-sectional structure of the first liquid cooling structure and the power device in the embodiment of the utility model;

[0032] Figure 6 for Figure 3 A schematic diagram of the enlarged structure at A in the middle;

[0033] Figure 7 This is the fourth structural schematic diagram of the liquid-cooled inverter device in the embodiment of the utility model;

[0034] Figure 8 This is the fifth structural diagram of the liquid-cooled inverter device in the embodiment of the utility model;

[0035] Fig. 9 This is a schematic diagram of the structure in which the electronic components and the power devices are arranged on the same side of the PCB board in the embodiment of the utility model;

[0036] Fig.10 This is a schematic diagram of the structure in which the power device is arranged on the side end of the PCB board in the embodiment of the utility model;

[0037] Fig.11 This is a schematic diagram of the structure in which the electronic components and the power devices are arranged on opposite sides of the PCB board in the embodiment of the utility model;

[0038] Fig.12 This is one of the series piping principle diagrams of the condenser in the embodiment of the utility model for cooling the power device and the inductor device;

[0039] Fig.13 This is a schematic diagram of parallel pipes used by the condenser in the embodiment of the utility model to cool down the power device and the inductor device;

[0040] Fig.14 This is one of the series-parallel combination pipeline principle diagrams of the condenser in the embodiment of the utility model for cooling the power device and the inductor device;

[0041] Fig.15 This is the second schematic diagram of the series-parallel combination pipeline for cooling the power device and the inductor device by the condenser in the embodiment of the utility model;

[0042] Fig.16 This is the third schematic diagram of the series-parallel combination pipeline for cooling the power device and the inductor device by the condenser in the embodiment of the utility model.

[0043] Description of reference numerals:

[0044] 1-housing; 2-inverter circuit; 21-inductor device; 211-inductor body; 212-inductor pin; 22-power device; 23-PCB board; 24-electronic components; 31-condenser; 32-first liquid cooling tube; 33-first liquid cooling structure; 331-heat-conducting structure; 3311-heat-conducting substrate; 3312-heat-conducting fins; 332-cover; 333-first water inlet; 334-first water outlet; 34-connecting pipe; 35-second liquid cooling structure; 36-second liquid cooling tube; 37-three-way connector. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0046] It should be noted that, in the coordinate system XYZ provided herein, the positive direction of the X axis represents the right, the reverse direction of the X axis represents the left, the positive direction of the Y axis represents the front, the reverse direction of the Y axis represents the back, the positive direction of the Z axis represents the top, and the reverse direction of the Z axis represents the bottom. At the same time, it should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment" and "one implementation" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or implementation are included in at least one embodiment or implementation of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or implementation. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or implementations in a suitable manner.

[0049] In order to solve the above technical problems, Figure 1 and Figure 2As shown, an embodiment of the utility model provides a liquid-cooled inverter device, including an inverter module and a heat dissipation module, the inverter module includes a housing 1 and an inverter circuit 2, the inverter circuit 2 includes an inductor 21 and a power device 22, the heat dissipation module includes a condenser 31, a liquid cooling pipeline, a first liquid cooling structure 33 and a second liquid cooling structure 35, the power device 22 and the first liquid cooling structure 33 are arranged in the housing 1, the inductor 21 and the second liquid cooling structure 35 are arranged in the housing 1, the condenser 31 is connected to the first liquid cooling structure 33 and the second liquid cooling structure 35 through the liquid cooling pipeline, the first liquid cooling structure 33 and the second liquid cooling structure 35 are respectively connected to the power device 22 and the inductor 21; the condenser 31 is arranged on the outer wall of the housing 1, and at least part of the liquid cooling pipeline is in the housing 1.

[0050] It should be noted that the first liquid cooling structure 33 is connected to the power device 22 to dissipate heat and cool the power device 22 through heat exchange, and the second liquid cooling structure 35 is connected to the inductor device 21 to dissipate heat and cool the inductor device 21 through heat exchange.

[0051] The inductor device 21 and the second liquid cooling structure 35 are arranged in the box body 1 , which means that the inductor device 21 and the second liquid cooling structure 35 can be arranged inside the box body 1 , or the inductor device 21 and the second liquid cooling structure 35 are arranged on the outer wall of the box body 1 .

[0052] Among them, the liquid cooling pipeline can be understood as including multiple pipelines, that is, the condenser 31 is connected to the first liquid cooling structure 33 and the second liquid cooling structure 35 through multiple pipelines, so that the low-temperature coolant output by the condenser 31 can circulate differently between the first liquid cooling structure 33, the second liquid cooling structure 35, the condenser 31 and multiple pipelines.

[0053] The liquid-cooled inverter device of this embodiment mainly includes an inverter module and a heat dissipation module, and the condenser 31 is used to provide a low-temperature coolant. When cooling the power device 22 and the inductor device 21 of the inverter circuit 2, the low-temperature coolant can be output by the condenser 31, and the coolant enters the first liquid cooling structure 33 and the second liquid cooling structure 35 through the liquid cooling pipeline. For example, the low-temperature coolant can flow out of the condenser 31, enter the first liquid cooling structure 33 and the second liquid cooling structure 35 through the liquid cooling pipeline, and then flow back to the condenser 31 through the liquid cooling pipeline to cool down again, and the process is sequentially Continuously circulate, in other words, the condenser 31 continuously outputs low-temperature coolant and outputs it again after cooling the refluxed coolant. Since the first liquid cooling structure 33 and the second liquid cooling structure 35 are respectively connected to the power device 22 and the inductor device 21, the heat generated during the operation of the power device 22 and the inductor device 21 can be taken away by the coolant circulating in the first liquid cooling structure 33 and the second liquid cooling structure 35, so that the circulating coolant is used to heat the power device 22 and the inductor device 21 in a heat exchange manner.

[0054] Since the power device 22, the first liquid cooling structure 33 and the second liquid cooling structure 35 are arranged in the box body 1, and the condenser 31 is arranged on the outer wall of the box body 1, the part of the liquid cooling pipeline connected to the condenser 31 and close to the condenser 31 is in the condenser 31, and the part of the liquid cooling pipeline far away from the condenser 31 is in the box body 1, so that the liquid cooling pipeline is safely protected by the box body 1, and the problem of easy damage of the liquid cooling pipeline due to being located on the outside of the box body 1 in the related technology is avoided, so as to ensure the heat dissipation and cooling operation of the inverter circuit 2.

[0055] In one embodiment of the present invention, Figure 2 and Fig.12 As shown, the condenser 31 has a first end and a second end, and the liquid cooling pipeline includes a first liquid cooling tube 32, a connecting tube 34 and a second liquid cooling tube 36. The first end is passed through the box body 1 and is connected to one end of the second liquid cooling tube 36 via the first liquid cooling tube 32, the first liquid cooling structure 33, the connecting tube 34, and the second liquid cooling structure 35 in sequence. The other end of the second liquid cooling tube 36 is connected to the second end passed through the box body 1, and at least a portion of the second liquid cooling tube 36 is in the box body 1.

[0056] It should be noted that the condenser 31 has a first end and a second end, the first liquid cooling pipe 32 is used to connect the first end of the condenser 31 with the first liquid cooling structure 33, the connecting pipe 34 is used to connect the first liquid cooling structure 33 with the second liquid cooling structure 35, and the second liquid cooling pipe 36 is used to connect the second liquid cooling structure 35 and the second end of the condenser 31.

[0057] The condenser 31 has the following two ways of series pipe structure for cooling the power device 22 and the inductor 21 through the liquid cooling pipe. In the first way, if the first end is a water outlet, the first liquid cooling pipe 32 is the water outlet pipe of the condenser 31, and the second liquid cooling pipe 36 is the return pipe of the condenser 31, and the second end is the return water outlet, then the coolant output from the condenser 31 through the first end first cools the power device 22 and then cools the inductor 21. Fig.12 As shown; the second type, if the second end is the water outlet, the second liquid cooling tube 36 is the water outlet pipe of the condenser 31, and the first liquid cooling tube 32 is the return pipe of the condenser 31, and the first end is the return water outlet. The coolant output from the condenser 31 through the second end first dissipates heat and cools the inductor device 21, and then dissipates heat and cools the power device 22.

[0058] At least part of the second liquid cooling tube 36 is in the box body 1, which means that when the second liquid cooling structure 35 is arranged inside the box body 1, the entire second liquid cooling tube 36 is in the box body 1; when the second liquid cooling structure 35 is arranged on the outer wall of the box body 1, part of the second liquid cooling tube 36 is in the box body 1, and the other part of the second liquid cooling tube 36 is in the second liquid cooling structure 35. At this time, the second liquid cooling tube 36 is not exposed outside the box body 1.

[0059] In one embodiment of the present invention, Fig.13 As shown, the condenser 31 has two first ends and two second ends, and the liquid cooling circuit includes two first liquid cooling tubes 32 and two second liquid cooling tubes 36, each of the first ends is connected to the liquid inlet end of the first liquid cooling structure 33 or the second liquid cooling structure 35 through each of the first liquid cooling tubes 32, and the liquid outlet end of the first liquid cooling structure 33 or the second liquid cooling structure 35 is connected to each of the second ends through each of the second liquid cooling tubes 36.

[0060] It should be noted that the condenser 31 has two first ends and two second ends. When the first end is a water outlet, the second end is a water return port; when the first end is a water return port, the second end is a water outlet.

[0061] The parallel pipe structure of the condenser 31 for cooling the power device 22 and the inductor device 21 through the liquid cooling pipe can be used in the following manner, taking the first end as the water outlet and the second end as the water return port as an example for exemplary description, that is, the first end is the water outlet, the first liquid cooling pipe 32 is the water outlet pipe of the condenser 31, the second liquid cooling pipe 36 is the water return pipe of the condenser 31, and the second end is the water return port, then the coolant output from the first end of the condenser 31 enters the first liquid cooling structure through the first liquid cooling pipe 32 The cooling liquid outputted from the other first end of the condenser 31 enters the second liquid cooling structure through another first liquid cooling tube 32, and then flows back from another second liquid cooling tube 36 through another second end into the condenser 31 to dissipate heat and cool the inductor 21, so that the power device 22 and the inductor 21 can be dissipated and cooled at the same time through the condenser 31.

[0062] In one embodiment of the utility model, the condenser 31 has a first end and a second end, and the liquid cooling pipeline includes a first liquid cooling tube 32 and a second liquid cooling tube 36. The first end is connected to the liquid inlet end of the first liquid cooling structure 33 or the second liquid cooling structure 35 through the first liquid cooling tube 32, and the liquid outlet end of the first liquid cooling structure 33 or the second liquid cooling structure 35 is connected to the second end through the second liquid cooling tube 36.

[0063] It should be noted that the condenser 31 has a first end and a second end. The series-parallel combination pipeline structure of the condenser 31 for dissipating heat and cooling the power device 22 and the inductor device 21 through the liquid cooling pipeline can be adopted as follows. When the first end is the water outlet and the second end is the water return port, an exemplary explanation is given. That is, the first end is the water outlet and the second end is the water return port. The coolant output from the first end of the condenser 31 enters the first liquid cooling structure 33 or the second liquid cooling structure 35 through the first liquid cooling pipe 32, and then flows back to the condenser 31 from the second liquid cooling pipe 36 through the second end to dissipate heat and cool the power device 22 or the inductor device 21.

[0064] The condenser 31 uses a liquid cooling pipeline to dissipate heat and cool the power device 22 and the inductor device 21 in series-parallel combination pipeline structures in the following three ways:

[0065] The first one is combined Fig.14As shown, the condenser 31 has a first end and two second ends, and the liquid cooling circuit includes a first liquid cooling tube 32, a connecting tube 34 and two second liquid cooling tubes 36. The first end of the condenser 31 is connected to the liquid inlet end of the first liquid cooling structure 33 through the first liquid cooling tube 32, a liquid outlet end of the first liquid cooling structure 33 is connected to the second end through the second liquid cooling tube 36, and the other liquid outlet end of the first liquid cooling structure 33 is connected to the other second end of the condenser 31 through the connecting tube 34 and the second liquid cooling structure 35, so that the low-temperature coolant output by the condenser 31 first cools the power device 22 and then cools the inductor device 21.

[0066] The second type is combined Fig.15 As shown, the condenser 31 has a first end and two second ends, and the liquid cooling circuit includes a first liquid cooling tube 32, the connecting tube 34 and two second liquid cooling tubes 36. The first end of the condenser 31 is connected to the liquid inlet end of the second liquid cooling structure 35 through the first liquid cooling tube 32, and a liquid outlet end of the second liquid cooling structure 35 is connected to the second end through the second liquid cooling tube 36. The other liquid outlet end of the second liquid cooling structure 35 is connected to the other second end of the condenser 31 through the connecting tube 34 and the first liquid cooling structure 33, so that the low-temperature coolant output by the condenser 31 first cools the inductor device 21 and then cools the power device 22.

[0067] The third type, combined Fig.16 As shown, the condenser 31 has a first end and two second ends, the liquid cooling pipeline includes a first liquid cooling pipe 32, a three-way joint 37 and two second liquid cooling pipes 36, the three-way joint 37 has three pipe openings, the condenser 31 is connected to the first pipe opening of the three-way joint 37 through the first liquid cooling pipe 32, and the other two pipe openings of the three-way joint 37 are respectively connected to the liquid inlet ends of the first liquid cooling structure 33 and the second liquid cooling structure 35, and the liquid outlet ends of the first liquid cooling structure 33 and the second liquid cooling structure 35 are respectively connected to the condenser 31 through each of the second liquid cooling pipes 36, so that the low-temperature coolant output from the first end of the condenser 31 flows back to the condenser 31 through the first liquid cooling pipe 32, the three-way joint 37, the first liquid cooling structure 33 and the second liquid cooling structure 35, the second liquid cooling pipe 36 and the second end in sequence, so that the low-temperature coolant output from the condenser 31 can cool the inductor 21 and the power device 22 at the same time.

[0068] In an embodiment of the present invention, the heat dissipation module further includes a sealing joint, which is arranged at the connection between the condenser 31 and the liquid cooling pipeline.

[0069] It should be noted that by providing a sealing joint at the connection between the condenser 31 and the liquid cooling pipeline, the sealing of the connection between the condenser 31 and the liquid cooling pipeline (such as the first liquid cooling pipe and the second liquid cooling pipe) can be effectively enhanced to prevent leakage of the coolant.

[0070] In one embodiment of the present invention, Figure 2 , Figure 4 and Figure 5 As shown, the first liquid cooling structure 33 includes a heat-conducting structure 331, a cover shell 332, a first water inlet pipe 333 and a first water outlet pipe 334, the heat-conducting structure 331 is in contact with the power device 22, the cover shell 332 is arranged on the heat-conducting structure 331, and the cover shell 332 is in contact with the heat-conducting structure 331, the cover shell 332 and the heat-conducting structure 331 are surrounded to form a first liquid cooling cavity, the first water inlet pipe 333 and the first water outlet pipe 334 are respectively connected to the first liquid cooling cavity, and the first water inlet pipe 333 and the first water outlet pipe 334 are respectively connected to the liquid cooling pipeline.

[0071] It should be noted that the power device 22 is arranged in the box body 1, and the heat-conducting structure 331 is arranged on the power device 22 and can be in contact with the power device 22. Since the cover 332 is in contact with the heat-conducting structure 331, the heat-conducting structure 331 can quickly transfer the heat generated by the power device 22 to the cover 332 by heat conduction. At this time, the heat-conducting structure 331 can effectively accelerate the heat transfer efficiency of the power device 22 to the cover 332; since the cover 332 and the heat-conducting structure 331 are enclosed to form a first liquid The cooling chamber is configured such that the cooling liquid in the condenser 31 is output from the first end and enters the first liquid cooling chamber through the first liquid cooling tube 32 and the first water inlet port 333 of the cover shell 332, and circulates in the first liquid cooling chamber, and then is discharged from the first water outlet port 334 on the cover shell 332 and enters the second liquid cooling structure 35 through the connecting pipe 34. In other words, the cooling liquid circulating in the cover shell 332 can quickly absorb the heat of the power device 22 transferred by the heat-conducting structure 331 through thermal interaction, so as to improve the heat dissipation effect and heat dissipation efficiency of the power device 22.

[0072] Further, combined with Figure 4 and Figure 5As shown, the first water inlet 333 and the first water outlet 334 are arranged at intervals on the housing 332, and are respectively connected to the first liquid cooling cavity formed by the housing 332 and the heat-conducting structure 331, so as to improve the convenience of connection between the first liquid cooling cavity and the first liquid cooling pipe 32 and the connecting pipe 34. The heat-conducting structure 331 and the power device 22 can be arranged closely, or the heat-conducting structure 331 and the power device 22 can be connected by a heat-conducting structural adhesive, which can enhance the connection stability and heat conduction efficiency of the heat-conducting structure 331 and the power device 22. The heat-conducting structural adhesive can be a prior art and is not specifically limited here.

[0073] In one embodiment of the present invention, Figure 5 As shown, the heat-conducting structure 331 includes a heat-conducting substrate 3311 and heat-conducting fins 3312 . The heat-conducting substrate 3311 is in contact with the power device 22 , and the heat-conducting fins 3312 are arranged on a side of the heat-conducting substrate 3311 away from the power device 22 .

[0074] It should be noted that since the thermal fins 3312 are arranged on the side of the thermally conductive substrate 3311 away from the power device 22, the surface area of ​​the thermally conductive substrate 3311 is increased. The thermally conductive substrate 3311 is in contact with the power device 22 so that the thermally conductive substrate 3311 can transfer the heat of the power device 22 absorbed to the thermally conductive fins 3312, thereby increasing the surface area of ​​the thermally conductive substrate 3311 to further improve the heat dissipation effect on the power device 22.

[0075] Among them, the thermal fins 3312 can be connected to the cover shell 332, or there is a small gap between the end of the thermal fins 3312 away from the thermal substrate 3311 and the inner wall of the cover shell 332. In other words, the two are not directly connected, so that the thermal fins 3312 can quickly transfer the heat absorbed by the power device 22 to the cover shell 332, so that the coolant circulating in the cover shell 332 can absorb the heat on the surface of the thermal fins 3312 through heat exchange, thereby further improving the heat dissipation effect on the power device 22.

[0076] Furthermore, the surface area of ​​the thermally conductive substrate 3311 should be greater than or equal to the surface area of ​​the power device 22, so that the thermally conductive substrate 3311 can quickly transfer all the heat generated by the power device 22 during operation to the thermally conductive fins 3312; the thermally conductive fins 3312 and the thermally conductive substrate 3311 can be an integrally formed structure, thereby increasing the mechanical strength of the thermally conductive structure 331 to improve the connection stability between the thermally conductive structure 331 and the cover shell 332, and correspondingly improving the service life of the thermally conductive structure 331.

[0077] Specifically, the heat-conducting fins 3312 may be a plate-like structure, a needle-like structure, a block-like structure, etc. arranged in an array, which is not specifically limited here.

[0078] In one embodiment of the present invention, Figure 5 As shown, the cover shell 332 is a shell structure with a hollow interior and an open end, the heat-conducting structure 331 is covered at the opening of the cover shell 332, the heat-conducting fins 3312 are in the first liquid cooling cavity, and the edge of the cover shell 332 is connected to the heat-conducting substrate 3311.

[0079] It should be noted that when the heat-conducting substrate 3311 is connected to the outer peripheral edge of the cover shell 332 which is a shell structure, a cavity is formed between the heat-conducting substrate 3311 and the shell structure, and the cavity is the first liquid cooling cavity, and the heat-conducting fins 3312 are located in the first liquid cooling cavity. Since the first water inlet pipe 333 and the first water outlet pipe 334 are respectively connected to the first liquid cooling cavity, the coolant output by the condenser 31 can allow the first liquid cooling pipe 32 and the first water inlet pipe 333 to enter the first liquid cooling cavity. At this time, the coolant in the first liquid cooling cavity is in full contact with the heat-conducting fins 3312 located in the first liquid cooling cavity, so that the coolant can exchange heat with the heat-conducting fins 3312 more quickly, so as to quickly absorb the heat of the power device 22 on the surface of the heat-conducting fins 3312, and further improve the heat dissipation effect on the power device 22.

[0080] The thickness of the heat-conducting fin 3312 may match the thickness of the first liquid cooling cavity, or the thickness of the heat-conducting fin 3312 may be slightly smaller than the thickness of the first liquid cooling cavity, so as to ensure that the heat-conducting fin 3312 can be completely in the first liquid cooling cavity; wherein the heat-conducting fin 3312 and the first liquid cooling cavity are Figure 5 The dimension in the Y-axis direction in the coordinate system is the thickness of the heat conducting fins 3312 and the first liquid cooling chamber.

[0081] The edges of the heat-conducting substrate 3311 and the cover shell 332 can be fixedly connected by means of sealant to prevent the coolant in the first liquid-cooling chamber from leaking from the connection between the two; further, the edges of the heat-conducting substrate 3311 and the cover shell 332 can also be connected by fasteners such as bolts to further improve the connection stability between the two on the basis of ensuring the sealed connection between the heat-conducting substrate 3311 and the edge of the opening.

[0082] Among them, the heat-conducting structure 331 can be installed in the box body 1 in the following manner. For example, the side of the heat-conducting substrate 3311 facing the power device 22 can be installed in the box body 1 through multiple support columns. Specifically, multiple support columns are installed on the inner wall of the box body 1, and then the heat-conducting structure 331 of the first liquid cooling structure 33 is installed on the support columns; or, multiple support columns are integrated on the heat-conducting substrate 3311, and then the first liquid cooling structure 33 is installed on the inner wall of the box body 1.

[0083] Among them, the thermal fins 3312 and the cover shell 332 can also be connected in the following manner, for example, there is a gap between the thermal fins 3312 and the inner wall of the cover shell 332, and the gap can be filled with thermal conductive glue; or, the thermal fins 3312 are in direct contact with the inner wall of the first liquid cooling chamber (without a gap), and the two can be fixed by welding.

[0084] In one embodiment of the present invention, Figure 6 As shown, the inverter circuit 2 also includes a PCB board 23 arranged in the box body 1, the second liquid cooling structure 35 has a second liquid cooling cavity, the inductor device 21 includes an inductor body 211 and an inductor pin 212, the inductor pin 212 is connected to the inductor body 211, the inductor body 211 is embedded in the second liquid cooling cavity, and at least a portion of the inductor pin 212 extends out of the second liquid cooling cavity and is electrically connected to the PCB board 23.

[0085] It should be noted that the second liquid cooling structure 35 can be a box structure with a hollow interior, and the hollow portion of the box structure is the second liquid cooling cavity. The inductor body 211 can be installed in the second liquid cooling cavity. Since the connecting pipe and the second liquid cooling pipe 36 are respectively connected to the second liquid cooling cavity of the second liquid cooling structure 35, the connecting pipe 34 transmits the cooling liquid to the second liquid cooling cavity for circulation, so as to dissipate heat and cool the inductor body 211 through heat exchange with the inductor body 211. After the cooling liquid in the second liquid cooling cavity is discharged, it flows back to the condenser 31 through the second liquid cooling pipe 36.

[0086] The inductor pin 212 extends out of the second liquid cooling chamber so as to be welded and fixed to the PCB board 23 .

[0087] Among them, at least part of the inductor pin 212 extends out of the second liquid-cooling cavity means that one end of the inductor pin 212 is electrically connected to the inductor body 211 in the second liquid-cooling cavity, and other parts of the inductor pin 212 extend out of the second liquid-cooling cavity, or part of the inductor pin 212 is in the second liquid-cooling cavity, and the other part of the inductor pin 212 extends out of the second liquid-cooling cavity.

[0088] In addition, a potting glue may be disposed on the outside of the inductor body 211, so that the inductor body 211 is wrapped with the potting glue to fix the inductor body 211 into an integrated structure, thereby correspondingly extending its service life; wherein the potting glue may be thermally conductive silicone, or other glue having insulating and thermally conductive properties, and in this embodiment, no specific limitation is made to the potting glue.

[0089] In an embodiment of the present invention, the second liquid cooling structure 35 is disposed on the inner wall of the box body 1 , or the second liquid cooling structure 35 is disposed on the outer wall of the box body 1 .

[0090] It should be noted that the second liquid cooling structure 35 can have the following two installation positions relative to the box body 1. For example, the first one is combined with Figure 2 and Figure 3 As shown, the second liquid cooling structure 35 and the inductor device 21 are both arranged in the box body 1, wherein the inductor body 211 of the inductor device 21 is embedded in the second liquid cooling cavity of the second liquid cooling structure 35, and the inductor pin 212 extends out of the second liquid cooling cavity and is connected to the PCB board 23. At this time, since the first liquid cooling structure 33 is also in the box body 1, the length of the connecting tube 34 between the first liquid cooling structure 33 and the second liquid cooling structure 35 and the length of the second liquid cooling tube 36 between the second liquid cooling structure 35 and the condenser 31 can be effectively reduced.

[0091] For example, the second one, combined Figure 7 and Figure 8 As shown, the condenser 31 is arranged outside the box body 1, such as being located on the lower side wall of the box body 1, and the second liquid cooling structure 35 can be arranged on the upper side wall outside the box body 1, wherein the inductor body 211 of the inductor device 21 is embedded in the second liquid cooling cavity of the second liquid cooling structure 35, one end of the inductor pin 212 is connected to the inductor body 211, and the other end of the inductor pin 212 extends out of the second liquid cooling cavity and penetrates the side wall of the box body 1 to connect the PCB board 23, so that the second liquid cooling structure 35 and the inductor device 21 arranged outside the box body 1 can effectively reduce the heat conducted from the inductor device 21 to the inside of the box body 1, so as to correspondingly reduce the heat accumulation of the heat in the box body 1; wherein, the water inlet and outlet in the second liquid cooling structure 35 respectively connected to the connecting pipe 34 and the second liquid cooling pipe 36 can also be located inside the box body 1, so as to avoid the water inlet and outlet of the second liquid cooling structure 35 being exposed to the outside of the box body 1 and damaged.

[0092] in, Figure 2 , Figure 7 In the embodiment, since the first liquid cooling structure 33 is disposed on the power device 22, the power device 22 is shielded. Figure 2 and Figure 7 The power device 22 in FIG. 1 is marked with a dotted frame.

[0093] In the related art, the inverter device mainly includes a box, a PCB board, electronic components, power devices and a radiator, wherein the pins of the electronic components and the power devices are electrically connected to the PCB board respectively, the radiator is arranged on the outer wall of the box, and the heat dissipation interface of the power device away from its own pins is fixed to the radiator through the side wall of the box to achieve heat conduction. However, such an arrangement will increase the thickness of the box in the entire inverter device, making it difficult to apply to installation places with limited space.

[0094] To solve the above problems, combined with Figure 8 and Fig. 9 As shown, in one embodiment of the utility model, the inverter circuit 2 also includes a PCB board 23 and electronic components 24 arranged in the box body 1, and the pins of the power device 22 and the pins of the electronic components 24 are electrically connected to the PCB board 23 respectively; the first liquid cooling structure 33 and the power device 22 are on the same side of the PCB board 23.

[0095] It should be noted that, since the pins of the power device 22 and the pins of the electronic components 24 are electrically connected to the PCB board 23 respectively, the power device 22 and the electronic components 24 are electrically connected to the PCB board 23, so that the transmission of electrical signals and currents can be achieved.

[0096] The electronic component 24 may be at least one combination of a resistor, a capacitor, an inductor, a sensor, etc.

[0097] Among them, the power device 22 and the electronic component 24 can be welded and fixed to the PCB board 23 through a DIP (dual in-line socket) welding process. For example, the DIP welding process refers to reserving several small holes on the PCB board 23 in advance, and then inserting the pins of the power device 22 and the electronic component 24 into different small holes of the PCB board 23 respectively, and installing the power device 22 and the electronic component 24 in place, and then welding the pins of the power device 22 and the electronic component 24 to the PCB board 23 firmly, so as to realize the electrical connection between the power device 22 and the electronic component 24 and the PCB board 23 respectively.

[0098] Since the first liquid cooling structure 33 is also arranged in the box body 1 and is on the same side of the PCB board 23 as the power device 22, the space on the side of the power device 22 away from the PCB board 23 can be effectively utilized. Compared with the above-mentioned related technologies, the overall thickness of the box body 1 can be effectively reduced.

[0099] Among them, box 1 is Fig. 9 The side wall on the opposite side of the Y axis in the coordinate system is the rear side wall of the box 1. Fig. 9 The dimension in the Y-axis direction in the coordinate system is the thickness of the box 1 .

[0100] In one embodiment of the present invention, Fig. 9 and Fig.10 As shown, the pins of the power device 22 and the pins of the electronic component 24 are electrically connected to the same surface of the PCB board 23 respectively.

[0101] It should be noted that, since the power device 22 and the electronic component 24 are electrically connected to the same surface of the PCB board 23, respectively, when the power device 22 and the electronic component 24 are respectively soldered and fixed to the PCB board 23, there is no need to turn the PCB board 23 over, so as to correspondingly improve the soldering efficiency of the power device 22 and the electronic component 24 and the PCB board 23.

[0102] Combination Fig. 9 As shown, in one embodiment of the present invention, the power device 22 and the electronic component 24 are installed on the same side of the PCB board 23 .

[0103] It should be noted that the power device 22 and the electronic component 24 can be arranged on the same side of the PCB board 23 in the following manner, for example, the PCB board 23 is installed on the rear side wall of the box body 1, and then the power device 22 and the electronic component 24 are installed on the front side wall of the PCB board 23, and the pins of the power device 22 and the pins of the electronic component 24 are respectively welded and fixed to the PCB board 23, and only the DIP welding process needs to be performed in sequence. Fig. 9 The side wall facing the positive direction of the Y axis in the coordinate system is the front side wall of the PCB board 23 .

[0104] In one embodiment of the present invention, Fig.10 As shown, the electronic components 24 are mounted on the surface of the PCB board 23 along its thickness direction, and the power device 22 is mounted on the end of the PCB board 23 perpendicular to the thickness direction.

[0105] It should be noted that the electronic components 24 are installed on the surface of the PCB board 23 along its own thickness direction, which means that the electronic components 24 can be installed on the front side wall of the PCB board 23, and the rear side wall of the PCB board 23 can be installed on the rear side wall of the box body 1 through the legs, and the power device 22 can be installed at the circumferential end of the PCB board 23, such as the left end. In other words, the electronic components 24 and the power device 22 are installed on different side walls of the PCB board 23, but the pins of the electronic components 24 and the pins of the power device 22 are still electrically connected to the same surface of the PCB board 23, so that the space around the PCB board 23 can be fully utilized, and the volume of the box body 1 can be correspondingly reduced to achieve lightweight liquid-cooled inverter device.

[0106] The thickness direction of the PCB board 23 refers to the thickness direction of the PCB board 23. Fig. 9 The Y-axis direction of the coordinate system; the end of the PCB board 23 along the direction perpendicular to the thickness direction refers to the circumferential (all around) end of the PCB board 23.

[0107] In one embodiment of the present invention, Fig.11As shown, the power device 22 and the electronic component 24 are respectively located on opposite sides of the PCB board 23 , and the pins of the power device 22 and the pins of the electronic component 24 are respectively electrically connected to opposite surfaces of the PCB board 23 .

[0108] It should be noted that the power device 22 and the electronic component 24 are respectively located on opposite sides of the PCB board 23. It can be understood that the power device 22 can be arranged on one side of the PCB board 23 along its own thickness direction, such as the rear side, and the electronic component 24 can be arranged on the other side of the PCB board 23 along its own thickness direction, such as the front side.

[0109] The pins of the power device 22 and the pins of the electronic components 24 are electrically connected to the opposite surfaces of the PCB board 23 respectively. It can be understood that the power device 22 can be electrically connected to one side surface (such as the rear surface) of the PCB board 23 along its own thickness direction, and the electronic component 24 is electrically connected to the other side surface (such as the front surface) of the PCB board 23 along its own thickness direction, and the one side surface and the other side surface are two opposite surfaces of the PCB board 23.

[0110] The utility model also provides a photovoltaic inverter device, comprising the liquid-cooled inverter device as described above.

[0111] It should be noted that the photovoltaic inverter device may also include at least a photovoltaic panel, which may be electrically connected to the PCB board 23 or the power device 22 in the liquid-cooled inverter device. The photovoltaic inverter device has all the technical effects of the liquid-cooled inverter device, which will not be described in detail here.

[0112] Although the utility model is disclosed as above, the protection scope of the utility model is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the protection scope of the utility model.

Claims

1. A liquid-cooled inverter device, characterized in that: The invention comprises an inverter module and a heat dissipation module, wherein the inverter module comprises a housing (1) and an inverter circuit (2), wherein the inverter circuit (2) comprises an inductor device (21) and a power device (22), wherein the heat dissipation module comprises a condenser (31), a liquid cooling pipeline, a first liquid cooling structure (33) and a second liquid cooling structure (35), wherein the power device (22) and the first liquid cooling structure (33) are arranged in the housing (1), wherein the inductor device (21) and the second liquid cooling structure (35) are arranged in the housing (1), wherein the condenser (31) is connected to the first liquid cooling structure (33) and the second liquid cooling structure (35) through the liquid cooling pipeline, wherein the first liquid cooling structure (33) and the second liquid cooling structure (35) are respectively connected to the power device (22) and the inductor device (21); wherein the condenser (31) is arranged on the outer wall of the housing (1), and at least part of the liquid cooling pipeline is located in the housing (1).

2. The liquid-cooled inverter device according to claim 1, characterized in that: The condenser (31) has a first end and a second end, and the liquid cooling pipeline includes a first liquid cooling pipe (32), a connecting pipe (34) and a second liquid cooling pipe (36). The first end is passed through the casing (1) and is connected to one end of the second liquid cooling pipe (36) via the first liquid cooling pipe (32), the first liquid cooling structure (33), the connecting pipe (34) and the second liquid cooling structure (35) in sequence. The other end of the second liquid cooling pipe (36) is connected to the second end passed through the casing (1). At least a portion of the second liquid cooling pipe (36) is located in the casing (1).

3. The liquid-cooled inverter device according to claim 1, characterized in that: The condenser (31) has two first ends and two second ends, and the liquid cooling pipeline includes two first liquid cooling tubes (32) and two second liquid cooling tubes (36), each of the first ends is connected to the liquid inlet end of the first liquid cooling structure (33) or the second liquid cooling structure (35) through each of the first liquid cooling tubes (32), and the liquid outlet end of the first liquid cooling structure (33) or the second liquid cooling structure (35) is connected to each of the second ends through each of the second liquid cooling tubes (36).

4. The liquid-cooled inverter device according to claim 1, characterized in that: The condenser (31) has a first end and a second end, and the liquid cooling pipeline includes a first liquid cooling pipe (32) and a second liquid cooling pipe (36), the first end is connected to the liquid inlet end of the first liquid cooling structure (33) or the second liquid cooling structure (35) through the first liquid cooling pipe (32), and the liquid outlet end of the first liquid cooling structure (33) or the second liquid cooling structure (35) is connected to the second end through the second liquid cooling pipe (36).

5. The liquid-cooled inverter device according to claim 4, characterized in that: The liquid cooling pipeline comprises a first liquid cooling pipe (32), a connecting pipe (34) and two second liquid cooling pipes (36); the condenser (31) is connected to the first liquid cooling structure (33) or the second liquid cooling structure (35) through the first liquid cooling pipe (32) and one of the second liquid cooling pipes (36); two ends of the connecting pipe (34) are connected to the first liquid cooling structure (33) and the second liquid cooling structure (35) respectively; the first liquid cooling structure (33) or the second liquid cooling structure (35) is connected to the condenser (31) through another of the second liquid cooling pipes (36); Alternatively, the liquid cooling circuit comprises a first liquid cooling tube (32), a three-way joint (37) and two second liquid cooling tubes (36); the condenser (31) is connected to one end of the three-way joint (37) via the first liquid cooling tube (32); the other two ends of the three-way joint (37) are respectively connected to the liquid inlet ends of the first liquid cooling structure (33) and the second liquid cooling structure (35); and the liquid outlet ends of the first liquid cooling structure (33) and the second liquid cooling structure (35) are respectively connected to the condenser (31) via one of the second liquid cooling tubes (36).

6. The liquid-cooled inverter device according to claim 1, characterized in that: The heat dissipation module further comprises a sealing joint, which is arranged at the connection between the condenser (31) and the liquid cooling pipeline.

7. The liquid-cooled inverter device according to claim 1, characterized in that: The first liquid cooling structure (33) comprises a heat-conducting structure (331), a cover (332), a first water inlet pipe opening (333) and a first water outlet pipe opening (334); the heat-conducting structure (331) is in contact with and connected to the power device (22); the cover (332) is arranged on the heat-conducting structure (331), and the cover (332) is in contact with and connected to the heat-conducting structure (331); the cover (332) and the heat-conducting structure (331) are combined to form a first liquid cooling cavity; the first water inlet pipe opening (333) and the first water outlet pipe opening (334) are respectively connected to the first liquid cooling cavity; and the first water inlet pipe opening (333) and the first water outlet pipe opening (334) are respectively connected to the liquid cooling pipeline.

8. The liquid-cooled inverter device according to claim 7, characterized in that: The heat-conducting structure (331) comprises a heat-conducting substrate (3311) and heat-conducting fins (3312); the heat-conducting substrate (3311) is in contact with and connected to the power device (22); and the heat-conducting fins (3312) are arranged on a side of the heat-conducting substrate (3311) away from the power device (22).

9. The liquid-cooled inverter device according to claim 8, characterized in that: The cover shell (332) is a shell structure with a hollow interior and an opening at one end. The heat-conducting structure (331) is covered at the opening of the cover shell (332). The heat-conducting fins (3312) are located in the first liquid cooling cavity. The edge of the cover shell (332) is connected to the heat-conducting substrate (3311).

10. The liquid-cooled inverter device according to claim 1, characterized in that: The inverter circuit (2) further comprises a PCB board (23) arranged in the housing (1); the second liquid cooling structure (35) has a second liquid cooling cavity; the inductor device (21) comprises an inductor body (211) and an inductor pin (212); the inductor pin (212) is connected to the inductor body (211); the inductor body (211) is embedded in the second liquid cooling cavity; at least a portion of the inductor pin (212) extends out of the second liquid cooling cavity and is electrically connected to the PCB board (23).

11. The liquid-cooled inverter device according to claim 10, characterized in that: The second liquid cooling structure (35) is arranged on the inner wall of the box body (1), or the second liquid cooling structure (35) is arranged on the outer wall of the box body (1).

12. The liquid-cooled inverter device according to any one of claims 1 to 11, characterized in that: The inverter circuit (2) further comprises a PCB board (23) and electronic components (24) arranged in the housing (1); pins of the power device (22) and pins of the electronic components (24) are respectively electrically connected to the PCB board (23); and the first liquid cooling structure (33) and the power device (22) are located on the same side of the PCB board (23).

13. The liquid-cooled inverter device according to claim 12, characterized in that: The pins of the power device (22) and the pins of the electronic component (24) are respectively electrically connected to the same surface of the PCB board (23).

14. The liquid-cooled inverter device according to claim 13, characterized in that: The power device (22) and the electronic component (24) are mounted on the same side of the PCB board (23).

15. The liquid-cooled inverter device according to claim 13, characterized in that: The electronic components (24) are mounted on the surface of the PCB board (23) along its own thickness direction, and the power device (22) is mounted on the end of the PCB board (23) perpendicular to the thickness direction.

16. The liquid-cooled inverter device according to claim 12, characterized in that: The power device (22) and the electronic component (24) are respectively located on opposite sides of the PCB board (23), and the pins of the power device (22) and the pins of the electronic component (24) are respectively electrically connected to opposite surfaces of the PCB board (23).

17. A photovoltaic inverter device, characterized in that: It comprises a liquid-cooled inverter device as described in any one of claims 1 to 16.

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