A module structure, chassis module and communication equipment
By designing a composable module structure, the problem that existing module structures cannot be switched quickly and at low cost is solved, and the flexibility and cost-effectiveness of module configuration combination are achieved.
Patent Information
- Application Number
- CN202420552740.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-21
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-03-21
AI Technical Summary
The existing module structure configuration combination cannot be switched quickly and at low cost, and cannot meet the requirements of different configuration specifications and customized requirements.
A module structure is designed, including a frame and a digital module. The height of the frame is a multiple of 1U or 1U and a width of half-width or half-width. The digital module can be inserted into the frame in combination, supporting rapid replacement and combination.
It realizes flexibility in module configuration combinations, fast and low-cost when configuration switching is required.
Smart Images
Figure CN222706574U_ABST
Abstract
Description
Technical Field
[0001] The present specification relates to the technical field of communication equipment, and in particular to a module structure, a chassis module and communication equipment. Background Art
[0002] The existing module structure is single and cannot meet the requirements of different configuration specifications or customization. Once the configuration is determined and the module is installed, it is impossible to switch quickly and at low cost. Summary of the invention
[0003] In order to overcome the problems existing in the related art, this specification provides a module structure, a chassis module and a communication device, which solves the problem that the module configuration combination in the prior art cannot be switched quickly and at low cost.
[0004] According to the first aspect of the embodiment of the present application, a module structure is provided, which at least includes a frame, wherein the height of the frame is 1U or a multiple of 1U, the width of the frame is half the width or a multiple of the half the width, and a digital module is arranged in the frame. The digital module has several blocks, and the arranged digital modules are of one type or a combination of several types.
[0005] Preferably, if the module structure is a computing node module, the digital module in the frame includes at least a plug-in card module, an IO module and a network card module.
[0006] Furthermore, if the height of the frame of the computing node module is 1U and the width is half width, the plug-in card module is inserted into the frame from one side of the frame opening, and the IO module and the network card module are stacked and inserted into the frame from the other side of the frame opening.
[0007] Furthermore, if the height of the frame of the computing node module is 2U and the width is half width, the frame height is divided into upper 1U and lower 1U, and at least the upper 1U or lower 1U opening of the frame is used to insert the plug-in card module, IO module and network card module, and the remaining space can be arbitrarily configured in combination.
[0008] Preferably, if the module structure is a hard disk module, the digital module in the frame is a hard disk.
[0009] Preferably, a wrench is also included, and the wrench is installed on the frame.
[0010] A second aspect of the present application provides a chassis module, including a chassis, wherein an opening of the chassis can simultaneously insert one or more module structures.
[0011] Preferably, if the chassis height is a multiple of 1U and the width is a multiple of half the width, slide rails are set on the inner walls on the left and right sides of the chassis, and the height of the slide rails from the bottom wall of the chassis is 1U or a multiple of 1U. There are several module structures, and the module structures can be inserted into the opening of the chassis along the slide rails.
[0012] Preferably, the module structure type inserted into the chassis is one type or a combination of several types.
[0013] A third aspect of an embodiment of the present application provides a communication device, comprising the above-mentioned chassis module.
[0014] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:
[0015] The module configuration combination in the embodiments of this specification is flexible, and when configuration switching is required, it is not only fast but also low-cost.
[0016] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.
[0018] Figure 1 This is a schematic diagram of the 1U half-width module structure of this application;
[0019] Figure 2 This is a schematic diagram of a 2U half-width module structure of this application;
[0020] Figure 3 This is a schematic diagram of another module structure of 2U half-width in this application;
[0021] Figure 4 This application Figure 1 A local enlarged view of point A;
[0022] Figure 5 It is a schematic diagram of the chassis structure of this application;
[0023] Figure 6 This is a schematic diagram of the server chassis structure of this application.
[0024] Reference numerals:
[0025] 1-frame; 2-card module; 3-IO module; 4-network card module; 6-heat dissipation module; 7-memory; 8-hard disk; 9-wrench; 10-chassis; 11-slide rail; 12-partition; 13-center backplane module; 14-power board module; 15-power module; 16-fan module DETAILED DESCRIPTION
[0026] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.
[0027] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0028] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0029] The present application embodiment provides a module structure, such as Figure 1-4 As shown, at least a frame 1 is included. The frame includes at least three adjacent faces, one of which is a bottom face and the other two side faces. The frame can be made of metal material or other relatively strong materials, which is not limited here. The height of the frame is 1U or a multiple of 1U, and the width of the frame is half width or a multiple of half width. A digital module is arranged in the frame, and the digital module has several blocks, and the arranged digital modules are a type or a combination of several types. In the above technical scheme, the size of the frame can be 1U half width, 1U full width, 2U half width, 2U full width, etc. It should be noted here that "1U" is a unit height, usually referring to the height of a standard rack, which is roughly equal to 1.75 inches (44.45 mm), ignoring the errors caused by the installation gap, etc. "2U" corresponds to two unit heights. "Full width" is the width of the module structure less than or equal to 360 mm, or the width of four digital modules can be placed in the width direction of the module structure. "Half width" means half of the full width. The embodiment of the present application can also be other sizes that meet the requirements, but considering the flexibility of the module combination, the above size is preferred. The digital module is usually installed in the front opening of the frame, which is convenient for quick identification of the configuration and installation. In the embodiment of the present application, the module configuration combination is flexible, and when the configuration needs to be switched, it is not only fast but also low-cost.
[0030] In one embodiment, the module structure is a computing node module, and the digital module in the frame includes at least a plug-in card module, an IO module, and a network card module.
[0031] like Figure 1 As shown, if the frame size of the computing node module is 1U half width, the plug-in card module 2 is inserted into the frame from the side of the opening on the front face of the frame, while the IO module 3 and the network card module 4 are smaller in size than the plug-in card module and can be stacked and inserted into the frame from the other side of the opening on the front face of the frame. Here, "one side" can be the left half of the frame, and the "other side" is the right half of the frame; similarly, "one side" can be the right half of the frame, and the "other side" is the left half of the frame. Of course, the above two placement methods are only used as examples and do not constitute any limitation.
[0032] If the frame size of the computing node module is 2U half width, the frame height can be divided into upper 1U and lower 1U. At least the upper 1U or lower 1U opening of the frame can be used to insert the card module, IO module and network card module, and the remaining space can be configured in any combination. For example, Figure 3 As shown, the card module 2 is inserted into the frame from one side of the lower 1U of the front end opening of the frame 1, the IO module 3 and the network card module 4 are stacked and inserted into the frame 1 from the other side of the lower 1U of the front end opening of the frame, and the hard disk 8 is inserted into the upper 1U of the front end opening of the frame. There are also several hard disks. Or, as Figure 2 As shown, the card module 2 is inserted on the left side of the upper 1U and the left side of the lower 1U, which may be multiple cards, and the hard disk 8 is inserted on the right side of the upper 1U. The IO module 3 and the network card module 4 are stacked and inserted into the right side of the lower 1U. In this embodiment, the upper 1U refers to the height of the upper half 1U of the frame when the frame height is 2U, and the space of this 1U height is away from the bottom wall of the frame 1. The lower 1U refers to the height of the lower half 1U of the frame, and the height of this 1U is calculated from the bottom wall of the frame. Here, "one side" can be the left half of the frame, and the "other side" is the right half of the frame; similarly, "one side" can be the right half of the frame, and the "other side" is the left half of the frame. Of course, the above two placement methods are only used as examples and do not constitute any limitation.
[0033] In the above two computing node module embodiments, Figure 1-3As shown, the computing node module includes the aforementioned plug-in card module 2, IO module 3 and network card module 4 located at the front end of the frame, as well as a memory 7 (such as DIMM) located at the rear of the frame, a heat dissipation module 6 and a CPU below the heat dissipation module. As an embodiment, specifically, the heat dissipation module 6 is arranged in the middle of the rear of the frame 1, and the memory 7 is located on both sides of the chip 5 and the heat dissipation module 6. The plug-in card module can adopt a PCIe plug-in card module, and the network card module can adopt an OCP3.0 network card module. Of course, this is only used as an example and does not constitute a limitation. In addition, the heat dissipation module here can be a metal radiator, of course, it can also be other, which is not limited here.
[0034] In another embodiment, the module structure is a hard disk module, and the digital module inserted in the frame is a hard disk. There are several hard disks, which are inserted separately.
[0035] like Figure 1-4 As shown, especially Figure 4 As shown, the module structure in all the above embodiments further includes a wrench 9, which is mounted on the frame to facilitate the plugging and unplugging of the module structure.
[0036] A second aspect of the present application provides a chassis module, such as Figure 5-Figure 6 As shown, it includes a chassis, and the opening of the chassis is simultaneously inserted with one or more of the above-mentioned module structures.
[0037] like Figure 5 As shown, if the height of the chassis is a multiple of 1U and the width is a multiple of half the width, a slide rail 11 can be provided on the inner side walls on the left and right sides of the chassis 10, and the height of the slide rail 11 from the bottom wall of the chassis 10 is 1U or a multiple of 1U, which is used for the module structure in the above embodiment. The module structure can be inserted into the opening of the chassis along the slide rail.
[0038] The type of module structure inserted into the chassis can be one or a combination of the above types. For example, if the chassis is a 2U full-width chassis, four 1U half-width module structures, or two 2U half-width module structures, or one 2U half-width plus two 1U half-width, or two 1U full-width module structures can be inserted. Figure 5 As shown, the left and right module structures can be separated by a partition 12 to avoid interference.
[0039] In such Figure 6In the server chassis shown, in addition to the computing node module inserted into the front face of the chassis, each computing node module is connected to the middle backplane module 13 through a connector. In addition, a fan module 16 is included, which is installed in a fan slot (not shown) at the rear end of the server chassis, and each fan module 16 is connected to the middle backplane module 13 through a connector. A power module 15 is installed in a power slot (not shown) at the rear end of the server chassis, and each power module 15 is connected to the power board module 14 through a gold finger (not shown). The power board module and the middle backplane module are electrically and signally connected through a bus (not shown) and a cable.
[0040] A third aspect of the embodiments of the present application further provides a communication device, including the machine in the above embodiment and the chassis module in the above embodiment.
[0041] Directional terms mentioned in the embodiments of the present application, such as left, right, up, down, etc., all correspond to the accompanying drawings.
[0042] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.
[0043] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.
[0044] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.
Claims
1. A module structure, comprising at least a frame, characterized in that: The height of the frame is 1U or a multiple of 1U, the width of the frame is half width or a multiple of half width, a digital module is arranged in the frame, the digital module has a plurality of blocks, and the arranged digital modules are of one type or a combination of several types; If the module structure is a computing node module, the digital module in the frame at least includes a card module, an IO module and a network card module; If the height of the frame of the computing node module is 1U and the width is half width, the plug-in card module is inserted into the frame from one side of the frame opening, and the IO module and the network card module are stacked and inserted into the frame from the other side of the frame opening; If the height of the frame of the computing node module is 2U and the width is half width, the frame height is divided into upper 1U and lower 1U, at least the upper 1U or lower 1U opening of the frame is used to insert the card module, IO module and network card module, and the remaining space can be configured in any combination; If the module structure is a hard disk module, the digital module in the frame is a hard disk.
2. The module structure according to claim 1, characterized in that: The utility model also comprises a wrench which is mounted on the frame.
3. A chassis module, comprising a chassis, characterized in that: The opening of the chassis can be simultaneously inserted with one or more module structures described in any one of claims 1-2.
4. The chassis module according to claim 3, characterized in that: If the chassis height is a multiple of 1U and the width is a multiple of half the width, then slide rails are set on the inner walls on the left and right sides of the chassis, and the height of the slide rails from the bottom wall of the chassis is 1U or a multiple of 1U. There are several module structures, and the module structures can be inserted into the opening of the chassis along the slide rails.
5. The chassis module according to claim 4, characterized in that: The module structure type inserted into the chassis is one type or a combination of several types.
6. A communication device, characterized in that: A chassis module comprising any one of claims 3-5.