A high temperature heating plate mechanism

By designing a vortex-shaped card slot in the heating plate on the heating plate, and combining the heat insulation cover plate and threaded thermocouple, the problems of uneven heating and unstable temperature are solved, achieving efficient and uniform heating effect.

CN222706652UActive Publication Date: 2025-04-01SHENZHEN SAITENGCHANGDING SEMICON ELECTRONICS CO LTD
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Patent Information

Application Number
CN202421085658.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-18
Publication Date
2025-04-01
Estimated Expiration
2034-05-18

AI Technical Summary

Technical Problem

The heating of existing heating plates is uneven, resulting in unstable product temperature and the negative pressure of the vacuum air guide tank takes away heat, reducing heating efficiency.

Method used

A high-temperature heating disk mechanism is designed, using ceramic heating disks, with a scroll-shaped slot on the lower surface, and a heating tube is embedded, combining a heat insulation cover plate and a threaded thermocouple to ensure that the contact area between the heating disk and the heating tube is large and uniform.

Benefits of technology

The heating plate is uniformly heated and efficiently heated, which improves the temperature stability and heating efficiency, and avoids the influence of the negative pressure to take away heat.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a high-temperature heating plate mechanism, which relates to the field of heating technology. The mechanism is composed of a heating plate made of ceramic material, a heating tube, a thermocouple and a heat-insulating cover plate. When the heating plate is manufactured, a slot in the shape of a spiral line is integrally formed on its lower surface, and the distance between each turn of the spiral line is equal, and heating tubes of the same shape are installed in the slot. The high-temperature heating plate mechanism is achieved by embedding a small-diameter heating tube into an equidistant spiral line-shaped slot of a ceramic disc, and then sealing the lower layer with a heat-insulating circular plate. The heating tube is coiled around the heating plate in this way, so that the contact surface value between the heating plate and the heating tube is relatively large and uniform. Therefore, the heating plate of this structure is heated more evenly and has a higher heating efficiency.
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Description

Technical Field

[0001] The utility model relates to the technical field of heating, in particular to a high-temperature heating disc mechanism. Background Art

[0002] The prior art discloses a ceramic disc heating device (CN116456516A), which adopts a structural design in which a graphene heating wire is placed between two layers of circular ceramic plates. The upper ceramic plate is also dug with a vacuum air guide groove for placing conductive materials at each product position on the entire disc.

[0003] However, the heating plate of the above-mentioned heating mechanism has only a few short heating rods, and the heating plate is not heated evenly, which may easily cause a large difference in temperature of the products at different positions on the material plate. In addition, since the products cannot actually fit tightly to the bottom of the material acupuncture point plate and are affected by heat convection, the negative pressure of the vacuum air guide groove will continue to absorb and take away the heat of the products, resulting in low and unstable temperature of the products. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a high-temperature heating plate mechanism, which solves the problems raised by the above-mentioned background technology.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a high-temperature heating plate mechanism, including a heating plate, a card slot is reserved on the lower surface of the heating plate, and the card slot is a vortex line structure, and also includes:

[0006] The heating tube is fixed inside the card slot and has a shape that matches the card slot.

[0007] Furthermore, the high temperature heating plate mechanism further includes:

[0008] The thermocouple, the detection end of which is located inside the heating plate, can detect the heating temperature of the heating plate.

[0009] Furthermore, the high temperature heating plate mechanism further includes:

[0010] The heat-insulating cover plate is installed at the lower part of the heating plate.

[0011] Furthermore, the heating plate is made of ceramic material.

[0012] Furthermore, a through hole 1 is provided through the middle of the heating plate, and a plurality of air holes 1 are provided on the upper surface of the heating plate, and a plurality of air holes 2 are provided on the lower surface and in the gaps of the card slots, and the air holes 1 are connected to the air holes 2.

[0013] Furthermore, a threaded hole is provided on the lower surface of the heating plate, and an external thread is reserved at the detection end of the thermocouple, so that the thermocouple can be installed in the threaded hole through the thread.

[0014] Furthermore, a through hole 2 is provided through the middle of the thermal insulation cover plate, and a through hole 3 is reserved on the side of the through hole 2, and the conductive connector of the heating tube is led out from the inside of the through hole 3.

[0015] Furthermore, a through hole four is also provided through the interior of the thermal insulation cover plate.

[0016] The utility model provides a high-temperature heating plate mechanism. Compared with the prior art, it has the following beneficial effects:

[0017] The high-temperature heating plate mechanism is achieved by embedding a small-diameter heating tube into an equidistant vortex line-shaped groove of a ceramic disc, and then sealing the lower layer with a heat-insulating circular plate. The heating tube is coiled around the heating plate in this way, so that the contact surface value between the heating plate and the heating tube is relatively large and uniform. Therefore, the heating plate of this structure is heated more evenly and has a higher heating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the disassembly of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the utility model after assembly from the first perspective;

[0020] Figure 3 It is a schematic diagram of the structure of the utility model after assembly from a second viewing angle;

[0021] Figure 4 It is a top view of the heating plate in the utility model;

[0022] Figure 5 It is a bottom view of the heating plate in the present invention.

[0023] In the figure: 1, heating plate; 11, slot; 12, through hole 1; 13, air hole 1; 14, air hole 2; 15, threaded hole; 2, heating tube; 3, thermocouple; 4, thermal insulation cover; 41, through hole 2; 42, through hole 3; 43, through hole 4. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-5 The utility model provides a technical solution: a high-temperature heating plate mechanism, which is composed of a heating plate 1 made of ceramic material, a heating tube 2, a thermocouple 3 and a heat-insulating cover plate 4. When the heating plate 1 is manufactured, a card slot 11 in the shape of a spiral line is integrally formed on its lower surface, and the distance between each turn of the spiral line is equal. The heating tube 2 of the same shape is installed in the card slot 11, so that the contact area between the heating plate 1 and the heating tube 2 can be relatively large and uniform. Therefore, the high-temperature heating plate mechanism of this embodiment, The heating is more uniform and the heating efficiency is higher; a threaded hole 15 is also reserved on the lower surface of the heating plate 1, and the thermocouple 3 selected in this embodiment is a threaded thermocouple. When installing the thermocouple 3, the thermocouple 3 can be directly screwed into the threaded hole 15 using a thread, so that the detection end of the thermocouple 3 will contact the heating plate 1 to detect the heating temperature of the heating plate 1. The heat-insulating cover plate 4 is installed on the lower part of the heating plate 1 by bolts, which can not only play a role in heat preservation, but also prevent excessive temperature from being transmitted to the following structure and causing damage.

[0026] In order to facilitate the installation of the mechanism into the device, a through hole 12 and a through hole 2 41 are respectively penetrated in the middle of the heating plate 1 and the insulation cover plate 4. In addition, in order to facilitate the power connection end of the heating tube 2 to be led out from the mechanism, a through hole 3 42 connected to the through hole 2 41 is reserved on the insulation cover plate 4. After the thermocouple 3 is installed, the tail end will protrude from the heating plate 1, so in order to make the insulation cover plate 4 adaptable, a through hole 4 43 is also reserved on the insulation cover plate 4.

[0027] Finally, six air holes 13 and six air holes 2 14 are respectively opened on the upper and lower surfaces of the heating plate 1. The air hole 13 is an oblong structure, and the air hole 2 14 is a circular structure, and the two are connected. The purpose of setting the air hole 13 and the air hole 2 14 is that the air holes with negative pressure can help the suction nozzle to discharge the material smoothly. After the heating is completed, the air holes are blown by the blowing device to make the product separate from the upper surface of the hole of the material plate, and the suction nozzle can quickly take away the heated product. This structure has air holes only at the material taking position, which not only ensures that the suction nozzle takes and discharges the material smoothly and efficiently, but also effectively reduces the influence of the negative pressure taking away the heat (arranging air holes is a well-known technology in the field and will not be described in detail here).

Claims

1. A high temperature heating plate mechanism, comprising a heating plate (1), characterized in that: The lower surface of the heating plate (1) is provided with a slot (11) reserved therefor, the slot (11) being a spiral line structure, and further comprising: A heating tube (2), wherein the heating tube (2) is fixed inside the slot (11) and has a shape that matches the slot (11).

2. A high temperature heating plate mechanism according to claim 1, characterized in that: Also includes: A thermocouple (3), wherein a detection end of the thermocouple (3) is located inside the heating plate (1) and is capable of detecting the heating temperature of the heating plate (1).

3. A high temperature heating plate mechanism according to claim 1, characterized in that: Also includes: A heat-insulating cover plate (4), wherein the heat-insulating cover plate (4) is installed at the bottom of the heating plate (1).

4. A high temperature heating plate mechanism according to claim 1, characterized in that: The heating plate (1) is made of ceramic material.

5. A high temperature heating plate mechanism according to claim 1, characterized in that: A through hole 1 (12) is provided in the middle of the heating plate (1), and a plurality of air holes 1 (13) are provided on the upper surface of the heating plate (1), and a plurality of air holes 2 (14) are provided on the lower surface and in the gaps of the slots (11), wherein the air holes 1 (13) are connected to the air holes 2 (14).

6. A high temperature heating plate mechanism according to claim 2, characterized in that: A threaded hole (15) is also provided on the lower surface of the heating plate (1), and an external thread is reserved at the detection end of the thermocouple (3), so that the thermocouple (3) can be installed in the threaded hole (15) through the thread.

7. A high temperature heating plate mechanism according to claim 3, characterized in that: A second through hole (41) is provided through the middle of the heat-insulating cover plate (4), and a third through hole (42) is reserved on the side of the second through hole (41), and the conductive connector of the heating tube (2) is led out from the inside of the third through hole (42).

8. A high temperature heating plate mechanism according to claim 7, characterized in that: A through hole four (43) is also provided through the interior of the heat-insulating cover plate (4).

Citation Information

Patent Citations

  • Ceramic disc heating device and method

    CN116456516A