An integrated semiconductor refrigeration electronic ice cap

Abstract

The utility model discloses an integrated semiconductor refrigeration electronic ice cap, which relates to the field of electronic ice caps, including an ice cap worn on the head, wherein the top of the ice cap is integrally formed with a fixing frame by injection molding, a heat dissipation mechanism is installed on the fixing frame, a square hole is provided at the center of the top of the ice cap, a refrigeration mechanism is installed on the inner wall of the square hole, an inner lining is formed on the inner wall of the ice cap, an interlayer is provided between the ice cap and the inner lining, a circulation pipe is fixedly installed on the inner wall of the interlayer, and the head and tail ends of the circulation pipe are connected by a micro pump; the refrigeration mechanism is used to transfer cold to the circulation pipe, and the heat dissipation mechanism is used to dissipate the heat of the refrigeration mechanism. The utility model can achieve a continuous cooling effect during wearing by arranging a semiconductor refrigeration mechanism, a heat dissipation mechanism and a circulation pipe, which is not affected by heat loss, and the wearing time is effectively extended.

Description

Technical Field

[0001] The utility model relates to the field of electronic ice caps, in particular to an integrated semiconductor refrigeration electronic ice cap. Background Art

[0002] The ice cap is a device that cools the patient's head and reduces blood circulation in the head, thereby reducing the problem of hair loss in patients during chemotherapy.

[0003] In the prior art, the ice cap is generally placed in a medical refrigerator for cooling, and then worn. During the use of this ice cap, due to its large area contact with the air, its temperature will rise relatively quickly, resulting in insufficient wearing time and no obvious cooling effect on the head. Utility Model Content

[0004] The purpose of the utility model is to provide an integrated semiconductor refrigeration electronic ice cap in order to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated semiconductor refrigeration electronic ice cap, comprising an ice cap worn on the head, the top of the ice cap is integrally formed with a fixing frame by injection molding, a heat dissipation mechanism is installed on the fixing frame, a square hole is opened at the center of the top of the ice cap, a refrigeration mechanism is installed on the inner wall of the square hole, an inner lining is formed on the inner wall of the ice cap, an interlayer is opened between the ice cap and the lining, a circulation pipe is fixedly installed on the inner wall of the interlayer, and the head and tail ends of the circulation pipe are connected by a micro pump;

[0006] The refrigeration mechanism is used to transfer cold energy to the circulation pipe, and the heat dissipation mechanism is used to dissipate heat from the refrigeration mechanism.

[0007] As a further solution of the utility model: the heat dissipation mechanism includes a plurality of heat dissipation holes opened on the outer wall of the fixed frame, and the interior of the fixed frame is a hollow structure, and the top of the fixed frame has an opening, and the top of the fixed frame is fixedly connected to a fan through a fixing frame.

[0008] As a further solution of the utility model: the refrigeration mechanism includes a semiconductor refrigeration plate fixedly installed inside the square hole, the top end of the semiconductor refrigeration plate is connected to a heat dissipation end plate, and the bottom end of the semiconductor refrigeration plate is connected to a cooling end plate.

[0009] As a further solution of the utility model: the bottom of the cooling end plate and the top of the outer wall of the circulation pipe are fitted together.

[0010] As a further solution of the utility model: an electric plug is installed on the top of the fixing frame located on one side of the fixing frame, and the current output port of the PCB board inside the electric plug is electrically connected to the semiconductor cooling plate and the micro pump respectively.

[0011] As a further solution of the utility model: the interior of the circulation pipe is filled with refrigerant.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. By setting up a semiconductor refrigeration mechanism, a heat dissipation mechanism and a circulation tube, a continuous cooling effect can be achieved during the wearing process, which is not affected by heat loss and the wearing time is effectively extended. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0016] Figure 3 It is a schematic diagram of the connection between the circulation pipe and the micro pump of the utility model.

[0017] In the figure: 1. ice cap; 2. fixing frame; 3. heat dissipation hole; 4. fixing frame; 5. fan; 6. electric plug; 7. lining; 8. interlayer; 9. semiconductor refrigeration plate; 10. heat dissipation end plate; 11. cooling end plate; 12. circulation pipe; 13. micro pump. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1 to Figure 3 In the embodiment of the utility model, an integrated semiconductor refrigeration electronic ice cap includes an ice cap 1 worn on the head, a fixing frame 2 is integrally formed on the top of the ice cap 1 by injection molding, a heat dissipation mechanism is installed on the fixing frame 2, a square hole is opened at the center of the top of the ice cap 1, a refrigeration mechanism is installed on the inner wall of the square hole, an inner lining 7 is formed on the inner wall of the ice cap 1, an interlayer 8 is opened between the ice cap 1 and the lining 7, a circulation pipe 12 is fixedly installed on the inner wall of the interlayer 8, and the head and tail ends of the circulation pipe 12 are connected by a micro pump 13;

[0020] The refrigeration mechanism is used to transfer cold energy to the circulation pipe 12, and the heat dissipation mechanism is used to dissipate heat from the refrigeration mechanism.

[0021] In this embodiment: when using the device, the ice cap 1 is worn on the patient's head, and then the device is connected to a power source, the energized heat dissipation mechanism, the refrigeration mechanism and the micro pump 13 are started, and heat and cold are generated at both ends of the refrigeration mechanism respectively, and the cold is transferred to the copper circulation tube 12, while the heat is blown away by the heat dissipation mechanism, thereby achieving the effect of transferring the cold to the patient's head.

[0022] Please refer to Figure 1 and Figure 2 The heat dissipation mechanism includes a plurality of heat dissipation holes 3 opened on the outer wall of the fixed frame 2, and the interior of the fixed frame 2 is a hollow structure, and the top of the fixed frame 2 has an opening, and the top of the fixed frame 2 is fixedly connected to a fan 5 through a fixing frame 4.

[0023] In this embodiment: when the fan 5 is started, the fan 5 blows the sucked air to the top of the refrigeration mechanism, and then the air overflows from the heat dissipation holes 3 with the heat, thereby achieving the purpose of real-time heat dissipation of the top of the refrigeration mechanism.

[0024] Please refer to Figure 2 The refrigeration mechanism includes a semiconductor refrigeration sheet 9 fixedly installed inside the square hole, the top end of the semiconductor refrigeration sheet 9 is connected to a heat dissipation end plate 10, and the bottom end of the semiconductor refrigeration sheet 9 is connected to a heat dissipation end plate 11.

[0025] In this embodiment: when current flows through a thermocouple pair formed by connecting a piece of N-type semiconductor material and a piece of P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form a hot and cold end. The above is the working principle of the semiconductor refrigeration plate 9. The heat is transferred to the top through the heat dissipation end plate 10, and the cold is transferred to the bottom through the cold dissipation end plate 11.

[0026] Please refer to Figure 2 and Figure 3 The bottom of the cooling end plate 11 is in contact with the top of the outer wall of the circulation pipe 12, and the interior of the circulation pipe 12 is filled with refrigerant.

[0027] In this embodiment: the temperature of the cooling end plate 11 is relatively low. During the operation of the micro pump 13, the refrigerant circulates in the circulation pipe 12, exchanges heat with the head, and the temperature of the refrigerant rises. Thereafter, the refrigerant exchanges heat with the cooling end plate 11 during the transmission process to cool the refrigerant.

[0028] Please refer to Figure 1 , Figure 2 and Figure 3An electric plug 6 is installed on one side of a fixing frame 4 at the top of the fixing frame 2, and the current output port of the PCB board inside the electric plug 6 is electrically connected to the semiconductor cooling sheet 9 and the micro pump 13 respectively.

[0029] In this embodiment: the connecting end of the wire is inserted into the plug interface of the electric plug 6, and the electric energy is transmitted to the semiconductor cooling plate 9, the micro pump 13 and the fan 5 through the terminal of the current output end, and then the three start to operate.

[0030] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An integrated semiconductor refrigeration electronic ice cap, comprising an ice cap (1) worn on the head, characterized in that: The top of the ice cap (1) is integrally formed with a fixing frame (2) by injection molding, a heat dissipation mechanism is installed on the fixing frame (2), a square hole is opened at the center of the top of the ice cap (1), a refrigeration mechanism is installed on the inner wall of the square hole, an inner lining (7) is formed on the inner wall of the ice cap (1), an interlayer (8) is opened between the ice cap (1) and the inner lining (7), a circulation pipe (12) is fixedly installed on the inner wall of the interlayer (8), and the head and tail ends of the circulation pipe (12) are connected via a micro pump (13); The refrigeration mechanism is used to transfer cold energy to the circulation pipe (12), and the heat dissipation mechanism is used to dissipate heat from the refrigeration mechanism.

2. The integrated semiconductor refrigeration electronic ice cap according to claim 1, characterized in that: The heat dissipation mechanism comprises a plurality of heat dissipation holes (3) formed on the outer wall of the fixed frame (2), the interior of the fixed frame (2) is a hollow structure, and the top of the fixed frame (2) has an opening. The top of the fixed frame (2) is fixedly connected to a fan (5) via a fixing frame (4).

3. The integrated semiconductor refrigeration electronic ice cap according to claim 2, characterized in that: The refrigeration mechanism comprises a semiconductor refrigeration sheet (9) fixedly mounted inside the square hole, the top end of the semiconductor refrigeration sheet (9) being connected to a heat dissipation end plate (10), and the bottom end of the semiconductor refrigeration sheet (9) being connected to a heat dissipation end plate (11).

4. The integrated semiconductor refrigeration electronic ice cap according to claim 3, characterized in that: The bottom of the cooling end plate (11) and the top of the outer wall of the circulation pipe (12) are in contact with each other.

5. The integrated semiconductor refrigeration electronic ice cap according to claim 4, characterized in that: An electric plug (6) is installed on the top of the fixing frame (2) and located on one side of the fixing frame (4), and a current output port of a PCB board inside the electric plug (6) is electrically connected to the semiconductor cooling sheet (9) and the micro pump (13) respectively.

6. The integrated semiconductor refrigeration electronic ice cap according to claim 5, characterized in that: The interior of the circulation pipe (12) is filled with refrigerant.

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