Small synchronous belt silicon wafer sending system

Abstract

The utility model discloses a small synchronous belt silicon wafer sending system which comprises a Z-axis lifting module, a silicon wafer basket, a silicon wafer correcting and guiding mechanism, a non-contact wafer sending machine structure and a basket conveyor, and a first driving motor, a conveying synchronous belt and a non-contact track jointly form the non-contact wafer sending machine structure. The second driving motor and the limiting roller form a silicon wafer correcting and guiding mechanism, the Z-axis lifting module is connected with a silicon wafer basket in a sliding mode in the X-axis direction, and the inner side face of the Z-axis lifting module is connected with a basket conveyor in a sliding mode. Only a single servo motor is needed for driving, no extra servo motor needs to be added, non-contact transmission is adopted, the silicon wafers cannot make contact with the conveying line body in the transmission process, and the machining effect of the silicon wafers in the follow-up process is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer launching, in particular to a small synchronous belt silicon wafer launching system. Background Art

[0002] Thin film preparation technology has a very wide range of applications in VLSI technology. According to its film forming method, it can be divided into two categories: physical vapor deposition (PVD) and chemical vapor deposition (CVD). Plasma enhanced chemical vapor deposition (PECVD) is a type of chemical vapor deposition, and its most prominent advantage is its low deposition temperature. The thin film deposited by PECVD has excellent electrical properties, good substrate adhesion and excellent step coverage. Because of these advantages, it has a wide range of applications in VLSI, optoelectronic devices, MEMS and other fields. Wafer transmission is an important equipment in the manufacturing process of solar panels, and is also an important technical link in the plasma enhanced chemical vapor deposition (PECVD) process. The current mainstream silicon wafer launching systems are roughly divided into two categories. One is a structure that directly contacts the silicon wafer through a linear module + synchronous belt. This type of linear module requires frequent reciprocating linear motion to launch the wafer. The disadvantage is that the service life of the module will be exhausted quickly, increasing the subsequent maintenance cost. The second type is to complete the launch through a telescopic belt and belt drive. The disadvantage of this type is that two motors are required to control the operation of a single wafer launcher, which increases the cost. Secondly, the transmission accuracy of the belt is far lower than that of the synchronous belt. At the same time, these two major types of wafer launching methods are that the belt or synchronous belt directly contacts the silicon wafer to launch the wafer, which will cause varying degrees of pollution to the silicon wafer, thereby greatly reducing the effect of the subsequent processing procedures of the silicon wafer.

[0003] The existing silicon wafer delivery system utilizes a motor and a synchronous belt for track transportation. During the process of track transportation of silicon wafers, it cannot be guaranteed that the silicon wafers in the basket loaded with silicon wafers are completely delivered, the delivery accuracy is not high, and the silicon wafers cannot be stably delivered without deviation during the delivery process, which will cause damage to the silicon wafers. For example, a semiconductor circular silicon wafer delivery mechanism disclosed in publication number CN210668287U has a screw rod and a screw rod bearing installed on a support. The design structure is simple and is applied to a large number of semiconductor side views and automated assembly lines. However, during use, it cannot be guaranteed that the silicon wafer delivery will not deviate, and it cannot be guaranteed that all the silicon wafers in the basket have been delivered, and the accuracy is not high.

[0004] Therefore, it is necessary to invent a small synchronous belt silicon wafer launching system to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a small synchronous belt silicon wafer launching system to solve the problem that in the process of silicon wafer launching, it is not possible to ensure that the silicon wafer is not damaged completely accurately and that the silicon wafer is not damaged during the launching process.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a small synchronous belt silicon wafer launching system, including a Z-axis lifting module, a silicon wafer basket, a silicon wafer correction guide mechanism, a contactless wafer launching machine structure and a basket conveyor. The No. 1 drive motor, the conveying synchronous belt and the contactless track together constitute the contactless wafer launching machine structure, the No. 2 drive motor and the limiting roller constitute the silicon wafer correction guide mechanism, the X-axis direction of the Z-axis lifting module is slidably connected to the silicon wafer basket, and the inner side of the Z-axis lifting module is slidably connected to the basket conveyor.

[0007] Preferably, the No. 1 driving motor is connected to a plurality of sets of conveying synchronous belts, the number of the conveying synchronous belts is the same as the contactless track, and the height difference between the contactless track and the No. 1 driving motor is the length of the conveying synchronous belts.

[0008] Preferably, the bottom of the limiting roller is flush with the height of the non-contact track, and the limiting rollers are respectively arranged on the same side of the non-contact track.

[0009] Preferably, the Z-axis lifting module is a metal steel plate, and rectangular through holes of the same size are opened on the Z-axis lifting module, and the distances between the multiple through holes are the same, and the X-axis module is fixedly connected to the Z-axis lifting module.

[0010] Preferably, a plurality of racks are arranged between the silicon wafer basket and the basket conveyor, the racks are meshed with gears, and the gears are mounted on a transmission sprocket in the basket conveyor.

[0011] Preferably, the moving direction of the flower basket conveyor is up and down along the direction of the Z-axis lifting module.

[0012] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0013] 1. The utility model adopts a smaller size, and the synchronous belt drive can be directly inserted into the bottom space of the flower basket. It only needs a single servo motor to drive it, and no additional servo motor is required. It adopts contactless transmission, and the silicon wafer will not come into contact with the conveyor line during the transmission process, which greatly improves the processing effect of the silicon wafer in the subsequent process;

[0014] 2. The utility model adopts contactless transmission, so the silicon wafer will not come into contact with the conveyor line during transmission, and the fragmentation rate of the silicon wafer during operation is greatly reduced, thereby greatly improving the wafer sending efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2This is a partial structural diagram of the Z-axis lifting module of the utility model;

[0017] Figure 3 It is a three-dimensional structural schematic diagram of the limiting roller of the utility model;

[0018] Figure 4 It is a three-dimensional structural schematic diagram of the conveying synchronous belt of the utility model.

[0019] Description of reference numerals:

[0020] 1. No. 1 driving motor; 2. Conveying synchronous belt; 3. Non-contact track; 4. No. 2 driving motor; 5. Limiting roller; 6. Z-axis lifting module; 7. Silicon wafer flower basket; 10. Flower basket conveyor. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] The utility model provides Figure 1-3 A small synchronous belt silicon wafer launching system shown in the figure includes a Z-axis lifting module 6, a silicon wafer basket 7, a silicon wafer correction guide mechanism, a contactless wafer launching machine structure and a basket conveyor 10. The No. 1 driving motor 1, the conveying synchronous belt 2 and the contactless track 3 together constitute the contactless wafer launching machine structure, the No. 2 driving motor 4 and the limiting roller 5 constitute the silicon wafer correction guide mechanism, the Z-axis lifting module 6 is slidably connected to the silicon wafer basket 7 in the X-axis direction, and the inner side of the Z-axis lifting module 6 is slidably connected to the basket conveyor 10.

[0023] Due to the restrictions of the non-contact wafer launching mechanism and the silicon wafer correction guide mechanism, the entire wafer launching process does not contact the silicon wafer. At the same time, the entire wafer launching system is small in size, the transportation is more flexible, and the wafer launching accuracy is improved.

[0024] A plurality of conveying synchronous belts 2 are connected to the No. 1 driving motor 1 . The number of the conveying synchronous belts 2 is the same as the number of the non-contact track 3 . The height difference between the non-contact track 3 and the No. 1 driving motor 1 is the length of the conveying synchronous belts 2 .

[0025] The contactless wafer delivery mechanism can deliver the flower basket without contacting the silicon wafer. After the flower basket is delivered, the friction with the silicon wafer is reduced during the whole process, thereby reducing damage to the silicon wafer.

[0026] The bottom of the limiting roller 5 is flush with the height of the non-contact track 3 , and the limiting rollers 5 are respectively arranged on the same side of the non-contact track 3 .

[0027] The function of the limiting roller 5 is to limit the silicon wafer conveying process from deviation, so as to ensure that the silicon wafers in the silicon wafer basket 7 are conveyed completely.

[0028] The Z-axis lifting module 6 is a metal steel plate, and rectangular through holes of the same size are opened on the Z-axis lifting module 6. The distances between the multiple through holes are the same. The X-axis module is fixedly connected to the Z-axis lifting module 6. Multiple sets of racks are arranged between the silicon wafer basket 7 and the basket conveyor 10. The racks are meshed with gears, and the gears are installed on the transmission sprocket in the basket conveyor 10. The moving direction of the basket conveyor 10 is up and down along the direction of the Z-axis lifting module 6.

[0029] The silicon wafers are transported up and down along the direction of the Z-axis lifting module 6 until the silicon wafers in the silicon wafer basket 7 are completely transported, and the damage to the silicon wafers during the transportation process is reduced to a minimum.

[0030] Working principle of this utility model:

[0031] Refer to the instruction manual Figure 1-3 When using the utility model, firstly, Figure 1 As shown, the basket full of silicon wafers is transported to the basket conveyor 10 through the front silicon wafer basket 7. After the basket is in place, the servo motor of the Z-axis lifting module 6 drives the basket conveyor 10 and the silicon wafer basket 7 to move downward by the distance of one silicon wafer position.

[0032] Refer to the instruction manual Figure 3-4 When the utility model is used, the silicon wafer falls on the contactless track 3 of the contactless wafer releasing mechanism, and the servo motor of the contactless wafer releasing mechanism drives the conveying synchronous belt 2 to rotate. The small boss on the conveying synchronous belt 2 hooks the side of the silicon wafer to take the silicon wafer out of the silicon wafer basket 7 and convey it to the rear end. Repeat the above contactless wafer releasing steps until all the silicon wafers in the fully loaded silicon wafer basket 7 are released.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A small synchronous belt silicon wafer launching system, comprising a Z-axis lifting module (6), a silicon wafer basket (7), a silicon wafer correction guide mechanism, a non-contact wafer launching machine structure and a basket conveyor (10), characterized in that: The invention comprises a first drive motor (1), a conveying synchronous belt (2) and a contactless track (3) which together form a contactless wafer launching machine structure, and a second drive motor (4) and a limit roller (5) which form a silicon wafer correction guide mechanism. The Z-axis lifting module (6) is slidably connected to a silicon wafer basket (7) in the X-axis direction, and the inner side surface of the Z-axis lifting module (6) is slidably connected to a basket conveyor (10).

2. A small synchronous belt silicon wafer launching system according to claim 1, characterized in that: The first drive motor (1) is connected to a plurality of sets of conveying synchronous belts (2), the number of the conveying synchronous belts (2) being the same as the number of the contactless track (3), and the height difference between the contactless track (3) and the first drive motor (1) being the length of the conveying synchronous belts (2).

3. A small synchronous belt silicon wafer launching system according to claim 2, characterized in that: The bottom of the limiting roller (5) is flush with the height of the non-contact track (3), and the limiting rollers (5) are respectively arranged on the same side of the non-contact track (3).

4. The small synchronous belt silicon wafer launching system according to claim 1, characterized in that: The Z-axis lifting module (6) is a metal steel plate, and rectangular through holes of the same size are provided on the Z-axis lifting module (6), and the distances between the multiple through holes are the same. The X-axis module is fixedly connected to the Z-axis lifting module (6).

5. The small synchronous belt silicon wafer launching system according to claim 1, characterized in that: A plurality of racks are arranged between the silicon wafer basket (7) and the basket conveyor (10), the racks being meshed with gears which are mounted on a transmission sprocket in the basket conveyor (10).

6. A small synchronous belt silicon wafer launching system according to claim 5, characterized in that: The flower basket conveyor (10) moves in a direction up and down along the direction of the Z-axis lifting module (6).

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