Small synchronous belt silicon wafer sending system
By designing a small synchronous belt silicon wafer transmission system, using a contactless chip generator and contactless chip rail, the problems of short module life, low transmission accuracy and pollution in the existing system are solved, and more efficient and stable silicon wafer transmission and subsequent processing effects are achieved.
Patent Information
- Application Number
- CN202420854352.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-04-24
AI Technical Summary
The existing silicon wafer chip launch system has problems such as short module service life, high maintenance cost, low belt transmission accuracy, and silicon wafer contact pollution.
A small synchronous belt silicon wafer radiator system is designed, using a contactless chip generator and a contactless chip rail. The silicon wafer is blown through a jet device, and contactless transmission is achieved using a special boss synchronous belt and pulley transmission device.
It improves the effect of the subsequent processing process of silicon wafers, reduces the fragmentation rate, reduces the collision risk when the flower basket enters and exits the starting machine, and avoids silicon wafer pollution.
Smart Images
Figure CN222714600U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a small synchronous belt silicon wafer sending system. Background Art
[0002] Thin film preparation technology has a very wide range of applications in VLSI technology. According to its film forming method, it can be divided into two categories: physical vapor deposition (PVD) and chemical vapor deposition (CVD). Plasma enhanced chemical vapor deposition (PECVD) is a type of chemical vapor deposition, and its most prominent advantage is its low deposition temperature. The thin film deposited by PECVD has excellent electrical properties, good substrate adhesion and excellent step coverage. Because of these advantages, it has a wide range of applications in VLSI, optoelectronic devices, MEMS and other fields. Silicon wafer transmission is an important equipment in the manufacturing process of solar panels, and it is also an important technical link in the process of plasma enhanced chemical vapor deposition (PECVD).
[0003] The current mainstream silicon wafer launching systems are roughly divided into two categories. One is a structure that directly contacts the silicon wafer through a linear module + synchronous belt. This type of linear module requires frequent reciprocating linear motion to launch the wafer. The disadvantage is that the service life of the module will be exhausted quickly, increasing the subsequent maintenance cost. The second type is to complete the wafer launching through a telescopic belt + belt drive. The disadvantage of this type is that two motors are required to control the operation of a single wafer launching machine, which increases the cost. Secondly, the transmission accuracy of the belt is much lower than that of the synchronous belt. At the same time, these two types of wafer launching methods are that the belt or synchronous belt directly contacts the silicon wafer to launch the wafer, which will cause varying degrees of pollution to the silicon wafer, thereby greatly reducing the effect of the subsequent processing steps of the silicon wafer. Utility Model Content
[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: the utility model provides a small synchronous belt silicon wafer launching system, including a contactless wafer launching machine, a silicon wafer storage basket and a contactless wafer launching track, the contactless wafer launching machine includes a body and a servo motor, the servo motor is located on one side of the body, and the servo motor is fixedly connected to the body, the contactless wafer launching track is located on the top of the body, the silicon wafer storage basket is located on one side of the contactless wafer launching track, and the silicon wafer storage basket is fixedly connected to the body, the contactless wafer launching track includes a bracket and two jet devices, the bracket is fixedly connected to the body, and the jet devices are installed on both sides of the bracket, an air inlet is provided on the outside of the jet device, and a ceramic gasket is provided on the top of the two jet devices, the ceramic gasket is fixedly connected to the jet device, and a plurality of jet ports are provided on the ceramic gasket.
[0005] Preferably, the contactless hair-spinning track includes four pulleys A, four transmission rollers and two special boss synchronous belts, wherein the four transmission rollers are respectively installed at the four corners of the bracket, and each transmission roller is installed with a pulley A, and the two special boss synchronous belts are respectively installed on the inner sides of the two jet devices.
[0006] Preferably, the inner ring and the outer ring of the two special boss synchronous belts are both provided with teeth and a plurality of blocks, and the distance between each block is equal.
[0007] Preferably, the contactless wafer launching machine further comprises two sets of silicon wafer guide wheels and a transmission device, wherein the two sets of silicon wafer guide wheels are respectively installed on both sides of the contactless wafer launching track, the silicon wafer guide wheels are fixedly connected to the machine body, and the bottom surface of the silicon wafer guide wheels is flush with the top surface of the bracket.
[0008] Preferably, the transmission device includes two pulleys B and a transmission shaft, the two pulleys B are fixedly connected to the transmission shaft, and the two pulleys A and the two pulleys B near one end of the servo motor are respectively connected by two belts, and one end of the transmission shaft is fixedly connected to the servo motor.
[0009] Preferably, a support seat for the transmission shaft is provided at the upper bottom end of the machine body, the support seat is fixedly connected to the machine body, and the support seat is connected to the transmission shaft via a bearing.
[0010] The beneficial effects of the utility model are as follows: 1. The utility model uses an air jet device to blow air into the silicon wafer, adopts contactless transmission, and the silicon wafer will not come into contact with the conveyor line during transmission, which greatly improves the processing effect of the silicon wafer in subsequent processes.
[0011] 2. The non-contact tracks on both sides are designed on the outside of the conveyor synchronous belt. The silicon wafer runs more smoothly on the non-contact track, which greatly reduces the fragmentation rate of the silicon wafer during operation.
[0012] 3. The wafer conveying part is designed to be thinner, which greatly reduces the risk of collision when the flower basket enters and exits the wafer ejector. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solution of the embodiment of the utility model, the following is a brief introduction to the drawings required for use in the embodiment of the utility model. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0014] Figure 1 It is the overall structure diagram of the utility model.
[0015] Figure 2 It is a side view of the utility model.
[0016] Figure 3 for Figure 1 A partial enlarged view of AA.
[0017] Figure 4 For contactless transmission track.
[0018] Explanation of the reference numerals: 1-contactless wafer launching machine, 1a-machine body, 1b-servo motor, 1c-silicon wafer guide wheel, 2-silicon wafer storage basket, 3-contactless wafer launching track, 3a-bracket, 3b-injection device, 3c-air inlet, 3d-ceramic gasket, 3e-injection port, 3f-pulley A, 3g-transmission roller, 3h-special boss synchronous belt, 3i-block, 4-transmission device, 4a-pulley B, 4b-belt, 4c-transmission shaft, 5-support seat. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] like Figure 1 and Figure 2 As shown, a small synchronous belt silicon wafer launching system includes a contactless wafer launching machine 1, a silicon wafer storage basket 2 and a contactless wafer launching track 3. The contactless wafer launching machine 1 includes a body 1a and a servo motor 1b. The servo motor 1b is located on one side of the body 1a, and the servo motor 1b is fixedly connected to the body 1a. The contactless wafer launching track 3 is located on the top of the body 1a. The silicon wafer storage basket 2 is located on one side of the contactless wafer launching track 3, so that the silicon wafers are stored in the silicon wafer storage basket 2 during transportation, and the silicon wafer storage basket 2 is fixedly connected to the body 1a. The contactless wafer launching track 3 is located on the top of the body 1a. The track 3 includes a bracket 3a and two jet devices 3b, wherein the bracket 3a is fixedly connected to the body 1a, and the jet devices 3b are installed on both sides of the bracket 3a, and an air inlet 3c is provided on the outer side of the jet device 3b. A ceramic gasket 3d is provided on the top of the two jet devices 3b, and the ceramic gasket 3d is fixedly connected to the jet device 3b, and a plurality of jet ports 3e are provided on the ceramic gasket 3d, so that the silicon wafer will not come into contact with the conveyor line body during the transmission process, thereby avoiding the belt 4b or the synchronous belt directly contacting the silicon wafer and causing different degrees of pollution to the silicon wafer.
[0021] like Figure 3As shown, the contactless wafer track 3 includes four pulleys A3f, four transmission rollers 3g and two special boss synchronous belts 3h, wherein the four transmission rollers 3g are respectively installed at the four corners of the bracket 3a, and each transmission roller 3g is installed with a pulley A3f, and the two special boss synchronous belts 3h are respectively installed on the inner sides of the two jet devices 3b, and the inner ring and outer ring of the two special boss synchronous belts 3h are provided with meshing teeth and a plurality of blocks 3i, and the blocks 3i enable the silicon wafer floating in the air to move, and the distance between each block 3i is equal, so that the special boss synchronous belt 3h can always push the silicon wafer to move when rotating.
[0022] like Figure 1 and Figure 2 As shown, the contactless wafer launching machine 1 also includes two sets of silicon wafer guide wheels 1c and a transmission device 4, wherein the two sets of silicon wafer guide wheels 1c are respectively installed on both sides of the contactless wafer launching track 3, the silicon wafer guide wheels 1c are fixedly connected to the machine body 1a, and the bottom surface of the silicon wafer guide wheels 1c is flush with the top surface of the bracket 3a, so as to prevent the silicon wafer from shifting during movement.
[0023] like Figure 4 As shown, the transmission device 4 includes two pulleys B4a and a transmission shaft 4c. The two pulleys B4a are fixedly connected to the transmission shaft 4c, and the two pulleys A3f close to one end of the servo motor 1b are connected to the two pulleys B4a through two belts 4b respectively. One end of the transmission shaft 4c is fixedly connected to the servo motor 1b, so that the servo motor 1b drives the two special boss synchronous belts 3h to rotate.
[0024] A support base 5 of the transmission shaft 4c is provided at the upper bottom end of the machine body 1a, and the support base 5 is fixedly connected to the machine body 1a, and the support base 5 is connected to the transmission shaft 4c through a bearing, thereby reducing the unstable operation of the transmission shaft 4c.
[0025] How it works;
[0026] When a large number of silicon wafers need to be placed in the silicon wafer storage basket 2, the jet device 3b and the servo motor 1b are turned on, so that the silicon wafers can directly enter the silicon wafer storage basket 2 through the wafer release track without contact, thereby avoiding the silicon wafers from contacting the belt 4b and causing different degrees of contamination to the silicon wafers. At the same time, multiple contactless wafer release tracks 3 can be installed on the machine body 1a, thereby improving work efficiency.
[0027] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.
Claims
1. A small synchronous belt silicon wafer launching system, characterized in that: The invention comprises a contactless wafer launching machine (1), a silicon wafer storage basket (2) and a contactless wafer launching track (3), wherein the contactless wafer launching machine (1) comprises a machine body (1a) and a servo motor (1b), wherein the servo motor (1b) is located on one side of the machine body (1a), and the servo motor (1b) is fixedly connected to the machine body (1a), wherein the contactless wafer launching track (3) is located on the top of the machine body (1a), and the silicon wafer storage basket (2) is located on one side of the contactless wafer launching track (3), and the silicon wafer storage basket (2) is fixedly connected to the machine body (1a). The contactless hairpin track (3) comprises a bracket (3a) and two jet devices (3b), wherein the bracket (3a) is fixedly connected to the machine body (1a), and the jet devices (3b) are installed on both sides of the bracket (3a), and air inlets (3c) are arranged on the outer sides of the jet devices (3b), and ceramic gaskets (3d) are arranged on the tops of the two jet devices (3b), wherein the ceramic gaskets (3d) are fixedly connected to the jet devices (3b), and a plurality of jet ports (3e) are arranged on the ceramic gaskets (3d).
2. A small synchronous belt silicon wafer launching system as claimed in claim 1, characterized in that: The contactless hair-spinning track (3) comprises four pulleys A (3f), four transmission rollers (3g) and two special boss synchronous belts (3h), wherein the four transmission rollers (3g) are respectively installed at the four corners of the bracket (3a), and each transmission roller (3g) is installed with a pulley A (3f), and the two special boss synchronous belts (3h) are respectively installed on the inner sides of two jet devices (3b).
3. A small synchronous belt silicon wafer launching system as claimed in claim 2, characterized in that: The inner ring and the outer ring of the two special boss synchronous belts (3h) are both provided with meshing teeth and a plurality of stoppers (3i), and the spacing between each stopper (3i) is equal.
4. A small synchronous belt silicon wafer launching system as claimed in claim 1, characterized in that: The contactless wafer launching machine (1) further comprises two sets of silicon wafer guide wheels (1c) and a transmission device (4), wherein the two sets of silicon wafer guide wheels (1c) are respectively installed on both sides of the contactless wafer launching track (3), the silicon wafer guide wheels (1c) are fixedly connected to the machine body (1a), and the bottom surface of the silicon wafer guide wheels (1c) is flush with the top surface of the bracket (3a).
5. A small synchronous belt silicon wafer launching system as claimed in claim 4, characterized in that: The transmission device (4) comprises two pulleys B (4a) and a transmission shaft (4c), the two pulleys B (4a) are fixedly connected to the transmission shaft (4c), and the two pulleys A (3f) and the two pulleys B (4a) at one end close to the servo motor (1b) are respectively connected via two belts (4b), and one end of the transmission shaft (4c) is fixedly connected to the servo motor (1b).
6. A small synchronous belt silicon wafer launching system as claimed in claim 5, characterized in that: A support seat (5) for a transmission shaft (4c) is provided at the upper bottom end of the machine body (1a); the support seat (5) is fixedly connected to the machine body (1a), and the support seat (5) is connected to the transmission shaft (4c) via a bearing.