Capacitor heat dissipation structure and capacitor

Abstract

The utility model discloses a capacitor and a capacitor heat dissipation structure, wherein the capacitor heat dissipation structure includes a heat dissipation element: the heat dissipation element is attached to the busbar by a fastening assembly; the fastening assembly includes a fastener and an insulating fitting, the fastener passes through a fastening hole corresponding to the heat dissipation element, and cooperates with the insulating fitting to fix the heat dissipation element to the busbar. For capacitors with solder joints in the heat dissipation area of ​​the heat dissipation element, the utility model can still use the entire surface of the heat dissipation element and achieve good thermal contact between the heat dissipation element and the busbar; at the same time, the fastening assembly applies a force, so that the thermal contact effect is similar to the hot pressing process, but does not require a high temperature and complex hot pressing process, and the design has higher compatibility.

Description

Technical Field

[0001] The utility model relates to the field of capacitors, in particular to a capacitor heat dissipation structure and a capacitor. Background Art

[0002] Metallized film capacitors have been widely used in new energy vehicle controllers. As the power density requirements of controllers become higher and higher, the thermal resistance requirements of capacitors are getting higher and higher. Film capacitors for new energy vehicle controllers are composed of capacitor cores (including plates, dielectrics, and metal layers sprayed on both end faces), lead electrodes (usually leads, solder tabs or busbars), packaging shells, and filling resins (such as epoxy resins).

[0003] In order to reduce the thermal resistance of capacitors, there are two commonly used structural solutions: 1. Replace the heat dissipation surface of the shell with a metal heat sink bonded with a hot pressing film to export the heat on the capacitor to the controller housing or water cooling plate. However, the bonding process of the hot pressing metal plate requires a high temperature of up to 140°C, so the hot pressing process cannot be performed after the capacitor is welded; and for capacitors with solder points in the heat dissipation area of ​​the metal plate, the entire metal heat sink cannot be hot pressed, otherwise the metal heat sink will block the solder points of the busbar. 2. Simply place the metal heat sink on the surface of the busbar. This design will greatly reduce the heat dissipation effect due to the air gap between the busbar and the metal heat sink. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems in the above-mentioned technology to a certain extent. To this end, one purpose of the utility model is to provide a heat dissipation structure of a capacitor, which can effectively fit the heat dissipation plate and the busbar without using welding process, thereby improving the heat conduction and heat dissipation effect.

[0005] Another object of the present invention is to provide a capacitor.

[0006] To achieve the above object, an embodiment of the utility model provides a capacitor heat dissipation structure, including:

[0007] Heat dissipation element: the heat dissipation element is attached to the busbar by a fastening assembly;

[0008] Fastening assembly: includes a fastener and an insulating fitting, wherein the fastener passes through a fastening hole correspondingly formed on the heat dissipation element and cooperates with the insulating fitting to fix the heat dissipation element to the busbar.

[0009] According to the heat dissipation structure of the capacitor in the embodiment of the utility model, the heat dissipation element is exerted with force by the fastening assembly so that it is closely attached to the busbar, thus having at least the following beneficial effects:

[0010] 1. For capacitors with solder joints in the heat dissipation area of ​​the heat dissipation element, the entire heat dissipation element can still be used, and good thermal contact between the heat dissipation element and the busbar can be achieved;

[0011] 2. The fastening components apply force, making the thermal contact effect similar to the hot pressing process, but without the need for high-temperature and complex hot pressing processes, and the design has higher compatibility.

[0012] In addition, the capacitor heat dissipation structure proposed in the above embodiment of the utility model may also have the following additional technical features:

[0013] Optionally, there are several groups of fastening components, which are arranged at different positions of the heat dissipation element.

[0014] Optionally, the fastening hole is a tapered hole, and the fastener is a countersunk screw.

[0015] Optionally, the insulating fitting comprises a base and a boss formed on the top surface of the base, a threaded hole is formed in the base and the boss; a thread is provided on the surface of the corresponding fastener to enable it to threadably cooperate with the insulating fitting.

[0016] To achieve the above object, another embodiment of the utility model provides a capacitor, comprising:

[0017] A shell, a core, a busbar, a heat dissipation element arranged on the busbar, and a fastening assembly for attaching the busbar and the heat dissipation element together; wherein the fastening assembly includes a fastener and an insulating fitting, the fastener passes through a fastening hole corresponding to the heat dissipation element and then cooperates with the insulating fitting to fix the heat dissipation element to the busbar, the insulating fitting includes a base and a boss formed on the top surface of the base, a threaded hole is formed in the base and the boss; a thread is provided on the surface of the fastener so that it can be threadedly matched with the insulating fitting; the fastening hole is a tapered hole, and the fastener is a countersunk screw.

[0018] In addition, a capacitor according to the above embodiment of the utility model may also have the following additional technical features:

[0019] Optionally, the fastening components include several groups, which are arranged at different positions of the heat dissipation element.

[0020] According to the embodiment of the utility model, the capacitor heat dissipation element is exerted with force by the fastening assembly so that it is closely fitted on the busbar, so that the heat dissipation effect of the busbar is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is an exploded view of a capacitor structure according to an embodiment of the utility model;

[0022] Figure 2 It is a three-dimensional diagram of an insulating matching piece according to an embodiment of the utility model;

[0023] Figure 3 A three-dimensional diagram of a heat dissipation element according to an embodiment of the utility model;

[0024] Figure 4 FIG. 4 is an exploded view of a capacitor structure according to another embodiment of the present invention.

[0025] Description of labels:

[0026] Heat dissipation element 1 Fastening hole 11

[0027] Fastener 21 Insulation fitting 22

[0028] Capacitor 100 core 200 busbar 300. DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0030] In the utility model, since the heat dissipation element is applied with force by the fastening assembly so that it is tightly attached to the busbar, for capacitors with solder joints in the heat dissipation area of ​​the heat dissipation element, the entire surface of the heat dissipation element can still be used, and good thermal contact between the heat dissipation element and the busbar can be achieved; and the fastening assembly applies force so that the thermal contact effect is similar to the hot pressing process, but does not require high-temperature and complex hot pressing processes, and the design has higher compatibility.

[0031] In order to better understand the above technical solution, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0032] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0033] Figures 1 to 3 A heat dissipation structure of a capacitor 100 according to an embodiment of the utility model includes:

[0034] Heat dissipation element 1: The heat dissipation element is attached to the busbar 300 by a fastening assembly; the heat dissipation element 1 can be made of metal material, or other materials with thermal conductivity that meets the requirements, and can also achieve the same effect;

[0035] Fastening assembly: including fasteners 21 and insulating fittings 22. After the fasteners 21 pass through the fastening holes 11 correspondingly formed on the heat dissipation element 1, they cooperate with the insulating fittings 22 to fix the heat dissipation element 1 to the busbar 300. After being fixed, the insulating fittings 22 wrap the fasteners 21 so that the fasteners 21 are close to the internal structures of the capacitor 100 such as the core 200, and the insulation performance will not be reduced due to the reduction in the spacing. Specifically, fasteners 21-busbar 300-heat dissipation element 1-fasteners 21 are arranged in sequence. After the fasteners 21 pass through the through holes set on the busbar 300 and the heat dissipation element 1, they are assembled with the insulating fittings 22, and the busbar 300 and the heat dissipation element 1 are pressed together by the mechanical force after the two are assembled.

[0036] Preferably, there are several groups of fastening components, which are arranged at different positions of the heat dissipation element 1. This solution can achieve uniform fixation of the heat dissipation element 1 and the busbar 300. By applying force at multiple points, the heat dissipation element 1 can be fixed flatly to the busbar 300, thereby achieving the effect of increasing the fitting area. At the same time, it can also avoid structures such as the bending of the core 200 or the busbar 300 in the capacitor 100.

[0037] Preferably, the fastening hole 11 is a tapered hole and the fastener 21 is a countersunk screw. With this solution, the fastener 21 can be in the same plane as the surface of the heat dissipation element 1 after being fixed, and there will be no protrusions that affect the flatness of the heat dissipation element 1. The heat dissipation element 1 can be further fitted with an external system such as a water cooling system, and the flat surface contributes to the heat dissipation effect of this type of solution.

[0038] Preferably, the insulating fitting 22 includes a base and a boss formed on the top surface of the base, and a threaded hole is formed in the base and the boss; a thread is provided on the surface of the corresponding fastener 21 to make it threadedly matched with the insulating fitting 22. In this technical solution, the purpose of the boss is to provide the fastener 21 with a longer fixing hole to improve the fixing force, while the base is to expand the contact area with the busbar 300 and reduce the deformation of the busbar 300. The fixing hole can be a blind hole or a through hole; the outer dimensions of the boss can be smaller than the base, so that the part extending into the interior of the capacitor 100 reduces the occupation of the internal space of the capacitor 100, and reduces the influence of the insulating fitting 22 on the structural layout of the core 200 and the busbar 300.

[0039] Figure 4A capacitor 100 according to another embodiment of the utility model comprises: a housing, a core 200, a busbar 300, a heat dissipation element 1 arranged on the busbar 300, and a fastening assembly for bonding the busbar 300 and the heat dissipation element 1 together; wherein the fastening assembly comprises a fastener 21 and an insulating fitting 22, and the specific structures and design schemes of the two have been described in detail above and will not be repeated here.

[0040] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0043] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A capacitor heat dissipation structure, characterized in that: include Heat dissipation element: the heat dissipation element is attached to the busbar by a fastening assembly; Fastening assembly: includes a fastener and an insulating fitting, wherein the fastener passes through a fastening hole correspondingly formed on the heat dissipation element and cooperates with the insulating fitting to fix the heat dissipation element to the busbar.

2. A capacitor heat dissipation structure as claimed in claim 1, characterized in that: The fastening components include several groups, which are arranged at different positions of the heat dissipation element.

3. A capacitor heat dissipation structure as claimed in claim 1, characterized in that: The fastening hole is a tapered hole, and the fastener is a countersunk screw.

4. A capacitor heat dissipation structure as claimed in claim 1, characterized in that: The insulating matching piece includes a base and a convex column formed on the top surface of the base, a threaded hole is formed in the base and the convex column; a thread is provided on the surface of the corresponding fastener to make it threadedly matched with the insulating matching piece.

5. A capacitor, characterized in that: It includes a shell, a core, a busbar, a heat dissipation element arranged on the busbar, and a fastening assembly that fits the busbar and the heat dissipation element together; wherein the fastening assembly includes a fastener and an insulating fitting, and after the fastener passes through the fastening hole corresponding to the heat dissipation element, it cooperates with the insulating fitting to fix the heat dissipation element to the busbar, and the insulating fitting includes a base and a boss formed on the top surface of the base, and a threaded hole is formed in the base and the boss; a thread is provided on the surface of the fastener so that it can be threadedly matched with the insulating fitting; the fastening hole is a tapered hole, and the fastener is a countersunk screw.

6. A capacitor according to claim 5, characterized in that: The fastening components include several groups, which are arranged at different positions of the heat dissipation element.

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