Power supply components and electronic equipment

Abstract

The present application discloses a power supply assembly and an electronic device, belonging to the technical field of electronic devices. The power supply assembly includes a fixed structure, an insulating structure, a conductive structure, an electrical bonding reduction structure and a battery; the insulating structure is connected to the fixed structure, the conductive structure is connected to the insulating structure, and the insulating structure insulates and separates the fixed structure from the conductive structure; the battery is connected to the side of the conductive structure away from the insulating structure through the electrical bonding reduction structure, and the electrical bonding reduction structure is configured to reduce the bonding performance after the electrical bonding reduction structure and the conductive structure are energized. After the power supply assembly is energized, it is easy to separate the battery from the fixed structure, which causes little damage to the battery, and the battery can be reused, which is convenient for disassembly of the battery.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a power supply component and electronic equipment. Background Art

[0002] Electronic devices are usually powered by batteries. In current electronic devices (such as mobile phones and tablet computers), the batteries are usually glued and fixed to the casing. This requires that the batteries need to be removed from the casing during the repair or replacement of the batteries of the electronic devices. The battery packaging film is easily damaged during the removal process, making the battery unusable.

[0003] In summary, the batteries in electronic devices are difficult to remove. Utility Model Content

[0004] The present application provides a power supply component and an electronic device. The power supply component can be energized to reduce the viscosity of the electrical debonding structure, thereby facilitating the separation of the electrical debonding structure from the conductive structure, and further separating the battery from the fixed structure, thereby facilitating the removal of the battery.

[0005] The technical solution is as follows:

[0006] In a first aspect, the present application provides a power supply component, comprising: a fixed structure, an insulating structure, a conductive structure, an electrical bonding reduction structure and a battery; the insulating structure is connected to the fixed structure, the conductive structure is connected to the insulating structure, and the insulating structure insulates and separates the fixed structure from the conductive structure; the battery is connected to a side of the conductive structure away from the insulating structure through the electrical bonding reduction structure, and the electrical bonding reduction structure is configured so that the bonding performance is reduced after the electrical bonding reduction structure and the conductive structure are energized.

[0007] The technical solution disclosed in this application includes at least the following beneficial effects:

[0008] During use of the power supply assembly, the battery is fixed to the conductive structure through the electrical bonding structure, the conductive structure is fixed to the fixed structure through the insulating structure, and the fixed structure and the insulating structure are insulated and isolated by the insulating structure. When the battery needs to be disassembled, the conductive structure and the electrical bonding structure are energized. Since an insulating structure is provided between the conductive structure and the fixed structure, the current does not flow to the fixed structure. After the electrical bonding structure is energized, the bonding performance decreases, so that the electrical bonding structure can be more easily separated from the conductive structure or the battery, so that the battery can be separated from the electrical bonding structure, or the battery and the electrical bonding structure can be separated from the conductive structure together, that is, the battery can be separated from the fixed structure without damaging the battery, so as to complete the disassembly of the battery. The disassembled battery can still be used again because it is not damaged.

[0009] In some embodiments, the electrical bonding reduction structure includes a first bonding layer, a conductive layer, an insulating layer, and a second bonding layer connected in sequence, the first bonding layer is bonded to the conductive structure, and the first bonding layer is configured to weaken the bonding performance after the conductive structure and the conductive layer are energized; the second bonding layer is bonded to the battery.

[0010] In this arrangement, the first adhesive layer is bonded to the conductive structure. After power is applied, the first adhesive layer can be separated from the conductive structure, so that the conductive structure and the battery can be removed from the fixed structure together.

[0011] In some implementations, a first hole is disposed on the fixed structure along a thickness direction, at least a portion of the conductive structure is located in the first hole, and an insulating structure is disposed between the conductive structure and a hole wall of the first hole.

[0012] In this arrangement, the first hole can reduce the weight of the fixing structure, thereby reducing the total weight of the power supply assembly. Part of the conductive structure extends into the first hole, thereby reducing the overall thickness of the power supply assembly.

[0013] In some implementations, a boss is disposed on the inner wall of the first hole, an edge region of the conductive structure is overlapped on the boss, and an insulating structure is disposed between the conductive structure and the boss.

[0014] In this arrangement, the arrangement of the boss facilitates the positioning and fixed installation of the conductive structure, thereby improving the connection stability between the conductive structure and the fixed structure.

[0015] In some implementations, a portion of the structure of the battery is located within the first hole.

[0016] In this implementation, part of the battery structure extends into the first hole, so that the overall thickness of the power supply assembly is further reduced.

[0017] In some implementations, the insulating structure includes an insulating adhesive structure, and the conductive structure is connected to the fixed structure via the insulating adhesive structure.

[0018] In this setting, the insulating structure can be connected to the conductive structure and the fixed structure through the insulating adhesive structure, without setting up other structures for connection, thereby improving the connection convenience of the conductive structure, the insulating structure and the fixed structure.

[0019] In some implementations, the thickness of the insulating structure is greater than or equal to 0.05 mm, and the breakdown voltage is greater than or equal to 15 V.

[0020] In this arrangement, the insulation performance of the insulation structure is better, which facilitates the insulation protection of the fixed structure.

[0021] In some implementations, the insulating structure includes an insulating bonding structure, the conductive structure is connected to the fixed structure via the insulating bonding structure, and the bonding shear strength of the insulating bonding structure is greater than or equal to 4 MPa.

[0022] In this arrangement, the strength of the insulating structure is relatively high, which can improve the connection strength with the fixed structure and the conductive structure.

[0023] In some implementations, the insulating structure is a ring-shaped structure.

[0024] In this arrangement, the insulating bonding structure in the annular area has an insulating effect, and the insulating effect is better.

[0025] In some implementations, the width of the insulating structure is greater than or equal to 0.5 mm.

[0026] In this arrangement, the contact areas between the insulating adhesive structure and the fixing structure and the conductive structure are relatively large, and the insulation effect is better.

[0027] In some implementations, the electrical bonding reduction structure has a lifting portion, and the lifting portion is exposed outside the battery.

[0028] In this arrangement, the lifting portion of the electrical bonding structure is exposed outside the battery. After the bonding performance of the electrical bonding structure decreases after power is applied, the electrical bonding structure can be separated from the conductive structure by peeling off the lifting portion, thereby facilitating separation of the battery from the fixed structure.

[0029] In some implementations, the conductive structure includes one of a steel sheet, a titanium alloy sheet, an aluminum alloy sheet, or a carbon fiber sheet.

[0030] In this arrangement, the conductive structure has a relatively strong structural strength, which facilitates improving the connection stability between the battery and the fixed structure, thereby increasing the support for the battery.

[0031] In some implementations, there are multiple batteries, and each of the multiple batteries is connected to the conductive structure via at least one electrical bonding structure.

[0032] In this arrangement, the conductive structure can connect multiple batteries through the electrical bonding structure.

[0033] A second aspect of the present application provides an electronic device, comprising a power supply component provided by any of the above technical solutions.

[0034] The electronic device disclosed in this application has at least the following beneficial effects:

[0035] Since the electronic device includes the above-mentioned power supply component, the battery in the power supply component provides electrical energy to the power-consuming unit in the electronic device. When the battery needs to be removed, the conductive structure and the electrical bonding structure can be energized. Since an insulating structure is provided between the conductive structure and the fixed structure, the current does not flow to the fixed structure. After the electrical bonding structure is energized, the bonding performance decreases, so that the electrical bonding structure can be more easily separated from the conductive structure or the battery, so that the battery can be separated from the electrical bonding structure, or the battery and the electrical bonding structure can be separated from the conductive structure together, that is, the battery can be separated from the fixed structure without damaging the battery, so as to complete the disassembly of the battery. The disassembled battery can still be used again because it is not damaged. In summary, the battery in the above-mentioned electronic device is easy to disassemble.

[0036] In some implementations, the fixed structure in the power supply assembly is a middle frame.

[0037] In this configuration, the middle frame of the electronic device is used as a fixed structure in the power supply assembly, and there is no need to add an additional fixed structure, thereby reducing the number of structures and the thickness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of parts explosion of an electronic device to which the power supply assembly provided by the first embodiment of the present application is applied;

[0039] Figure 2 is a schematic diagram of the structure of the power supply assembly provided in the first embodiment of the present application;

[0040] Figure 3 yes Figure 2 Sectional view at AA in the middle;

[0041] Figure 4 It is a structural schematic diagram of the electrical bonding reduction structure in the power supply assembly provided in the first embodiment of the present application;

[0042] Figure 5 It is a schematic diagram of power-on of the electrical bonding reduction structure in the power supply assembly provided in the first embodiment of the present application;

[0043] Figure 6 It is a structural schematic diagram of the fixed structure in the power supply assembly provided in the first embodiment of the present application;

[0044] Figure 7 is a cross-sectional view of a power supply assembly provided in a second embodiment of the present application;

[0045] Figure 8 is a cross-sectional view of a power supply assembly provided in a third embodiment of the present application;

[0046] Fig. 9 is a cross-sectional view of a power supply assembly provided in a fourth embodiment of the present application;

[0047] Fig.10 It is a schematic diagram of the arrangement position of the insulating structure on the fixed structure in the power supply assembly provided in the first embodiment of the present application;

[0048] Fig.11 is a cross-sectional view of a power supply assembly provided in a fifth embodiment of the present application;

[0049] Fig.12 is a structural schematic diagram of a power supply assembly provided in a sixth embodiment of the present application;

[0050] Fig.13 It is a schematic diagram of the relative positions of the conductive structure and the fixed structure in the power supply assembly provided in the first embodiment of the present application;

[0051] Fig.14 It is a schematic diagram of the relative positions of the electrical bonding reduction structure, the conductive structure and the fixed structure in the power supply assembly provided in the first embodiment of the present application.

[0052] The meanings of the figures are as follows:

[0053] 100. Power supply components;

[0054] 110, fixing structure; 111, first hole; 112, boss;

[0055] 120. Insulation structure;

[0056] 130. Conductive structure;

[0057] 140. Electrically reduced bonding structure; 141. First bonding layer; 142. Conductive layer; 143. Insulating layer; 144. Second bonding layer; 145. Lifting portion;

[0058] 150. Battery;

[0059] 210, outer shell; 220, middle frame;

[0060] 300. Display screen. DETAILED DESCRIPTION

[0061] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0062] It should be understood that the "multiple" mentioned in this application refers to two or more. In the description of this application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of this application, the words "first" and "second" are used to distinguish between the same items or similar items with basically the same functions and effects. Those skilled in the art can understand that the words "first" and "second" do not limit the quantity and execution order, and the words "first" and "second" do not limit them to be different.

[0063] The power supply assembly provided in the embodiment of the present application is explained in detail below. In each embodiment of the present application, electrical connection refers to the connection between two electrical devices through a conductor so that electrical signals can be transmitted between the two electrical devices. In each of the drawings of the present application, the leads with arrows all point to the device itself, and the leads with dots all point to an area, such as a slot, a hole, a cavity, a notch, etc.

[0064] The embodiments of the present application provide a power supply component and an electronic device, the power supply component can be applied to the electronic device, the power supply component includes a battery, and the battery can be used to power the power consumption unit in the electronic device. The electronic device can be a battery-powered terminal device such as a mobile phone, a television, a display, a tablet computer, a car computer, or a smart display wearable device such as a smart watch or a smart bracelet, or a communication device such as a server, a storage device, a base station, or a smart car. The embodiments of the present application do not impose any special restrictions on the specific form of the above-mentioned electronic devices.

[0065] like Figure 1 , Figure 2 and Figure 3 As shown, the power supply assembly 100 includes: a fixed structure 110, an insulating structure 120, a conductive structure 130, an electrical bonding reduction structure 140 and a battery 150; the insulating structure 120 is connected to the fixed structure 110, the conductive structure 130 is connected to the insulating structure 120, and the insulating structure 120 insulates and separates the fixed structure 110 from the conductive structure 130; the battery 150 is connected to the side of the conductive structure 130 away from the insulating structure 120 through the electrical bonding reduction structure 140, and the electrical bonding reduction structure 140 is configured to reduce the bonding performance after the electrical bonding reduction structure 140 and the conductive structure 130 are energized.

[0066] The fixing structure 110 is used to fix the power supply component 100 in the electronic device. The fixing structure 110 can be connected to the structure in the electronic device, or the fixing structure 110 can be integrated with part of the structure in the electronic device into an integrated structure, that is, part of the structure in the electronic device is used as the fixing structure 110 to fix the power supply component 100. Figure 1 As shown, the electronic device includes a shell assembly, a display screen 300 and a power supply assembly 100, the shell assembly includes a housing 210, the power supply assembly 100 is located between the housing 210 and the display screen 300, the power supply assembly 100 can be connected to the housing 210, or the fixed structure 110 in the power supply assembly 100 can be integrated with the housing 210 as an integral structure, or the housing 210 is used as the fixed structure 110 in the power supply assembly 100. In another configuration, the shell assembly also includes a middle frame 220, the middle frame 220 is installed between the housing 210 and the display screen 300, the power supply assembly 100 can be connected to the middle frame 220, or the fixed structure 110 in the power supply assembly 100 can be integrated with the middle frame 220 as an integral structure, or the middle frame 220 is used as the fixed structure 110 in the power supply assembly 100. Figure 1 In the embodiment, the middle frame 220 is used as the fixed structure 110 in the power supply assembly 100, that is, the power supply assembly 100 and the shell assembly are integrated into an integral structure.

[0067] The insulating structure 120 is used to insulate and isolate the fixed structure 110 from the conductive structure 130, so that when the conductive structure 130 is powered on, the current does not flow to the fixed structure 110. The insulating structure 120 may be a layered structure, and the insulating structure 120 is disposed at the portion of the conductive structure 130 that is opposite to the fixed structure 110. Exemplarily, at least within the projection range of the conductive structure 130 on the fixed structure 110, the insulating structure 120 is disposed between the conductive structure 130 and the fixed structure 110.

[0068] The conductive structure 130 , the electrical adhesion reduction structure 140 and the battery 150 are stacked in a first direction, and the thickness directions of the fixed structure 110 , the insulating structure 120 , the conductive structure 130 and the electrical adhesion reduction structure 140 are in the same direction, which is the first direction.

[0069] The conductive structure 130 is a layered structure with conductive properties. The projection of the conductive structure 130 in the first direction at least covers the projection of the electrical anti-adhesion structure 140 in the first direction, so that after the conductive structure 130 and the electrical anti-adhesion structure 140 are energized, the viscosity of the electrical anti-adhesion structure 140 within the projection range in the first direction is reduced.

[0070] The electrically debonding structure 140 is a tape that loses its adhesiveness after being energized, or is called an electrically peelable tape. This type of tape has strong adhesiveness and strong holding power before being energized. After being energized, the viscosity of the tape decreases and it is only slightly bonded, so it can be easily peeled off from the adherend.

[0071] During use of the power supply assembly 100, the battery 150 is fixed to the conductive structure 130 via the electrical bonding structure 140, the conductive structure 130 is fixed to the fixed structure 110 via the insulating structure 120, and the fixed structure 110 and the insulating structure 120 are insulated and isolated by the insulating structure 120. When the battery 150 needs to be removed, the conductive structure 130 and the electrical bonding structure 140 are energized, and since the insulating structure 120 is provided between the conductive structure 130 and the fixed structure 110, the current does not flow to the fixed structure 110. After the electrical bonding structure 140 is energized, the bonding performance decreases, so that the electrical bonding structure 140 can be more easily separated from the conductive structure 130 or the battery 150, so that the battery 150 can be separated from the electrical bonding structure 140, or the battery 150 and the electrical bonding structure 140 can be separated from the conductive structure 130 together, that is, the battery 150 can be separated from the fixed structure 110 without damaging the battery 150, so as to complete the disassembly of the battery 150, and the disassembled battery 150 can still be used again because it is not damaged. When the power supply component 100 is used in an electronic device, the housing 210 or the middle frame 220 of the electronic device can be used as the fixed structure 110 in the power supply component 100. Taking the middle frame 220 as the fixed structure 110 as an example, since an insulating structure 120 is arranged between the conductive structure 130 and the fixed structure 110, even when the conductive structure 130 and the electrical debonding structure 140 are energized to remove the battery 150, the energization will not cause the current to flow to the fixed structure 110, thereby protecting other components installed on the fixed structure 110 and not damaging other components installed on the fixed structure 110. Therefore, the fixed structure 110 can be normally installed with other components, which is conducive to the layout and installation of various internal components of the electronic device.

[0072] The conductive structure 130 is a sheet structure made of a conductive material. For example, the conductive structure 130 can be made of metal or carbon fiber. For example, in some implementations, the conductive structure 130 includes one of a steel sheet, a titanium alloy sheet, an aluminum alloy sheet, or a carbon fiber sheet.

[0073] In this configuration, the conductive structure 130 has a relatively strong structural strength and relatively large rigidity, which facilitates improving the connection stability between the battery 150 and the fixed structure 110 and provides a high degree of support for the battery 150 .

[0074] In some implementations, such as Figure 2As shown, the electrical adhesion reduction structure 140 has a lifting portion 145, and the lifting portion 145 is exposed outside the battery 150. In the projection in the thickness direction, the projection of the battery 150 covers part of the electrical adhesion reduction structure 140, and the area of ​​the electrical adhesion reduction structure 140 not covered by the battery 150 forms the lifting portion 145, and the side of the lifting portion 145 away from the conductive structure 130 is not opposite to the battery 150, but exposed outside the battery 150. In this arrangement, the lifting portion 145 of the electrical adhesion reduction structure 140 is exposed outside the battery 150. After the adhesive performance of the electrical adhesion reduction structure 140 decreases after power is applied, the electrical adhesion reduction structure 140 can be separated from the conductive structure 130 by peeling off the lifting portion 145, thereby facilitating the separation of the battery 150 from the fixed structure 110. In addition, since the lifting portion 145 is exposed outside the battery 150 , it is easy to connect the electrical bonding structure 140 to a powered device during the process of disassembling the battery 150 .

[0075] In a feasible embodiment, the electrical bonding structure 140 may be provided with a protective film, which is adhered to the lifting portion 145 of the electrical bonding structure 140, and covers the first adhesive layer 141 of the lifting portion 145, thereby preventing the area of ​​the first adhesive layer 141 exposed outside the battery 150 from being adhered to impurities or dust.

[0076] In some implementations, the thickness of the insulating structure 120 is greater than or equal to 0.05 mm. For example, the thickness of the insulating structure 120 may be 0.05 mm, 0.08 mm, 0.1 mm, or 0.12 mm. Since the thickness of the insulating structure 120 is relatively large, and the insulating structure 120 is located between the fixed structure 110 and the conductive structure 130, the distance between the fixed structure 110 and the conductive structure 130 is relatively large, and the insulation effect is better. The thickness of the insulating structure 120 is relatively large, so that the insulating performance of the insulating structure 120 is better, which facilitates the insulation protection of the fixed structure 110.

[0077] In some implementations, the breakdown voltage of the insulating structure 120 is greater than or equal to 15V. For example, the breakdown voltage of the insulating structure 120 may be 15V, 18V, 20V, 22V, or 25V.

[0078] In some implementations, the insulating structure 120 includes an insulating adhesive structure, and the bonding shear strength of the insulating adhesive structure is greater than or equal to 4MPa. For example, the bonding shear strength of the insulating adhesive structure may be 4MPa, 5MPa, 6MPa, 8MPa or 10MPa, etc. In this arrangement, since the insulating structure 120 includes an insulating adhesive structure, the insulating adhesive structure can be connected to the fixed structure 110 and the conductive structure 130 without adopting other structural arrangements, which facilitates the connection of the fixed structure 110, the insulating structure 120 and the conductive structure 130, is easy to operate, and has high assembly efficiency. The bonding shear strength of the insulating adhesive structure is greater than or equal to 4MPa, that is, the bonding shear strength of the insulating adhesive structure is relatively large, that is, the insulating adhesive structure has better shear resistance, which enables the insulating adhesive structure to more effectively resist wear during daily use, thereby improving the integrity and insulation reliability of the insulating adhesive structure. When subjected to external force, this type of insulating adhesive structure is not easy to displace or fall off, which helps to maintain the connection stability between the fixed structure 110 and the conductive structure 130. Since the insulating adhesive structure has a strong bonding shear strength, it can provide a relatively greater connection strength even if the bonding area is relatively small. The insulating adhesive structure used has a small bonding area, which means that the volume and weight of the insulating adhesive structure are relatively small, which is beneficial to reducing the overall weight and volume of the power supply assembly 100.

[0079] In some specific examples, the insulating adhesive structure may include any one of hot melt adhesive film, AB adhesive, hot melt adhesive, UV adhesive, pressure sensitive adhesive, etc.

[0080] like Figure 4 and Figure 5 As shown, in some implementations, the electrical reduction bonding structure 140 includes a first bonding layer 141, a conductive layer 142, an insulating layer 143, and a second bonding layer 144 connected in sequence, the first bonding layer 141 is bonded to the conductive structure, and the first bonding layer 141 is configured to weaken the bonding performance after the conductive structure 130 and the conductive layer 142 are energized; the second bonding layer 144 is bonded to the battery 150.

[0081] In this arrangement, it is worth noting that the first adhesive layer 141, the conductive layer 142, the insulating layer 143 and the second adhesive layer 144 are stacked in sequence in the first direction, that is, in the thickness direction of the power supply assembly 100. The first adhesive layer 141 is bonded to the conductive structure 130. After power is turned on, the first adhesive layer 141 can be separated from the conductive structure 130, so as to facilitate the removal of the electrically conductive structure 140 and the battery 150 from the fixed structure 110. The conductive layer 142 has conductive properties. The conductive layer 142 can be made of a metal material. Exemplarily, the conductive layer 142 is an aluminum sheet. The insulating layer 143 acts as an insulator between the conductive layer 142 and the second adhesive layer 144. Since the second adhesive layer 144 is connected to the battery 150, the insulating layer 143 acts as an insulator between the conductive layer 142 and the battery 150. The insulating layer 143 is made of an insulating material, and for example, the insulating layer 143 is made of PET (polyethylene glycol terephthalate). The second adhesive layer 144 is used to connect the insulating layer 143 and the battery 150. The second adhesive layer 144 can be made of a high-vibration-resistant tape, and for example, the second adhesive layer 144 can be made of an acrylic resin pressure-sensitive adhesive.

[0082] In this configuration, only a four-layer stacked structure is used to achieve the bonding of the electrical bonding reduction structure 140 and the function of reducing the bonding performance after power is applied. The structure is simple and the thickness is relatively smaller, which is beneficial to reducing the overall thickness of the power supply assembly 100.

[0083] like Figure 5 As shown, in a specific embodiment, the first bonding layer 141 in the electrical bonding structure 140 is an electrolyte bonding structure, including an electrolyte ion liquid, wherein the electrolyte ion liquid contains cations and anions. After power is applied to both sides of the first bonding layer 141, the cations in the electrolyte ion liquid move toward the negative electrode, and the anions move toward the positive electrode. This movement and the chemical reaction in the first bonding layer 141 cause the viscosity of the first bonding layer 141 to drop sharply, so that the electrical bonding structure 140 can be torn off from the conductive structure 130 without leaving any residual glue.

[0084] In some implementations, such as Figure 6 and Figure 7 As shown, the fixing structure 110 is provided with a first hole 111 along the thickness direction. Figure 6 It is shown that the fixing structure 110 is provided with a first hole 111, Figure 7 is a cross-sectional view of a power supply assembly 100 having a fixing structure 110 provided with a first hole 111, and the section line position thereof is Figure 2 Same as in the middle AA.

[0085] It is worth noting that the first hole 111 can be a through hole or a blind hole. The provision of the first hole 111 can reduce the weight of the fixing structure 110 , thereby reducing the total weight of the power supply assembly 100 .

[0086] In a specific embodiment, the first hole 111 is a through hole, and the first hole 111 penetrates the fixed structure 110 in the thickness direction of the fixed structure 110, the insulating structure 120 is located on one side of the fixed structure 110 in the thickness direction, and the insulating structure 120 is arranged around the periphery of the first hole 111, the conductive structure 130 is located on the side of the insulating structure 120 away from the fixed structure 110 in the thickness direction, the electrical adhesion reduction structure 140 is on the side of the conductive structure 130 away from the fixed structure 110 in the thickness direction, and the battery 150 is connected to the side of the electrical adhesion reduction structure 140 away from the fixed structure 110 in the thickness direction. In this arrangement, the arrangement of the first hole 111 reduces the weight of the fixed structure 110, and the arrangement of the first hole 111 reduces the area of ​​the relative region between the conductive structure 130 and the fixed structure 110, and reduces the material used for the insulating structure 120.

[0087] like Figure 8 As shown, in some configurations, at least a portion of the conductive structure 130 is located in the first hole 111, and an insulating structure 120 is disposed between the conductive structure 130 and the hole wall of the first hole 111. In this configuration, a portion of the conductive structure 130 extends into the first hole 111, thereby reducing the overall thickness of the power supply assembly 100. Figure 8 is a cross-sectional view of the power supply assembly 100 in which the conductive structure 130 is partially located in the first hole 111, and the section line position is Figure 2 Same as in the middle AA.

[0088] like Fig. 9 As shown, in some implementations, a boss 112 is provided on the inner wall of the first hole 111, the edge area of ​​the conductive structure 130 overlaps the boss 112, and an insulating structure 120 is provided between the conductive structure 130 and the boss 112. The boss 112 and the fixed structure 110 can be an integral structure manufactured by integral molding, the boss 112 is located in the first hole 111, and the thickness of the boss 112 is less than the dimension of the first hole 111 in the thickness direction of the fixed structure 110. That is, a step surface is formed between the surface of the boss 112 and the surface of the fixed structure 110 facing the battery 150, and the step surface is used to limit and support the conductive structure 130. A plurality of bosses 112 can be arranged at intervals in the circumferential direction of the inner wall of the first hole 111, or the boss 112 is a ring structure, which is arranged around the inner wall of the first hole 111. In this configuration, the configuration of the boss 112 facilitates the positioning and fixed installation of the conductive structure 130 , thereby improving the connection stability between the conductive structure 130 and the fixed structure 110 . Fig. 9is a cross-sectional view of the power supply assembly 100 having the boss 112, and the section line position thereof is Figure 2 Same as in the middle AA.

[0089] like Figure 3 As shown, in some implementations, part of the structure of the battery 150 is located in the first hole 111. In this arrangement, the conductive structure 130, the insulating structure 120 and the electrical bonding structure are completely located in the first hole 111, and part of the structure of the battery 150 is located in the first hole 111. Since part of the structure of the battery 150 extends into the first hole 111, the overall thickness of the power supply assembly 100 is further reduced.

[0090] like Fig.10 As shown, in some implementations, the insulating structure 120 is an annular structure. It is worth noting that the annular structure here refers to a closed annular structure. The specific shape of the insulating structure 120 can match the shape of the first hole 111. For example, if the first hole 111 is a circular hole, the insulating structure 120 can be a circular annular structure. In the case where the first hole 111 is a square hole, the insulating structure 120 can be a square annular structure. Since the insulating structure 120 is a closed annular structure, and the insulating structure 120 surrounds the outer periphery of the conductive structure 130, the insulating structure 120 is provided between the conductive structure 130 and the fixed structure 110. In this arrangement, the insulating structure 120 has an insulating effect in the annular area, and the insulating effect is better. When the insulating structure 120 includes an insulating bonding structure, in one arrangement, the insulating bonding structure is an annular structure. Of course, in other embodiments, the insulating structure 120 may also include an insulating adhesive structure and an insulating non-adhesive structure, which are staggered and arranged to form an annular structure. The insulating adhesive structure plays an insulating and connecting role between the conductive structure 130 and the fixed structure 110, and the insulating non-adhesive structure plays an insulating role between the conductive structure 130 and the fixed structure 110.

[0091] The insulating structure 120 may be disposed in the first hole 111, or may be partially disposed in the first hole 111 and partially disposed outside the first hole 111. Fig.11 In this arrangement, the insulating structure 120 has a larger arrangement area, a larger insulation range, and a stronger insulation reliability. Fig.11 is a cross-sectional view of the power supply assembly 100 in which the insulating structure 120 is partially located in the first hole 111 and partially located outside the first hole 111, and the section line position is Figure 2 Same as in the middle AA.

[0092] In some implementations, the width of the insulating structure 120 is greater than or equal to 0.5 mm. It is worth noting that the width of the insulating structure 120 refers to the minimum distance between the outer annular surface and the inner annular surface in the projection of the insulating structure 120 in the thickness direction. In this configuration, the contact area between the insulating structure 120 and the fixed structure 110 and the conductive structure 130 is relatively large, the insulation effect is better, and the insulation reliability is stronger.

[0093] In some implementations, the first adhesive layer 141 is configured to have a peeling force greater than or equal to 0.4 N / mm when the conductive structure 130 and the conductive layer 142 are not powered, and a peeling force less than or equal to 0.05 N / mm when the fixed structure 110 and the conductive layer 142 are powered. Exemplarily, the peeling force of the first adhesive layer 141 when not powered is 0.4 N / mm, 0.5 N / mm, 0.6 N / mm, 0.8 N / mm, 1 N / mm, or 1.2 N / mm, etc. The peeling force of the first adhesive layer 141 when powered is 0.05 N / mm, 0.04 N / mm, 0.03 N / mm, 0.02 N / mm, or 0.01 N / mm, etc. In this arrangement, the bonding strength of the first adhesive layer 141 is relatively large when not powered, which is convenient for improving the connection stability between the battery 150 and the fixed structure 110. The bonding strength of the first adhesive layer 141 is relatively small after power is applied, which is convenient for separating the battery 150 from the fixed structure 110, and no residual glue is left on the conductive structure 130. In a specific example, when power is not applied, and at room temperature and high temperature and high humidity environment, the peeling force of the first adhesive layer is above 0.4N / mm, so that the battery 150 can be firmly fixed to the conductive structure 130 through the electrical reduction bonding structure 140 during use, and fixed to the fixed structure 110 through the conductive structure 130. After power is applied, for example, when 10V DC is applied for 60s, the peeling force of the first adhesive layer 141 drops to below 0.05N / mm, so that the electrical reduction bonding structure 140 is easy to be torn off from the conductive structure 130 without leaving residual glue.

[0094] In the power supply assembly 100, the number of the battery 150 can be one or more. Figures 1 to 3 In the embodiment, the number of batteries 150 is one, and the number of electrical bonding structures 140 is one. The battery 150 is adhered to the conductive structure 130 through the electrical bonding structure 140. After the conductive structure 130 and the electrical bonding structure 140 are energized, the electrical bonding structure 140 can be easily torn off from the conductive structure 130, thereby separating the battery 150 from the conductive structure 130, that is, separating the battery 150 from the fixed structure 110.

[0095] In some implementations, such as Fig.12As shown, there are multiple batteries 150, and the multiple batteries 150 are connected to the conductive structure 130 through at least one electrical bonding structure 140. In a specific implementation, the number of batteries 150 and the electrical bonding structure 140 is the same, and the multiple batteries 150 and the multiple electrical bonding structures 140 are arranged one by one, and each battery 150 is respectively attached to the conductive structure 130 through the corresponding electrical bonding structure 140. When one of the batteries 150 is removed, the conductive structure 130 and the electrical bonding structure 140 corresponding to the battery 150 to be removed are energized, so that the electrical bonding can be torn off from the conductive structure 130, so that the battery 150 can be removed from the conductive structure 130, and thus the battery 150 can be removed from the fixed structure 110. In this arrangement, any one or more of the multiple batteries 150 can be removed from the fixed structure 110, which is convenient for maintenance and replacement of the battery 150. In some specific examples, each electrical reduction bonding structure 140 may be provided with a lifting portion 145 .

[0096] This embodiment provides a power supply assembly 100. During the manufacturing and assembly process, a fixing structure 110 is first manufactured, and then a first hole 111 is opened on the fixing structure 110. Figure 6 Then, an insulating structure 120 is provided on the fixed structure 110, as shown in FIG. Fig.10 Then, the conductive structure 130 is fixedly arranged on the insulating structure 120, as shown. Fig.13 After the conductive structure 130 is fixed, the electrical bonding structure 140 is pasted on the conductive structure 130, as shown. Fig.14 Finally, the battery 150 is attached to the electrical bonding structure 140, as shown. Figure 2 The manufacturing and assembly process of the power supply assembly 100 is simple and efficient, the battery 150 can be disassembled and reused, and the disassembly and installation process of the battery 150 is convenient and efficient.

[0097] like Figure 1 , Figure 2 and Figure 3 As shown, an embodiment of the present application further provides an electronic device, comprising a power supply component 100 provided by any of the above technical solutions.

[0098] Since the electronic device includes the above-mentioned power supply component 100, the battery 150 in the power supply component 100 provides power to the power-consuming unit in the electronic device. When the battery 150 needs to be removed, the conductive structure 130 and the electrical bonding structure 140 can be energized. Since the insulating structure 120 is provided between the conductive structure 130 and the fixed structure 110, the current does not flow to the fixed structure 110. After the electrical bonding structure 140 is energized, the bonding performance decreases, so that the electrical bonding structure 140 can be more easily separated from the conductive structure 130 or the battery 150, so that the battery 150 is separated from the electrical bonding structure 140, or the battery 150 and the electrical bonding structure 140 are separated from the conductive structure 130 together, that is, the battery 150 can be separated from the fixed structure 110 without damaging the battery 150, so as to complete the disassembly of the battery 150, and the disassembled battery 150 can still be used again because it is not damaged. In summary, the battery 150 in the above-mentioned electronic device is easy to disassemble.

[0099] Exemplarily, the electronic device further includes a housing 210, a middle frame 220, and a display screen 300, and the battery 150 in the power supply component 100 is located between the middle frame 220 and the display screen 300. In some implementations, the fixed structure 110 in the power supply component 100 is the middle frame 220. In this setting, the middle frame 220 of the electronic device is used as the fixed structure 110 in the power supply component 100, and there is no need to add an additional fixed structure 110, thereby reducing the number of structures and reducing the thickness of the electronic device.

[0100] In a specific embodiment, the fixed structure 110 is a middle frame 220, and the material for manufacturing the middle frame 220 may include aluminum alloy. The middle frame 220 can be formed by metal die casting (die casting + injection molding) and profile CNC (Computer numerical control, computer numerical control machine tool), that is, combining CNC and NMT (Nano Molding Technology, nano molding technology) to form an integrated middle frame 220. A first hole 111 is provided in the fixed structure 110 along the thickness direction, that is, a first hole 111 is provided on the middle frame 220 along the thickness direction, and the first hole 111 can be formed by punching or CNC processing. A boss 112 is provided in the first hole 111, and the boss 112 and the middle frame 220 are an integrally formed structure. When the first hole 111 is punched or CNC-processed, a boss 112 is formed on the inner wall of the first hole 111. The boss 112 is an annular structure. The boss 112 surrounds the inner wall of the first hole 111. The thickness of the boss 112 is less than the axial length of the first hole 111. The axial length of the first hole 111 is the size of the first hole 111 in the first direction (or in the thickness direction of the fixing structure 110). In other words, in the first direction, the size of the first hole 111 is less than the size of the boss 112. The insulating structure 120 is provided on the inner wall of the first hole 111 and the side wall of the boss 112 facing the battery 150. The insulating structure 120 covers the side wall of the boss 112 facing the battery 150 and the hole wall of the first hole 111. The conductive structure 130 is located in the first hole 111. The thickness of the conductive structure 130 is less than the axial length of the first hole 111. Exemplarily, the thickness of the conductive structure 130 may be less than the difference between the axial length of the first hole 111 and the thickness of the boss 112. In this arrangement, an insulating structure 120 is provided between the conductive structure 130 and the boss 112, and an insulating structure 120 is provided between the conductive structure 130 and the inner wall of the first hole 111, that is, an insulating structure 120 is provided between the conductive structure 130 and the fixed structure 110. The thickness of the insulating structure 120 is greater than or equal to 0.05 mm, and the breakdown voltage is greater than or equal to 15 V. The insulating structure 120 plays a better role in insulating and isolating between the conductive structure 130 and the fixed structure 110. An electrical adhesion reduction structure 140 is attached to the battery 150, and the electrical adhesion reduction structure 140 includes a first adhesive layer 141, a conductive layer 142, an insulating layer 143, and a second adhesive layer 144 connected in sequence. The first adhesive layer 141 is bonded to the conductive structure, and the first adhesive layer 141 is configured to weaken the bonding performance after the conductive structure 130 and the conductive layer 142 are energized; the second adhesive layer 144 is bonded to the battery 150.With such arrangement, after the conductive layer 142 and the conductive structure 130 are energized, the viscosity of the first adhesive layer 141 is reduced, so that the electrical bonding structure 140 can be torn off from the conductive structure 130, so that the battery 150 and the electrical bonding structure 140 can be removed from the fixed structure 110. This disassembly method does not damage the battery 150, and the battery 150 and the electrical bonding structure 140 can be reused. The battery 150 is adhered to the conductive structure 130 through the electrical bonding structure 140, and the battery 150 can be installed on the fixed structure 110 again.

[0101] The battery 150 in the electronic device provided in the embodiment of the present application is easy to disassemble, and the disassembly of the battery 150 does not damage the battery 150. The battery 150 can be reused, which reduces the loss of the battery 150. Since the battery 150 and the conductive structure 130 are connected by the electrical bonding structure 140, and the fixed structure 110 and the conductive structure 130 are connected by the insulating structure 120, when the electrical bonding structure 140 and the conductive structure 130 are energized, other components installed on the fixed structure 110 will not be affected. The installation and disassembly process of the battery 150 of the electronic device provided in this embodiment is simple and easy to operate, with high disassembly efficiency and low cost, and consumers can operate it at home.

[0102] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A power supply component, characterized in that: include: Fixing structures, insulating structures, conducting structures, electrical bonding structures and batteries; The insulating structure is connected to the fixed structure, the conductive structure is connected to the insulating structure, and the insulating structure insulates and separates the fixed structure from the conductive structure; the battery is connected to the side of the conductive structure away from the insulating structure through the electrical bonding reduction structure, and the electrical bonding reduction structure is configured to reduce the bonding performance after the electrical bonding reduction structure and the conductive structure are energized.

2. The power supply assembly according to claim 1, characterized in that: The electrical bonding reduction structure includes a first bonding layer, a conductive layer, an insulating layer, and a second bonding layer connected in sequence, wherein the first bonding layer is bonded to the conductive structure, and the first bonding layer is configured to weaken the bonding performance after the conductive structure and the conductive layer are energized; and the second bonding layer is bonded to the battery.

3. The power supply assembly according to claim 1, characterized in that: A first hole is arranged on the fixed structure along the thickness direction, at least a part of the conductive structure is located in the first hole, and the insulating structure is arranged between the conductive structure and the hole wall of the first hole.

4. The power supply assembly according to claim 3, characterized in that: A boss is disposed on the inner wall of the first hole, an edge region of the conductive structure overlaps the boss, and the insulating structure is disposed between the conductive structure and the boss.

5. The power supply assembly according to claim 3, characterized in that: A portion of the battery structure is located in the first hole.

6. The power supply assembly according to any one of claims 1 to 5, characterized in that: The insulating structure includes an insulating adhesive structure, the insulating adhesive structure has an adhesive shear strength greater than or equal to 4 MPa, and the conductive structure is connected to the fixed structure via the insulating adhesive structure.

7. The power supply assembly according to claim 6, characterized in that: The thickness of the insulating structure is greater than or equal to 0.05 mm, and the breakdown voltage is greater than or equal to 15 V.

8. The power supply assembly according to claim 3, characterized in that: The insulating structure is a ring structure.

9. The power supply assembly according to claim 3, characterized in that: The width of the insulating structure is greater than or equal to 0.5 mm.

10. The power supply assembly according to any one of claims 1 to 5, characterized in that: The electrical adhesion reduction structure has a lifting portion, and the lifting portion is exposed outside the battery.

11. The power supply assembly according to any one of claims 1 to 5, characterized in that: The conductive structure includes one of a steel sheet, a titanium alloy sheet, an aluminum alloy sheet or a carbon fiber sheet.

12. The power supply assembly according to any one of claims 1 to 5, characterized in that: There are multiple batteries, and each of the multiple batteries is connected to the conductive structure via at least one electrical bonding structure.

13. An electronic device, characterized in that: Comprising a power supply assembly as described in any one of claims 1-12.

14. The electronic device according to claim 13, characterized in that: The fixed structure in the power supply assembly is a middle frame.

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