Photovoltaic optimizer and photovoltaic system

Abstract

The embodiment of the utility model provides a photovoltaic optimizer and a photovoltaic system, wherein the photovoltaic optimizer includes: a plastic shell, a receiving cavity is formed in the plastic shell, and the receiving cavity is filled with a heat dissipation medium; a heat dissipation bracket is arranged in the receiving cavity, and the heat dissipation bracket includes a support surface; a circuit structure is arranged in the receiving cavity, and at least part of the circuit structure is in contact with the support surface of the heat dissipation bracket; wherein the thermal conductivity of the plastic shell is greater than or equal to 1.0W / m·K, and the heat generated by the circuit structure is dissipated through the receiving cavity and the plastic shell. In the technical solution of the utility model, on the one hand, by utilizing its excellent thermal conductivity, the heat dissipation effect can be ensured without additionally setting up a metal heat sink, and on the other hand, there is no need to design extra heat dissipation space to ensure the overall miniaturization requirements of the photovoltaic optimizer.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, and in particular to a photovoltaic optimizer and a photovoltaic system. Background Art

[0002] At present, the use of new energy sources has received more and more attention, and photovoltaic systems that convert solar energy into electrical energy are gradually accepted by users. In order to improve the conversion efficiency of photovoltaic panels, photovoltaic optimizers are usually connected in series with photovoltaic panels. In related technologies, photovoltaic optimizers will emit a lot of heat during operation. In order to ensure its normal operation, metal radiators are usually added to achieve heat dissipation. However, the weight of the entire photovoltaic optimizer will also increase accordingly. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art or related technology.

[0004] In view of this, an embodiment of the first aspect of the present utility model provides a photovoltaic optimizer.

[0005] An embodiment of a second aspect of the utility model provides a photovoltaic system.

[0006] In order to achieve the above-mentioned purpose, an embodiment of the first aspect of the utility model provides a photovoltaic optimizer, including: a plastic shell, a accommodating cavity is formed in the plastic shell, and the accommodating cavity is filled with a heat dissipation medium; a heat dissipation bracket is arranged in the accommodating cavity, and the heat dissipation bracket includes a supporting surface; a circuit structure is arranged in the accommodating cavity, and at least part of the circuit structure is in contact with the supporting surface of the heat dissipation bracket; wherein the thermal conductivity of the plastic shell is greater than or equal to 1.0W / m·K, and the heat generated by the circuit structure is dissipated through the accommodating cavity through the plastic shell.

[0007] The photovoltaic optimizer proposed by the utility model includes a plastic shell, a heat dissipation bracket and a circuit structure, wherein the plastic shell is the external structure of the optimizer, plays a role in protecting internal components, providing waterproof and dustproof functions, and forming an internal accommodating cavity. The heat dissipation medium is filled in the accommodating cavity formed by the plastic shell, and its function is to absorb and transfer the heat generated by the circuit structure. The heat dissipation medium evenly distributes the heat through its high thermal conductivity and effectively transfers the heat to the plastic shell, thereby realizing the heat dissipation to the external environment. A heat dissipation bracket is also provided in the accommodating cavity, and the circuit structure can be supported by the supporting surface and contacted with it, so as to quickly absorb heat and transfer the heat to the heat dissipation medium filled in the accommodating cavity through the heat dissipation bracket. The circuit structure mainly includes all electronic components and circuit boards of the photovoltaic optimizer, and some of the components will generate heat during operation. At least part of these circuit structures is in contact with the supporting surface of the heat dissipation bracket to realize the heat transfer. The heat of the circuit structure is directly transferred to the heat dissipation bracket through the contact surface, and then transferred to the heat dissipation medium by the bracket, and finally dissipated to the external environment through the plastic shell. The above contact relationship is relatively close, which can ensure efficient heat conduction.

[0008] It should be emphasized that the material of the shell in this solution is a plastic material with significantly improved thermal conductivity. The thermal conductivity of the plastic shell is greater than or equal to 1.0W / m·K, and its thermal conductivity is much greater than that of ordinary PC plastic. For example, it can be made of modified PA6 material. The modified PA6 nylon plastic shell not only protects the internal components from the influence of the external environment, but also effectively transfers the internal heat to the external environment through its high thermal conductivity, thereby improving the heat dissipation efficiency. Specifically, on the one hand, by utilizing its excellent thermal conductivity, the heat dissipation effect can be guaranteed without the additional provision of a metal heat sink. On the other hand, since the shell is made of a material with a high thermal conductivity, there is no need to design extra heat dissipation space, thereby ensuring the overall miniaturization requirements of the photovoltaic optimizer. The plastic shell not only protects the internal circuit structure from the influence of the external environment, but also plays a basic heat dissipation function. The design of the shell also needs to take into account the mechanical strength to withstand the impact and pressure that may be encountered during installation and operation.

[0009] Furthermore, by limiting the properties of the material, that is, the thermal conductivity of the plastic shell is greater than or equal to 1.2W / m·K, this higher thermal conductivity helps to more effectively transfer the heat generated inside to the shell surface and then dissipate it into the environment. Compared with the 0.2W / m·K of ordinary plastic materials, it has a significant improvement in thermal conductivity.

[0010] Of course, the bracket can be made of metal or other high thermal conductivity materials, and its design usually considers providing sufficient surface area to contact with the circuit structure to optimize heat transfer.

[0011] It should be supplemented that the heat dissipation medium may be a heat-conductive potting glue, which may also contain heat-conductive particles to improve the overall heat conduction efficiency.

[0012] For the entire heat dissipation process, when the optimizer is working, the components in the circuit structure generate heat. The generated heat is transferred to the heat dissipation bracket through the contact surface between the circuit structure and the heat dissipation bracket. The heat dissipation bracket further transfers the absorbed heat to the surrounding heat dissipation medium. The heat dissipation medium absorbs the heat and evenly distributes the heat in the accommodation cavity to avoid the formation of hot spots. Finally, the heat dissipation medium transfers the heat to the plastic shell, which is dissipated to the external environment from the shell surface.

[0013] Through the above structural features and connection relationships, this photovoltaic optimizer can achieve effective heat dissipation, ensure that the circuit structure operates at a safe temperature, extend product life, and improve overall performance.

[0014] In some technical solutions, optionally, the plastic shell includes: a first shell and a second shell that are interlocked, and the heat dissipation bracket is arranged on the second shell; wherein the interface where the first shell and the second shell are connected is sealed by welding.

[0015] In this technical solution, the plastic shell is composed of a first shell and a second shell that are interlocked, a heat dissipation bracket is arranged on the second shell, and the interface between the first shell and the second shell is sealed by welding. This design provides structural strength and heat dissipation efficiency while ensuring sealing. Specifically, the first shell and the second shell are the main external structures of the photovoltaic optimizer, and the two are interlocked to form a complete shell. The interface of the two shells is sealed by welding to ensure waterproof and dustproof performance. The welding seal ensures that the internal electronic components are not affected by the external environment, such as water, dust and other pollutants. The interlocking design increases the overall strength of the shell, and welding further enhances the stability and durability of the structure. The two-part shell design is easy to manufacture and assemble, can simplify the production process, and improve production efficiency.

[0016] In some technical solutions, optionally, a clamping structure is provided on the second shell, and the heat dissipation bracket is detachably connected to the second shell via the clamping structure.

[0017] In this technical solution, by providing a snap-fit ​​structure on one of the housings, the heat dissipation bracket is snap-fitted to the housing, which can effectively improve the installation efficiency of the heat dissipation bracket. Specifically, the snap-fit ​​structure is provided on the second housing, and is used to achieve a detachable connection with the heat dissipation bracket, which facilitates the installation and disassembly of the heat dissipation bracket, simplifies the assembly and maintenance process, ensures that the heat dissipation bracket will not loosen or fall off during operation, and provides a reliable mechanical connection.

[0018] The clamping structure is arranged on the second housing to provide a connection point with the heat dissipation bracket. The heat dissipation bracket is connected to the second housing through the clamping structure to achieve detachable installation. The circuit structure is installed on the heat dissipation bracket, and part of it contacts the support surface of the heat dissipation bracket to achieve heat transfer.

[0019] With this design, the optimizer has higher flexibility and convenience in assembly and maintenance. The detachable heat dissipation bracket not only simplifies the production process, but also facilitates later maintenance and replacement, significantly improving the maintainability and overall reliability of the product. This structural design ensures the high efficiency of the heat dissipation path while ensuring the mechanical stability and reliability of the product.

[0020] In some technical solutions, optionally, the projected area of ​​the heat dissipation bracket on the bottom wall of the second shell is not less than 80% of the area of ​​the bottom wall of the second shell; and / or the dimension of the heat dissipation bracket in the height direction of the second shell is not less than 80% of the height of the second shell.

[0021] In this technical solution, by limiting the projected area and height ratio of the heat dissipation bracket to the second shell, the heat dissipation efficiency of the entire photovoltaic optimizer and the stability of the overall structure can be guaranteed. Specifically, the projected area of ​​the heat dissipation bracket on the bottom wall of the second shell is not less than 80% of the area of ​​the bottom wall of the second shell. This requirement ensures that the heat dissipation bracket has sufficient surface area to contact the second shell, thereby improving the efficiency of heat transfer from the circuit structure to the shell. A larger projected area means that there are more contact points between the heat dissipation bracket and the second shell, which helps to distribute heat more evenly. The increased contact area can improve the efficiency of heat transfer from the circuit structure to the shell through the heat dissipation bracket. In addition, by limiting the size of the heat dissipation bracket in the height direction of the second shell to not less than 80% of the height of the second shell, it can be ensured that the heat dissipation bracket has sufficient height to support the circuit structure, so that the gap between the circuit structure located on the heat dissipation bracket and the first shell is small, so that the heat can be quickly transferred to the first shell through the heat dissipation medium and dissipated outward.

[0022] It can be understood that sufficient height can ensure that the heat dissipation bracket can support the entire circuit structure and maintain its stability. A heat dissipation bracket with a larger height can provide more space for filling the heat dissipation medium, which helps to disperse and dissipate heat.

[0023] In some technical solutions, optionally, the heat dissipation bracket specifically includes: a connecting portion and a contact portion that are connected to each other, the connecting portion is connected to the plastic shell, and the contact portion protrudes from the connecting portion; wherein a surface of the contact portion on one side away from the connecting portion is a supporting surface.

[0024] In this technical solution, the heat dissipation bracket is composed of a connected connection part and a contact part. The connection part is the part where the heat dissipation bracket is connected to the plastic shell, and is mainly used to fix the heat dissipation bracket on the plastic shell to ensure good contact between the heat dissipation bracket and the shell. The connection part ensures that the heat dissipation bracket is stably installed on the plastic shell and will not loosen due to vibration or temperature changes. The contact part is the part where the heat dissipation bracket is protruding from the connection part. By directly contacting the contact part with the heat-generating part of the circuit structure, heat can be quickly absorbed. Among them, by providing a supporting surface on the contact part, on the one hand, a stable support can be provided for the circuit structure to ensure the stability of the circuit structure during operation. On the other hand, the supporting surface serves as a direct contact surface for heat transfer from the circuit structure to the heat dissipation bracket, and the supporting surface is the starting point of heat transfer.

[0025] Of course, the design of the contact portion should ensure that there is a large enough surface area in contact with the circuit structure to improve the heat transfer efficiency.

[0026] The design of the heat dissipation bracket ensures that the heat generated by the circuit structure can be quickly transferred to the support surface and then transferred to the plastic housing through the contact part and the connecting part.

[0027] In some technical solutions, optionally, the connection parts are arranged at both ends of the contact part, a heat-conducting layer is arranged on the supporting surface, and the thermal conductivity of the heat-conducting layer is greater than the thermal conductivity of the heat dissipation bracket.

[0028] In this technical solution, the connecting parts are arranged at both ends of the contact part, which can provide a more uniform support and heat transfer path. The connecting parts at both ends can more evenly disperse the weight of the circuit structure and reduce local stress. In addition, by arranging the connecting parts at both ends of the contact part, it helps to form a more uniform heat flow path and reduce the formation of hot spots.

[0029] By providing a thermal conductive layer on the support surface, which is a layer of material with high thermal conductivity, to improve the efficiency of heat transfer from the circuit structure to the heat dissipation bracket, it can be understood that the thermal conductivity of the thermal conductive layer is higher than the thermal conductivity of the heat dissipation bracket itself, and heat can be transferred from the circuit structure to the heat dissipation bracket more quickly. The thermal conductive layer helps to evenly distribute heat on the support surface and reduce the risk of local overheating.

[0030] Materials with high thermal conductivity can quickly transfer heat from the circuit structure to the heat sink. Selecting thermally conductive materials with good thermal stability can ensure that the performance does not decrease during long-term operation.

[0031] Through this design, the heat dissipation bracket of the photovoltaic optimizer can not only effectively transfer and dissipate heat to maintain the stable operation of the circuit structure, but also can be easily maintained and replaced when necessary, improving the reliability and maintainability of the product. By adding a thermal conductive layer, especially its high thermal conductivity, the heat dissipation efficiency can be significantly improved.

[0032] In some technical solutions, optionally, it also includes: a glue filling port, which is arranged on the plastic shell, and the heat dissipation medium includes a potting glue, and the potting glue is poured through the glue filling port to fill the accommodating cavity.

[0033] In this technical solution, a glue injection port is provided on the plastic housing to allow the potting glue to be injected into the accommodating cavity of the plastic housing to protect the circuit structure and dissipate heat. After the potting glue is injected, the glue injection port can be sealed to ensure the waterproof and dustproof performance of the optimizer.

[0034] Potting compounds usually have good thermal conductivity, which helps transfer heat from the circuit structure to the heat sink and housing. Of course, potting compounds also have good electrical insulation properties, which can protect the circuit structure from moisture and other environmental factors.

[0035] Furthermore, the glue injection port is located at a convenient position for operation, so as to facilitate the injection of the potting glue and subsequent sealing. For example, the glue injection port can be arranged on the first housing.

[0036] In some technical solutions, optionally, it also includes: reinforcing ribs, which are arranged on the outer surface of the plastic shell.

[0037] In this technical solution, by providing reinforcing ribs on the outer surface of the plastic shell, the reinforcing ribs can significantly improve the bending, torsion and compression resistance of the plastic shell, and help prevent the shell from deformation or cracking when subjected to external impact or internal pressure changes. In addition, the reinforcing ribs provide additional support for the shell to ensure the stability of the structure under various use conditions.

[0038] The reinforcing ribs of this solution can not only improve the structural strength but also serve as additional heat dissipation paths to help disperse and transfer heat. By properly arranging the reinforcing ribs, the heat flow distribution in the shell can be optimized and the formation of hot spots can be reduced.

[0039] Since the reinforcing ribs of the present solution are arranged on the outer surface of the plastic shell, the filling effect during the glue pouring can be effectively reduced, and the possibility of generating bubbles or gaps can be reduced.

[0040] By setting reinforcing ribs on the outer surface of the plastic shell, the photovoltaic optimizer can improve its structural strength and heat dissipation performance while ensuring lightweight, thereby improving overall reliability and durability. This design is particularly important for photovoltaic equipment used outdoors because they need to withstand the test of various environmental factors.

[0041] In some technical solutions, optionally, the material of the plastic shell includes PA6 nylon plastic, mineral powder, and glass fiber, and the tensile strength of the plastic shell is greater than or equal to 90 MPa; the flame retardancy level of the plastic shell is greater than or equal to V0.

[0042] In this technical solution, the modified PA6 used for injection molding to form a plastic shell specifically includes: PA6 nylon plastic, mineral powder, and glass fiber. Among them, PA6 nylon plastic is used as the base material, and PA6 (polyamide 6) has good comprehensive properties, including mechanical strength, heat resistance, chemical resistance and processing performance. Mineral powder is used as a filling material to improve the rigidity, heat resistance and dimensional stability of the plastic shell. Glass fiber can significantly improve the tensile strength and impact resistance of the plastic shell.

[0043] The tensile strength of the plastic shell is greater than or equal to 90 MPa. This higher tensile strength ensures the stability and durability of the shell when subjected to mechanical loads, making it easy to utilize this property to directly integrally inject the reinforcing rib structure.

[0044] In addition, the flame retardant grade of the plastic housing is greater than or equal to V0 (according to UL94 standard), which means that in the vertical burning test, the flame propagation speed of the material is extremely low, providing higher safety performance.

[0045] Through the selection of materials and control of performance indicators in this solution, the plastic shell of the photovoltaic optimizer can provide the necessary strength, heat dissipation capacity and safety performance while ensuring lightweight, meeting the stringent requirements of the photovoltaic industry.

[0046] An embodiment of a second aspect of the present application provides a photovoltaic system, including: a photovoltaic panel; and a photovoltaic optimizer according to any of the above embodiments, wherein the other end of the photovoltaic line in the photovoltaic optimizer is connected to the photovoltaic panel.

[0047] The photovoltaic system provided in the present application includes a photovoltaic panel and a photovoltaic optimizer. The use of the photovoltaic optimizer improves the efficiency of power transmission and ensures that the power collected from the photovoltaic panel can be efficiently and stably transmitted to the subsequent circuit system.

[0048] Since the photovoltaic system includes any of the above-mentioned photovoltaic optimizers, it has the beneficial effects of any of the above-mentioned photovoltaic optimizers, which will not be described in detail here.

[0049] Additional aspects and advantages of the present invention will become apparent in the following description or will be understood through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 A schematic structural diagram of a photovoltaic optimizer according to an embodiment of the utility model is shown;

[0051] Figure 2 A schematic structural diagram of a photovoltaic optimizer according to an embodiment of the utility model is shown;

[0052] Figure 3 A schematic structural diagram of a photovoltaic optimizer according to an embodiment of the utility model is shown;

[0053] Figure 4 A schematic diagram of a photovoltaic optimizer according to an embodiment of the utility model is shown;

[0054] Figure 5 A schematic structural diagram of a heat dissipation bracket according to an embodiment of the utility model is shown;

[0055] Figure 6 A schematic diagram showing the relative position structure of the second housing and the heat dissipation bracket according to an embodiment of the utility model is shown;

[0056] Figure 7 A schematic diagram showing the relative position structure of the second housing and the heat dissipation bracket according to an embodiment of the utility model is shown;

[0057] Figure 8 A schematic structural diagram of a photovoltaic system according to an embodiment of the utility model is shown;

[0058] Fig. 9 A schematic structural diagram of a heat dissipation bracket according to an embodiment of the utility model is shown.

[0059] in, Figures 1 to 9 The corresponding relationship between the reference numerals and the component names is as follows:

[0060] 100: photovoltaic optimizer; 102: plastic shell; 1022: first shell; 1024: second shell; 1026: snap-on structure; 1032: accommodating cavity; 104: circuit structure; 106: heat dissipation bracket; 1062: connecting part; 1064: contact part; 1066: supporting surface; 108: glue filling port; 110: reinforcing rib; 112: photovoltaic line; 114: interface; 116: thermal conductive layer;

[0061] 200: Photovoltaic system: 202: Photovoltaic panels. DETAILED DESCRIPTION

[0062] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present invention, the embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0063] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0064] Refer to the following Figures 1 to 9Some embodiments according to the present invention are described.

[0065] like Figure 1 and Figure 2 As shown, a photovoltaic optimizer 100 proposed in this embodiment includes a plastic shell 102, a heat dissipation bracket 106 and a circuit structure 104, wherein the plastic shell 102 is the external structure of the optimizer, plays a role in protecting internal components, providing waterproof and dustproof functions, and forming an internal accommodating cavity 1032. The heat dissipation medium is filled in the accommodating cavity 1032 formed by the plastic shell 102, and its function is to absorb and transfer the heat generated by the circuit structure 104. The heat dissipation medium evenly distributes the heat through its high thermal conductivity and effectively transfers the heat to the plastic shell 102, thereby achieving heat dissipation to the external environment. A heat dissipation bracket 106 is also provided in the accommodating cavity 1032, and the circuit structure 104 can be supported by a supporting surface 1066 and contacted with it, so as to quickly absorb heat and transfer the heat to the heat dissipation medium filled in the accommodating cavity 1032 through the heat dissipation bracket. The circuit structure 104 mainly includes all electronic components and circuit boards of the photovoltaic optimizer 100, some of which will generate heat during operation. At least part of these circuit structures 104 is in contact with the supporting surface 1066 of the heat dissipation bracket 106 to achieve heat transfer. The heat of the circuit structure 104 is directly transferred to the heat dissipation bracket 106 through the contact surface, and then transferred to the heat dissipation medium by the bracket, and finally dissipated to the external environment through the plastic shell 102. The above contact relationship is relatively close, which can ensure efficient heat conduction.

[0066] It should be emphasized that the material of the shell in this solution is a plastic material with significantly improved thermal conductivity. The thermal conductivity of the plastic shell is greater than or equal to 1.0W / m·K, and its thermal conductivity is much greater than that of ordinary PC plastic. For example, it can be made of modified PA6 material. The plastic shell 102 made of modified PA6 nylon not only protects the internal components from the influence of the external environment, but also effectively transfers the internal heat to the external environment through its high thermal conductivity, thereby improving the heat dissipation efficiency. Specifically, on the one hand, by utilizing its excellent thermal conductivity, the heat dissipation effect can be ensured without additionally setting up a metal radiator. On the other hand, since the shell is made of a material with a high thermal conductivity, there is no need to design extra heat dissipation space, thereby ensuring the overall miniaturization requirements of the photovoltaic optimizer 100. The plastic shell 102 not only protects the internal circuit structure 104 from the influence of the external environment, but also plays a basic heat dissipation function. The design of the shell also needs to take into account the mechanical strength to withstand the impact and pressure that may be encountered during installation and operation.

[0067] Furthermore, by limiting the properties of the material, that is, the thermal conductivity of the plastic shell is greater than or equal to 1.2W / m·K, this higher thermal conductivity helps to more effectively transfer the heat generated inside to the shell surface and then dissipate it into the environment. Compared with the 0.2W / m·K of ordinary plastic materials, it has a significant improvement in thermal conductivity.

[0068] Furthermore, if Figure 1 and Figure 3 As shown, the photovoltaic line 112 is connected to the circuit structure 104 and led out through the plastic housing.

[0069] Of course, the bracket can be made of metal or other high thermal conductivity materials, and its design is usually considered to provide sufficient surface area to contact with the circuit structure 104 to optimize heat transfer.

[0070] It should be supplemented that the heat dissipation medium may be a heat-conductive potting glue, which may also contain heat-conductive particles to improve the overall heat conduction efficiency.

[0071] For the entire heat dissipation process, when the optimizer is working, the components in the circuit structure 104 generate heat. The generated heat is transferred to the heat dissipation bracket 106 through the contact surface between the circuit structure 104 and the heat dissipation bracket 106. The heat dissipation bracket 106 further transfers the absorbed heat to the surrounding heat dissipation medium. The heat dissipation medium absorbs the heat and evenly distributes the heat in the accommodation cavity 1032 to avoid the formation of hot spots. Finally, the heat dissipation medium transfers the heat to the plastic housing 102, and the heat is dissipated to the external environment from the housing surface.

[0072] Through the above structural features and connection relationships, the photovoltaic optimizer 100 can achieve effective heat dissipation, ensure that the circuit structure 104 operates at a safe temperature, extend the product life, and improve the overall performance.

[0073] In a specific embodiment, the plastic shell 102 is composed of a first shell 1022 and a second shell 1024 that are interlocked, the heat dissipation bracket 106 is arranged on the second shell 1024, and the interface 114 between the first shell 1022 and the second shell 1024 is sealed by welding. This design provides structural strength and heat dissipation efficiency while ensuring sealing. Specifically, the first shell 1022 and the second shell 1024 are the main external structures of the photovoltaic optimizer 100, and the two are interlocked to form a complete shell. The interface 114 of the two shells is sealed by welding to ensure waterproof and dustproof performance. The welding seal ensures that the internal electronic components are not affected by the external environment, such as water, dust and other pollutants. The interlocking design increases the overall strength of the shell, and welding further enhances the stability and durability of the structure. The two-part shell design is easy to manufacture and assemble, can simplify the production process, and improve production efficiency.

[0074] Furthermore, the interface 114 of the two shells is sealed by ultrasonic welding to ensure waterproof and dustproof performance, reaching IP68 level.

[0075] In some embodiments, a snap-fit ​​structure 1026 is optionally provided on one of the housings to snap-fit ​​the heat dissipation bracket 106 to the housing, which can effectively improve the installation efficiency of the heat dissipation bracket 106. Specifically, the snap-fit ​​structure 1026 is provided on the second housing 1024, and is used to achieve a detachable connection with the heat dissipation bracket 106, which facilitates the installation and disassembly of the heat dissipation bracket 106, simplifies the assembly and maintenance process, ensures that the heat dissipation bracket 106 will not loosen or fall off during operation, and provides a reliable mechanical connection.

[0076] like Figure 2 As shown, the clamping structure 1026 is disposed on the second housing 1024, providing a connection point with the heat dissipation bracket 106. The heat dissipation bracket 106 is connected to the second housing 1024 through the clamping structure 1026 to achieve detachable installation. The circuit structure 104 is installed on the heat dissipation bracket 106, and part of it contacts the support surface 1066 of the heat dissipation bracket 106 to achieve heat transfer.

[0077] Through this design, the optimizer has higher flexibility and convenience in assembly and maintenance. The detachable heat dissipation bracket 106 not only simplifies the production process, but also facilitates later maintenance and replacement, significantly improving the maintainability and overall reliability of the product. This structural design ensures the high efficiency of the heat dissipation path while ensuring the mechanical stability and reliability of the product.

[0078] The snap-fit ​​structure 1026 can be in the form of a slot, a buckle, a hook, etc. The specific design needs to take into account the convenience and firmness of installation.

[0079] In some embodiments, optionally, limiting the projected area and height ratio of the heat dissipation bracket 106 and the second housing 1024 can ensure the heat dissipation efficiency of the entire photovoltaic optimizer 100 and the stability of the overall structure. Figure 7 As shown, the projected area S2 of the heat dissipation bracket 106 on the bottom wall of the second shell 1024 is not less than 80% of the area S1 of the bottom wall of the second shell 1024. This requirement ensures that the heat dissipation bracket 106 has sufficient surface area to contact the second shell 1024, thereby improving the efficiency of heat transfer from the circuit structure 104 to the shell. A larger projected area means that there are more contact points between the heat dissipation bracket 106 and the second shell 1024, which helps to distribute heat more evenly. The increased contact area can improve the efficiency of heat transfer from the circuit structure 104 to the shell through the heat dissipation bracket 106.

[0080] In addition, if Figure 6As shown, by limiting the dimension H2 of the heat dissipation bracket 106 in the height direction of the second shell 1024 to be not less than 80% of the height H1 of the second shell 1024, it can be ensured that the heat dissipation bracket 106 has sufficient height to support the circuit structure 104, so that the gap between the circuit structure 104 located on the heat dissipation bracket 106 and the first shell 1022 is smaller, so that heat can be quickly transferred to the first shell 1022 through the heat dissipation medium and dissipated outward.

[0081] It can be understood that sufficient height can ensure that the heat dissipation bracket 106 can support the entire circuit structure 104 and maintain its stability. The heat dissipation bracket 106 with a larger height can provide more space for filling the heat dissipation medium, which helps to disperse and dissipate heat.

[0082] In a specific embodiment, Figure 5 As shown, the heat dissipation bracket 106 is composed of a connecting portion 1062 and a contact portion 1064 connected to each other. The connecting portion 1062 is the portion where the heat dissipation bracket 106 is connected to the plastic housing 102, and is mainly used to fix the heat dissipation bracket 106 on the plastic housing 102 to ensure good contact between the heat dissipation bracket 106 and the housing. The connecting portion 1062 ensures that the heat dissipation bracket 106 is stably installed on the plastic housing 102 and will not loosen due to vibration or temperature changes. The contact portion 1064 is the portion of the heat dissipation bracket 106 protruding from the connecting portion 1062. By directly contacting the contact portion 1064 with the heat generating portion of the circuit structure 104, heat can be quickly absorbed. Among them, by providing a supporting surface 1066 on the contact portion 1064, on the one hand, a stable support can be provided for the circuit structure 104 to ensure the stability of the circuit structure 104 during operation. On the other hand, the supporting surface 1066 serves as a direct contact surface for heat transfer from the circuit structure 104 to the heat dissipation bracket 106, and the supporting surface 1066 is the starting point of heat transfer.

[0083] The connecting portion 1062 cooperates with the snap-fit ​​structure 1026 to achieve snap-fit.

[0084] Of course, the design of the contact portion 1064 should ensure that there is a sufficiently large surface area in contact with the circuit structure 104 to improve the heat transfer efficiency.

[0085] It is understandable that the material of the heat dissipation bracket 106 should have good thermal conductivity, such as aluminum or copper, to ensure that heat can be transferred quickly.

[0086] Furthermore, surface treatment of the support surface 1066, such as anodizing or coating, can improve heat conduction efficiency and protect the material surface. The shape of the contact portion 1064 should match the shape of the circuit structure 104 to maximize the contact area and reduce air gaps.

[0087] The design of the heat dissipation bracket 106 ensures that the heat generated by the circuit structure 104 can be quickly transferred to the support surface 1066 and then transferred to the plastic housing 102 through the contact portion 1064 and the connecting portion 1062 .

[0088] In another specific embodiment, the connection portion 1062 is disposed at both ends of the contact portion 1064 to provide a more uniform support and heat transfer path. The connection portions 1062 at both ends can more evenly disperse the weight of the circuit structure 104 and reduce local stress. In addition, by disposing the connection portion 1062 at both ends of the contact portion 1064, it helps to form a more uniform heat flow path and reduce the formation of hot spots.

[0089] like Fig. 9 As shown, by providing a heat-conducting layer 116 on the support surface 1066, which is a layer of material with high thermal conductivity, it is used to improve the efficiency of heat transfer from the circuit structure 104 to the heat dissipation bracket 106. It can be understood that the thermal conductivity of the heat-conducting layer 116 is higher than the thermal conductivity of the heat dissipation bracket 106 itself, and heat can be transferred from the circuit structure 104 to the heat dissipation bracket 106 more quickly. The heat-conducting layer helps to evenly distribute heat on the support surface 1066 and reduce the risk of local overheating.

[0090] Materials with high thermal conductivity can quickly transfer heat from the circuit structure 104 to the heat dissipation bracket 106. Selecting a thermally conductive material with good thermal stability can ensure that the performance does not decrease during long-term operation.

[0091] Through this design, the heat dissipation bracket 106 of the photovoltaic optimizer 100 can not only effectively transfer and dissipate heat to maintain the stable operation of the circuit structure 104, but also can be easily maintained and replaced when necessary, thereby improving the reliability and maintainability of the product. By adding a heat-conducting layer, especially its high thermal conductivity, the heat dissipation efficiency can be significantly improved.

[0092] Of course, the thermal expansion coefficients of the thermal conductive layer and the heat dissipation bracket 106 need to be considered during design to ensure that their deformations match when the temperature changes to avoid damage caused by thermal stress. The addition of the thermal conductive layer should not affect the overall mechanical strength and durability of the heat dissipation bracket 106. The convenience of maintenance and replacement of the thermal conductive layer should be considered during design to meet possible needs during long-term use.

[0093] In a specific embodiment, optionally, Figure 4 As shown, a glue injection port 108 is provided on the plastic housing to allow the potting glue to be injected into the accommodating cavity 1032 of the plastic housing to protect and dissipate heat for the circuit structure 104. After the potting glue is injected, the glue injection port 108 can be sealed to ensure the waterproof and dustproof performance of the optimizer.

[0094] The potting compound generally has good thermal conductivity, which helps to transfer heat from the circuit structure 104 to the heat dissipation bracket 106 and the housing. Of course, the potting compound also has good electrical insulation properties, which can protect the circuit structure 104 from moisture and other environmental factors.

[0095] Furthermore, the glue injection port 108 is located at a convenient position for operation, so as to facilitate the injection of the potting glue and the subsequent sealing. For example, the glue injection port 108 can be provided on the first housing 1022 .

[0096] Specifically, the filling process of the potting compound includes: after the circuit structure 104 and the heat dissipation bracket 106 are installed in place, prepare to inject the potting compound, and evenly inject the potting compound into the accommodating cavity 1032 through the potting port 108 to ensure that all circuit structures 104 are completely covered. The potting compound needs a certain amount of time to solidify after injection to form a stable protective layer. After the potting compound is solidified, the potting port 108 is sealed to ensure the overall sealing and protection performance.

[0097] In a specific embodiment, optionally, reinforcing ribs 110 are provided on the outer surface of the plastic shell 102. The reinforcing ribs 110 can significantly improve the bending, torsion and compression resistance of the plastic shell 102. When subjected to external impact or internal pressure changes, the reinforcing ribs 110 help prevent the shell from being deformed or broken. In addition, the reinforcing ribs 110 provide additional support for the shell to ensure the stability of the structure under various use conditions.

[0098] The reinforcing ribs 110 of the present solution can improve the structural strength and also serve as an additional heat dissipation path to help disperse and transfer heat. By properly arranging the reinforcing ribs 110, the heat flow distribution in the shell can be optimized and the formation of hot spots can be reduced.

[0099] Since the reinforcing ribs 110 of the present solution are arranged on the outer surface of the plastic housing 102 , the filling effect during the glue pouring can be effectively reduced, and the possibility of generating bubbles or gaps can be reduced.

[0100] The reinforcing rib 110 and the housing are manufactured together by injection molding, which can ensure the tight combination between the reinforcing rib 110 and the housing. After injection molding, some post-processing, such as grinding or chemical treatment, may be required to ensure the surface quality and performance of the reinforcing rib 110.

[0101] By providing reinforcing ribs 110 on the outer surface of the plastic housing 102, the photovoltaic optimizer 100 can improve its structural strength and heat dissipation performance while ensuring lightness, thereby improving overall reliability and durability. This design is particularly important for photovoltaic devices used outdoors because they need to withstand the test of various environmental factors.

[0102] In a specific embodiment, optionally, the modified PA6 used for injection molding to form the plastic housing 102 specifically includes: PA6 nylon plastic, mineral powder, and glass fiber, wherein PA6 nylon plastic is used as the base material, and PA6 (polyamide 6) has good comprehensive properties, including mechanical strength, heat resistance, chemical resistance, and processing performance. Mineral powder is used as a filling material to improve the rigidity, heat resistance, and dimensional stability of the plastic housing 102. Glass fiber can significantly improve the tensile strength and impact resistance of the plastic housing 102.

[0103] The tensile strength of the plastic shell 102 is greater than or equal to 90 MPa. This relatively high tensile strength ensures the stability and durability of the shell when subjected to mechanical loads, and it is convenient to utilize this property to directly integrally inject the reinforcing rib 110 structure.

[0104] In addition, the flame retardancy rating of the plastic housing 102 is greater than or equal to V0 (according to the UL94 standard), which means that in a vertical burning test, the flame propagation speed of the material is extremely low, providing a higher safety performance.

[0105] Through the selection of materials and control of performance indicators in this solution, the plastic shell 102 of the photovoltaic optimizer 100 can provide the necessary strength, heat dissipation capacity and safety performance while ensuring lightweight, meeting the stringent requirements of the photovoltaic industry.

[0106] The present application provides another embodiment of a photovoltaic system 200, such as Figure 8 As shown, the photovoltaic system 200 includes a photovoltaic panel 202 and a photovoltaic optimizer 100. The use of the photovoltaic optimizer 100 improves the efficiency of power transmission, ensuring that the power collected from the photovoltaic panel 202 can be efficiently and stably transmitted to the subsequent circuit system.

[0107] Since the photovoltaic system 200 includes any of the above photovoltaic optimizers 100 , it has the beneficial effects of any of the above photovoltaic optimizers 100 , which will not be described in detail here.

[0108] In a specific embodiment, a photovoltaic optimizer is provided, including: an upper shell (ie, a first shell), a heat sink (ie, a heat dissipation structure), and a lower shell (ie, a second shell).

[0109] The upper shell and the lower shell are plastic shells. The circuit board (i.e., the circuit structure) and other components are in the sealed cavity of the upper and lower shells. The heat sink is fixed to the lower shell by the buckle (i.e., the buckle structure) on the lower shell.

[0110] The circuit board in the cavity is fixed on the heat sink, and the wire is led out through the opening formed by the merging of the upper and lower shells. The upper shell and the lower shell are plastic parts, and the two plastic parts are welded together by ultrasonic welding.

[0111] The potting port (i.e., glue filling port) is the injection port for the potting glue. After the product is assembled, the potting glue is injected through the potting port to fill the internal space of the cavity.

[0112] The circuit board in the product contacts the heat sink, transferring heat to the entire heat sink. The heat from the heat sink is then transferred to the potting compound in the entire cavity. After the potting compound absorbs the heat from the heat sink, it transfers the heat to the upper and lower shells. The heat is then exchanged with the upper and lower shells through natural wind to dissipate heat.

[0113] The heat of ordinary plastic materials is 0.2W / m·K. After the heat is transferred to the ordinary material shell, it is difficult to transfer it out, so more space or a metal radiator is needed to assist in heat dissipation to solve the heat exchange problem.

[0114] The plastic shell of this solution is made of modified PA6 and filled with mineral powder glass fiber. It is mostly used in LED (light-emitting diode) lighting, car lights, 5G heat dissipation shells, etc. Its chemical properties and mechanical properties can meet the requirements. The flame retardant performance meets the V0 level in UL94, and the tensile strength is 90MPa, which is higher than the 60MPa of ordinary plastic PC (polycarbonate). At the same time, it also ensures the strength of the product when there are no metal parts. The thermal conductivity of the modified PA6 is 1.2W / m·K, which is 6 times that of ordinary plastic materials, which can improve the thermal conductivity of the plastic shell itself.

[0115] In terms of mechanics, the product needs to pass pressure resistance test and impact test, and the tensile strength of modified PA6 is higher than that of ordinary materials. Therefore, by utilizing its mechanical properties, many reinforcing rib features are added to the product to ensure that the product can pass the mechanical test.

[0116] After using this material, the space of the shell size can be reduced accordingly, the use of metal radiators to enhance heat dissipation can be eliminated, and the strength of the product itself can be ensured.

[0117] According to the photovoltaic optimizer provided by the utility model, on the one hand, by utilizing its excellent thermal conductivity, the heat dissipation effect can be ensured without additionally setting up a metal heat sink. On the other hand, there is no need to design extra heat dissipation space, thereby ensuring the overall miniaturization requirement of the photovoltaic optimizer.

[0118] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0119] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0120] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0121] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A photovoltaic optimizer, characterized in that: include: A plastic shell, wherein a receiving cavity is formed in the plastic shell, and the receiving cavity is filled with a heat dissipation medium; A heat dissipation bracket is disposed in the accommodating cavity, and the heat dissipation bracket includes a supporting surface; A circuit structure is disposed in the accommodating cavity, and at least a portion of the circuit structure is in contact with a supporting surface of the heat dissipation bracket; The thermal conductivity of the plastic shell is greater than or equal to 1.0 W / m·K, and the heat generated by the circuit structure is dissipated through the plastic shell via the accommodating cavity.

2. The photovoltaic optimizer according to claim 1, characterized in that: The plastic housing comprises: A first shell and a second shell that are buckled together, the heat dissipation bracket being arranged on the second shell; The interface between the first shell and the second shell is sealed by welding.

3. The photovoltaic optimizer according to claim 2, characterized in that: The second shell is provided with a clamping structure, and the heat dissipation bracket is detachably connected to the second shell via the clamping structure.

4. The photovoltaic optimizer according to claim 2, characterized in that: The projected area of ​​the heat dissipation bracket on the bottom wall of the second shell is not less than 80% of the area of ​​the bottom wall of the second shell; and / or The dimension of the heat dissipation bracket in the height direction of the second shell is not less than 80% of the height of the second shell.

5. The photovoltaic optimizer according to claim 1, characterized in that: The heat dissipation bracket specifically comprises: A connecting portion and a contact portion connected to each other, wherein the connecting portion is connected to the plastic housing, and the contact portion protrudes from the connecting portion; Wherein, a surface of the contact portion away from the connecting portion is the supporting surface.

6. The photovoltaic optimizer according to claim 5, characterized in that: The connecting parts are arranged at two ends of the contact part, a heat-conducting layer is arranged on the supporting surface, and the heat conductivity of the heat-conducting layer is greater than the heat conductivity of the heat dissipation bracket.

7. The photovoltaic optimizer according to claim 1, characterized in that: Also includes: A glue filling port is provided on the plastic shell, the heat dissipation medium includes a potting glue, and the potting glue is poured through the glue filling port to fill the accommodating cavity.

8. The photovoltaic optimizer according to claim 1, characterized in that: Also includes: The reinforcing ribs are arranged on the outer surface of the plastic shell.

9. The photovoltaic optimizer according to claim 1, characterized in that: The material of the plastic shell includes PA6 nylon plastic, mineral powder and glass fiber; The tensile strength of the plastic shell is greater than or equal to 90 MPa.

10. The photovoltaic optimizer according to claim 1, characterized in that: The flame retardancy level of the plastic housing is greater than or equal to V0.

11. A photovoltaic system, characterized in that: include: Photovoltaic panels; The photovoltaic optimizer according to any one of claims 1 to 10, wherein the photovoltaic optimizer is electrically connected to the photovoltaic panel.

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