Sealing jig

Abstract

The utility model provides a packaging jig for forming a sealing glue layer on the front side of an LED light board, the packaging jig comprises: a first mold, comprising a main body and a blocking convex edge arranged on the first surface of the main body, the blocking convex edge and the first surface forming a receiving cavity for receiving the LED light board; a second mold, movably arranged relative to the first mold and having an installation position and a pressing position, the second mold having a second surface facing the first surface, when the second mold is located at the installation position, the second mold is spaced apart from the first mold, when the second mold is located at the pressing position, the second surface abuts against the blocking convex edge to form a glue injection space together with the first surface and the blocking convex edge; an ejection mechanism, arranged on the main body and capable of ejecting the LED light board out of the receiving cavity. The technical solution of the present application can effectively solve the problem in the related art that the assembly cost is increased in order to ensure the flatness of the box level or the screen level.

Description

Technical Field

[0001] The utility model relates to the technical field of LED display device assembly, in particular to a packaging fixture. Background Art

[0002] COB (Chips on Board) packaging can effectively solve the problem of LED heat dissipation, and can realize dustproof, moisture-proof and waterproof of the LED light board surface. At the same time, it makes the LED light board have a certain pressure resistance, and can also adjust the blackness of the PCB board of the LED light board to ensure the display effect after integration. There are many ways to inject glue (such as epoxy resin) into the existing COB light board, but the injection thickness benchmark of these methods is the LED lamp bead surface to ensure that the thickness of the final glue layer is consistent.

[0003] However, since the PCB board of the LED light board itself also has a certain manufacturing tolerance, when multiple LED light boards are spliced ​​to form a box or a display screen, it is difficult to ensure the flatness of the box level or the screen level. At this time, the assemblers need to adjust the flatness of the box level or the screen level, which increases the operation difficulty and assembly time of the assemblers, thereby increasing the assembly cost. Utility Model Content

[0004] The main purpose of the utility model is to provide a packaging jig to solve the problem in the related art that the assembly cost is increased in order to ensure the flatness of the box level or the screen level.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a packaging jig for forming a sealing layer on the front side of an LED lamp board, the packaging jig comprising: a first mold, comprising a main body and a blocking convex edge arranged on the first surface of the main body, the blocking convex edge and the first surface forming a housing cavity for accommodating the LED lamp board; a second mold, movably arranged relative to the first mold and having an installation position and a pressing position, the second mold having a second surface facing the first surface, when the second mold is located at the installation position, the second mold is spaced apart from the first mold, and when the second mold is located at the pressing position, the second surface abuts against the blocking convex edge to form a glue injection space together with the first surface and the blocking convex edge; an ejection mechanism, arranged on the main body and capable of ejecting the LED lamp board out of the housing cavity.

[0006] Furthermore, the main body includes a first mold base and a first mold core, the first mold base is provided with an installation cavity, the first mold core is arranged in the installation cavity, the first surface is formed on the first mold core, and the ejection mechanism can be movably arranged on the first mold base and penetrated through the first mold core to push the LED lamp board.

[0007] Further, the installation cavity includes a first cavity and a second cavity which are interconnected, the cross-sectional area of ​​the first cavity is larger than the cross-sectional area of ​​the second cavity, a step surface is formed between the first cavity and the second cavity, the first mold core includes a first core body and a second core body, the cross-sectional area of ​​the first core body is larger than the cross-sectional area of ​​the second core body, the first surface is formed on the first core body, the second core body is arranged in the second cavity, the first core body is arranged in the first cavity and is spaced apart from the step surface, and the ejection mechanism is arranged between the first core body and the step surface.

[0008] Furthermore, the ejection mechanism includes a driving rocker arm swingably arranged on the first mold base and an ejector pin structure movably penetrated through the first core body, the first end of the driving rocker arm penetrates outwardly from the first mold base to form an operating end, and the second end of the driving rocker arm extends between the first core body and the step surface to form a driving end and is movably penetrated through the ejector pin structure.

[0009] Furthermore, the ejector pin structure includes a main body block and a plurality of ejectors arranged on the main body block, the plurality of ejectors are penetrated through the first core body, the driving end is penetrated through the main body block, and a limiting rod penetrating through the main body block is arranged on the step surface.

[0010] Furthermore, the main body is provided with a plurality of air suction channels connected with the accommodating cavity, and each air suction channel has an air suction hole formed on the first surface and located on the inner side of the enclosure convex edge.

[0011] Furthermore, a relief groove for avoiding components on the rear side of the LED light board is provided on the bottom wall of the accommodating cavity.

[0012] Furthermore, a glue pouring channel penetrating the second surface is provided on the second mold, and / or a release layer is provided on the second surface.

[0013] Furthermore, the second mold includes a second mold base and a second mold core fixedly connected to the second mold base, and the second surface is formed on the second mold core.

[0014] Furthermore, the first mold also includes a sealing member arranged between the enclosure flange and the second surface.

[0015] The technical solution of the utility model is applied, the first mold is used to place the LED light board, the second mold is movably arranged relative to the first mold, when the second mold is located at the installation position, the second mold is spaced apart from the first mold, and the staff can place the LED light board into the accommodating cavity; when the second mold is located at the pressing position, the second mold is pressed on the first mold, the second surface is pressed against the enclosure convex edge and cooperates with the first surface and the enclosure convex edge to define the injection space. In specific operation, the staff can place the back of the LED light board against the first surface, and use the first surface as the reference for the injection thickness, so that the thickness of the multiple LED light boards after the injection (that is, the distance between the rear surface of the LED light board and the front surface of the glue layer) is consistent. After the injection operation is completed and the glue layer is solidified, the ejection mechanism is used to eject the LED light board to carry out the subsequent steps. In this way, when assembling the box or the whole screen, the flatness of the box level and the screen level can be effectively guaranteed without the need for the staff to perform other adjustment operations, which simplifies the operation of the staff, saves assembly time and shortens the project cycle, thereby reducing the overall project cost. Therefore, the technical solution of the present application can effectively solve the problem in the related art that the assembly cost is increased in order to ensure the flatness of the box level or the screen level. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0017] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of a packaging fixture according to the utility model is shown;

[0018] Figure 2 Shows Figure 1 Schematic diagram of the decomposition structure of the packaging fixture;

[0019] Figure 3 Shows Figure 1 A schematic diagram of the three-dimensional structure of the first mold core of the packaging fixture;

[0020] Figure 4 Shows Figure 3 A schematic diagram of a three-dimensional structure of the first mold core from another angle;

[0021] Figure 5 Shows Figure 1 A cross-sectional schematic diagram of a packaging fixture;

[0022] Figure 6 Shows Figure 5 An enlarged view of point A of the packaging fixture;

[0023] Figure 7 Shows Figure 1 A schematic cross-sectional view of the packaging fixture from another angle;

[0024] Figure 8 Shows Figure 7 An enlarged view of location B of the packaging fixture;

[0025] Fig. 9 The present invention is a flow chart of packaging a COB light board using the packaging fixture of the present invention.

[0026] The above drawings include the following reference numerals:

[0027] 1. LED light board;

[0028] 10. first mold; 11. main body; 111. first surface; 112. first mold base; 113. first mold core; 1131. first core body; 1132. second core body; 114. mounting cavity; 1141. first cavity body; 1142. second cavity body; 1143. step surface; 115. limit rod; 116. air suction channel; 12. enclosure convex edge; 13. accommodating cavity; 14. avoidance groove;

[0029] 20. Second mold; 21. Second surface; 22. Glue pouring channel; 23. Second mold base; 24. Second mold core;

[0030] 30. Ejector mechanism; 31. Driving rocker; 32. Ejector structure; 321. Main block; 322. Ejector;

[0031] 40. Glue injection space. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0033] Specifically, when splicing a box or a screen, the rear side surface of the LED light board 1 is generally used as the splicing base surface. The glue injection method in the prior art uses the front side of the PCB board of the LED light board as the glue injection base, which can only ensure that the thickness of the glue layer is consistent after the injection is completed. However, since the PCB board itself also has a certain manufacturing tolerance, the consistency of the thickness of the multiple LED light boards 1 after the injection is completed (that is, the distance between the rear surface of the LED light board to the front surface of the glue layer) is difficult to ensure, and thus the flatness at the box level or the screen level is difficult to ensure.

[0034] like Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the present application provides a packaging jig for forming a sealing glue layer on the front side of an LED light board 1. The embodiment of the packaging jig of the present application includes: a first mold 10, a second mold 20 and an ejection mechanism 30. The first mold 10 includes a body 11 and a retaining convex edge 12 arranged on a first surface 111 of the body 11. The retaining convex edge 12 and the first surface 111 form a receiving cavity 13 for receiving the LED light board 1; the second mold 20 is movably arranged relative to the first mold 10 and has an installation position and a pressing position. The second mold 20 has a second surface 21 facing the first surface 111. When the second mold 20 is located at the installation position, the second mold 20 is spaced apart from the first mold 10. When the second mold 20 is located at the pressing position, the second surface 21 abuts against the retaining convex edge 12 to form a glue injection space 40 together with the first surface 111 and the retaining convex edge 12; the ejection mechanism 30 is arranged on the body 11 and can eject the LED light board 1 from the receiving cavity 13.

[0035] According to the technical solution of this embodiment, the first mold 10 is used to place the LED light board 1, and the second mold 20 is movably arranged relative to the first mold 10. When the second mold 20 is located at the installation position, the second mold 20 is spaced apart from the first mold 10, and the staff can place the LED light board 1 into the accommodating cavity 13; when the second mold is located at the pressing position, the second mold 20 is pressed on the first mold 10, and the second surface 21 is pressed against the enclosure convex edge 12 and cooperates with the first surface 111 and the enclosure convex edge 12 to define the injection space 40. In specific operation, the staff can place the back of the LED light board 1 against the first surface 111, and use the first surface 111 as the reference for the injection thickness, so that the thickness of the multiple LED light boards after the injection (that is, the distance between the rear surface of the LED light board and the front surface of the glue layer) is consistent. After the injection operation is completed and the glue layer is solidified, the ejection mechanism 30 is used to eject the LED light board 1 to carry out the subsequent steps. In this way, when assembling the cabinet or the entire screen, the flatness of the cabinet and the screen can be effectively guaranteed without the need for the staff to perform other adjustment operations, which simplifies the staff's operation, saves assembly time and thus shortens the project cycle, thereby reducing the overall project cost. Therefore, the technical solution of this embodiment can effectively solve the problem in the related art that the assembly cost increases in order to ensure the flatness of the cabinet or the screen.

[0036] Specifically, in this embodiment, the first mold 10 is a lower mold, and the second mold 20 is an upper mold. During the injection operation, in order to avoid collision between the upper mold and the lower mold, the downward movement speed of the upper mold can be controlled by a program so that the upper mold and the lower mold are in stable contact.

[0037] In this embodiment, the thickness of the glue injection is determined by the distance between the first surface 111 and the second surface 21 (that is, the height of the enclosure convex edge 12), and has no direct connection with the PCB board. Therefore, the distance between the first surface 111 and the second surface 21 is determined and will not change due to the thickness tolerance of the PCB board. Specifically, the distance between the first surface 111 and the second surface 21 can be set to 2.6mm, and the distance between the upper surface of the glue layer and the upper surface of the PCB board can be set to 0.25mm.

[0038] It should be noted that the LED light board 1 includes a PCB board, lamp beads arranged on the front side of the PCB board, and various electronic components of different sizes arranged on the back side of the PCB board (hereinafter referred to as devices), and the periphery (outer frame) of the PCB board is the process edge. When describing this application, the "front side of the LED light board 1" used refers to the front side of the PCB board of the LED light board 1, and the "back side of the LED light board 1" refers to the back side of the PCB board, that is, the above-mentioned "using the back side of the LED light board 1 as the basis for the thickness of the glue injection" refers to using the back side of the PCB board as the basis for the thickness of the glue injection.

[0039] In the related art, since there are various models and specifications of LED light boards 1, in order to perform glue injection operations on LED light boards 1 of different models and specifications, it is necessary to equip each model and specification of LED light boards 1 with a packaging jig, and the supporting equipment (such as driving equipment, adsorption equipment, etc.) needs to be connected separately, which makes the cost of the jig high and the operation of replacing the jig is cumbersome, thereby greatly increasing the overall cost of injection molding; and it is very unfriendly to the injection molding of some small-batch and experimental LED light boards, because generally experimental or small-batch COB injection molding generally does not carry out production line-level manufacturing output, and only a small number of LED light boards will be injected at one time. If a packaging jig is specially manufactured for it, the cost will be uncontrollable and unrecoverable. Therefore, there will be a situation in which the COB light board finished product cycle in small projects is greatly lengthened or the project experiment is shelved.

[0040] In this embodiment, if Figure 2 as well as Figures 5 to 8 As shown, the main body 11 includes a first mold base 112 and a first mold core 113. The first mold base 112 is provided with an installation cavity 114. The first mold core 113 is provided in the installation cavity 114. The first surface 111 is formed on the first mold core 113. The ejection mechanism 30 is movably provided on the first mold base 112 and penetrates the first mold core 113 to push the LED light board 1. The main body 11 is set as a split structure, so that when performing glue injection operation on LED light boards 1 of different models and specifications, it is only necessary to replace the first mold core 113 that is compatible with the LED light board 1, without replacing other components, and without reconnecting the supporting equipment, which can effectively reduce the cost of the fixture and simplify the replacement operation.

[0041] In this embodiment, the first mold core 113 is set as an independent structure. When conducting experiments on the light output quality of adhesive layers with different thicknesses, the first mold core 113 can be replaced to adjust the distance between the first surface 111 and the second surface 21, thereby achieving the purpose of controlling the thickness of the adhesive layer. This is suitable for small batch scenarios such as laboratories or project pre-research, is easy to operate, and has controllable costs.

[0042] like Figure 2 as well as Figures 5 to 8 As shown, the installation cavity 114 includes a first cavity 1141 and a second cavity 1142 which are interconnected, the cross-sectional area of ​​the first cavity 1141 is larger than the cross-sectional area of ​​the second cavity 1142, a step surface 1143 is formed between the first cavity 1141 and the second cavity 1142, the first mold core 113 includes a first core 1131 and a second core 1132, the cross-sectional area of ​​the first core 1131 is larger than the cross-sectional area of ​​the second core 1132, the first surface 111 is formed on the first core 1131, the second core 1132 is arranged in the second cavity 1142, the first core 1131 is arranged in the first cavity 1141 and is spaced apart from the step surface 1143, and the ejection mechanism 30 is arranged between the first core 1131 and the step surface 1143. Among them, the shape of the first mold core 113 is compatible with the shape of the installation cavity 114, which can ensure stable assembly between the two. There is a gap between the first core body 1131 and the step surface 1143 for placing the ejection mechanism 30, which can reasonably utilize the space in the installation cavity 114 and make the structure compact.

[0043] The first mold base 112 includes a lower mold fixing plate and a lower mold frame disposed above the lower mold fixing plate, the installation cavity 114 vertically penetrates the lower mold frame, and the upper surface of the lower mold fixing plate forms the bottom surface of the installation cavity 114. The lower mold frame and the first mold core 113 are fixed to the lower mold fixing plate by bolts.

[0044] like Figure 2 , Figure 7 and Figure 8 As shown, the ejection mechanism 30 includes a driving swing rod 31 swingably arranged on the first mold base 112 and an ejector pin structure 32 movably penetrated through the first core 1131. The first end of the driving swing rod 31 penetrates outward from the first mold base 112 to form an operating end, and the second end of the driving swing rod 31 extends between the first core 1131 and the step surface 1143 to form a driving end and movably penetrates through the ejector pin structure 32. The driving swing rod 31 drives the ejector pin structure 32 to move to push the LED light board 1, which has the advantages of simple structure and easy operation.

[0045] like Figure 2 , Figure 5 and Figure 6 As shown, the ejector structure 32 includes a main body block 321 and a plurality of ejectors 322 arranged on the main body block 321. The plurality of ejectors 322 are arranged through the first core 1131, the driving end is arranged through the main body block 321, and a limiting rod 115 is arranged on the step surface 1143 and is arranged through the main body block 321. The limiting rod 115 is arranged along Figure 6The main body block 321 is provided with a vertical direction extending from the center of the main body block 321, and can guide the main body block 321, so that when the swing rod 31 is driven to swing, the ejector structure 32 can only be moved along the extension direction of the limit rod 115, thereby ensuring the reliability of the movement of the ejector structure 32. A plurality of ejectors 322 are provided for ejecting the LED light board 1, so that a large ejection force can be applied to the LED light board 1 and the ejector 322 is not easy to break.

[0046] Specifically, in this embodiment, a limiting hole for the limiting rod 115 to pass through and a driving hole for the driving rocker arm 31 to pass through are provided on the main body block 321, and an ejection hole for the ejector pin 322 to pass through is provided on the first core body 1131, wherein the limiting rod 115 and the limiting hole are clearance-matched, the driving rocker arm 31 and the driving hole are clearance-matched, and the ejector pin 322 and the ejection hole are clearance-matched, so as to prevent the ejection mechanism 30 from being stuck during the activity.

[0047] Specifically, after the curing of the glue layer is completed, the upper mold is controlled by the program to move to the installation position, and then the operating end of the ejection mechanism 30 is pressed down to drive the rocker arm 31 to swing and drive the ejector structure 32 to move to eject the LED light board 1 after the curing is completed and tilt it at a certain angle so that the staff can take it out. After that, check the packaging quality of the glue layer, such as whether there are bubbles, etc. If everything is good, an LED light board 1 (also known as a COB light board) encapsulated with epoxy resin is obtained. Since the manufacturing precision of the packaging jig is very high, there is no need for secondary processing of the epoxy resin surface, but there are process edges around it, which require high-precision CNC cutting. High-precision CNC cutting has its own technical advantages, and subsequent processing is relatively simple. After that, the COB light board is left to stand for 24 hours to release the stress generated by the CNC program, thereby obtaining a complete COB light board.

[0048] like Figure 3 and Figure 4 As shown, the main body 11 is provided with a plurality of air suction channels 116 communicating with the accommodating cavity 13, and each air suction channel 116 has an air suction hole formed on the first surface 111 and located on the inner side of the enclosure convex edge 12. The first end of the air suction channel 116 penetrates the first surface 111 to form an air suction hole, and the second end of the air suction channel 116 can be connected to an adsorption device, and the adsorption device is used to vacuum the first surface 111 and the back of the LED light board 1, so that the LED light board 1 is stably installed in the accommodating cavity 13. Specifically, the adsorption force of the vacuum adsorption is about 70Mpa, and this magnitude of adsorption force can well ensure the flatness of the PCB board and provide a good plane for the subsequent glue injection step.

[0049] like Figure 2 , Figure 3 , Figure 7 and Figure 8As shown, a shunting groove 14 for evading the components on the rear side of the LED light board 1 is provided on the bottom wall of the accommodating cavity 13. The shunting groove 14 can evade the components on the rear side of the LED light board 1 to prevent the components on the rear side of the LED light board 1 from interfering with the main body 11, so that the rear side surface of the PCB board of the LED light board 1 can be better adsorbed on the first surface 111, and the consistency of the thickness of the multiple LED light boards 1 after the glue injection can be effectively ensured. Specifically, there are multiple shunting grooves 14, and the multiple shunting grooves 14 correspond one-to-one to the multiple components on the rear side of the LED light board 1. When placing the LED light board 1, it can be placed manually or by a jig.

[0050] like Figure 1 , Figure 2 and Figure 7 As shown, the second mold 20 is provided with a glue injection channel 22 that passes through the second surface 21. After the installation of the LED light board 1 and the pressing of the first mold 10 and the second mold 20 are completed, the glue injection space 40 can be vacuumed by a vacuum pump connected to the glue injection channel 22, and then the epoxy resin is injected into the glue injection space 40 through the glue injection channel 22. Specifically, the amount of epoxy resin for injection can be determined according to the required injection thickness, injection area, and whether there is space for glue overflow. After the glue injection is completed, it is cured at room temperature for about 24 hours, so that the 0.25 mm thick epoxy resin layer can be completely cured. Of course, heat curing can also be selected. Within a certain temperature range, the curing time will become shorter as the temperature increases.

[0051] In this embodiment, a release layer is provided on the second surface 21. After the glue pouring and the glue layer solidification are completed, the second mold 20 needs to be switched to the installation position again, and a release film is provided on the second surface 21. The release film can prevent adhesion with the second mold core during the pouring of epoxy resin, and facilitates the separation of the solidified glue layer from the second surface 21.

[0052] like Figure 1 , Figure 2 , Figure 5 and Figure 7 As shown, the second mold 20 includes a second mold base 23 and a second mold core 24 fixedly connected to the second mold base 23, and the second surface 21 is formed on the second mold core 24. The second mold core 24 is fixed to the second mold base 23 by bolts, and a positioning column is provided on the second mold core 24, and a positioning hole matched with the positioning column is provided on the second mold base 23, so that the combination of the two is more accurate.

[0053] In this embodiment, the first mold 10 further includes a sealant disposed between the enclosure convex edge 12 and the second surface 21. By providing the sealant, a good vacuum space can be formed in the glue injection space 40 during the glue pouring operation, thereby avoiding bubbles inside the glue layer after solidification.

[0054] The following combination Fig. 9 The process of packaging the COB light board using the packaging fixture of this embodiment is described as follows:

[0055] First, prepare the packaging jig and adjust the inspection control program; place the un-injected LED light board 1 at the corresponding position of the lower mold (specifically, place it in the accommodating cavity 13), and fix it by vacuum adsorption (controlling suction); spray the release agent on the second surface 21 to form a release layer, and press the upper mold down to the lower mold through the control program, and vacuum extract the injection space 40; slowly inject the calculated amount of glue to ensure the pressure of the injection port of the injection channel, seal the pressure, and wait for the epoxy resin glue to evenly cover the lamp surface; cure at room temperature for 24 hours, take out the LED light board 1, and check the injection quality; CNC cut the process edge of the light board, check the cutting quality, and let the LED light board 1 stand for 24 hours after cutting to release the stress generated by the CNC; light up the LED light board 1 (if necessary) to obtain a COB light board with intact injection.

[0056] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0057] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0058] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A packaging jig for forming a sealing layer on the front side of an LED light board (1), characterized in that: The packaging fixture comprises: A first mold (10) comprises a main body (11) and a retaining flange (12) arranged on a first surface (111) of the main body (11), wherein the retaining flange (12) and the first surface (111) form a receiving cavity (13) for receiving the LED light board (1); a second mold (20) movably arranged relative to the first mold (10) and having an installation position and a pressing position, the second mold (20) having a second surface (21) facing the first surface (111), when the second mold (20) is located at the installation position, the second mold (20) is spaced apart from the first mold (10), and when the second mold (20) is located at the pressing position, the second surface (21) abuts against the enclosure convex edge (12) to form a glue injection space (40) together with the first surface (111) and the enclosure convex edge (12); An ejection mechanism (30) is arranged on the main body (11) and is capable of ejecting the LED lamp panel (1) out of the accommodating cavity (13).

2. The packaging jig according to claim 1, characterized in that: The main body (11) comprises a first mold base (112) and a first mold core (113); the first mold base (112) is provided with a mounting cavity (114); the first mold core (113) is arranged in the mounting cavity (114); the first surface (111) is formed on the first mold core (113); and the ejection mechanism (30) is movably arranged on the first mold base (112) and penetrates the first mold core (113) to push the LED lamp board (1).

3. The packaging jig according to claim 2, characterized in that: The installation cavity (114) comprises a first cavity (1141) and a second cavity (1142) which are interconnected, the cross-sectional area of ​​the first cavity (1141) is larger than the cross-sectional area of ​​the second cavity (1142), a step surface (1143) is formed between the first cavity (1141) and the second cavity (1142), the first mold core (113) comprises a first core (1131) and a second core (1132), the cross-sectional area of ​​the first core (1131) is larger than the cross-sectional area of ​​the second core (1132), the first surface (111) is formed on the first core (1131), the second core (1132) is arranged in the second cavity (1142), the first core (1131) is arranged in the first cavity (1141) and is spaced apart from the step surface (1143), and the ejection mechanism (30) is arranged between the first core (1131) and the step surface (1143).

4. The packaging jig according to claim 3, characterized in that: The ejection mechanism (30) comprises a driving rocker arm (31) swingably arranged on the first mold base (112) and an ejector pin structure (32) movably penetrated through the first core body (1131); the first end of the driving rocker arm (31) penetrates outward from the first mold base (112) to form an operating end, and the second end of the driving rocker arm (31) extends between the first core body (1131) and the step surface (1143) to form a driving end and is movably penetrated through the ejector pin structure (32).

5. The packaging jig according to claim 4, characterized in that: The ejector pin structure (32) comprises a main body block (321) and a plurality of ejector pins (322) arranged on the main body block (321); the plurality of ejector pins (322) are inserted through the first core body (1131); the driving end is inserted through the main body block (321); and a limiting rod (115) is arranged on the step surface (1143) and is inserted through the main body block (321).

6. The packaging jig according to any one of claims 1 to 5, characterized in that: The main body (11) is provided with a plurality of air suction channels (116) connected to the accommodating cavity (13), and each of the air suction channels (116) has an air suction hole formed on the first surface (111) and located on the inner side of the enclosure convex edge (12).

7. The packaging jig according to any one of claims 1 to 5, characterized in that: An escape groove (14) for evading components on the rear side of the LED light board (1) is provided on the bottom wall of the accommodating cavity (13).

8. The packaging jig according to any one of claims 1 to 5, characterized in that: The second mold (20) is provided with a glue pouring channel (22) penetrating the second surface (21), and / or the second surface (21) is provided with a release layer.

9. The packaging jig according to any one of claims 1 to 5, characterized in that: The second mold (20) comprises a second mold base (23) and a second mold core (24) fixedly connected to the second mold base (23), and the second surface (21) is formed on the second mold core (24).

10. The packaging jig according to any one of claims 1 to 5, characterized in that: The first mold (10) further comprises a sealing member arranged between the enclosure flange (12) and the second surface (21).

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