A multi-band Beidou Bluetooth composite miniaturized antenna

Abstract

Provided is a multi-band Beidou Bluetooth composite miniaturized antenna, which has an antenna cover and an antenna base plate fastened together as one; in a built-in closed cavity formed by the antenna cover and the antenna base plate, a multi-band Beidou antenna is provided on the upper surface of the antenna base plate; the antenna cover has a boss; a Bluetooth antenna is fixedly installed in the boss; the multi-band Beidou antenna and the Bluetooth antenna form a multi-band Beidou Bluetooth composite miniaturized antenna body. The utility model solves the technical problem of how to miniaturize the composite design of a multi-band Beidou Bluetooth antenna; improves the overall stability of the multi-band Beidou Bluetooth composite miniaturized antenna, realizes the miniaturized design of the product, can obtain a more ideal gain index, is fully functional, easy to implement, safe, practical, reliable, and convenient for production and debugging.

Description

Technical Field

[0001] The utility model belongs to the technical field of electrical basic electrical component antennas, and specifically relates to a multi-band Beidou Bluetooth composite miniaturized antenna. Background Art

[0002] With the continuous popularization and development of the Beidou satellite navigation system, various Beidou antennas have emerged. In the wave of globalization, the Beidou-3 antenna is particularly important due to its multi-band performance and global communication. At the same time, with the rapid development of science and technology, people's demand for equipment is no longer limited to pure performance. On the basis of ensuring ideal performance, they prefer convenience and versatility. Therefore, miniaturized technology and Beidou-3 antennas with composite other frequency band functions are the main research and development goals. In this regard, the following technical solutions are proposed. Utility Model Content

[0003] The technical problem solved by the utility model is: to provide a multi-band Beidou Bluetooth composite miniaturized antenna, and to solve the technical problem of how to miniaturize and compositely design the multi-band Beidou Bluetooth antenna.

[0004] The technical solution adopted by the utility model is as follows: a multi-band Beidou Bluetooth composite miniaturized antenna, comprising an antenna cover and an antenna base plate which are fastened together in an integral manner; a multi-band Beidou antenna is arranged on the upper end surface of the antenna base plate in a built-in closed cavity formed by the antenna cover and the antenna base plate; the antenna cover is provided with a boss; a Bluetooth antenna is fixedly installed in the boss; the multi-band Beidou antenna and the Bluetooth antenna form a multi-band Beidou Bluetooth composite miniaturized antenna body.

[0005] Among the above technical solutions, as the preferred technical solution of the utility model: the multi-band Beidou antenna is stacked in a pyramid shape from top to bottom by welding layer by layer; the multi-band Beidou antenna is composed of an S-band antenna printed board, an L-band antenna printed board, a B3-band antenna printed board, and a B2-band antenna printed board from top to bottom.

[0006] In the above technical scheme, as a further improvement of the utility model: a Beidou-band antenna feeding network board is welded on the back of the bottom of the multi-band Beidou antenna; a connector is welded on the back of the Beidou-band antenna feeding network board; the multi-band Beidou antenna and the Beidou-band antenna feeding network board constitute a multi-band Beidou antenna assembly; the Beidou-band antenna feeding network board of the multi-band Beidou antenna assembly is embedded and fastened to the antenna bottom plate as an integral whole.

[0007] In the above technical scheme, as a further improvement of the utility model: the Bluetooth antenna has a radio frequency cable connected to it; the radio frequency cable is fixed along the wiring groove of the antenna cover, and the radio frequency cable passes through the reserved hole of the Beidou frequency band antenna feeding network board to realize the Bluetooth signal transmission of the Bluetooth antenna.

[0008] Among the above technical solutions, as the preferred technical solution of the utility model: the surface of each printed circuit board of the multi-band Beidou antenna is a rectangular radiator, and first-order strip lines are provided at symmetrical positions around it; among them, the B3 and B2 bands use power dividers to widen the standing wave bandwidth to meet the standing wave requirements; the printed circuit boards of the multi-band Beidou antenna are all high-dielectric high-frequency substrates.

[0009] Among the above technical solutions, as the preferred technical solution of the utility model: the Bluetooth antenna adopts a spiral line formed by a printed circuit board, and is used to improve the antenna impedance through a T-type matching network, thereby achieving broadband matching of the Bluetooth frequency band.

[0010] In the above technical scheme, as a further improvement of the utility model: the outside of the Bluetooth antenna and the RF cable of the Bluetooth antenna are reinforced by filling with fixing glue, and a reserved hole is designed in the Beidou band antenna feeding network board to isolate the metal ground of the Beidou antenna and the Bluetooth antenna, thereby reducing the mutual coupling phenomenon between the Beidou band and the Bluetooth band.

[0011] Among the above technical solutions, as the preferred technical solution of the utility model: the antenna cover is made of high-strength engineering plastic PPS material, and its surface is sprayed with three-proof paint; the antenna base plate is made of surface-treated aluminum alloy material.

[0012] In the above technical solution, as a further improvement of the utility model: fixing glue is provided in the glue groove of the radome at the connection portion between the radome and the antenna base plate.

[0013] Among the above technical schemes, as the preferred technical scheme of the utility model: the material of the S-band antenna printed board is glass cloth plus PTFE composite ceramic high-frequency substrate; the material of the L-band antenna printed board and the B3-band antenna printed board is ceramic composite polytetrafluoroethylene resin high-frequency substrate; the material of the B2-band antenna printed board is ceramic composite polyphenylene ether resin high-frequency substrate.

[0014] The advantages of this utility model compared with the prior art:

[0015] 1. The utility model is arranged in a pyramid-like layered manner from top to bottom, which improves the overall stability of the multi-band Beidou Bluetooth composite miniaturized antenna and ensures signal reception and transmission.

[0016] 2. The printed circuit boards of the multi-band Beidou antennas of the utility model all adopt high-dielectric high-frequency substrates, and cooperate with the Bluetooth antenna design in the boss to effectively reduce the overall volume of the antenna and realize the miniaturization design of the product.

[0017] 3. The utility model realizes the signal transmission and reception of Beidou multi-band composite Bluetooth frequency band, takes into account the electromagnetic interference of each frequency band, and can obtain a more ideal gain index while ensuring miniaturization.

[0018] 4. All antennas of the utility model are made of domestic materials, which reduces the risk of material sources, has complete functions, is easy to implement, safe, practical and reliable.

[0019] 5. The utility model arranges first-order strip lines symmetrically around the rectangular radiators of the S-band antenna, the L-band antenna, the B3-band antenna, and the B2-band antenna, respectively, to facilitate production and debugging. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is the front view of the utility model;

[0021] Figure 2 It is a cross-sectional view of the utility model;

[0022] Figure 3 It is a schematic diagram of the back side of the utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the Bluetooth antenna of the utility model;

[0024] Figure 5 for Figure 4 Installation diagram of Bluetooth antenna;

[0025] Figure 6 It is the overall installation diagram of the utility model;

[0026] Figure 7 The radiation pattern of the S-band antenna of the utility model;

[0027] Figure 8 It is the standing wave curve diagram of the S-band antenna of the utility model;

[0028] Fig. 9 The radiation pattern of the L-band antenna of the utility model;

[0029] Fig.10 It is the standing wave curve diagram of the L-band antenna of the utility model;

[0030] Fig.11 This is the radiation pattern of the B3 frequency band antenna of the utility model;

[0031] Fig.12 It is the standing wave curve diagram of the B3 frequency band antenna of the utility model;

[0032] Fig.13 This is the radiation pattern of the B2 frequency band antenna of the utility model;

[0033] Fig.14 It is the standing wave curve diagram of the B2 frequency band antenna of the utility model;

[0034] Fig.15 The radiation pattern of the Bluetooth antenna of the utility model;

[0035] Fig.16 It is the standing wave curve diagram of the Bluetooth antenna of the utility model;

[0036] In the figure: 1-radome, 101-wiring groove, 102-radome glue groove, 1-1 boss, 2-antenna base plate, 3-S-band antenna printed board, 4-L-band antenna printed board, 5-B3-band antenna printed board, 6-B2-band antenna printed board, 7-Beidou-band antenna feed network board, 701-reserved hole, 8-connector, 9-Bluetooth antenna, 10-RF cable, 11-stainless steel pan head screw, 12-stainless steel countersunk screw, 13-multi-band Beidou antenna, 14-multi-band Beidou antenna assembly, 15-fixing glue. DETAILED DESCRIPTION

[0037] The following will be combined with the attached embodiment of the present utility model Figure 1-16 , clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] A multi-band Beidou Bluetooth composite miniaturized antenna comprises an antenna cover 1 and an antenna base plate 2 which are fastened together in an integrated manner. The fastening assembly structure is retained for easy disassembly and assembly.

[0039] The improvement of the utility model is that, in order to achieve a miniaturized and compact design: (such as Figure 1 , Figure 2 (As shown in the figure), in the built-in closed cavity formed by the antenna cover 1 and the antenna base plate 2, a multi-band Beidou antenna 13 is provided on the upper end surface of the antenna base plate 2 to realize the multi-band function of the Beidou antenna.

[0040] The antenna cover 1 has a boss 1-1 (such as Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown); the Bluetooth antenna 9 is solidified and installed in the boss 1-1; the function of the composite Bluetooth antenna is realized, and the composite Bluetooth antenna 9 is miniaturized and compactly installed in the boss 1-1.

[0041] The multi-band Beidou antenna 13 and the Bluetooth antenna 9 form a multi-band Beidou Bluetooth composite miniaturized antenna body.

[0042] In the above embodiment, as a preferred embodiment of the utility model: the multi-band Beidou antenna 13 is formed in a pyramid stacking shape from top to bottom by welding layer by layer. Layer-by-layer welding allows the welder to precisely control each welding layer to ensure that each layer of welding reaches the optimal quality. This welding method can significantly reduce welding defects such as pores, slag inclusions and unfusion, thereby improving the overall performance of the antenna. The pyramid stacking shape formed by the layer-by-layer welding of the antenna can enhance the stability of the structure and make it more reliable in complex environments. Each layer of welding increases the strength and rigidity of the structure, making the entire antenna more sturdy and durable. This design helps to improve the performance of the antenna, especially in applications where multiple frequency band signals need to be processed simultaneously. By welding layer by layer, antennas of different frequency bands can be more closely integrated together to improve the efficiency of signal transmission.

[0043] In the above embodiments, as the preferred technical solution of the utility model: (such as Figure 2 , Figure 6 The multi-band Beidou antenna 13 is composed of an S-band antenna printed board 3, an L-band antenna printed board 4, a B3-band antenna printed board 5, and a B2-band antenna printed board 6, which are connected together by tightening from top to bottom. The technical advantages are mainly reflected in frequency band isolation, electromagnetic coupling effect, impedance matching, signal coverage and positioning accuracy, and volume and weight optimization. These advantages make the multi-band Beidou antenna have broad application prospects in the fields of navigation positioning, communication command, etc.

[0044] In the above embodiment, preferably: the material of the S-band antenna printed circuit board 3 is a glass cloth plus PTFE composite ceramic high-frequency substrate.

[0045] It should be noted that PTFE (polytetrafluoroethylene) is widely used in microstrip antennas, which helps to reduce energy loss during signal transmission and improve the radiation efficiency of antennas. Combined with glass cloth and ceramic filler, by adjusting the material ratio, this composite substrate can present the characteristics of low loss and high dielectric constant, thereby ensuring the excellent performance and miniaturization of S-band antennas in high-frequency applications. The glass cloth reinforcement improves the strength and toughness of the substrate, giving it good mechanical properties and being able to withstand certain external force impact and vibration. At the same time, the PTFE material itself also has good high temperature resistance, which enables the composite substrate to maintain stable performance under different temperature environments. PTFE is a very corrosion-resistant material that can resist erosion by a variety of chemical substances. This allows the S-band antenna printed circuit board to maintain stable performance in harsh environments. In summary, the S-band antenna printed circuit board 3 uses glass cloth plus PTFE composite ceramic high-frequency substrate as the material, which has technical advantages such as low dielectric loss, high dielectric constant, good thermal stability and mechanical properties, high-precision drilling process and dimensional accuracy, excellent corrosion resistance and chemical stability, and a wide range of applications. These advantages make this composite substrate an ideal choice for S-band antenna printed boards.

[0046] In the above embodiment, preferably: the L-band antenna printed board 4 and the B3-band antenna printed board 5 are made of a ceramic composite polytetrafluoroethylene resin high-frequency substrate.

[0047] It should be noted that ceramic materials have excellent thermal and electrical conductivity. When combined with PTFE, these composite substrates can present a higher dielectric constant (Dk) and low dielectric loss (Df). The low dielectric constant helps reduce signal transmission delay, ensures the quality of signal transmission, and reduces signal loss. Ceramic materials themselves have good high temperature resistance. When combined with PTFE, this composite substrate can maintain stable electrical performance in high temperature environments. PTFE itself also has high thermal stability, and the operating temperature can reach 250°C, which makes the composite substrate perform well in high temperature working environments such as L band and B3 band. Ceramic materials have high hardness and good wear resistance. When combined with PTFE, this composite substrate has excellent mechanical properties and can withstand certain external impact and vibration. PTFE is a chemically inert material that shows good corrosion resistance to most chemicals and solvents. This composite substrate can resist the erosion of various chemicals, ensuring the stability and reliability of the antenna printed circuit board in harsh environments. Ceramic composite PTFE resin high-frequency substrates can be manufactured using high-precision processing technology, such as laser cutting, CNC drilling, etc., to ensure the dimensional accuracy and reliability of the antenna printed circuit board.

[0048] In the above embodiment, preferably: the material of the B2 frequency band antenna printed circuit board 6 is a ceramic composite polyphenylene ether resin high-frequency substrate.

[0049] It should be noted that polyphenylene oxide resin (PPO) itself has the characteristics of low dielectric constant (Dk) and low dielectric loss (Df), which makes PPO an ideal material for high-frequency applications. By compounding with ceramic materials, its electrical properties can be further optimized to ensure that the B2 band antenna printed circuit board has excellent signal transmission efficiency and quality in the high frequency range. The dielectric constant of polyphenylene oxide resin (PPO) is usually low, about 2.5. After modification and adjustment, the dielectric constant of polyphenylene oxide resin (PPO) material can be as high as more than 20, which can meet the dielectric constant requirements of antennas in different frequency bands. Polyphenylene oxide resin has excellent heat resistance and good thermal stability, and can maintain stable electrical properties in high temperature environments. After compounding with ceramic materials, this high-frequency substrate can maintain stable performance in a wider temperature range, meeting the working requirements of B2 band antennas in high temperature environments. Polyphenylene oxide resin has high mechanical strength, high dimensional stability and low moisture absorption. These characteristics make the polyphenylene ether resin (PPO) high-frequency substrate have better impact resistance, vibration resistance and wear resistance during manufacturing and use, and improve the reliability and service life of the antenna printed circuit board. Polyphenylene ether resin has good chemical stability and corrosion resistance, and can resist the erosion of various chemical substances. After compounding with ceramic materials, this high-frequency substrate can maintain stable performance in harsh chemical environments, ensuring the reliability of B2 band antennas in various applications. Ceramic composite polyphenylene ether resin high-frequency substrates can be manufactured using high-precision processing technologies such as laser cutting and CNC drilling. These technologies can ensure that the antenna printed circuit board has precise size and shape, meeting the dimensional accuracy requirements of B2 band antennas. As a thermoplastic resin, polyphenylene ether resin has good processability. This makes the ceramic composite polyphenylene ether resin high-frequency substrate more flexible and convenient in the manufacturing process, and can meet the needs of antenna printed circuit boards of different shapes and sizes.

[0050] In the above embodiments, as a further improved embodiment of the utility model: (such as Figure 2 The B2 band antenna printed circuit board 6 of the multi-band Beidou antenna 13 is welded with a Beidou band antenna feed network board 7 on the bottom back. The Beidou band antenna feed network board 7 is welded with a connector 8 on the back (as shown in FIG. Figure 8As shown). On the one hand, it is conducive to the miniaturized and compact design of multi-band composite antennas, and on the other hand, this design improves the integration of the antenna system; this integrated design helps to reduce the volume and weight of the antenna system, and is convenient for installation and use on various platforms. The design of the Beidou band antenna feed network board 7 can be optimized according to specific needs to achieve better performance matching. By adjusting the parameters of the feed network board, the performance indicators of the antenna such as gain, beam width and directivity can be optimized to meet the needs of specific application scenarios. This design has significant technical advantages in improving electrical connection performance, enhancing structural stability, simplifying installation and maintenance, improving antenna system integration, optimizing performance matching, and enhancing system reliability.

[0051] In the above embodiment, preferably: the connector 8 is a SSMP non-standard connector, and the connector 8 can also be a SSMP-K type RF connector. Wherein: the bottom back of the Beidou frequency band antenna feed network board 7 adopts a high temperature reflow soldering process to weld four SSMP-K type connectors 8 in a designated area.

[0052] It should be noted that the connector 8 is a miniature version of the SSMP-K as an SMP type connector, with a smaller size and smaller installation density, which makes it particularly suitable for board-to-board connection, especially in modular dense installation places. Its minimum size installation density can reach a connector center spacing of 4.3mm, which is very suitable for high-density blind plug-in application scenarios. The SSMP-K connector can operate in a frequency range of up to 65GHz, covering a wide range of communication frequency band requirements. Its wide-band operating range makes it an ideal choice for various high-frequency communication systems. The SSMP-K connector has the characteristics of low standing wave ratio (VSWR) and high cost performance. Its electrical performance is stable, and it can maintain stable signal transmission in a high-frequency environment and reduce signal loss. The SSMP-K connector adopts a plug-in structure, which is convenient and fast to plug in and transmit stable signals. Its design structure is stable and reliable, and can withstand certain external force impact and vibration, ensuring stable operation in harsh environments. The manufacturing process of the SSMP-K connector adopts high-precision processing technology, such as laser cutting, CNC drilling, etc., to ensure the dimensional accuracy and reliability of the product. This high-precision processing technology helps to improve the performance and service life of the connector. SSMP-K connectors are compatible with all standard connector interface IEC / MIL / CECC interface standards, enabling them to connect to a variety of different types of equipment and systems. This high compatibility and versatility make SSMP-K connectors have a wide range of application prospects in various application scenarios. SSMP connectors can be customized according to customer needs to meet different frequency bands, sizes and performance requirements. This customized service makes SSMP-K connectors more flexible and diversified to meet the specific needs of different customers.

[0053] In the above embodiment, further: metal probes and polytetrafluoroethylene media are inserted into corresponding holes of the S-band antenna printed board 3, the L-band antenna printed board 4, the B3-band antenna printed board 5, and the B2-band antenna printed board 6, and are stacked from top to bottom, and are soldered on the front of the Beidou band antenna feed network board 7 using low-temperature reflow soldering.

[0054] It should be noted that low-temperature reflow soldering effectively reduces the thermal stress of components and PCB boards by soldering at a temperature lower than that of conventional reflow soldering. The traditional reflow soldering temperature is usually around 220°C, while low-temperature reflow soldering avoids the problem of structural damage to solder joints and shortened component life caused by high temperature by reducing the soldering temperature. Since low-temperature reflow soldering reduces thermal stress, it improves the reliability of electronic components during the assembly process. This technology makes the solder joints more stable, reduces faults and failures caused by thermal stress, and thus improves the overall quality and reliability of the product. The double-sided heating technology used in low-temperature reflow soldering helps to reduce and prevent the bending and deformation of PCB boards. This technology heats both the front and back sides of the PCB board at the same time, making the temperature distribution more uniform, thereby reducing the deformation of the PCB board caused by temperature differences. Low-temperature reflow soldering uses imported N2 flowmeters, and the N2 concentration can be accurately controlled through data acquisition and control cards. This precise control helps to maintain the stability of the soldering environment and improve soldering quality. Low-temperature reflow soldering technology has high operational flexibility and adaptability. It can adjust parameters such as welding temperature, time and atmosphere according to different product requirements and process requirements to meet the welding needs of different electronic components.

[0055] In the above embodiment, further: the multi-band Beidou antenna 13 and the Beidou frequency band antenna feed network board 7 form a multi-band Beidou antenna assembly 14; the Beidou frequency band antenna feed network board 7 of the multi-band Beidou antenna assembly 14 is embedded and fastened to the antenna bottom plate 2 as a whole. The embedded structure further miniaturizes the design.

[0056] In the above embodiment, preferably, the Beidou frequency band antenna feed network board 7 of the multi-band Beidou antenna assembly 14 is fastened to the antenna base plate 2 as a whole using four stainless steel pan head screws 11. The four stainless steel pan head screws 11 are respectively coated with thread fasteners. The stainless steel pan head screws 11 have excellent installation and disassembly properties, excellent anti-loosening ability, excellent corrosion resistance and anti-rust performance, high strength and durability, good fire resistance, high aesthetics, and strong customizability. Applying thread fasteners further improves the connection reliability and anti-loosening performance.

[0057] In the above embodiments, as a further improved embodiment of the utility model: (such as Figure 2 , Figure 3 , Figure 4 , Figure 5(As shown in the figure) the Bluetooth antenna 9 has a radio frequency cable 10 connected to it; the radio frequency cable 10 is fixed along the wiring groove 101 of the antenna cover 1, and the radio frequency cable 10 passes through the reserved hole 701 of the Beidou frequency band antenna feeding network board 7 to realize the Bluetooth signal transmission of the Bluetooth antenna 9.

[0058] In the above embodiment, as a preferred embodiment of the utility model: the surface of each printed circuit board of the multi-band Beidou antenna 13 is a rectangular radiator, and a first-order strip line is provided at a symmetrical position around it. By adjusting the size of the strip line in the later stage, the debugging of the antenna is convenient and the production efficiency is improved.

[0059] In the above embodiment, the B3 and B2 frequency bands use power dividers to broaden the standing wave bandwidth to meet the standing wave requirements; the printed circuit boards of the multi-band Beidou antenna 13 are all high-dielectric high-frequency substrates, which effectively reduces the overall volume of the antenna and realizes the miniaturization design of the product.

[0060] It should be noted that the power divider widens the standing wave bandwidth. The power divider can effectively distribute the input RF signal to multiple output ports, while widening the standing wave bandwidth to ensure the stability and reliability of the signal during transmission. By optimizing the design of the power divider, the loss of the signal during transmission can be reduced and the transmission quality of the signal can be improved. The B3 and B2 frequency bands have specific requirements for the standing wave bandwidth. The application of power dividers can ensure that the signal transmission in these frequency bands meets the corresponding technical indicators.

[0061] It should be noted that high-dielectric high-frequency substrates have higher dielectric constants and lower loss tangents, which help to increase the gain of the antenna, reduce the noise factor, and improve the radiation efficiency. The use of high-dielectric high-frequency substrates can reduce the physical size of the antenna, making the antenna more compact and lightweight, suitable for various space-constrained application scenarios. High-dielectric high-frequency substrates have lower frequency drift and temperature coefficients, and can maintain stable performance under different working environments and temperature conditions, ensuring stable signal transmission.

[0062] In the above embodiment, as a preferred embodiment of the utility model: the Bluetooth antenna 9 is in the form of a spiral line processed by a printed circuit board, and is used to improve the antenna impedance through a T-type matching network, thereby achieving broadband matching of the Bluetooth frequency band.

[0063] It should be noted that the T-type matching network can achieve effective broadband matching within the Bluetooth frequency band due to its wide bandwidth characteristics. This matching performance ensures that the antenna has good signal transmission efficiency and stability within the Bluetooth frequency band. The use of a T-type matching network can adjust the input impedance of the antenna to match the output impedance of the Bluetooth module. This optimization of impedance matching reduces signal loss and improves the quality of signal transmission. The Bluetooth antenna 9 in the form of a spiral is processed through a printed circuit board and is small, concealed and has good directivity. This design allows the antenna to be easily integrated into various Bluetooth devices while maintaining efficient signal transmission performance. By optimizing impedance matching and adopting broadband matching technology, the Bluetooth antenna 9 can transmit Bluetooth signals more efficiently. This helps to increase the communication distance and transmission speed of Bluetooth devices and improve user experience.

[0064] In the above embodiment, as a further improved embodiment of the utility model: the Bluetooth antenna 9 and the outside of the RF cable 10 of the Bluetooth antenna 9 are filled and reinforced by fixing glue 15, and the Beidou band antenna feeding network board 7 is designed with a reserved hole 701 to isolate the metal ground of the Beidou antenna and the Bluetooth antenna, thereby reducing the mutual coupling phenomenon between the Beidou band and the Bluetooth band.

[0065] In the above embodiment, preferably: the radio frequency cable 10 is a radio frequency cable with an IPEX connector. The fixing glue 15 is silica gel.

[0066] It should be noted that the IPEX connector RF cable has fast transmission speed, high stability, small size, and good compatibility. The IPEX connector can support high-frequency signal transmission up to 6GHz. This high-frequency support capability ensures the transmission quality and stability of wireless signals and meets the needs of modern wireless communications for high-speed, high-quality signal transmission. The IPEX connector uses a spring-type connection method, which can ensure the reliability of the connection and reduce the risk of loose or falling connections. At the same time, the IPEX connector is also highly durable and can meet the needs of long-term use. The connection and removal of the IPEX connector is very convenient and can be easily completed with just a flick of the hand. This ease-of-use design reduces the user's operating difficulty and improves the efficiency of use.

[0067] The technical advantages of choosing silicone for fixing glue 15 are: silicone has excellent high temperature resistance and a wide range of applicable temperatures, usually up to -40℃ to 300℃. This means that in a high temperature environment, the silicone fixing glue can still maintain good performance and shape without melting or losing viscosity. Silicone shows good stability to most chemicals, such as acids, alkalis, salts, etc. This allows the silicone fixing glue to maintain stable performance in various chemical environments and is not easily eroded or destroyed by chemicals. Silicone has good flexibility and elasticity, and can adapt to the fit of various irregular or complex surfaces to form a strong adhesion. This excellent elasticity and firmness allows the silicone fixing glue to effectively fix items and prevent them from falling off or shifting. Silicone has good electrical insulation properties and can maintain stable resistance over a wide temperature range and frequency range. This allows the silicone fixing glue to ensure the safety and stability of the circuit in applications in the fields of electronics and electrical engineering. As a polymer material, silicone has excellent anti-aging properties. Even during long-term use, the silicone fixing glue will not show obvious performance degradation or aging, ensuring its stability and reliability in long-term use. Silicone is a non-toxic, odorless, environmentally friendly material that does not cause any harm to human health. Silicone fixing glue has good removability. If the fixed items need to be replaced or repaired, they can be easily removed without damaging the fixed items or surfaces.

[0068] Specifically: After the back of the Bluetooth antenna 9 is coated with silicone, the Bluetooth antenna 9 is bonded and constrained to be fixed in the boss 1-1. The front of the Bluetooth antenna 9 is welded with inductor and capacitor components to match the standing wave, and the RF cable 10 with an IPEX connector is used. After the RF cable 10 passes through the reserved wiring groove 101 of the antenna cover 1 and the reserved hole 701 of the Beidou frequency band antenna feed network board 7, silicone is also coated at the position of the reserved hole 701, so as to reinforce the position of the RF cable 10.

[0069] In the above-mentioned embodiment, as a preferred embodiment of the utility model: the antenna cover 1 is made of high-strength engineering plastic PPS, and its surface is sprayed with three-proof paint; the antenna base plate 2 is made of aluminum alloy material after surface treatment.

[0070] It should be noted that the high-strength engineering plastic PPS material has technical advantages such as high heat resistance, excellent mechanical properties, good dimensional stability, electrical properties, flame retardancy, chemical stability, easy processing, high rigidity and low water absorption. The three-proof paint has strong protection, good adhesion, good insulation, high temperature resistance, convenient production, many types, good environmental protection, and chemical corrosion resistance. The antenna base plate 2 of the aluminum alloy material after surface treatment forms a uniform and dense oxide film (such as Al2O3) on the surface of the aluminum alloy through surface treatment processes such as anodizing. This oxide film has excellent protection and can significantly improve the corrosion resistance of the aluminum alloy. Prevent the corrosive media (such as moisture, oxygen, acid and alkali, etc.) in the environment from directly contacting the aluminum alloy matrix, thereby effectively preventing the occurrence of corrosion. The surface-treated aluminum alloy, such as using chemical plating or physical vapor deposition (PVD) technology, can form a layer of high hardness and high wear resistance coating on the surface. This coating can effectively improve the surface hardness of the aluminum alloy and increase wear resistance, thereby extending its service life. Different surface treatment processes can give aluminum alloy surfaces different colors, textures and glossiness. For example, electrophoresis, spraying and other processes can make the aluminum alloy surface present various colors and maintain metallic luster. It can meet the aesthetic needs of different customers and make aluminum alloy products more beautiful and elegant. Surface treatment technologies, such as anodizing and micro-arc oxidation, can form a dense ceramic surface film layer on the surface of aluminum alloy. This film layer has excellent dimensional stability and can reduce the dimensional changes caused by environmental factors such as temperature and humidity during the use of aluminum alloy products. Surface treatment processes such as spraying and polishing can improve the smoothness and glossiness of the aluminum alloy surface, reduce surface roughness, thereby reducing the friction coefficient and improving the lubrication conditions of aluminum alloy products. These surface treatment technologies can also remove tiny burrs and defects on the surface of aluminum alloys and improve the surface quality of products. Modern surface treatment processes pay more and more attention to environmental protection, such as using environmentally friendly coatings such as low volatile organic compound (VOC) coatings and water-based coatings for spraying. These environmentally friendly coatings can reduce pollution to the environment and meet the requirements of sustainable development.

[0071] In the above embodiment, as a further improved embodiment of the utility model: a fixing glue 15 is provided in the radome glue groove 102 at the connection part between the radome 1 and the antenna bottom plate 2, so as to increase the reliability of the fastening connection.

[0072] In the above embodiment, as a further improved embodiment of the utility model: the antenna cover 1 and the antenna base plate 2 are fastened together using nine stainless steel countersunk screws 12. The stainless steel countersunk screws 12 have excellent rust and corrosion resistance, high hardness and toughness, can withstand large tensile and shear forces, are easy to install, beautiful, and meet many international standards, such as DIN965 (German standard), ISO7046-2 (international standard), JIS B1111 (Japanese standard) and ANSI / ASMEB18.6.3 (American standard).

[0073] From the above description, it can be found that the utility model has a pyramid-like layered arrangement from top to bottom, which improves the overall stability of the multi-band Beidou Bluetooth composite miniaturized antenna and ensures signal reception and transmission.

[0074] The printed circuit boards of the multi-band Beidou antenna of the utility model all adopt a high-dielectric high-frequency substrate, which is coordinated with the Bluetooth antenna design in the boss to effectively reduce the overall volume of the antenna and realize the miniaturization design of the product.

[0075] The utility model realizes the signal transmission and reception of Beidou multi-band composite Bluetooth band, takes into account the electromagnetic interference of each band, and can obtain a relatively ideal gain index (such as Figures 7 to 16 shown).

[0076] Each antenna of the utility model adopts domestic materials, which reduces the risk of material sources, has complete functions, is easy to implement, and is safe, practical and reliable.

[0077] The utility model arranges first-order strip lines at symmetrical positions around rectangular radiators of the S-band antenna, the L-band antenna, the B3-band antenna and the B2-band antenna, respectively, to facilitate production and debugging.

[0078] In summary, the utility model solves the technical problem of how to miniaturize the composite design of the multi-band Beidou Bluetooth antenna; improves the overall stability of the multi-band Beidou Bluetooth composite miniaturized antenna, and realizes the miniaturized design of the product. It can obtain a relatively ideal gain index, has complete functions, and is compatible with the Beidou multi-band composite Bluetooth band requirements. At the same time, it has good manufacturability, relatively ideal performance indicators, and is easy to achieve. It is safe, practical, reliable, and easy to produce and debug.

[0079] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0080] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification and equivalent replacement made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A multi-band Beidou Bluetooth composite miniaturized antenna, comprising an antenna cover (1) and an antenna base plate (2) fastened together in an integral manner; characterized in that: In the built-in closed cavity formed by the antenna cover (1) and the antenna base plate (2), a multi-band Beidou antenna (13) is provided on the upper end surface of the antenna base plate (2); the antenna cover (1) is provided with a boss (1-1); a Bluetooth antenna (9) is fixedly installed in the boss (1-1); the multi-band Beidou antenna (13) and the Bluetooth antenna (9) form a multi-band Beidou Bluetooth composite miniaturized antenna body.

2. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 1, characterized in that: The multi-band Beidou antenna (13) is stacked in a pyramid shape from top to bottom by welding layer by layer; the multi-band Beidou antenna (13) is composed of an S-band antenna printed board (3), an L-band antenna printed board (4), a B3-band antenna printed board (5), and a B2-band antenna printed board (6) from top to bottom.

3. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 2, characterized in that: A Beidou frequency band antenna feeding network board (7) is welded on the back of the bottom of the multi-band Beidou antenna (13); a connector (8) is welded on the back of the Beidou frequency band antenna feeding network board (7); the multi-band Beidou antenna (13) and the Beidou frequency band antenna feeding network board (7) form a multi-band Beidou antenna assembly (14); the Beidou frequency band antenna feeding network board (7) of the multi-band Beidou antenna assembly (14) is embedded and fastened to the antenna bottom plate (2) as a whole.

4. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 1, characterized in that: The Bluetooth antenna (9) has a radio frequency cable (10) connected thereto; the radio frequency cable (10) is fixed along a wiring groove (101) of the antenna cover (1), and the radio frequency cable (10) passes through a reserved hole (701) of a Beidou frequency band antenna feeding network board (7) to realize Bluetooth signal transmission of the Bluetooth antenna (9).

5. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 1, 2 or 3, characterized in that: The surface of each printed circuit board of the multi-band Beidou antenna (13) is a rectangular radiator, and first-order strip lines are arranged at symmetrical positions around the radiator; The B3 and B2 frequency bands use power dividers to broaden the standing wave bandwidth to meet the standing wave requirements; and the printed circuit boards of the multi-band Beidou antenna (13) are all high-dielectric high-frequency substrates.

6. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 1 or 4, characterized in that: The Bluetooth antenna (9) is in the form of a spiral line processed from a printed circuit board and is used to improve antenna impedance through a T-type matching network, thereby achieving broadband matching of the Bluetooth frequency band.

7. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 1 or 4, characterized in that: The exterior of the Bluetooth antenna (9) and the radio frequency cable (10) of the Bluetooth antenna (9) are filled and reinforced by fixing glue (15), and a reserved hole (701) is designed on the Beidou frequency band antenna feeding network board (7) to isolate the metal grounds of the Beidou antenna and the Bluetooth antenna, thereby reducing the mutual coupling phenomenon between the Beidou frequency band and the Bluetooth frequency band.

8. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 1, characterized in that: The antenna cover (1) is made of high-strength engineering plastic PPS, and its surface is sprayed with three-proof paint; the antenna base plate (2) is made of surface-treated aluminum alloy material.

9. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 1 or 8, characterized in that: A fixing glue (15) is provided in the radome glue groove (102) at the connection portion between the radome (1) and the antenna base plate (2).

10. The multi-band Beidou Bluetooth composite miniaturized antenna according to claim 2, characterized in that: The material of the S-band antenna printed board (3) is a glass cloth plus PTFE composite ceramic high-frequency substrate; the material of the L-band antenna printed board (4) and the B3-band antenna printed board (5) is a ceramic composite polytetrafluoroethylene resin high-frequency substrate; and the material of the B2-band antenna printed board (6) is a ceramic composite polyphenylene ether resin high-frequency substrate.

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