A communication substrate heat dissipation device

Abstract

The utility model relates to a heat dissipation device for a communication substrate, comprising: a heat dissipation box body, in which a communication substrate is installed; a mobile heat dissipation component installed in the heat dissipation box body; a heat dissipation fan component connected to the mobile heat dissipation component for dissipating heat for the communication substrate; a bottom heat dissipation plate, provided with a plurality of heat dissipation holes, for dissipating heat through natural convection or forced convection. The present invention solves the technical problem that the fixed heat dissipation device in the prior art cannot be adjusted according to the heat distribution of the communication substrate, resulting in limited heat dissipation effect, poor flexibility and inconvenient maintenance.

Description

Technical Field

[0001] The utility model belongs to the technical field of communication heat dissipation, and specifically refers to a communication substrate heat dissipation device. Background Art

[0002] In modern communication equipment, the heat dissipation of the communication substrate is an important factor in ensuring the stability and reliability of the equipment. Existing communication substrate heat dissipation devices are mainly fixed, which usually install the communication substrate in a heat dissipation box and conduct and dissipate heat through a fan or heat sink. However, this fixed heat dissipation method has certain limitations.

[0003] The heat dissipation device of the prior art mainly has the following disadvantages:

[0004] 1. Limited heat dissipation effect: Fixed heat dissipation devices cannot be adjusted according to the heat distribution of the communication substrate due to their fixed position, which may lead to poor heat dissipation in certain areas, thus affecting the overall heat dissipation efficiency of the communication substrate.

[0005] 2. Lack of flexibility: Fixed heat sinks cannot be moved to dissipate heat. When different areas on the communication substrate generate different amounts of heat, the high-heat areas cannot be intensively dissipated, resulting in uneven heat dissipation.

[0006] 3. Inconvenient maintenance: Since the heat dissipation device is fixedly installed, when the heat dissipation fan or other heat dissipation components fail, maintenance and replacement are relatively difficult, which affects the maintenance efficiency of the equipment.

[0007] Therefore, there is an urgent need for a new communication substrate heat dissipation device that can improve the heat dissipation effect while increasing the flexibility and maintenance convenience of the heat dissipation device to solve the shortcomings of the existing technology. Utility Model Content

[0008] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a communication substrate heat dissipation device.

[0009] The technical solution adopted by the utility model is as follows: the utility model provides a communication substrate heat dissipation device, including: a heat dissipation box, in which a communication substrate is installed; a mobile heat dissipation component, installed in the heat dissipation box; a heat dissipation fan component, connected to the mobile heat dissipation component, for dissipating heat for the communication substrate; a bottom heat dissipation plate, provided with multiple heat dissipation holes, for dissipating heat through natural convection or forced convection.

[0010] Furthermore, the mobile heat dissipation assembly includes a first fixing plate and a second fixing plate, wherein the first fixing plate is installed in the heat dissipation box, and the second fixing plate can move on the first fixing plate.

[0011] Furthermore, the mobile heat dissipation assembly also includes a first threaded rod and a first guide column. The first motor drives the first threaded rod to rotate, thereby driving the second fixed plate to move on the first guide column for lateral movement of the heat dissipation fan assembly.

[0012] Furthermore, the mobile heat dissipation assembly also includes a second threaded rod and a second guide column. The second motor drives the second threaded rod to rotate, thereby driving the fan fixing plate to move on the second guide column for longitudinal movement of the heat dissipation fan assembly.

[0013] Furthermore, the heat dissipation fan assembly includes a fan, and the fan is used to dissipate heat from the communication substrate through heat dissipation holes on the bottom heat dissipation plate.

[0014] Furthermore, the heat dissipation box also includes an upper plate for covering the top of the heat dissipation box to prevent external dust and debris from entering.

[0015] Based on the above technical solution, the communication substrate is efficiently cooled by a mobile heat dissipation assembly and a heat dissipation fan assembly arranged in the heat dissipation box, and natural convection or forced convection heat dissipation is achieved through the heat dissipation holes on the bottom heat dissipation plate, thereby solving the problem of poor heat dissipation of the communication substrate in a high temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A main structure diagram of a communication substrate heat dissipation device provided by the utility model;

[0017] Figure 2 A bottom structural diagram of a communication substrate heat dissipation device provided by the utility model;

[0018] Figure 3 A structural diagram of the connection between the communication substrate and the mobile heat dissipation component provided by the utility model;

[0019] Figure 4 This is a top structural diagram of the mobile heat dissipation component provided by the utility model;

[0020] Figure 5 This is a bottom structural diagram of the mobile heat dissipation component provided by the utility model.

[0021] Among them, 1. upper plate, 2. heat dissipation box, 3. bottom heat dissipation plate, 4. communication substrate, 5. mobile heat dissipation assembly, 6. heat dissipation fan assembly, 501. first fixed plate, 502. second fixed plate, 503. first threaded rod, 504. first guide column, 505. second guide column, 506. second threaded rod, 507. second motor, 508. first motor, 601. fan fixing plate, 602. fan.

[0022] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention. Specific embodiment:

[0026] like Figure 1-Figure 4 As shown, the utility model provides, in a possible embodiment, a communication substrate heat dissipation device, including: a heat dissipation box 2, in which a communication substrate 4 is installed; a mobile heat dissipation component 5, installed in the heat dissipation box 2; a heat dissipation fan component 6, connected to the mobile heat dissipation component 5, for dissipating the heat of the communication substrate 4; a bottom heat dissipation plate 3, provided with a plurality of heat dissipation holes, for dissipating heat by natural convection or forced convection.

[0027] like Figure 1 , Figure 3 and Figure 4 As shown, in a possible implementation manner provided by the present invention, the mobile heat dissipation assembly 5 includes a first fixing plate 501 and a second fixing plate 502 , wherein the first fixing plate 501 is installed in the heat dissipation box 2 . The second fixing plate 502 can move on the first fixing plate 501 .

[0028] like Figure 3-Figure 5 As shown, in a possible implementation mode provided by the utility model, the mobile heat dissipation assembly 5 also includes a first threaded rod 503 and a first guide column 504, and the first motor 508 drives the first threaded rod 503 to rotate, thereby driving the second fixed plate 502 to move on the first guide column 504, for lateral movement of the heat dissipation fan assembly 6.

[0029] like Figure 3-Figure 5As shown, the utility model provides, in a possible implementation, the mobile heat dissipation assembly 5 also includes a second threaded rod 506 and a second guide column 505, and the second motor 507 drives the second threaded rod 506 to rotate, thereby driving the fan fixing plate 601 to move on the second guide column 505, for longitudinal movement of the heat dissipation fan assembly 6.

[0030] like Figure 2-Figure 5 As shown, the present invention provides, in a possible implementation, the heat dissipation fan assembly 6 includes a fan 602, and the fan 602 is used to dissipate heat for the communication substrate 4 through the heat dissipation holes on the bottom heat dissipation plate 3.

[0031] like Figure 1 As shown, the utility model provides, in a possible implementation manner, the heat dissipation box body 2 further includes an upper plate 1 for covering the top of the heat dissipation box body 2 to prevent external dust and debris from entering.

[0032] like Figure 1 As shown, the utility model provides, in a possible implementation manner, the upper plate 1 is detachably mounted on the upper portion of the heat dissipation box body 2 .

[0033] Specific working process:

[0034] The communication substrate heat dissipation device includes a heat dissipation box 2, in which a communication substrate 4 is installed. A mobile heat dissipation component 5 is also installed in the heat dissipation box 2. The mobile heat dissipation component 5 includes a first fixed plate 501 and a second fixed plate 502. The first fixed plate 501 is fixed in the heat dissipation box 2, and the second fixed plate 502 can move on the first fixed plate 501.

[0035] The design of the mobile heat dissipation component 5 enables the heat dissipation fan component 6 to move flexibly in the heat dissipation box 2. Specifically, the mobile heat dissipation component 5 also includes a first threaded rod 503 and a first guide column 504. The first motor 508 drives the first threaded rod 503 to rotate, thereby driving the second fixed plate 502 to move laterally along the first guide column 504, thereby realizing the lateral movement of the heat dissipation fan component 6.

[0036] In addition, the mobile heat dissipation assembly 5 also includes a second threaded rod 506 and a second guide column 505. The second motor 507 drives the second threaded rod 506 to rotate, thereby driving the fan fixing plate 601 to move longitudinally along the second guide column 505, thereby realizing the longitudinal movement of the heat dissipation fan assembly 6. The heat dissipation fan assembly 6 includes a fan 602. Through the operation of the fan 602, the communication substrate 4 is cooled, and the heat is effectively dissipated through the heat dissipation holes on the bottom heat dissipation plate 3. The bottom heat dissipation plate 3 is provided with multiple heat dissipation holes for natural convection or forced convection heat dissipation.

[0037] In order to prevent external dust and debris from entering, the heat dissipation box 2 also includes an upper plate 1, which covers the top of the heat dissipation box 2 and is detachable to facilitate equipment maintenance and component replacement.

[0038] Through this design, the communication substrate heat dissipation device not only improves the heat dissipation efficiency, but also increases the flexibility and maintenance convenience of the device, effectively solving the limitations of existing fixed heat dissipation devices.

[0039] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0041] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A communication substrate heat dissipation device, characterized in that: include: A heat dissipation box (2) having a communication substrate (4) installed therein; A mobile heat dissipation component (5) is installed in the heat dissipation box (2); A heat dissipation fan assembly (6) connected to the mobile heat dissipation assembly (5) and used to dissipate heat from the communication substrate (4); The bottom heat dissipation plate (3) is provided with a plurality of heat dissipation holes for dissipating heat through natural convection or forced convection.

2. The communication substrate heat dissipation device according to claim 1, characterized in that: The mobile heat dissipation assembly (5) comprises a first fixing plate (501) and a second fixing plate (502), wherein the first fixing plate (501) is installed in the heat dissipation box (2), and the second fixing plate (502) is movable on the first fixing plate (501).

3. The communication substrate heat dissipation device according to claim 2, characterized in that: The mobile heat dissipation assembly (5) further comprises a first threaded rod (503) and a first guide column (504); the first motor (508) drives the first threaded rod (503) to rotate, thereby driving the second fixed plate (502) to move on the first guide column (504), so as to enable the heat dissipation fan assembly (6) to move laterally.

4. The communication substrate heat dissipation device according to claim 3, characterized in that: The mobile heat dissipation assembly (5) further comprises a second threaded rod (506) and a second guide column (505), wherein the second motor (507) drives the second threaded rod (506) to rotate, thereby driving the fan fixing plate (601) to move on the second guide column (505), so as to achieve longitudinal movement of the heat dissipation fan assembly (6).

5. The communication substrate heat dissipation device according to claim 4, characterized in that: The heat dissipation fan assembly (6) comprises a fan (602), and the fan (602) is used to dissipate heat from the communication substrate (4) through the heat dissipation holes on the bottom heat dissipation plate (3).

6. The communication substrate heat dissipation device according to claim 5, characterized in that: The heat dissipation box (2) also includes an upper plate (1) which is used to cover the top of the heat dissipation box (2) and prevent external dust and debris from entering.

7. The communication substrate heat dissipation device according to claim 6, characterized in that: The upper plate (1) is detachably mounted on the upper part of the heat dissipation box (2).

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