Heat dissipation structure and energy storage device

Abstract

The utility model discloses a heat dissipation structure and an energy storage device. The heat dissipation structure comprises a shell, the shell is provided with a first cavity and a second cavity, the first cavity is communicated with the second cavity, and the first cavity and the second cavity are suitable for installing electronic components respectively; and the first heat exchange mechanism is installed in the shell, the air inlet end of the first heat exchange mechanism communicates with the second cavity, and the air outlet end of the first heat exchange mechanism communicates with the first cavity. The first heat exchange mechanism can make air in the first cavity and the second cavity circulate so as to conduct heat exchange on the electronic components in the first cavity and the second cavity, and therefore heat exchange can be conducted on the multiple electronic components at the same time, and the heat exchange cost can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of energy storage equipment, and more specifically, to a heat dissipation structure and an energy storage device. Background Art

[0002] In the related art, electronic components such as PCS (Power Conversion System) and BMS (Battery Management System) are generally installed inside the energy storage cabinet. In order to keep the temperature of PCS and BMS in the normal range at all times during operation, they need to be cooled. However, currently, two sets of flow channels are generally required to cool PCS and BMS respectively, which results in high cooling costs.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Utility Model Content

[0004] One purpose of the utility model is to provide a new technical solution for a heat dissipation structure.

[0005] According to a first aspect of the present invention, a heat dissipation structure is provided. The heat dissipation structure comprises:

[0006] A housing having a first cavity and a second cavity, wherein the first cavity is connected to the second cavity, and the first cavity and the second cavity are suitable for installing electronic components respectively;

[0007] The first heat exchange mechanism is installed in the shell, the air inlet end of the first heat exchange mechanism is connected to the second cavity, and the air outlet end of the first heat exchange mechanism is connected to the first cavity.

[0008] Optionally, a partition is provided in the shell to separate the shell into the first cavity and the second cavity, and a first through hole is provided on one side of the partition, and the first cavity and the second cavity are connected through the first through hole.

[0009] Optionally, a second through hole is further provided on a side of the partition away from the first through hole, and the second through hole is suitable for communicating with the air inlet end.

[0010] Optionally, the partition is provided with a third through hole between the first through hole and the second through hole, and the third through hole is respectively connected to the first cavity and the second cavity.

[0011] Optionally, along the second direction of the partition, the air outlet end corresponds to the position of the first through hole, and a first layer of air duct can be formed between the air outlet end and the first through hole.

[0012] Optionally, along the first direction of the partition, the first through hole and the third through hole are respectively located at different positions of the partition, and the third through hole can form a second layer of air duct.

[0013] Optionally, a first fan is further included, the liquid inlet pipe of the first heat exchange mechanism is arranged in the first cavity, the first fan is opposite to the liquid inlet pipe, and the first fan can blow gas from the third through hole into the second cavity.

[0014] Optionally, the electronic component includes a first element, the first element is installed in the second cavity, the outer side of the first element is provided with a first air inlet hole and a second air inlet hole, the first through hole is suitable for corresponding to the first air inlet hole, and the third through hole is suitable for corresponding to the second air inlet hole.

[0015] Optionally, a second fan is further included, and the second fan is located at one side of the first element, and the second fan is suitable for blowing the gas flowing out of the first element toward the second through hole.

[0016] According to a second aspect of the present application, an energy storage device is provided, which includes the heat dissipation structure of the above embodiment.

[0017] Optionally, the energy storage device includes a second heat exchange mechanism, which is suitable for exchanging heat for the battery pack, and the second heat exchange mechanism is connected to the first heat exchange mechanism.

[0018] A technical effect of the present application is that a first cavity and a second cavity are connected in a shell, and electronic components are installed in the first cavity and the second cavity respectively. The air inlet end of the first heat exchange mechanism is connected to the second cavity, and the air outlet end is connected to the first cavity. The first heat exchange mechanism can circulate air in the first cavity and the second cavity to exchange heat with the electronic components in the first cavity and the second cavity respectively, so that heat can be exchanged for multiple electronic components at the same time, so as to reduce the heat exchange cost.

[0019] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0021] Figure 1 It is a schematic diagram of the internal structure of the heat dissipation structure of an embodiment of the present application.

[0022] Figure 2 It is a schematic diagram of the internal structure of the heat dissipation structure of another embodiment of the present application.

[0023] Figure 3 It is a schematic diagram of the internal structure of the heat dissipation structure of another embodiment of the present application.

[0024] Figure 4 It is a schematic diagram of the internal structure of a shell of a heat dissipation structure of an embodiment of the present application.

[0025] Figure 5 It is a schematic diagram of the heat dissipation structure of an embodiment of the present application.

[0026] Figure 6 It is a structural schematic diagram of the first element of an embodiment of the present application.

[0027] Figure 7 It is a schematic diagram of the structure of an energy storage device according to an embodiment of the present application.

[0028] Reference numerals:

[0029] 1. Shell; 11. First cavity; 12. Second cavity; 13. Partition; 131. First through hole; 132. Second through hole; 133. Third through hole; 14. Maintenance window; 15. Mounting plate; 2. First heat exchange mechanism; 21. Air outlet; 22. Liquid inlet pipe; 23. Liquid outlet pipe; 3. First element; 31. First air inlet hole; 32. Second air inlet hole; 33. Shutter; 34. Second fan; 4. Second element; 41. Third fan; 5. Third element; 51. First fan; 6. Bus connector; 7. Cabinet; 8. Battery pack; 9. Output connector; 10. Input connector. DETAILED DESCRIPTION

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0032] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0033] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0034] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0035] According to an embodiment of the present application, a heat dissipation structure is provided. Figures 1 to 5 As shown, the heat dissipation structure includes a housing 1 and a first heat exchange mechanism 2. The housing 1 has a first cavity 11 and a second cavity 12, the first cavity 11 is connected to the second cavity 12, and the first cavity 11 and the second cavity 12 are suitable for installing electronic components respectively. The first heat exchange mechanism 2 is installed in the housing 1, the air inlet end of the first heat exchange mechanism 2 is connected to the second cavity 12, and the air outlet end 21 of the first heat exchange mechanism 2 is connected to the first cavity 11.

[0036] In this example, the shell 1 has a first cavity 11 and a second cavity 12 that are connected. Electronic components are installed in the first cavity 11 and the second cavity 12, respectively. The air inlet end of the first heat exchange mechanism 2 is connected to the second cavity 12, and the air outlet end 21 is connected to the first cavity 11. The first heat exchange mechanism 2 can circulate air in the first cavity 11 and the second cavity 12 to exchange heat with the electronic components in the first cavity 11 and the second cavity 12, respectively, so that heat can be exchanged for multiple electronic components at the same time without the need to additionally set up flow channels to different electronic components, so as to reduce the heat exchange cost.

[0037] In this example, the first heat exchange mechanism 2 may be a refrigeration mechanism that can reduce the temperature of the air in the housing 1, so that cold air circulates in the first cavity 11 and the second cavity 12, thereby cooling and dissipating the electronic components in the first cavity 11 and the second cavity 12. Alternatively, the first heat exchange mechanism 2 may also be used for heating to increase the temperature of the electronic components. Those skilled in the art may determine this according to actual conditions, and no specific limitation is made here.

[0038] In this example, the housing 1 is an insulating box made of insulating material, such as glass fiber, epoxy glass paperboard or glass fiber reinforced plastic, which has good physical and mechanical properties. Of course, the housing 1 can also be made of other insulating materials, which can be determined by those skilled in the art according to actual conditions and are not specifically limited here.

[0039] In this example, the housing 1 is sealed, for example, the protection level can be IP55. The air inside the housing 1 can be prevented from leaking out, and the outside air does not participate in the air circulation inside the housing 1, ensuring that the air duct circulation inside the housing 1 is not affected by external factors and reducing the risk of fire. Of course, the protection level of the housing 1 can be determined by those skilled in the art according to actual conditions, and is not specifically limited here.

[0040] like Figure 7 As shown, in this example, the heat dissipation structure of the present application can be used in an energy storage device, and the housing 1 is installed in a cabinet 7 of the energy storage device, and a battery pack 8 is also arranged in the cabinet 7. The electronic components include a PCS, a filter and a BMS, which are respectively as follows Figure 1 The first component 3, the second component 4 and the third component 5 are shown in the figure. The first component 3 and the second component 4 are installed in the second cavity 12, and the third component 5 is installed in the first cavity 11. The side wall of the housing 1 is provided with a bus connector 6, and the electronic components inside the housing 1 are connected to the total positive and negative lines of the external power supply through the bus connector 6, which is convenient for wiring. Among them, the electronic components can be fixed to the housing 1 by screwing or clamping.

[0041] Of course, the electronic components may also be other types of components, and those skilled in the art may determine according to actual conditions, and no specific limitation is made here.

[0042] like Figure 1 and Figure 7 As shown, a battery pack 8 is installed in the cabinet 7, and the battery pack 8 has a second heat exchange mechanism. The first heat exchange mechanism 2 can be connected to the second heat exchange mechanism, so there is no need to set up additional cooling structures or water tanks, etc., so that the structure of the energy storage device can be more compact and the heat dissipation cost of the heat dissipation structure can be reduced.

[0043] like Figure 1 and Figure 2 As shown, the side wall of the housing 1 is provided with an output connector 9 and an input connector 10 of the second heat exchange mechanism, the liquid inlet pipe 22 of the first heat exchange mechanism 2 is connected to the output connector 9, and the liquid outlet pipe 23 of the first heat exchange mechanism 2 is connected to the input connector 10. The cold liquid of the second heat exchange mechanism can be input from the output connector 9 to the liquid inlet pipe 22 to cool the cold plate of the first heat exchange mechanism 2, and then flow to the input connector 10 through the liquid outlet pipe 23, and then flow back to the second heat exchange mechanism, thereby circulating.

[0044] Of course, the heat dissipation structure of the present application can also be used in other electrical equipment. Those skilled in the art can determine it according to actual conditions, and no specific limitation is made here.

[0045] like Figure 4 As shown, in this example, the side wall of the housing 1 is also provided with a maintenance window 14, which can be opened to repair the internal electronic components when necessary. The maintenance window 14 can be set as a transparent structure so that maintenance personnel can observe the internal electronic components from the outside to facilitate maintenance work.

[0046] In an example, Figure 1 and Figure 4As shown, a partition 13 is provided in the shell 1 to separate the shell 1 into the first cavity 11 and the second cavity 12 , and a first through hole 131 is provided on one side of the partition 13 , and the first cavity 11 and the second cavity 12 are connected through the first through hole 131 .

[0047] like Figure 4 As shown, in this example, the inner cavity of the housing 1 is provided with a partition 13, and the partition 13 can separate the inner cavity of the housing 1 into a first cavity 11 and a second cavity 12. A first through hole 131 is provided on one side of the partition 13, and the first cavity 11 and the second cavity 12 are connected through the first through hole 131 to circulate air in the first cavity 11 and the second cavity 12. The partition 13 can be made of an insulating material to ensure electrical isolation between the two cavities.

[0048] In this example, the partition 13 may be formed integrally with the housing 1, or may be connected to the inner wall of the housing 1 by bonding or welding. Those skilled in the art may determine the method according to actual conditions, and no specific limitation is made here.

[0049] In an example, Figures 1 to 4 As shown, the partition 13 is further provided with a second through hole 132 on one side away from the first through hole 131, and the second through hole 132 is adapted to be connected to the air inlet end. The first through hole 131 is located on one side of the partition 13, and the second through hole 132 is located on the side of the partition 13 away from the first through hole 131, so that the air circulation in the first cavity 11 and the second cavity 12 is more complete.

[0050] like Figure 2 and Figure 4 As shown, the first through hole 131 can be located on one side of the extension direction of the partition 13, and the second through hole 132 is located on the other opposite side. The first heat exchange mechanism 2 is located on the side of the housing 1 away from the first through hole 131, and the air inlet end of the first heat exchange mechanism 2 is connected to the second through hole 132. The air enters the air inlet end from the second through hole 132, and after being cooled in the first heat exchange mechanism 2, it flows out from the air outlet end 21 of the heat exchanger. The air outlet end 21 is located in the first cavity 11 and away from the first through hole 131, so that the cold air flowing out from the air outlet end 21 can flow through the first cavity 11, thereby having a good cooling effect on the electronic components in the first cavity 11.

[0051] like Figure 1 and Figure 4 As shown, in this example, a mounting plate 15 is provided on one side of the first cavity 11 away from the first through hole 131, and the first heat exchange mechanism 2 is mounted on the mounting plate 15. The mounting plate 15 has a through hole, which is suitable for avoiding the air inlet end of the first heat exchange mechanism 2 so that the air inlet end can be connected to the second through hole 132.

[0052] In an example, Figure 1 and Figure 4 As shown, the partition 13 is provided with a third through hole 133 between the first through hole 131 and the second through hole 132, and the third through hole 133 is respectively connected to the first cavity 11 and the second cavity 12. The third through hole 133 is located between the first through hole 131 and the second through hole 132, and cold air can flow into the second cavity 12 from the third through hole 133.

[0053] like Figure 4 As shown, in this example, there are a plurality of third through holes 133, and the plurality of third through holes 133 are distributed in an array. Regarding the arrangement of the third through holes 133, those skilled in the art may determine it according to actual conditions, and no specific limitation is made here.

[0054] In this example, if Figure 4 As shown, along the second direction of the partition 13, the air outlet end 21 corresponds to the position of the first through hole 131, and a first layer of air duct can be formed between the air outlet end and the first through hole. The second direction is assumed to be the length direction of the partition 13, and the first direction can be the width direction of the partition 13. The air outlet end 21 of the first heat exchange mechanism 2 corresponds to the position of the first through hole 131, for example, the air outlet end 21 and the first through hole 131 are at the same height in the width direction of the partition 13, so that a first layer of air duct can be formed between the air outlet end 21 and the first through hole 131. The wind blown out from the first through hole 131 can flow directly into the first through hole 131.

[0055] like Figure 4 As shown, in this example, along the first direction of the partition 13, the first through hole 131 and the third through hole 133 are respectively located at different positions of the partition 13, and the third through hole 133 can form a second layer of air duct. For example, the third through hole 133 is located at the lower side of the first through hole 131 and the air outlet end 21, that is, the first layer of air duct is the upper layer of air duct, and the second layer of air duct is the lower layer of air duct, so that the cold air flowing into the first through hole 131 and the cold air flowing into the third through hole 133 can be divided into upper and lower layers.

[0056] like Figure 2 As shown, in this example, the heat dissipation structure also includes a first fan 51, the liquid inlet pipe 22 of the first heat exchange mechanism 2 is arranged in the first cavity 11, the first fan 51 is opposite to the liquid inlet pipe 22, and the first fan 51 can blow gas from the third through hole 133 into the second cavity 12.

[0057] The liquid in the liquid inlet pipe 22 is cold liquid, and the first fan 51 is arranged opposite to the liquid inlet pipe 22 so that the first fan 51 can blow out cold air when it rotates. The first fan 51 can be integrated with the third element 5. The first fan 51 is located on the side of the third element 5 away from the third through hole 133, and the cold air blown by the first fan 51 can first flow into the third element 5 to cool the third element 5, and then flow into the second cavity 12 from the third through hole 133.

[0058] In this example, the third through hole 133 is located at the lower side of the first through hole 131, the first fan 51 corresponds to the third through hole 133, and the air outlet end 21 corresponds to the first through hole 131, so that the cold air blown out by the first fan 51 and the cold air blown out by the first heat exchange mechanism 2 are divided into two layers, upper and lower.

[0059] In an example, Figure 1 and Figure 6 As shown, the electronic component includes a first element 3, which is installed in the second cavity 12. The outer side of the first element 3 is provided with a first air inlet hole 31 and a second air inlet hole 32. The first through hole 131 is suitable for corresponding to the first air inlet hole 31, and the third through hole 133 is suitable for corresponding to the second air inlet hole 32.

[0060] like Figure 6 As shown, in this example, the first air inlet 31 is located on the upper side of the second air inlet 32. The upper cold air entering from the first through hole 131 can enter the first element 3 from the first air inlet 31 to cool the structure in the first element 3. The lower cold air flowing in from the third through hole 133 can enter the first element 3 from the second air inlet 32 ​​to cool the structure in the first element 3. The positions of the first air inlet 31 and the second air inlet 32 ​​only need to facilitate the entry of cold air, which can be determined by those skilled in the art according to actual conditions and are not specifically limited here.

[0061] like Figure 6 As shown, a shutter 33 is further provided at the upper end of the first element 3 , and the upper cold air entering from the first through hole 131 can enter the first element 3 through the shutter 33 to cool the structure inside the first element 3 .

[0062] In this example, if Figures 1 to 3 As shown, the electronic components further include a second component 4. The second component 4 is installed in the second cavity 12, and the second component 4 is located on the upper side of the first component 3. The upper cold air can enter the second component 4 from the vent of the second component 4 to dissipate heat and cool the components inside the second component 4.

[0063] In an example, Figure 2As shown, the heat dissipation structure further includes a second fan 34, which is located at one side of the first element 3. The second fan 34 is adapted to blow the gas flowing out of the first element (3) toward the second through hole 132. The second fan 34 is provided to facilitate gas circulation in the second cavity 12.

[0064] like Figure 2 As shown, the second fan 34 can be integrated into the first element 3 , and the second fan 34 is located at the air outlet of the first element 3 . The second fan 34 can accelerate the air flow, accelerate the cold air circulation, and improve the heat dissipation efficiency of the first element 3 .

[0065] In this example, if Figure 2 As shown, a third fan 41 is further provided at the air outlet of the second element 4, and the third fan 41 can also be integrated in the second element 4. The third fan 41 can blow the cold air flowing through the second element 4 toward the second through hole 132 to accelerate the air flow, accelerate the cold air circulation, and improve the heat dissipation efficiency of the second element 4.

[0066] According to another embodiment of the present application, an energy storage device is provided. The energy storage device includes the heat dissipation structure of the above embodiment. The heat dissipation structure includes a shell 1 and a first heat exchange mechanism 2. The shell 1 has a first cavity 11 and a second cavity 12 connected to each other, and the first cavity 11 and the second cavity 12 are respectively installed with electronic components. The air inlet end of the first heat exchange mechanism 2 is connected to the second cavity 12, and the air outlet end 21 is connected to the first cavity 11. The first heat exchange mechanism 2 can circulate the air in the first cavity 11 and the second cavity 12 to exchange heat with the electronic components in the first cavity 11 and the second cavity 12 respectively, so that multiple electronic components can be exchanged heat at the same time, without the need to set up additional flow channels to different electronic components, so as to reduce the heat exchange cost.

[0067] like Figure 7 As shown, in this example, the energy storage device includes a cabinet 7 and a battery pack 8, the battery pack 8 is arranged in the cabinet 7, and the housing 1 is arranged in the cabinet 7 and located on one side of the battery pack 8. The energy storage device also includes a second heat exchange mechanism, which is suitable for heat exchange of the battery pack, and the second heat exchange mechanism is connected to the first heat exchange mechanism 2. Figure 1 and Figure 2 As shown, the side wall of the housing 1 is provided with an output connector 9 and an input connector 10 of the second heat exchange mechanism, the liquid inlet pipe 22 of the first heat exchange mechanism 2 is connected to the output connector 9, and the liquid outlet pipe 23 of the first heat exchange mechanism 2 is connected to the input connector 10. The cold liquid of the second heat exchange mechanism can be input from the output connector 9 to the liquid inlet pipe 22 to cool the cold plate of the first heat exchange mechanism 2, and then flow to the input connector 10 through the liquid outlet pipe 23, and then flow back to the second heat exchange mechanism, thereby circulating.

[0068] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0069] Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A heat dissipation structure, characterized in that: include: A housing having a first cavity and a second cavity, wherein the first cavity is connected to the second cavity, and the first cavity and the second cavity are suitable for installing electronic components respectively; The first heat exchange mechanism is installed in the shell, the air inlet end of the first heat exchange mechanism is connected to the second cavity, and the air outlet end of the first heat exchange mechanism is connected to the first cavity.

2. The heat dissipation structure according to claim 1, characterized in that: A partition is provided in the shell to separate the shell into the first cavity and the second cavity. A first through hole is provided on one side of the partition, and the first cavity and the second cavity are connected through the first through hole.

3. The heat dissipation structure according to claim 2, characterized in that: A second through hole is further provided on one side of the partition away from the first through hole, and the second through hole is suitable for communicating with the air inlet end.

4. The heat dissipation structure according to claim 3, characterized in that: The partition plate is provided with a third through hole between the first through hole and the second through hole, and the third through hole is respectively connected to the first cavity and the second cavity.

5. The heat dissipation structure according to claim 4, characterized in that: Along the second direction of the partition, the air outlet end corresponds to the position of the first through hole, and a first layer of air duct can be formed between the air outlet end and the first through hole.

6. The heat dissipation structure according to claim 4, characterized in that: Along the first direction of the partition, the first through hole and the third through hole are respectively located at different positions of the partition, and the third through hole can form a second layer of air duct.

7. The heat dissipation structure according to claim 4, characterized in that: It also includes a first fan. The liquid inlet pipe of the first heat exchange mechanism is arranged in the first cavity. The first fan is opposite to the liquid inlet pipe. The first fan can blow gas into the second cavity from the third through hole.

8. The heat dissipation structure according to claim 4, characterized in that: The electronic component includes a first element, which is installed in the second cavity. A first air inlet hole and a second air inlet hole are provided on the outer side of the first element. The first through hole is suitable for corresponding to the first air inlet hole, and the third through hole is suitable for corresponding to the second air inlet hole.

9. The heat dissipation structure according to claim 8, characterized in that: The device further includes a second fan, which is located at one side of the first element and is suitable for blowing the gas flowing out of the first element toward the second through hole.

10. An energy storage device, characterized in that: It comprises the heat dissipation structure as claimed in any one of claims 1 to 9.

11. The energy storage device according to claim 10, characterized in that: It includes a second heat exchange mechanism, which is suitable for exchanging heat for the battery pack, and the second heat exchange mechanism is connected to the first heat exchange mechanism.

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