LED bracket and packaging device thereof

Abstract

The utility model relates to the technical field of LED brackets, and in particular to an LED bracket and its packaging device. The LED bracket specifically includes: a bracket plastic body, a metal conductive layer, a metal substrate and an insulating tape; the metal conductive layer is laid on the exposed upper surface of the bracket plastic body and the metal substrate; the insulating tape includes at least one first insulating strip, the first insulating strip is closed and arranged on the upper surface of the bracket plastic body, the first insulating strip divides the metal conductive layer into a sealing area and a packaging cavity for inorganic packaging, and the sealing area is used to lay inorganic adhesive materials; the sealing area includes an annular sealing strip and at least one air outlet. The air outlet protrudes from the annular sealing strip, and the inorganic adhesive material solidifies along the annular sealing strip to the air outlet to form a sealing tin layer; the air outlet includes an inner air outlet end and an outer air outlet end, the inner air outlet end is longer than the outer air outlet end, the inner air outlet end is lower than the outer air outlet end, and the inner air outlet end is connected to the annular sealing strip. The utility model has the advantage of improving the air tightness inside the packaging body.

Description

Technical Field

[0001] The utility model relates to the technical field of LED brackets, in particular to an LED bracket and a packaging device thereof. Background Art

[0002] With the development of semiconductor technology for lighting, there are currently three main structures of LED light source chips: upright, flip-chip and vertical structure. The flip-chip structure is connected to the carrier through the metal electrode at the bottom of the chip, without the need for additional wire bonding. It has unique advantages in reliability, heat dissipation, and uniform current distribution. Although the manufacturing cost is relatively high compared to upright chips, it still occupies a certain share in special application scenarios in the market.

[0003] Currently, for flip chips with AuSn electrodes, due to their material properties, the reflow temperature during packaging is generally as high as 300°C. The mainstream matching solution is to use a cover / bracket with a ceramic + metal cup (multi-layer electroplating) structure, which is relatively expensive. The combination of EMC / PCT bracket and flip chip is currently mainly connected by inorganic adhesive materials, and the main components are SnAgCu. Due to the limitations of the material itself, in actual production, the primary reflow temperature generally does not exceed 250°C, and the secondary reflow temperature needs to be further reduced (~225°C). In order to avoid serious failure, this feature limits the use scenarios of downstream industry production processes or terminal products.

[0004] The wavelength range of UV light is 10nm-400nm, and it is mainly divided into three bands: UVA, UVB and UVC. Among them, UV LED is widely used in agriculture, printing, medical treatment, plant growth, sterilization and disinfection, etc. In the current inorganic packaging field of high-energy UV LED, silicon dioxide wafers are usually used for the final sealing of the package body. It is necessary to provide an oxygen-free internal environment for the UV LED to further extend the life of the product at the terminal. Therefore, during the packaging and use process, the requirements for the airtightness of the package body are more stringent.

[0005] Therefore, an LED bracket is provided to address the deficiencies in the prior art. Utility Model Content

[0006] In order to overcome the deficiencies of the prior art, the utility model provides an LED bracket, aiming to solve the problem of airtightness inside a packaging body.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] An LED bracket comprises: a bracket plastic body, a metal conductive layer, a metal base and an insulating tape;

[0009] The metal conductive layer is laid on the exposed upper surface of the bracket plastic body and the metal base;

[0010] An insulating strip, comprising at least one first insulating strip, at least one second insulating strip and at least two third insulating strips, wherein the first insulating strip is closed and arranged on the upper surface of the support plastic body, the first insulating strip divides the metal conductive layer into a sealing area and a packaging cavity for inorganic packaging, the sealing area is used to lay inorganic adhesive material, the third insulating strip is relatively arranged on the inner side surface of the support plastic body, and the two ends of the third insulating strip are respectively connected to the first insulating strip and the second insulating strip;

[0011] A metal substrate, comprising a first substrate and a second substrate, wherein the second insulating strip separates the first substrate and the second substrate;

[0012] The sealing area comprises an annular sealing strip and at least one air outlet, wherein the air outlet protrudes from the annular sealing strip, and the inorganic adhesive material solidifies along the annular sealing strip to the air outlet to form a sealing tin layer;

[0013] The air outlet comprises an inner air outlet end and an outer air outlet end, wherein the inner air outlet end is longer than the outer air outlet end, the inner air outlet end is lower than the outer air outlet end, and the inner air outlet end is connected to the annular sealing strip.

[0014] As a further improvement of the technical solution of the utility model, the first insulating strip, the second insulating strip and the third insulating strip separate the packaging cavity into a first conductive island and a second conductive island.

[0015] As a further improvement of the technical solution of the utility model, the sealing includes double inorganic adhesive material sealing;

[0016] Inorganic bonding materials include high-temperature inorganic bonding materials and low-temperature inorganic bonding materials;

[0017] When double inorganic adhesive materials are used for sealing: a high-temperature inorganic adhesive material and a low-temperature inorganic adhesive material are used to seal the sealing area;

[0018] The melting point difference between the high temperature inorganic adhesive material and the low temperature inorganic adhesive material is greater than 50°C.

[0019] As a further improvement of the technical solution of the utility model, the air outlet is a funnel-shaped air outlet.

[0020] As a further improvement of the technical solution of the utility model, the cross section of the packaging cavity is in an inverted trapezoidal shape.

[0021] A packaging device for an LED bracket is applicable to the above-mentioned LED bracket, and further comprises a cover plate, wherein the cover plate is fixedly connected to the LED bracket via the inorganic adhesive material.

[0022] As a further improvement of the technical solution of the utility model, it also includes a flip chip, and the flip chip is fixed in the packaging cavity by reflow soldering.

[0023] As a further improvement of the technical solution of the utility model, it also includes a filler, and the filler is located in the packaging cavity to cover the flip chip.

[0024] Compared with the prior art, the beneficial effects of the utility model are as follows: by laying a metal conductive layer on the surface of the plastic body of the bracket, the first insulating strip divides the metal conductive layer into a sealing area and a packaging cavity for inorganic packaging, and the packaging cavity is used to carry a flip chip. During packaging and use, the cover plate is connected to the packaging body through an inorganic adhesive material, and the inorganic adhesive material solidifies along the annular sealing strip to the air outlet to form a sealing tin layer, which effectively improves the air tightness of the packaging body; the outer end of the air outlet is larger than the inner end of the air outlet, making the inorganic packaging process more controllable. At the same time, the addition of a metal coating on the surface of the sealing area can also enhance the bending resistance of the packaging body and improve the overall LED packaging production process yield. This LED bracket has the characteristic of improving the air tightness inside the packaging body. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The technology of the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments:

[0026] Figure 1 It is a structural schematic diagram of the LED bracket of the utility model;

[0027] Figure 2 This is a schematic diagram of the structure of the package in the LED bracket of the utility model;

[0028] Figure 3 yes Figure 2 Schematic diagram of the enlarged structure at point A in the middle.

[0029] In the figure:

[0030] 1. Plastic body of the bracket;

[0031] 2. Metal conductive layer;

[0032] 21, sealing area; 211, annular sealing strip; 212, air outlet; 213, air outlet inner end; 214, air outlet outer end;

[0033] 22. packaging cavity; 221. first conductive island; 222. second conductive island;

[0034] 3. Insulating tape; 31. First insulating strip; 32. Second insulating strip; 33. Third insulating strip;

[0035] 4. Metal substrate; 41. First substrate; 42. Second substrate;

[0036] 5. Flip chip. DETAILED DESCRIPTION

[0037] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the utility model, so as to fully understand the purpose, scheme and effect of the utility model. It should be noted that the embodiments and features in the embodiments in this application can be combined with each other without conflict. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0038] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the accompanying drawings.

[0039] Reference Figures 1 to 3 , an LED bracket, comprising a bracket plastic body 1, a metal conductive layer 2, an insulating tape 3 and a metal base 4;

[0040] In one embodiment, the metal conductive layer 2 is laid on the exposed upper surface of the bracket plastic body 1 and the metal base 4; the insulating tape 3 includes at least one first insulating strip 31, the first insulating strip 31 is closed and arranged on the upper surface of the bracket plastic body 1, the first insulating strip 31 divides the metal conductive layer 2 into a sealing area 21 and a packaging cavity 22 for inorganic packaging, and the inorganic adhesive material is laid on the sealing area 21; the sealing area 21 includes an annular sealing strip 211 and at least one air outlet 212, the air outlet 212 protrudes from the annular sealing strip 211, and the inorganic adhesive material solidifies along the annular sealing strip 211 to the air outlet 212 to form a sealing tin layer; refer to Figure 3 As shown, the air outlet 212 includes an inner air outlet end 213 and an outer air outlet end 214. The inner air outlet end 213 is longer than the outer air outlet end 214, and the inner air outlet end 213 is lower than the outer air outlet end 214. The outer air outlet end 214 is connected to the annular sealing strip 211. Preferably, the air outlet 212 is a funnel-shaped air outlet 212.

[0041] Among them, by laying the metal conductive layer 2 on the surface of the bracket plastic body 1, the first insulating strip 31 divides the metal conductive layer 2 into a sealing area 21 for inorganic packaging and a packaging cavity 22, and the packaging cavity 22 is used to carry the UV LED. During the packaging and use process, the cover plate is connected to the packaging body through an inorganic adhesive material, and the inorganic adhesive material solidifies along the annular sealing strip 211 to the air outlet 212 to form a sealing tin layer, which effectively improves the air tightness of the packaging body; the air outlet outer end 214 in the air outlet 212 is larger than the air outlet inner end 213, making the inorganic packaging process more controllable. At the same time, the addition of a metal plating layer on the surface of the sealing area 21 can also enhance the bending resistance of the packaging body and improve the overall LED packaging production process yield. This LED bracket has the characteristic of improving the air tightness inside the packaging body.

[0042] In one embodiment, referring to Figure 2 As shown, the insulating strip 3 also includes at least one second insulating strip 32, the packaging cavity 22 includes a metal substrate 4, the metal substrate 4 includes a first substrate 41 and a second substrate 42, and the second insulating strip 32 isolates the first substrate 41 and the second substrate 42. The insulating strip 3 also includes at least two third insulating strips 33, the third insulating strips 33 are relatively arranged on the inner side of the bracket plastic body 1, and the two ends of the third insulating strip 33 are respectively connected to the first insulating strip 31 and the second insulating strip 32. The first insulating strip 31, the second insulating strip 32 and the third insulating strip 33 separate the packaging cavity 22 into a first conductive island 221 and a second conductive island 222, the first substrate 41 is located in the first conductive island 221, and the second substrate 42 is located in the second conductive island 222. Preferably, the metal substrate 4 includes a copper alloy layer, and one or more metal layers of silver, copper, nickel and gold are arranged on the surface of the copper alloy layer.

[0043] In one embodiment, the design of the first conductive island 221 and the second conductive island 222 involves designing the first insulating strip 31 to the upper surface of the bracket plastic body 1 to reduce the exposed area of ​​the first insulating strip 31 in the packaging cavity 22 to further suppress its light absorption effect, which can contribute a solution to high-light-efficiency packaging devices.

[0044] In one embodiment, the sealing includes single inorganic adhesive material sealing or double inorganic adhesive material sealing; when single inorganic adhesive material sealing: the inorganic adhesive material uses a single inorganic adhesive material to seal in the sealing area 21; preferably, when double inorganic adhesive material sealing, the inorganic adhesive material includes high-temperature inorganic adhesive material and low-temperature inorganic adhesive material: the inorganic adhesive material uses high-temperature inorganic adhesive material and low-temperature inorganic adhesive material to seal in the sealing area 21, and when the temperature rises first and then drops, the inorganic adhesive material in the annular sealing strip 211 is initially solidified first, and the inorganic adhesive material at the air outlet 212 is finally solidified to discharge the last bit of air; the melting point difference between the high-temperature inorganic adhesive material and the low-temperature inorganic adhesive material is greater than 50°C. The inorganic adhesive material composition is an alloy of Sn.

[0045] In one embodiment, the packaging cavity 22 is injection molded after being melted at a high temperature; the cross section of the packaging cavity 22 is an inverted trapezoidal shape having at least one step shape.

[0046] In one embodiment, the metal conductive layer 2 is one or more of silver, nickel, and gold, and the metal conductive layer 2 is laid on the upper surface, inner wall, and bottom surface of the sealing area 21 and the packaging cavity 22; the metal conductive layer 2 is formed by electroplating, and the metal conductive layer 2 is etched to form an insulating tape 3; the insulating tape 3 is the area where the bracket plastic body 1 is exposed after the metal conductive layer 2 is etched.

[0047] A packaging device for an LED bracket, suitable for the above-mentioned LED bracket, referring to Figure 1 As shown, it also includes a cover plate, which is fixedly connected to the LED bracket through an inorganic adhesive material. Preferably, the cover plate is a glass sheet.

[0048] In one embodiment, the packaged device further includes a flip chip 5, which is flip-chip soldered in the package cavity 22 by reflow soldering. Preferably, the flip chip 5 includes a positive electrode tin layer and a negative electrode tin layer, and the positive electrode tin layer and the negative electrode tin layer are fixedly connected to the first conductive island 221 and the second conductive island 222, respectively.

[0049] In one embodiment, to further extend the life of the product at the terminal, the packaged device further includes a filler, which is located in the package cavity 22 and covers the flip chip 5. Preferably, the filler is a silicone resin, which is cured by heating to complete the package, and further package the flip chip 5. Preferably, the flip chip 5 is a UVLED.

[0050] For other contents of the LED bracket described in the present invention, please refer to the prior art and will not be described in detail here.

[0051] The above are only preferred embodiments of the present invention and are not intended to limit the present invention in any form. Therefore, any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention are still within the scope of the technical solution of the present invention.

[0052] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0053] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. An LED bracket, characterized in that: include: The bracket comprises a plastic body, a metal conductive layer, a metal substrate and an insulating tape; The metal conductive layer is laid on the exposed upper surface of the bracket plastic body and the metal base; An insulating strip, comprising at least one first insulating strip, at least one second insulating strip and at least two third insulating strips, wherein the first insulating strip is closed and arranged on the upper surface of the support plastic body, the first insulating strip divides the metal conductive layer into a sealing area and a packaging cavity for inorganic packaging, the sealing area is used to lay inorganic adhesive material, the third insulating strip is relatively arranged on the inner side surface of the support plastic body, and the two ends of the third insulating strip are respectively connected to the first insulating strip and the second insulating strip; A metal substrate, comprising a first substrate and a second substrate, wherein the second insulating strip separates the first substrate and the second substrate; The sealing area comprises an annular sealing strip and at least one air outlet, wherein the air outlet protrudes from the annular sealing strip, and the inorganic adhesive material solidifies along the annular sealing strip to the air outlet to form a sealing tin layer; The air outlet comprises an inner air outlet end and an outer air outlet end, wherein the inner air outlet end is longer than the outer air outlet end, the inner air outlet end is lower than the outer air outlet end, and the inner air outlet end is connected to the annular sealing strip.

2. The LED bracket according to claim 1, characterized in that: The first insulating strip, the second insulating strip and the third insulating strip separate the packaging cavity into a first conductive island and a second conductive island.

3. The LED bracket according to claim 1, characterized in that: The sealing includes double inorganic adhesive material sealing; Inorganic bonding materials include high-temperature inorganic bonding materials and low-temperature inorganic bonding materials; When double inorganic adhesive materials are used for sealing: a high-temperature inorganic adhesive material and a low-temperature inorganic adhesive material are used to seal the sealing area; The melting point difference between the high temperature inorganic adhesive material and the low temperature inorganic adhesive material is greater than 50°C.

4. The LED bracket according to claim 1, characterized in that: The air outlet is a funnel-shaped air outlet.

5. The LED bracket according to claim 1, characterized in that: The cross section of the packaging cavity is in an inverted trapezoidal shape.

6. A packaging device for an LED bracket, suitable for the LED bracket according to any one of claims 1 to 5, characterized in that: It also includes a cover plate, which is fixedly connected to the LED bracket through the inorganic adhesive material.

7. The LED bracket packaging device according to claim 6, characterized in that: It also includes a flip chip, which is fixed in the packaging cavity through reflow soldering.

8. The LED bracket packaging device according to claim 7, characterized in that: It also includes a filler, which is located in the packaging cavity and covers the flip chip.

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