A lifting chamfering machine

Abstract

The utility model belongs to the technical field of silicon wafer processing, and specifically relates to a lifting chamfering machine, including a base, a rotating device with adjustable height is arranged on the base, a suction cup is arranged horizontally at the end of the rotating shaft of the rotating device, and a plurality of positioning hydraulic cylinders evenly distributed around the center line of the suction cup are also arranged on the base, the output shaft of the positioning hydraulic cylinder faces the center line of the suction cup and a contact is arranged at the end of the output shaft; a grinding wheel motor is arranged horizontally and slidably on the base, and a grinding wheel is arranged at the end of the rotating shaft of the grinding wheel motor. In the utility model, the positioning of the silicon wafer is achieved by the positioning hydraulic cylinder, so that the center of the silicon wafer coincides with the rotation center line of the rotating motor. When the silicon wafer is chamfered, the silicon wafer rotates, and the grinding wheel can evenly chamfer the outer circumference of the silicon wafer; and the utility model can chamfer silicon wafers of different models, and the position of the grinding wheel and the positioning device (contact) can be adjusted according to the model of the silicon wafer, and has a wide range of applications.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer processing, and in particular relates to a lifting chamfering machine. Background Art

[0002] Silicon is a commonly used semiconductor material, widely used in aerospace, optical fiber and other fields, and is a very important material. During the processing of silicon wafers, the edge surface has defects such as edges, burrs, broken edges and even cracks after cutting, and the edge surface is relatively rough. Silicon wafer chamfering is to grind the sharp edge of the cut silicon wafer into a specified shape to prevent cracks, broken edges and lattice defects from occurring at the edge during subsequent processing, thereby improving the mechanical strength and machinability of the silicon wafer. At the same time, silicon wafer chamfering can remove the stress layer generated by rolling the outer diameter of the crystal rod.

[0003] The existing patent with application number 201820276811.8 discloses an automatic chamfering device for the outer edge of a single crystal silicon wafer, wherein a positioning plate and a micro switch are arranged in a casing, the positioning plate and the micro switch are arranged at right angles in the casing, a grinding wheel for chamfering the silicon wafer is arranged on one side of the casing, a connecting plate is arranged on the piston rod of the cylinder, a driving pulley and a driven pulley connected by a belt are installed on the connecting plate, the driving pulley is connected to the grinding wheel motor, a vacuum suction cup is arranged on the driven pulley, and when positioning the silicon wafer, the distance between the center of the vacuum suction cup and the positioning plate is equal to the distance between the center of the vacuum suction cup and the micro switch. distance; when the chamfering device is working, after the grinding wheel rotates, the silicon wafer is first placed flat on the top of the vacuum suction cup, and then the silicon wafer is placed against the positioning plate to achieve preliminary positioning, and finally the silicon wafer is placed against the micro switch to make the silicon wafer concentric with the vacuum suction cup. At this time, the controller controls the vacuum pumping device to start, and the vacuum pumping device draws vacuum on the vacuum suction cup, and the vacuum suction cup sucks the single crystal silicon wafer, thereby achieving automatic centering of the single crystal silicon wafer. At the same time, the piston rod of the cylinder is controlled to retract, and the grinding wheel motor drives the active pulley to rotate, thereby driving the vacuum suction cup to rotate. During the retraction of the piston rod, the single crystal silicon wafer slowly becomes tangent to the grinding wheel to achieve chamfering.

[0004] When the chamfering device of the prior art is chamfering, it is necessary to set the silicon wafer and the vacuum suction cup concentrically, so that when the grinding wheel motor drives the vacuum suction cup to rotate, the center of the silicon wafer coincides with the center of rotation. If the center of the silicon wafer does not coincide with the center of rotation, the silicon wafer will be damaged during the chamfering process, or the silicon wafer will no longer be circular after chamfering. The chamfering device of the prior art uses a positioning plate and a micro switch distributed at right angles to concentrically position the silicon wafer, so that the radius of the silicon wafer concentrically positioned with the center of the suction cup is equal to the distance between the center of the vacuum suction cup and the positioning plate or the micro switch. After the chamfering device is designed and manufactured, it can only process silicon wafers of the same type and the same radius. If silicon wafers with different radii are to be processed, it is necessary to replace the chamfering device of another specification, which is too costly, or it is necessary to remove the positioning block and the micro switch, and change the installation position of the positioning block and the micro switch according to the specifications of the silicon wafer, which is inconvenient to operate. Utility Model Content

[0005] In order to solve the technical problem that the above-mentioned chamfering machine can only process silicon wafers of half the same model, the utility model provides a lifting chamfering machine.

[0006] The purpose of the utility model is to be achieved by adopting the following technical solutions. A lifting chamfering machine proposed in the utility model includes a base, a rotating device with adjustable height is vertically arranged on the base, a suction cup is horizontally arranged at the end of the rotating shaft of the rotating device, the center line of the suction cup coincides with the rotation center line of the rotating device, and a plurality of positioning hydraulic cylinders evenly distributed around the center line of the suction cup are also arranged on the base, the output shaft of the positioning hydraulic cylinder faces the center line of the suction cup and the end of the output shaft is provided with a contact for contacting with the silicon wafer; a grinding wheel motor is horizontally slidably arranged on the base, and a grinding wheel for chamfering the silicon wafer is arranged at the end of the rotating shaft of the grinding wheel motor.

[0007] Compared with the prior art, the utility model is advantageous in that: in the utility model, the positioning of the silicon wafer is achieved by a positioning hydraulic cylinder so that the center of the silicon wafer coincides with the rotation center line of the rotating motor. When the silicon wafer is chamfered, the silicon wafer rotates, and the grinding wheel can evenly chamfer the outer circumference of the silicon wafer. Moreover, the utility model can chamfer silicon wafers of different models, and the position of the grinding wheel and the positioning device (contact) can be adjusted according to the model of the silicon wafer, and has a wide range of applications.

[0008] Furthermore, a lifting hydraulic cylinder is vertically arranged on the base, a rotating motor is arranged at the end of the output shaft of the lifting hydraulic cylinder, a reducer is connected to the rotating motor, and a suction cup is arranged at the end of the rotating shaft of the reducer.

[0009] Compared with the prior art, the utility model is advantageous in that: by setting a lifting hydraulic cylinder and adjusting the height of the suction cup, the silicon wafer can avoid interference of the positioning hydraulic cylinder on the grinding wheel after being fixed.

[0010] Furthermore, a positioning bracket is provided on the suction cup, the rotating motor, the reducer, and the upper cover of the lifting hydraulic cylinder, and a through hole is provided on the positioning bracket for the suction cup and the rotating motor to pass through.

[0011] Compared with the prior art, the utility model is advantageous in that the suction cup, the rotating motor, the reducer and the lifting hydraulic cylinder are protected by the positioning bracket of the cover.

[0012] Furthermore, the positioning hydraulic cylinder is arranged on the upper surface of the positioning bracket.

[0013] Furthermore, a movable bracket is slidably arranged on the base, the grinding wheel motor is installed on the movable bracket, and a horizontal hydraulic cylinder is also arranged on the base, and the output shaft end of the horizontal hydraulic cylinder is fixed to the movable bracket.

[0014] Compared with the prior art, the utility model is advantageous in that the position of the grinding wheel can be adjusted according to the type of silicon wafer by setting a horizontal hydraulic cylinder.

[0015] Furthermore, the movable bracket is provided with a nozzle located above the grinding wheel and used for spraying cooling liquid, and a waste tank located below the grinding wheel.

[0016] Compared with the prior art, the utility model is advantageous in that the nozzle, the waste material tank and the grinding wheel can slide synchronously, ensuring that the coolant can be sprayed and the waste material can be received while the chamfering is being performed.

[0017] Furthermore, the contact is a hemispherical or conical contact.

[0018] Compared with the prior art, the utility model is advantageous in that point contact with the silicon wafer is achieved, thereby preventing the contactor from getting stuck with the silicon wafer, thereby preventing the positioning of the silicon wafer from being affected.

[0019] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional schematic diagram of an embodiment of a lifting chamfering machine of the present invention;

[0021] Figure 2 for Figure 1 A three-dimensional schematic diagram from another perspective;

[0022] Figure 3 for Figure 1 A three-dimensional schematic diagram of the silicon wafer lifting device;

[0023] Figure 4 for Figure 1 A top view of

[0024] Figure 5 for Figure 4 Sectional view at point A;

[0025] Figure 6 for Figure 1 A three-dimensional schematic diagram of the silicon wafer lifting device after fixing the silicon wafer and lifting it. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] The utility model is a lifting chamfering machine embodiment, as Figures 1 to 6 As shown. The lifting chamfering machine includes a base 1, a fixed bracket 2 is arranged on one side of the upper surface of the base 1, and a movable bracket 3 is arranged on the fixed bracket 2 for horizontal sliding. A guide rail 201 is arranged on the upper surface of the fixed bracket 2, and a guide rail groove is arranged at the bottom of the movable bracket 3. The guide rail 201 is slidably nested in the guide rail groove, so that the movable bracket 3 can slide in the horizontal direction.

[0028] A grinding wheel motor 4 is horizontally arranged on the movable bracket 3, and the rotating shaft of the grinding wheel motor 4 extends out of the movable bracket 3 and a grinding wheel 5 is arranged at the end of the rotating shaft. A nozzle 6 for spraying coolant and a waste tank 7 for receiving particle dust and coolant are also fixedly arranged on the movable bracket 3. The nozzle 6 is located directly above the grinding wheel 5 and faces the grinding wheel 5. The tail of the nozzle 6 is connected to a coolant pipe 601, and the coolant pipe 601 is fixed to the top of the movable bracket 3. The coolant pipe 601 fixed to the movable bracket 3 is made of a rigid material so that the nozzle 6 can extend out of the movable bracket 3 and keep the position fixed. The coolant pipe 601 connected to the pump is made of a flexible material so that the movable bracket 3 can avoid tearing the coolant pipe 601 when moving. The other end of the coolant pipe 601 is connected to the pump and the coolant tank in sequence. When the grinding wheel motor 4 is started, the pump is started to extract the coolant in the coolant tank and spray it onto the grinding wheel 5 through the nozzle. The waste trough 7 is located directly below the grinding wheel 5 and fixed on the trough bracket 701. The trough bracket 701 is fixed on the movable bracket 3 and extends outward. The extension direction is consistent with the extension direction of the rotating shaft of the grinding wheel motor 4, so that the waste trough 7 can be located below the grinding wheel 5 to receive the particle dust generated when the grinding wheel is chamfered and the coolant sprayed by the nozzle. When the grinding wheel 5 chamfers the silicon wafer 17, the particle dust generated is washed into the waste trough 7 by the coolant. While cooling the grinding wheel 5 and the silicon wafer 17, the particle dust is washed to maintain a good working environment. The waste trough 7 can be detachably mounted on the trough bracket 701, and the waste in the waste trough 7 is emptied on time, or a discharge pipe is set at the bottom of the waste trough 7 to discharge the waste through the discharge pipe. The discharge pipe is made of flexible material to prevent the movable bracket 3 from tearing the discharge pipe when moving. The grinding wheel motor 4, the nozzle 6 and the waste trough 7 are fixedly arranged on the movable bracket 3, so that when the movable bracket adjusts the horizontal position according to the diameter of the silicon wafer 17, the grinding wheel 5, the nozzle 6 and the waste trough 7 remain in the vertical direction, ensuring that the particles and dust can be cleaned in time while chamfering.

[0029] A horizontal hydraulic cylinder 8 is also provided on the fixed support 2, and the extension direction of the output shaft of the horizontal hydraulic cylinder 8 is parallel to the movement direction of the movable support 3. The end of the output shaft of the horizontal hydraulic cylinder 8 is fixed to the movable support 3. The horizontal hydraulic cylinder 8 is connected to the hydraulic control device, and the extension length of the output shaft of the horizontal hydraulic cylinder 8 is controlled by the hydraulic control device, thereby adjusting the position of the movable support 3. When chamfering the silicon wafer 17, the extension length of the horizontal hydraulic cylinder 8 is adjusted according to the diameter of the silicon wafer 17, thereby adjusting the position of the movable support 3, so that the grinding wheel 5 adapts to the size of the silicon wafer 17 and contacts the silicon wafer 17, and the silicon wafer 17 is chamfered.

[0030] A silicon wafer lifting device is arranged on the other side of the upper surface of the base 1, and the silicon wafer lifting device is close to the side of the grinding wheel 5. The silicon wafer lifting device includes a lifting hydraulic cylinder 9 arranged on the upper surface of the base 1, and the lifting hydraulic cylinder 9 is arranged vertically on the base 1. The output shaft of the lifting hydraulic cylinder 9 faces upward, and a motor base 10 is fixedly arranged at the end of the output shaft. A rotating motor 11 is vertically arranged on the motor base 10, and a reducer 12 is connected to the rotating motor 11. A suction cup 13 is arranged at the end of the rotating shaft as the output end of the reducer 12, and the suction cup 13 is used to fix the silicon wafer 17. The suction cup 13 is connected to the vacuum device. The lifting hydraulic cylinder 9 can change the height of the rotating motor 11, the reducer 12, and the suction cup 13, and the silicon wafer 17 can be lifted and contacted with the grinding wheel 5 for chamfering after the silicon wafer 17 is fixed on the suction cup 13. The rotation of the rotating motor 11 drives the suction cup 13 and the silicon wafer 17 fixed on the suction cup 13 to rotate, so that the grinding wheel 5 chamfers the outer circumference of the silicon wafer 17. The center line of the suction cup 13 coincides with the center line of the rotating shaft of the reducer 13 .

[0031] A hollow positioning bracket 14 is also provided on the base 1. The cover of the positioning bracket 14 is provided on the silicon wafer lifting device. The positioning bracket 14 is detachably provided on the base 1, so that the positioning bracket 14 can be removed and the internal devices can be repaired. A through hole 1401 is provided on the upper surface of the positioning bracket 14 so that the rotating motor 11, the reducer 12 and the suction cup 13 can pass through. Three positioning hydraulic cylinders 15 are evenly distributed on the upper surface of the positioning bracket 14 around the center line of the suction cup 13. The positioning hydraulic cylinders 15 are horizontally provided on the positioning bracket 14, and the output shafts of the three positioning hydraulic cylinders 15 point to the center line of the suction cup 13. A contact 16 is provided at the end of the output shaft of the positioning hydraulic cylinder 15 for abutting the circumferential surface of the silicon wafer 17. The contact 16 is a hemisphere, and its convex surface faces the center line of the suction cup 13, so that the contact 16 and the circumferential surface of the silicon wafer 17 are in point contact. The three positioning hydraulic cylinders 15 are equidistant from the center line of the suction cup 13, and the three positioning hydraulic cylinders 15 are synchronously extended and retracted under the action of the hydraulic control device, so that the front end vertices of the three contacts 16 can form a circle with the center on the center line of the suction cup. Before placing the silicon wafer 17, the end of the suction cup 13 extends to the outside of the positioning bracket 14 and approaches the contacts 16 of the positioning hydraulic cylinder 15, so that the extension line of the output shaft of the positioning hydraulic cylinder 15 is located above the suction cup 13; the positioning hydraulic cylinder 15 is retracted backward to avoid interfering with the placement of the silicon wafer 17; after placing the silicon wafer 17 on the suction cup 13, the positioning hydraulic cylinder 15 is started at the same time, so that the contacts 16 extend forward at the same time. If the silicon wafer 17 is placed exactly at the center of the suction cup 13, the three contacts 16 simultaneously contact the circumferential surface of the silicon wafer 17 and press tightly, and there is no need Correct the position of the silicon wafer 17; if one or two contacts 16 first contact the outer circumference of the silicon wafer 17, it means that the silicon wafer is biased toward the positioning hydraulic cylinder 15 where the contact 16 is located. Under the push of the positioning hydraulic cylinder 15, the silicon wafer 17 slides on the suction cup 13, and when the contact that has not yet contacted the silicon wafer 17 contacts the silicon wafer 17, the three contacts 16 are in contact with the silicon wafer 17 at the same time, and the silicon wafer 17 is pushed to the center of the suction cup 13 and pressed against the silicon wafer 17, so as to realize the positioning of the silicon wafer 17, and the center of the circle of the silicon wafer 17 is located on the center line of the suction cup 13. A pressure sensor is provided on the positioning hydraulic cylinder 15, and when the contacts 16 press against the silicon wafer 17 at the same time, the output shaft of the positioning hydraulic cylinder 15 stops extending and remains; or before the positioning hydraulic cylinder 15 is turned on, the extension length of the output shaft of the positioning hydraulic cylinder 15 is set, and when the output shaft of the positioning hydraulic cylinder 15 is extended to the set length, the circle surrounded by the vertices of the contacts 16 coincides with the outer circumference of the silicon wafer. After the suction cup 13 is vacuumed to fix the silicon wafer 17 , the positioning hydraulic cylinder 15 contracts to fix the silicon wafer 17 at the center position of the suction cup 13 .

[0032] When using the lifting chamfering machine, in the initial state, the positioning hydraulic cylinder 15 retracts backwards to avoid interfering with the placement of the silicon wafer 17. The lifting hydraulic cylinder 9 is actuated to extend the suction cup 13 out of the through hole 1401 and close to the contact 16 of the positioning hydraulic cylinder 15. The suction cup 13 is located below the extension line of the output shaft of the positioning hydraulic cylinder 15. The horizontal hydraulic cylinder 8 retracts backwards to avoid interfering with the lifting of the lifting hydraulic cylinder 9. When starting to chamfer the silicon wafer 17, the silicon wafer 17 is placed on the suction cup 13. The extension length of the output shaft of the positioning hydraulic cylinder 15 is set according to the specifications of the silicon wafer 17, so that after the output shaft extends to this length, the size of the circle surrounded by the vertices of the contact 16 is consistent with the specifications of the silicon wafer 17. Then the positioning hydraulic cylinder 15 is started to extend its output shaft, and the contact 16 is simultaneously pressed against the outer circle of the silicon wafer 17. After the silicon wafer 17 is positioned on the peripheral surface, the silicon wafer 17 is positioned; the suction cup 13 is started to fix the silicon wafer 17; after the silicon wafer 17 is fixed, the positioning hydraulic cylinder 15 is restored to its initial state; the lifting hydraulic cylinder 9 is started to raise the silicon wafer 17 to the chamfering position; the rotating motor 11 is started to make the suction cup 13 drive the silicon wafer 17 to rotate, at this time, the center of the silicon wafer 17 is the rotation center; the grinding wheel 5 and the nozzle 6 are started, and according to the specifications of the silicon wafer to be processed, the horizontal hydraulic cylinder 8 is started to adjust the position of the grinding wheel 5, so that the grinding wheel 5 is close to the silicon wafer 17 and the outer circumference of the silicon wafer 17 is chamfered; after the chamfering is completed, the horizontal hydraulic cylinder 8 shrinks and closes the grinding wheel 5 and the nozzle 6, the rotating motor 11 stops rotating, and the lifting hydraulic cylinder 9 is restored to its initial state; the vacuum device of the suction cup 13 is closed, the silicon wafer 17 is removed, and the chamfering is completed.

[0033] In other embodiments, the contacts 16 may be convex conical contacts.

[0034] In the utility model, the positioning of the silicon wafer 17 is achieved by positioning the hydraulic cylinder 14, so that the center of the silicon wafer 17 coincides with the rotation center line of the rotating motor 11. When the silicon wafer 17 is chamfered, the silicon wafer 17 rotates, and the grinding wheel 5 can evenly chamfer the outer circumference of the silicon wafer 17; and the utility model can chamfer silicon wafers 17 of different models, and the positions of the grinding wheel 5 and the positioning device (contact 16) can be adjusted according to the model of the silicon wafer 17, and has a wide range of applications.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A lifting chamfering machine, comprising a base, characterized in that: A height-adjustable rotating device is vertically arranged on the base, a suction cup is horizontally arranged at the end of the rotating shaft of the rotating device, and the center line of the suction cup coincides with the rotation center line of the rotating device. A plurality of positioning hydraulic cylinders evenly distributed around the center line of the suction cup are also arranged on the base, the output shaft of the positioning hydraulic cylinder faces the center line of the suction cup and a contact for contacting the silicon wafer is arranged at the end of the output shaft; a grinding wheel motor is horizontally slidably arranged on the base, and a grinding wheel for chamfering the silicon wafer is arranged at the end of the rotating shaft of the grinding wheel motor.

2. A lifting chamfering machine according to claim 1, characterized in that: A lifting hydraulic cylinder is vertically arranged on the base, a rotating motor is arranged at the end of the output shaft of the lifting hydraulic cylinder, a reducer is connected to the rotating motor, and a suction cup is arranged at the end of the rotating shaft of the reducer.

3. A lifting chamfering machine according to claim 2, characterized in that: A positioning bracket is arranged on the cover of the suction cup, the rotating motor, the speed reducer and the lifting hydraulic cylinder, and a through hole is arranged on the positioning bracket for the suction cup and the rotating motor to pass through.

4. A lifting chamfering machine according to claim 3, characterized in that: The positioning hydraulic cylinder is arranged on the upper surface of the positioning bracket.

5. The lifting chamfering machine according to claim 1, characterized in that: A movable bracket is slidably arranged on the base, a grinding wheel motor is mounted on the movable bracket, a horizontal hydraulic cylinder is also arranged on the base, and an output shaft end of the horizontal hydraulic cylinder is fixed to the movable bracket.

6. The lifting chamfering machine according to claim 5, characterized in that: The movable bracket is provided with a spray head located above the grinding wheel and used for spraying cooling liquid, and a waste material tank located below the grinding wheel.

7. The lifting chamfering machine according to claim 1, characterized in that: The contact is a hemispherical or conical contact.

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