Refrigeration equipment

Abstract

The utility model relates to the technical field of refrigeration devices, and provides refrigeration equipment. The refrigeration equipment comprises an equipment body, a refrigeration box and a power supply assembly, a cavity is formed in the equipment body, the refrigeration box is arranged in the cavity, a storage chamber is defined in the refrigeration box, and the power supply assembly is arranged in the cavity and suitable for being electrically connected with the refrigeration box. According to the refrigeration equipment, the independent storage chamber with the lowest temperature lower than that of the refrigeration chamber of the refrigeration equipment can be formed in the refrigeration equipment, an original refrigeration system of the refrigeration equipment does not need to be changed, and the cost of the refrigeration equipment is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of refrigeration devices, and in particular to refrigeration equipment. Background Art

[0002] Refrigeration equipment includes refrigerators, freezers, wine cabinets, etc. Taking refrigerators as an example, refrigerators are household appliances that people often use in their daily lives. Assembled refrigerators are convenient to transport and install, their market prospects are getting better and better.

[0003] In the related art, when a lower temperature storage condition is required, the entire refrigeration system of the refrigeration equipment needs to be rebuilt to change the variable temperature range of the entire compartment of the refrigeration equipment, resulting in a higher cost of the refrigeration equipment. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes a refrigeration device, which can form an independent storage compartment with a minimum temperature lower than the refrigeration compartment of the refrigeration device in the refrigeration device, without changing the original refrigeration system of the refrigeration device, thereby reducing the cost of the refrigeration device.

[0005] The refrigeration device according to the embodiment of the present application includes:

[0006] A device body, wherein the device body is formed with a cavity;

[0007] A refrigeration box is disposed in the cavity, and the refrigeration box defines a storage compartment;

[0008] A power supply component is arranged in the cavity, and the power supply component is suitable for being electrically connected to the refrigeration box.

[0009] According to the refrigeration device of the embodiment of the present application, a refrigeration box is placed in the cavity of the device body, and the power supply component in the cavity and the refrigeration box are electrically connected, so that the power supply component can supply power to the refrigeration box, so that the refrigeration box can work. When the refrigeration box is working, the storage compartment can be cooled so that the minimum temperature of the storage compartment is lower than the minimum temperature of the refrigeration compartment of the device body. That is, the present application can form an independent storage compartment in the refrigeration device whose minimum temperature is lower than the refrigeration compartment of the refrigeration device, and because the refrigeration box is independent of the device body, there is no need to change the original refrigeration system of the refrigeration device, thereby reducing the cost of the refrigeration device.

[0010] According to an embodiment of the present application, the refrigeration box is detachably installed in the cavity.

[0011] According to an embodiment of the present application, the cavity is a refrigeration compartment of the device body, and the refrigeration box is suitable for conducting the generated heat into the refrigeration compartment.

[0012] According to one embodiment of the present application, the equipment body is formed with a compressor cabin, and the compressor of the equipment body is installed in the compressor cabin, wherein:

[0013] The cavity is the compressor cabin; or,

[0014] The refrigeration box is connected to the compressor chamber, and the refrigeration box is suitable for conducting the generated heat into the compressor chamber.

[0015] According to one embodiment of the present application, a control unit is provided on the outer wall of the device body, and the control unit is suitable for controlling the operation of the refrigeration box, wherein:

[0016] The power supply assembly and / or the refrigeration box are electrically connected to the control unit.

[0017] According to one embodiment of the present application, the refrigeration box includes an outer shell, an inner shell and a semiconductor refrigeration chip, the outer shell forms an installation cavity, the inner shell is arranged in the installation cavity, the inner shell forms the storage compartment, the cold end of the semiconductor refrigeration chip abuts against the inner shell, and the hot end of the semiconductor refrigeration chip abuts against the outer shell.

[0018] According to one embodiment of the present application,

[0019] The cold end of the semiconductor refrigeration chip is connected to the inner tank through a first temperature equalizing plate; and / or,

[0020] The cold end of the semiconductor refrigeration chip is connected to the inner tank through a first heat pipe; and / or,

[0021] The hot end of the semiconductor refrigeration chip is connected to the housing via a second temperature equalizing plate; and / or,

[0022] The hot end of the semiconductor refrigeration chip is connected to the housing through a second heat pipe.

[0023] According to one embodiment of the present application, the refrigeration box includes a cooling block, which is located between the second temperature averaging plate and the hot end of the semiconductor refrigeration chip, and the hot end of the semiconductor refrigeration chip and the second temperature averaging plate are both in contact with the cooling block.

[0024] According to an embodiment of the present application, the cooling block and the second temperature homogenizing plate are connected via a first heat conducting layer; and / or,

[0025] The cooling block and the hot end of the semiconductor refrigeration chip are connected via a second heat-conducting layer; and / or,

[0026] The cold end of the semiconductor refrigeration chip and the first temperature equalizing plate are connected via a third heat conducting layer; and / or,

[0027] The first temperature homogenizing plate and the inner tank are connected via a fourth heat conducting layer; and / or,

[0028] The second temperature homogenizing plate and the housing are connected via a fifth heat conducting layer.

[0029] According to an embodiment of the present application, a temperature detection element is provided in the storage compartment, the temperature detection element is suitable for detecting the temperature in the storage compartment, and the temperature detection element is electrically connected to the semiconductor refrigeration chip.

[0030] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 is a schematic diagram of the structure of a refrigeration device provided in an embodiment of the present application;

[0033] Figure 2 is a schematic diagram of the structure of a refrigeration box provided in an embodiment of the present application;

[0034] Figure 3 It is a cross-sectional view of the refrigeration box provided in an embodiment of the present application.

[0035] Reference numerals:

[0036] 1. Equipment body; 2. Refrigeration box; 11. Refrigeration room; 12. Compressor cabin; 21. Storage room;

[0037] 22. outer shell; 23. liner; 24. semiconductor refrigeration chip; 25. first temperature equalizing plate;

[0038] 26. Second temperature equalizing plate; 27. Cooling block. DETAILED DESCRIPTION

[0039] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0040] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0041] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0042] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0044] Combine the following Figures 1 to 3 A refrigeration device of the present application is described.

[0045] According to the embodiments of the present application, Figure 1 , Figure 2 and Figure 3 As shown, the refrigeration device includes an equipment body 1, a refrigeration box 2 and a power supply component. The equipment body 1 forms a cavity, the refrigeration box 2 is arranged in the cavity, the refrigeration box 2 defines a storage compartment 21, the power supply component is arranged in the cavity, and the power supply component is suitable for being electrically connected to the refrigeration box 2.

[0046] According to the refrigeration device of the embodiment of the present application, the refrigeration box 2 is placed in the cavity of the device body 1, and the power supply component in the cavity is electrically connected to the refrigeration box 2, so that the power supply component can supply power to the refrigeration box 2, so that the refrigeration box 2 can work. When the refrigeration box 2 is working, the storage compartment 21 can be cooled down, so that the minimum temperature of the storage compartment 21 is lower than the minimum temperature of the refrigeration compartment 11 of the device body 1. That is, the present application can form an independent storage compartment 21 in the refrigeration device, whose minimum temperature is lower than the refrigeration compartment 11 of the refrigeration device, and because the refrigeration box 2 is independent of the device body 1, there is no need to change the original refrigeration system of the refrigeration device, thereby reducing the cost of the refrigeration device.

[0047] It is understandable that the refrigeration box 2 can be used alone as long as a power supply is provided to the refrigeration box 2. That is, the user can take the refrigeration box 2 out of the cavity and place it in another suitable position. The refrigeration box 2 can refrigerate the storage compartment 21 by simply connecting the refrigeration box 2 to the power supply, thereby increasing the user's usability and meeting the different needs of the user.

[0048] It is understandable that the cavity may be a refrigeration cavity of the device body 1 , or may be an independent cavity additionally opened in the device body 1 for installing the refrigeration box 2 .

[0049] It is understandable that the cavity can be the refrigerator of the device body 1 or the freezer of the device body 1. When the cavity is the refrigerator of the device body 1, the adjustable temperature range of the storage compartment 21 of the refrigerator 2 is set to be greater than the adjustable temperature range of the refrigerator, and the lowest temperature of the storage compartment 21 is lower than the lowest temperature of the refrigerator. When the cavity is the freezer of the device body 1, the adjustable temperature range of the storage compartment 21 of the refrigerator 2 is set to be greater than the adjustable temperature range of the freezer, and the lowest temperature of the storage compartment 21 is lower than the lowest temperature of the freezer.

[0050] Exemplarily, the refrigerating box 2 is, for example, a semiconductor refrigerator.

[0051] In one embodiment of the present application, the refrigeration box 2 is detachably installed in the cavity.

[0052] It can be understood that since the refrigeration box 2 and the device body 1 are detachably connected, when the refrigeration box 2 and the device body 1 need to be used together, the refrigeration box 2 can be installed in the cavity of the device body 1. When the refrigeration box 2 needs to be used alone, the refrigeration box 2 can be removed from the cavity, which makes the use of the refrigeration box 2 more flexible and can meet the different usage requirements of users.

[0053] Exemplarily, the refrigeration box 2 is detachably installed in the cavity by at least one of snap-fitting, magnetic attraction, and the like.

[0054] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3 As shown, the cavity is a refrigeration chamber 11 of the device body 1 , and the refrigeration box 2 is suitable for conducting the generated heat into the refrigeration chamber 11 .

[0055] It is understandable that the refrigeration box 2 is installed in the refrigeration chamber 11 of the device body 1, and the heat generated by the refrigeration box 2 during operation can be directly transferred to the refrigeration chamber 11, while the device body 1 will cool the refrigeration chamber 11, so that the heat generated by the refrigeration box 2 during operation can be discharged to the outside. That is, this embodiment uses the refrigeration cycle of the device body 1 to transfer the heat generated by the refrigeration box 2 to the outside, so that the refrigeration box 2 can work normally, and there is no need to set up a new heat dissipation structure at the device body 1.

[0056] It can be understood that the refrigeration box 2 is installed in the refrigeration room 11, so that the refrigeration box 2 and the refrigeration room 11 share the heat dissipation structure of the equipment body 1, and the refrigeration box 2 and the equipment body 1 constitute a cascade refrigeration device.

[0057] It is understandable that installing the refrigeration box 2 in the refrigeration compartment 11 makes the environment of the refrigeration box 2 a low-temperature environment, which can improve the refrigeration efficiency of the refrigeration box 2.

[0058] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3 As shown, the equipment body 1 is formed with a compressor cabin 12 , the compressor of the equipment body 1 is installed in the compressor cabin 12 , and the cavity is the compressor cabin 12 .

[0059] It is understandable that the refrigeration box 2 is installed in the compressor cabin 12 so that the heat generated by the refrigeration box 2 can be directly dissipated into the compressor cabin 12, so that when the equipment body 1 dissipates heat from the compressor cabin 12, the heat generated by the refrigeration box 2 can be discharged to the outside.

[0060] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3As shown, the equipment body 1 is formed with a compressor cabin 12 , the compressor of the equipment body 1 is installed in the compressor cabin 12 , the refrigeration box 2 is connected to the compressor cabin 12 , and the refrigeration box 2 is suitable for conducting the generated heat into the compressor cabin 12 .

[0061] It can be understood that the refrigeration box 2 and the compressor cabin 12 are connected so that the heat generated by the refrigeration box 2 can be transferred to the compressor cabin 12 through heat conduction, so that when the equipment body 1 dissipates heat from the compressor cabin 12, the heat generated by the refrigeration box 2 can be discharged to the outside.

[0062] In one embodiment of the present application, a control unit is provided on the outer wall surface of the device body 1 , and the control unit is suitable for controlling the operation of the refrigeration box 2 , and the control unit is electrically connected to the refrigeration box 2 .

[0063] It is understandable that the control unit and the refrigeration box 2 are electrically connected so that the user can control the refrigeration box 2 through the control unit, including but not limited to controlling the switch and refrigeration temperature of the refrigeration box 2.

[0064] In one embodiment of the present application, a control part is provided on the outer wall surface of the device body 1, and the control part is suitable for controlling the operation of the refrigeration box 2, and the control part is electrically connected to the power supply component.

[0065] It is understandable that the control unit and the power supply assembly are electrically connected so that the user can control the power supply assembly through the control unit, and further control whether the power supply assembly supplies power to the refrigeration box 2, that is, control the switch of the refrigeration box 2.

[0066] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3 As shown, the refrigeration box 2 includes an outer shell 22, an inner shell 23 and a semiconductor refrigeration chip 24. The outer shell 22 forms a mounting cavity, the inner shell 23 is arranged in the mounting cavity, the inner shell 23 forms a storage compartment 21, the cold end of the semiconductor refrigeration chip 24 abuts against the inner shell 23, and the hot end of the semiconductor refrigeration chip 24 abuts against the outer shell 22.

[0067] It is understandable that the cold end of the semiconductor refrigeration chip 24 can cool the inner liner 23, so that the temperature in the storage compartment 21 is reduced, and the temperature in the storage compartment 21 is regulated. When the semiconductor refrigeration chip 24 cools the inner liner 23, the heat generated will be transferred to the outer shell 22 through the hot end of the semiconductor refrigeration chip 24, and then the heat will be dissipated into the cavity through the outer shell 22.

[0068] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3 As shown, the cold end of the semiconductor refrigeration chip 24 is connected to the inner tank 23 through the first temperature equalizing plate 25 .

[0069] It can be understood that by connecting the cold end of the semiconductor refrigeration chip 24 and the inner tank 23 through the first temperature equalizing plate 25, the cold energy generated by the semiconductor refrigeration chip 24 can be transferred to the inner tank 23 more quickly and evenly, thereby achieving rapid and uniform cooling of the inner tank 23.

[0070] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3 As shown, the cold end of the semiconductor refrigeration chip 24 is connected to the inner tank 23 through the first heat pipe.

[0071] It is understandable that by connecting the cold end of the semiconductor refrigeration chip 24 and the inner tank 23 through the first heat pipe, the cold energy generated by the semiconductor refrigeration chip 24 can be transferred to the inner tank 23 more quickly and evenly, thereby achieving rapid and uniform cooling of the inner tank 23.

[0072] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3 As shown, the hot end of the semiconductor cooling chip 24 is connected to the housing 22 through the second temperature averaging plate 26.

[0073] It can be understood that by connecting the hot end of the semiconductor refrigeration chip 24 and the housing 22 through the second temperature equalizing plate 26, the heat generated by the semiconductor refrigeration chip 24 can be transferred to the housing 22 more quickly and evenly, thereby achieving rapid heat dissipation.

[0074] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3 As shown, the hot end of the semiconductor refrigeration chip 24 is connected to the housing 22 through a second heat pipe.

[0075] It can be understood that by connecting the hot end of the semiconductor refrigeration chip 24 and the housing 22 through the second heat pipe, the heat generated by the semiconductor refrigeration chip 24 can be transferred to the housing 22 more quickly and evenly, thereby achieving rapid heat dissipation.

[0076] It can be understood that while using the first temperature averaging plate 25 and / or the first heat pipe to connect the cold end and the inner tank 23, using the second temperature averaging plate 26 and / or the second heat pipe to connect the hot end and the outer shell 22, the temperature difference between the cold end of the semiconductor refrigeration chip 24 and the hot end of the semiconductor refrigeration chip 24 can be reduced, the cooling efficiency of the semiconductor refrigeration chip 24 can be improved, and a lower temperature can be obtained using lower power.

[0077] In one embodiment of the present application, Figure 1 , Figure 2 and Figure 3As shown, the refrigeration box 2 includes a cooling block 27 , which is located between the second temperature averaging plate 26 and the hot end of the semiconductor refrigeration chip 24 , and the hot end of the semiconductor refrigeration chip 24 and the second temperature averaging plate 26 are both in contact with the cooling block 27 .

[0078] It can be understood that the hot end of the semiconductor refrigeration chip 24 is connected to the second temperature averaging plate 26 through the cold conduction block 27, so that the heat at the hot end of the semiconductor refrigeration chip 24 can be transferred to the second temperature averaging plate 26 through the cold conduction block 27. The cold conduction block 27 is installed between the hot end and the second temperature averaging plate 26, which can position and fix the semiconductor refrigeration chip 24, so that the semiconductor refrigeration chip 24 remains stable.

[0079] In one embodiment of the present application, the cooling block 27 and the second temperature equalizing plate 26 are connected via a first heat conducting layer.

[0080] It can be understood that by providing the first heat-conducting layer between the cooling block 27 and the second temperature-averaging plate 26 , the heat-conducting efficiency between the cooling block 27 and the second temperature-averaging plate 26 can be effectively improved.

[0081] In one embodiment of the present application, the cooling block 27 and the hot end of the semiconductor refrigeration chip 24 are connected via a second heat-conducting layer.

[0082] It can be understood that by providing a second heat-conducting layer between the cooling block 27 and the hot end of the semiconductor refrigeration chip 24 , the heat-conducting efficiency between the hot end and the cooling block 27 can be effectively improved.

[0083] In one embodiment of the present application, the cold end of the semiconductor refrigeration chip 24 and the first temperature equalizing plate 25 are connected via a third heat conducting layer.

[0084] It can be understood that by providing a third heat conduction layer between the cold end of the semiconductor refrigeration chip 24 and the first temperature equalizing plate 25 , the cold energy at the cold end can be effectively transferred to the first temperature equalizing plate 25 .

[0085] In one embodiment of the present application, the first temperature equalizing plate 25 and the inner tank 23 are connected via a fourth heat conducting layer.

[0086] It can be understood that by providing the fourth heat conducting layer between the first temperature averaging plate 25 and the inner liner 23 , the heat conduction efficiency between the first temperature averaging plate 25 and the inner liner 23 can be improved.

[0087] In one embodiment of the present application, the second temperature homogenizing plate 26 and the housing 22 are connected via a fifth heat conducting layer.

[0088] It is understandable that by providing the fifth heat conducting layer between the second temperature averaging plate 26 and the outer shell 22 , the heat conducting efficiency between the second temperature averaging plate 26 and the outer shell 22 can be improved, and the heat can be effectively conducted to the outer shell 22 .

[0089] In one embodiment of the present application, a temperature detection element is provided in the storage compartment 21 . The temperature detection element is suitable for detecting the temperature in the storage compartment 21 . The temperature detection element is electrically connected to the semiconductor refrigeration chip 24 .

[0090] It can be understood that the temperature in the storage compartment 21 can be detected by the temperature detection element, and the detection data can be transmitted to the semiconductor refrigeration chip 24, so that the semiconductor refrigeration chip 24 can work according to the temperature in the storage compartment 21, ensuring that the temperature in the storage compartment 21 can be controlled at a preset temperature.

[0091] Exemplarily, the temperature detection element is, for example, a temperature sensing package or a temperature sensor.

[0092] Finally, it should be noted that the above implementation modes are only used to illustrate the present application, rather than to limit the present application. Although the present application is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent substitutions of the technical solutions of the present application do not depart from the spirit and scope of the technical solutions of the present application, and should be included in the scope of the claims of the present application.

Claims

1. A refrigeration device, characterized in that: include: A device body, wherein the device body is formed with a cavity; A refrigeration box is disposed in the cavity, and the refrigeration box defines a storage compartment; A power supply component is arranged in the cavity, and the power supply component is suitable for being electrically connected to the refrigeration box.

2. The refrigeration equipment according to claim 1, characterized in that: The refrigeration box is detachably installed in the cavity.

3. The refrigeration equipment according to claim 1, characterized in that: The cavity is a refrigeration compartment of the device body, and the refrigeration box is suitable for conducting the generated heat into the refrigeration compartment.

4. The refrigeration equipment according to claim 1, characterized in that: The equipment body is formed with a compressor cabin, and the compressor of the equipment body is installed in the compressor cabin, wherein, The cavity is the compressor cabin; or, The refrigeration box is connected to the compressor chamber, and the refrigeration box is suitable for conducting the generated heat into the compressor chamber.

5. The refrigeration device according to any one of claims 1 to 4, characterized in that: The outer wall surface of the device body is provided with a control part, and the control part is suitable for controlling the operation of the refrigeration box, wherein: The power supply assembly and / or the refrigeration box are electrically connected to the control unit.

6. The refrigeration device according to any one of claims 1 to 4, characterized in that: The refrigeration box includes an outer shell, an inner shell and a semiconductor refrigeration chip. The outer shell forms an installation cavity, the inner shell is arranged in the installation cavity, the inner shell forms the storage compartment, the cold end of the semiconductor refrigeration chip abuts against the inner shell, and the hot end of the semiconductor refrigeration chip abuts against the outer shell.

7. The refrigeration device according to claim 6, characterized in that: The cold end of the semiconductor refrigeration chip is connected to the inner tank through a first temperature equalizing plate; and / or, The cold end of the semiconductor refrigeration chip is connected to the inner tank through a first heat pipe; and / or, The hot end of the semiconductor refrigeration chip is connected to the housing via a second temperature equalizing plate; and / or, The hot end of the semiconductor refrigeration chip is connected to the housing through a second heat pipe.

8. The refrigeration device according to claim 7, characterized in that: The refrigeration box includes a cooling block, which is located between the second temperature averaging plate and the hot end of the semiconductor refrigeration chip. The hot end of the semiconductor refrigeration chip and the second temperature averaging plate are both in contact with the cooling block.

9. The refrigeration device according to claim 8, characterized in that: The cooling block and the second temperature homogenizing plate are connected via a first heat conducting layer; and / or, The cooling block and the hot end of the semiconductor refrigeration chip are connected via a second heat-conducting layer; and / or, The cold end of the semiconductor refrigeration chip and the first temperature equalizing plate are connected via a third heat conducting layer; and / or, The first temperature homogenizing plate and the inner tank are connected via a fourth heat conducting layer; and / or, The second temperature homogenizing plate and the housing are connected via a fifth heat conducting layer.

10. The refrigeration equipment according to claim 6, characterized in that: A temperature detection element is disposed in the storage compartment. The temperature detection element is suitable for detecting the temperature in the storage compartment. The temperature detection element is electrically connected to the semiconductor refrigeration chip.

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