Ceramic substrate positioning and adjustment device for probe card

Abstract

The utility model relates to the field of semiconductor testing technology, and more specifically, to a positioning and adjustment device for a ceramic substrate of a probe card. The device includes a probe ceramic substrate, a plurality of positioning and adjustment mechanisms, a plurality of mask plates, and a fixed reference component: the probe ceramic substrate is placed above the fixed reference component, and probes and alignment marking points are distributed on the surface; the mask plate is arranged on the fixed reference component, and a mask plate pattern for alignment is distributed on the surface; the positioning and adjustment mechanism is arranged on the fixed reference component and distributed around the probe ceramic substrate; wherein the positioning and adjustment mechanism pushes the probe ceramic substrate to perform displacement adjustment within a certain range, so that the alignment marking points are aligned with the mask plate pattern. The utility model realizes the positioning, adjustment and fixation of the probe ceramic plate substrate through the positioning and adjustment structure, which not only improves the alignment accuracy and operation efficiency, but also reduces the production cost and complexity.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, and more specifically to a ceramic substrate positioning and adjusting device for a probe card. Background Art

[0002] The mask is an important component used in photolithography technology during the manufacturing process of semiconductor devices. Its function is to enable the photolithography equipment to expose and form circuit patterns on the ceramic substrate.

[0003] In the production process of semiconductor devices, the accuracy of alignment technology is crucial. In order to achieve accurate positioning of the probe card ceramic substrate and the mask during the alignment and overlap process, it is necessary to move the ceramic substrate of the probe card to achieve accurate alignment of the Mark (alignment mark) points of the ceramic substrate of the probe card with the mask pattern. The ultimate goal is to achieve accurate positioning between the probes distributed on the surface of the ceramic substrate and the entire probe card and the test machine.

[0004] In the current semiconductor production process, the movement and positioning of the probe ceramic substrate mainly rely on manual adjustment. Although this method can achieve the purpose of positioning to a certain extent, there are many problems and challenges.

[0005] First, manual adjustment requires the operator to have rich experience and professional skills. In the actual production process, the operator needs to first set the reference for the adjustment direction. This is usually done by manually adjusting to a certain position, and then temporarily adding a limit block as the reference for the adjustment direction. However, the uncertainty of this reference leads to the uncontrollability of manual adjustment, making fine-tuning difficult and inaccurate.

[0006] Secondly, when the ceramic substrate needs to be disassembled, the operator needs to reset the reference of the adjustment direction, which not only increases the complexity and time-consuming of the production process, but also may lead to a decrease in positioning accuracy.

[0007] Therefore, this traditional alignment method is not only costly but also lacks flexibility and is unable to meet the requirements for high precision and high efficiency in modern semiconductor production. Utility Model Content

[0008] The utility model aims to provide a ceramic substrate positioning and adjusting device for a probe card, so as to solve the problems of low positioning accuracy and poor flexibility of the prior art probe ceramic substrate alignment technical solution.

[0009] In order to achieve the above-mentioned purpose, the utility model provides a ceramic substrate positioning and adjustment device for a probe card, including a probe ceramic substrate, a plurality of positioning and adjustment mechanisms, a plurality of mask plates and a fixed reference component:

[0010] The probe ceramic substrate is placed above the fixed reference component, and probes and alignment marking points are distributed on the surface;

[0011] The mask is arranged on a fixed reference component, and a mask pattern for alignment is distributed on the surface;

[0012] The positioning and adjusting mechanism is arranged on the fixed reference component and distributed around the ceramic substrate of the probe;

[0013] The positioning adjustment mechanism pushes the probe ceramic substrate to perform displacement adjustment within a certain range so that the alignment mark point is aligned with the mask pattern.

[0014] In some embodiments, the number of the positioning adjustment mechanisms is 4 groups, which are symmetrically and evenly distributed around the ceramic substrate, and are defined as mutually perpendicular X and Y directions according to the relative arrangement directions;

[0015] The positioning adjustment mechanism pushes the probe ceramic substrate to perform displacement adjustment along the X direction or the Y direction.

[0016] In some embodiments, the positioning adjustment mechanism includes a first substrate adjustment structure, a second substrate adjustment structure, and a third substrate adjustment structure:

[0017] The first substrate adjustment structure is mounted on the fixed reference component, and one side of the structure is in contact with the probe ceramic substrate;

[0018] The second substrate adjustment structure is mounted on and fixedly connected to the fixed reference component;

[0019] The third substrate adjusting structure is arranged on the second substrate adjusting structure;

[0020] The third substrate adjusting structure pushes the first substrate adjusting structure to adjust the displacement of the probe ceramic substrate within a certain range.

[0021] In some embodiments, a first protrusion is provided at the bottom of the first substrate adjusting structure;

[0022] A limiting groove structure is provided on the surface of the fixed reference component;

[0023] The first protrusion matches the limiting groove structure to perform limiting movement.

[0024] In some embodiments, a second protrusion is provided at the bottom of the second substrate adjusting structure;

[0025] The second protrusion matches the limiting groove structure.

[0026] In some embodiments, a recessed portion is provided at the bottom of the first substrate adjusting structure for accommodating the second substrate adjusting structure:

[0027] The recessed portion is communicated with a side wall of one side of the first substrate adjusting structure, and a side wall is retained on the other side.

[0028] In some embodiments, the first substrate adjustment structure has first countersunk hole structures on both sides, and the first countersunk holes are connected to the fixed reference component through first fasteners;

[0029] The diameter of the first countersunk hole is larger than the diameter of the first fastener;

[0030] The second substrate adjustment structure has second countersunk hole structures on both sides, and the second countersunk hole structures are fixedly connected to the fixed reference component through a second fastener;

[0031] The diameter of the second countersunk hole matches the diameter of the second fastener.

[0032] In some embodiments, the second substrate adjustment structure has a central through hole in the middle along the displacement adjustment direction;

[0033] The third substrate adjusting structure passes through the central through hole and abuts against the first substrate adjusting structure to push the first substrate adjusting structure to perform displacement adjustment.

[0034] In some embodiments, the third substrate adjustment structure adopts an external thread structure;

[0035] The central through hole of the second substrate adjustment structure is an internal thread structure;

[0036] The third substrate adjustment structure performs displacement adjustment through a rotation action to achieve position control of the probe ceramic substrate.

[0037] In some embodiments, the ceramic substrate positioning and adjustment device of the probe card further includes a mask limit block:

[0038] The mask limiting block limits and fixes the mask on the fixed reference component.

[0039] In order to achieve the above object, the utility model provides a method for positioning and adjusting a ceramic substrate of a probe card, which is implemented based on the above-mentioned ceramic substrate positioning and adjusting device of the probe card, and includes the following steps:

[0040] Using the structural position of the probe card as a reference, adjust the position of the probe ceramic substrate and the mask to achieve preliminary alignment of the relative position of the alignment mark point and the mask pattern;

[0041] Determine the displacement adjustment direction, and fine-tune the positioning adjustment mechanism corresponding to the displacement adjustment direction so that the alignment mark point is completely aligned with the mask pattern.

[0042] In some embodiments, the positioning adjustment mechanism of the ceramic substrate positioning adjustment device of the probe card includes a first substrate adjustment structure, a second substrate adjustment structure, and a third substrate adjustment structure, and the method further includes:

[0043] The third substrate adjusting structure pushes the first substrate adjusting structure to fine-tune the displacement of the probe ceramic substrate within a certain range along the displacement adjustment direction.

[0044] The utility model proposes a ceramic substrate positioning and adjustment device for a probe card, which realizes positioning adjustment and fixation of the probe ceramic substrate through a positioning adjustment structure, and can effectively adjust the positioning of the ceramic substrate of the probe, which not only improves the alignment accuracy and efficiency, but also reduces the production cost and complexity, and further promotes the steady development and progress of the semiconductor industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The above and other features, properties and advantages of the present invention will become more apparent through the following description in conjunction with the accompanying drawings and embodiments, in which the same reference numerals always represent the same features, wherein:

[0046] Figure 1 An overall schematic diagram of a ceramic substrate positioning and adjusting device for a probe card according to an embodiment of the utility model is disclosed;

[0047] Figure 2a A first installation stereogram of a positioning and adjusting mechanism according to an embodiment of the utility model is disclosed;

[0048] Figure 2b A second installation stereogram of the positioning and adjusting mechanism according to an embodiment of the utility model is disclosed;

[0049] Figure 3a A first stereoscopic perspective view of a positioning and adjusting mechanism according to an embodiment of the utility model is disclosed;

[0050] Figure 3b A second stereoscopic perspective view of a positioning adjustment mechanism according to an embodiment of the utility model is disclosed;

[0051] Figure 4a Revealed Figure 1 AA cross-sectional view of the ceramic substrate positioning and adjusting device of the probe card shown;

[0052] Figure 4b Revealed Figure 4a A partial enlarged view of the positioning adjustment mechanism shown;

[0053] Figure 4c Revealed Figure 4a An exploded view of the parts of the positioning adjustment mechanism shown;

[0054] Figure 5a Revealed Figure 1 A BB cross-sectional view of the ceramic substrate positioning and adjustment device of the probe card shown;

[0055] Figure 5b Revealed Figure 5a An exploded view of the parts of the positioning adjustment mechanism shown;

[0056] Figure 6a Revealed Figure 1 A D-direction view of the ceramic substrate positioning and adjustment device of the probe card shown;

[0057] Figure 6b Revealing Figure 6a A partial enlarged view of the ceramic substrate positioning and adjusting device of the probe card shown;

[0058] Figure 7 A flow chart of a method for positioning and adjusting a ceramic substrate of a probe card according to an embodiment of the utility model is disclosed.

[0059] The meanings of the reference numerals in the figures are as follows:

[0060] 1. Probe ceramic plate substrate;

[0061] 2. Positioning adjustment mechanism;

[0062] 21 first substrate adjustment structure;

[0063] 211 first protrusion;

[0064] 212 recessed portion;

[0065] 213 first countersunk hole;

[0066] 22 second substrate adjustment structure;

[0067] 221 second protrusion;

[0068] 222 central through hole;

[0069] 223 second countersunk hole;

[0070] 23 a third substrate adjusting structure;

[0071] 3. Mask limit block;

[0072] 4. The first mask;

[0073] 5. Second mask;

[0074] 6. Fixing the reference component;

[0075] 61 limit slots. DETAILED DESCRIPTION

[0076] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0077] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention. Although the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation, the shape, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout may also be more complicated.

[0078] In order to accurately realize the positioning of the comparison and overlapping process in the production of semiconductor devices, the manual alignment technology of the existing technology must be innovated and improved. The utility model proposes a ceramic substrate positioning and adjustment device for a probe card, which enables the ceramic substrate position of the probe to be accurately, finely and conveniently adjusted.

[0079] Figure 1 The overall schematic diagram of the ceramic substrate positioning and adjusting device of the probe card according to an embodiment of the utility model is disclosed, as shown in FIG. Figure 1 As shown, the utility model proposes a ceramic substrate positioning and adjustment device for a probe card, including a probe ceramic substrate 1, a plurality of positioning and adjustment mechanisms 2, a plurality of mask plates and a fixed reference component 6:

[0080] The probe ceramic substrate 1 is placed above the fixed reference component 6, and probes and Mark points for alignment are distributed on the surface;

[0081] The mask plate includes two first mask plates 4 and two second mask plates 5, which are arranged on a fixed reference component 6, and mask plate patterns for alignment are distributed on the surface;

[0082] The positioning adjustment mechanism 2 is arranged on the fixed reference component 6 and distributed around the probe ceramic substrate 1;

[0083] The fixed reference component 6 is used to provide a fixed adjustment reference for the positioning adjustment mechanism 2 and the mask.

[0084] The probe ceramic substrate 1 can be placed above the fixed reference component 6. It is not fixed but can be moved, so that the relative position of the probe ceramic substrate 1 and the mask can be adjusted to meet the complete alignment of the alignment mark point and the mask pattern. Since the position of the mark point of the probe ceramic substrate 1 is not evenly distributed in a circle, the distribution position of the alignment pattern in the corresponding mask is different, so there are differences between each mask.

[0085] In this embodiment, the pattern of the first mask 4 is used to align the mark points of a portion of the position of the probe ceramic substrate 1;

[0086] The pattern of the second mask 5 is used for aligning the mark point of another part of the position of the probe ceramic substrate 1;

[0087] In this embodiment, the adjusting device further includes a mask limit block 3:

[0088] The mask limiting blocks 3 , which are four in number, are used to accurately limit and fix the first mask 4 and the second mask 5 on the fixed reference component 6 , so as to accurately locate the positional relationship between the mask and the fixed reference component 6 .

[0089] In this embodiment, the fixed reference component 6 is a flange metal ring structure, more specifically, the fixed reference component 6 is a flange metal steel ring structure, which is used to ensure the reference and fixing function of the positioning adjustment mechanism 2 during the displacement adjustment process, thereby ensuring the precise positioning of the positioning adjustment mechanism 2, the probe card and the test machine.

[0090] In this embodiment, the number of positioning adjustment mechanisms 2 is 4, which are symmetrically and evenly distributed around the probe ceramic substrate 1 and fixedly set on the fixed reference component 6. According to the relative setting direction, they are defined as the X direction and the Y direction perpendicular to each other, such as Figure 1 shown.

[0091] The positioning adjustment mechanism 2 pushes the probe ceramic substrate 1 to adjust its displacement along the X direction or the Y direction.

[0092] Figure 2a and Figure 2b The first installation stereogram and the second installation stereogram of the positioning adjustment mechanism according to an embodiment of the utility model are disclosed respectively. Figure 3a and Figure 3b The first and second stereoscopic perspective views of the positioning and adjusting mechanism according to an embodiment of the utility model are disclosed respectively. Figures 2a to 3b As shown, the positioning adjustment mechanism 2 includes a first substrate adjustment structure 21, a second substrate adjustment structure 22 and a third substrate adjustment structure 23:

[0093] The first substrate adjustment structure 21 is mounted on the fixed reference component 6, and one side is in contact with the probe ceramic substrate 1;

[0094] The second substrate adjustment structure 22 is mounted on the fixed reference component 6 and fixedly connected;

[0095] The third substrate adjusting structure 23 is disposed on the second substrate adjusting structure 22 , and adjusts the displacement of the probe ceramic substrate 1 within a certain range by pushing the first substrate adjusting structure 21 .

[0096] In this embodiment, the shape of the first substrate adjustment structure 21 is similar to a rectangular three-dimensional structure, but in fact, its core design concept is to ensure that the side in contact with the probe ceramic substrate is flat. Such a design can ensure that during operation, the contact between it and the probe ceramic substrate is stable and uniform, thereby ensuring a stable and efficient movement process.

[0097] There is actually greater design freedom for the overall shape of the first substrate adjustment structure 21. As long as the contact surface is flat, various three-dimensional structures can be used to meet specific application scenarios or performance requirements. For example, according to actual needs, shapes such as cylinders, cones, and triangular prisms can be selected. The selection of these shapes will directly affect the stability, strength, and manufacturing cost of the structure.

[0098] Figure 4a Revealed Figure 1 The AA cross-sectional view of the ceramic substrate positioning and adjustment device of the probe card shown, Figure 4b Revealed Figure 4a The partial enlarged view of the positioning adjustment mechanism shown in FIG. Figure 4c Revealed Figure 4a The exploded view of the parts of the positioning adjustment mechanism shown, Figure 5a Revealed Figure 1 The BB cross-sectional view of the ceramic substrate positioning and adjustment device of the probe card shown, Figure 5b Revealed Figure 5a The exploded view of the positioning adjustment mechanism is shown in Figure 1. Figures 2a to 5b As shown, the first substrate adjustment structure 21 has first countersunk holes 213 on both sides, and the bottom of the first countersunk holes 213 is connected to the fixed reference component 6 through a first fastener;

[0099] The diameter of the first countersunk hole 231 is greater than the diameter of the first fastener.

[0100] The design of the first countersunk hole 213 structure aims to achieve dual functions: one is to serve as an interface for fastener connection, and the other is to provide a certain movement and adjustment space.

[0101] The connection and fixing method of the first substrate adjusting structure 21 ensures that the first substrate adjusting structure 21 is connected to the fixed reference component 6 while ensuring movement and adjustment within a certain range.

[0102] The second substrate adjusting structural member 22 has second countersunk holes 223 structures on both sides, and the bottom of the second countersunk holes 223 structures is fixedly connected to the fixed reference component 6 through a second fastener.

[0103] The diameter of the second countersunk hole 223 matches the diameter of the second fastener.

[0104] The structural design of the second countersunk hole 223 not only increases the stability of the structure, but also enables the connector to be better hidden inside, thereby realizing the overall assembly of the first substrate adjustment structure 21 , the second substrate adjustment structure 22 and the third substrate adjustment structure 23 .

[0105] In order to ensure the stability and reliability of the connection, there is a strict matching requirement between the diameter of the second countersunk hole 223 structure and the diameter of the second fastener. Only when the diameters of the two are completely matched can the fastener and the countersunk hole be firmly connected.

[0106] The connection and fixing method of the second substrate adjusting structure 22 ensures that the second substrate adjusting structure 22 is tightly connected to the fixed reference component 6 without movement, thereby providing a force basis for the third substrate adjusting structure 23 to push the first substrate adjusting structure 21 .

[0107] like Figures 2a to 3b As shown, a recessed portion 212 is provided at the middle position of the bottom of the first substrate adjusting structure 21:

[0108] The recessed portion 212 is used to accommodate the second substrate adjusting structure 22 .

[0109] One side of the recessed portion 212 is connected to a side wall of the first substrate adjusting structure 21 , and the other side retains a side wall, thereby ensuring that the third substrate adjusting structure 23 can pass through the second substrate adjusting structure 22 and abut against a side wall of the first substrate adjusting structure 21 , thereby pushing the first substrate adjusting structure 21 .

[0110] The shape of the second substrate adjusting structural member 22 is designed to match the recessed portion 212 , which can not only ensure the stability and reliability between the structural members, but also effectively reduce errors and deviations during the assembly process.

[0111] In this embodiment, the second substrate adjustment structure 22 is designed to be in the shape of a cuboid. As a common geometric shape, the cuboid has the advantages of stable structure, easy processing and assembly. However, in other cases, according to actual needs and application scenarios, the second substrate adjustment structure 22 can also be designed into other shapes, such as circular, triangular or irregular shapes. The flexibility of this design enables the structure to adapt to various complex and special application environments.

[0112] Through the above structural design, the space occupied by the first substrate adjustment structure 21, the second substrate adjustment structure 22 and the third substrate adjustment structure 23 after assembly is significantly optimized. This improvement is crucial for products with strict space requirements, ensuring that they will not be affected by space interference during use, thereby ensuring the normal function and feasibility of operation of the product, with excellent versatility and broad application prospects.

[0113] like Figures 2a to 5b As shown, a first protrusion 211 is provided at the bottom of the first substrate adjusting structure 21;

[0114] The surface of the fixed reference component 6 is provided with a limiting groove 61 structure;

[0115] The first protrusion 211 matches the limiting groove 61 structure to perform limiting movement.

[0116] Furthermore, a second protrusion 221 is provided at the bottom of the second substrate adjusting structure 22;

[0117] The second protrusion 221 matches the structure of the limiting groove 61 .

[0118] Precise positioning is achieved between the first substrate adjusting structure 21, the second substrate adjusting structure 22 and the fixed reference component 6 through the limiting groove 61 structure, ensuring that when the third substrate adjusting structure 23 pushes the first substrate adjusting structure 21 to move, the first substrate adjusting structure 21 only translates in a single direction without angular displacement. At the same time, it can also effectively ensure that the probe ceramic substrate 1 maintains a stable position to prevent it from angular displacement.

[0119] Figure 6a Revealed Figure 1 The D direction view of the ceramic substrate positioning and adjustment device of the probe card is shown. Figure 6b Revealing Figure 6a A partial enlarged view of the ceramic substrate positioning and adjustment device of the probe card is shown in FIG. Figures 2a to 6b As shown, the second substrate adjustment structure 22 has a central through hole 222 formed in the middle along the displacement adjustment direction;

[0120] The third substrate adjusting structure 23 passes through the central through hole 222 and abuts against the side wall of the first substrate adjusting structure 21 , thereby pushing the probe ceramic substrate 1 to perform displacement adjustment.

[0121] The third substrate adjusting structure 23 acts on the first substrate adjusting structure 21 and does not directly act on the probe ceramic substrate 1, thereby ensuring that a larger range of surface contact is established between the first substrate adjusting structure 21 and the probe ceramic substrate 1, and effectively avoiding the angular displacement (rotation) of the probe ceramic substrate 1 during the movement. If the third substrate adjusting structure 23 directly forms local contact with the probe ceramic substrate 1, this contact mode is equivalent to point contact, which may cause the probe ceramic substrate 1 to be more prone to angular displacement when moving in the X and Y directions.

[0122] Furthermore, the third substrate adjustment structure 23 adopts an external thread structure;

[0123] The central through hole 222 of the second substrate adjusting structure 22 is an internal thread structure;

[0124] The third substrate adjustment structure 23 performs displacement adjustment through a rotation action to achieve control of the position of the probe ceramic substrate 1 .

[0125] Furthermore, the third substrate adjusting structure 23 is an adjusting screw.

[0126] Based on the ceramic substrate positioning and adjusting device of the probe card, the utility model further proposes a ceramic substrate positioning and adjusting method of the probe card.

[0127] Figure 7 A flow chart of a method for positioning and adjusting a ceramic substrate of a probe card according to an embodiment of the utility model is disclosed. Figure 7 As shown, the utility model proposes a method for positioning and adjusting a ceramic substrate of a probe card, comprising the following steps:

[0128] Step S1, using the structural position of the probe card as a reference, adjusting the positions of the probe ceramic substrate and the mask to achieve preliminary alignment of the relative positions of the alignment mark point and the mask pattern;

[0129] Step S2, determining the displacement adjustment direction, and fine-tuning the positioning adjustment mechanism corresponding to the displacement adjustment direction so that the alignment mark point is completely aligned with the mask pattern.

[0130] More specifically, the positioning and adjusting method of the ceramic substrate positioning and adjusting device based on the above-mentioned probe card comprises the following steps:

[0131] Step 1: Determine the direction of the probe ceramic board substrate 1. Based on the positions of other structural parts of the probe card as a reference, determine the Mark point of the probe ceramic board substrate 1 in the correct direction, ensure that the up, down, left, and right directions of the substrate match the positions of other structural parts of the probe card, and avoid the substrate being placed up, down, left, and right in reverse;

[0132] Step 2: determine the positioning adjustment reference so that the patterns of the first mask 4 and the second mask 5 are in the correct direction;

[0133] Step 3: Determine the positioning adjustment direction. Among the four groups of positioning adjustment mechanisms 2, the two symmetrical groups are respectively set to the X and Y directions;

[0134] Since the position of the mask pattern is precisely fixed, first determine the relative position of the Mark point and the pattern, and then determine which group of positioning adjustment structures needs to be adjusted so that the substrate Mark point moves closer to the pattern.

[0135] Step 4: Positioning and adjusting the drive, fine-tuning the X direction and the Y direction, and pushing the first substrate adjusting structure 21 to move by fine-tuning the third substrate adjusting structure 23, so that the Mark point of the probe ceramic substrate 1 is close to the mask patterns of the first mask 4 and the second mask 5;

[0136] Step 5: Evaluate the positioning and adjustment effect, determine the alignment effect between the Mark point of the probe ceramic board substrate 1 and the mask patterns of the first mask 4 and the second mask 5, and then use fasteners to fix the positions of the four positioning and adjustment mechanisms 2 to complete the positioning process of the probe ceramic board substrate 1.

[0137] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0138] The utility model provides a ceramic substrate positioning and adjusting device for a probe card, which specifically has the following features:

[0139] Beneficial effects:

[0140] 1) The relationship between the positioning and adjustment structures is precisely positioned to ensure that only the X and Y directions can be moved, while the positions and angles in other directions remain unchanged. Therefore, there is no need to reset or find the benchmarks in the X and Y directions, and fine-tuning can be performed directly. The operation is very convenient, and there is no order restriction for fine-tuning in the X and Y directions, which has great flexibility.

[0141] 2) The positioning and adjustment structure can not only fix the substrate while adjusting its position to prevent the position of the substrate from changing, but also, in the subsequent disassembly and assembly of the substrate, only one side of the two symmetrical groups of positioning and adjustment structures needs to be loosened to keep the other two sides fixed. In this way, when the substrate needs to be reinstalled, there is no need to perform positioning and adjustment again. Only the two groups of positioning and adjustment structures that have been loosened need to be fine-tuned and moved to directly complete the positioning of the substrate, thereby avoiding repeated adjustment steps.

[0142] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0143] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0144] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0145] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0146] The above embodiments are provided for persons familiar with the art to implement or use the present invention. Personnel familiar with the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope of the innovative features mentioned in the claims.

Claims

1. A ceramic substrate positioning and adjustment device for a probe card, characterized in that: It includes a probe ceramic substrate, several positioning adjustment mechanisms, several mask plates and fixed reference components: The probe ceramic substrate is placed above the fixed reference component, and probes and alignment marking points are distributed on the surface; The mask is arranged on a fixed reference component, and a mask pattern for alignment is distributed on the surface; The positioning and adjusting mechanism is arranged on the fixed reference component and distributed around the ceramic substrate of the probe; The positioning adjustment mechanism pushes the probe ceramic substrate to perform displacement adjustment within a certain range so that the alignment mark point is aligned with the mask pattern.

2. The ceramic substrate positioning and adjusting device for a probe card according to claim 1, characterized in that: The number of the positioning adjustment mechanisms is 4 groups, which are symmetrically and evenly distributed around the ceramic substrate, and are defined as mutually perpendicular X and Y directions according to the relative arrangement directions; The positioning adjustment mechanism pushes the probe ceramic substrate to perform displacement adjustment along the X direction or the Y direction.

3. The ceramic substrate positioning and adjusting device for a probe card according to claim 1, characterized in that: The positioning adjustment mechanism includes a first substrate adjustment structure, a second substrate adjustment structure and a third substrate adjustment structure: The first substrate adjustment structure is mounted on the fixed reference component, and one side of the structure is in contact with the probe ceramic substrate; The second substrate adjustment structure is mounted on and fixedly connected to the fixed reference component; The third substrate adjusting structure is arranged on the second substrate adjusting structure; The third substrate adjusting structure pushes the first substrate adjusting structure to adjust the displacement of the probe ceramic substrate within a certain range.

4. The ceramic substrate positioning and adjusting device for a probe card according to claim 3, characterized in that: A first protrusion is provided at the bottom of the first substrate adjusting structure; A limiting groove structure is provided on the surface of the fixed reference component; The first protrusion matches the limiting groove structure to perform limiting movement.

5. The ceramic substrate positioning and adjusting device for a probe card according to claim 4, characterized in that: A second protrusion is provided at the bottom of the second substrate adjusting structure; The second protrusion matches the limiting groove structure.

6. The ceramic substrate positioning and adjusting device for a probe card according to claim 4, characterized in that: A recessed portion is provided at the bottom of the first substrate adjusting structure for accommodating the second substrate adjusting structure: The recessed portion is communicated with a side wall of one side of the first substrate adjusting structure, and a side wall is retained on the other side.

7. The ceramic substrate positioning and adjusting device for a probe card according to claim 3, characterized in that: The first substrate adjustment structure has first countersunk hole structures on both sides, and the first countersunk holes are connected to the fixed reference component through first fasteners; The diameter of the first countersunk hole is larger than the diameter of the first fastener; The second substrate adjustment structure has second countersunk hole structures on both sides, and the second countersunk hole structures are fixedly connected to the fixed reference component through a second fastener; The diameter of the second countersunk hole matches the diameter of the second fastener.

8. The ceramic substrate positioning and adjusting device for a probe card according to claim 3, characterized in that: The second substrate adjustment structure has a central through hole in the middle along the displacement adjustment direction; The third substrate adjusting structure passes through the central through hole and abuts against the first substrate adjusting structure to push the first substrate adjusting structure to perform displacement adjustment.

9. The ceramic substrate positioning and adjusting device for a probe card according to claim 8, characterized in that: The third substrate adjustment structure adopts an external thread structure; The central through hole of the second substrate adjustment structure is an internal thread structure; The third substrate adjustment structure performs displacement adjustment through a rotation action to achieve position control of the probe ceramic substrate.

10. The ceramic substrate positioning and adjusting device for a probe card according to claim 1, characterized in that: Also includes mask limit blocks: The mask limiting block limits and fixes the mask on the fixed reference component.

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