Evaporation device and evaporation equipment
By setting a flow guide assembly and a heating structure between the injection assembly of the evaporation device and the target substrate, the problem of material waste is solved, efficient guidance and utilization of material gas molecules is achieved, and the utilization rate of material is improved.
Patent Information
- Application Number
- CN202421397275.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-18
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-06-18
AI Technical Summary
The existing evaporation source system easily causes waste of material when the material is heated and evaporated, and some of the materials are attached to the angle limiting plate, limiting the evaporation of the material to the target substrate.
An evaporation device is designed, including a first housing, an injection assembly and a flow guide assembly. The flow guide assembly consists of a flow guide plate body and a heating structure. The flow guide plate body encloses to form a flow guide channel, guiding material gas molecules to the target substrate. The heating structure heats the flow guide plate body to prevent the material gas molecules from being disorderly attached and improve material utilization.
By providing a flow guide assembly between the injection assembly and the target substrate, the material gas molecules are prevented from being attached in disorder, avoiding material waste, and the material gas molecules are rebounded to the target substrate again through the heating structure, greatly improving the material utilization rate.
Smart Images
Figure CN222758311U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vacuum evaporation equipment, in particular to an evaporation device and evaporation equipment. Background Art
[0002] At present, the vacuum coating process is mainly used in the production of perovskites. The equipment used is an evaporation source system, which mainly includes a crucible for loading materials and angle limiting plates on both sides of the crucible for controlling the evaporation area. When the material is heated and evaporated, part of the material adheres to the angle limiting plate, which limits the evaporation of this part of the material to the target substrate, resulting in material waste. Utility Model Content
[0003] In view of this, the utility model provides an evaporation device and an evaporation equipment to solve the problem that the existing evaporation source system easily causes material waste when the material is heated and evaporated.
[0004] In a first aspect, the utility model provides a vapor deposition device, comprising:
[0005] A first shell, the inner wall of which encloses a vacuum chamber;
[0006] The injection assembly is arranged relatively spaced apart from the target substrate in the vacuum chamber, and the injection assembly is suitable for injecting material gas molecules toward the target substrate;
[0007] The guide plate body is arranged between the injection assembly and the target substrate. The guide plate body is suitable for enclosing and forming a guide channel. The guide channel is suitable for guiding the material gas molecules to the target substrate. The heating structure is suitable for heating the guide plate body to heat the material gas molecules to separate from or collide with the guide plate body.
[0008] Beneficial effects: The evaporation device provided by the utility model sets a guide component between the injection component and the target substrate. The guide component includes a guide plate body and a heating structure. The inner wall of the guide plate body is enclosed to form a guide channel, thereby preventing some material gas molecules from scattering disorderly and adhering to the surroundings of the vacuum chamber, thereby avoiding material waste. At the same time, the guide plate body is heated by the heating structure, so that the material gas molecules that collide with the guide plate body are rebounded to the target substrate again, thereby avoiding the deposition of material gas molecules on the guide plate body, thereby greatly improving the material utilization rate.
[0009] In an optional embodiment, the heating structure includes a first heating element and a second heating element, the first heating element is arranged at one end of the guide plate body close to the injection assembly, and the second heating element is arranged at one end of the guide plate body close to the target substrate, and the heating temperature of the second heating element is higher than the heating temperature of the first heating element.
[0010] Beneficial effect: A temperature gradient is formed on the guide plate body, which prevents the material gas molecules from being deposited on the top of the guide plate body due to collision energy loss, avoids affecting the evaporation area, and is conducive to improving material utilization.
[0011] In an optional implementation, the first heating element is evenly arranged on the guide plate body; the second heating element is evenly arranged on the guide plate body.
[0012] Beneficial effect: The first heating element is evenly arranged on the outer wall of the guide plate body to ensure the uniformity of heat applied by the first heating element to the heating area of the guide plate body; the second heating element is evenly arranged on the outer wall of the guide plate body to ensure the uniformity of heat applied by the second heating element to the heating area of the guide plate body, thereby ensuring the uniformity of the movement speed of the material gas molecules toward the target substrate, and further ensuring the uniformity of the coating thickness.
[0013] In an optional embodiment, the guide assembly further includes a plurality of air pipes, the jet direction of the air pipes is set at an angle to the guide plate body, and the air pipes are suitable for introducing a carrier gas flow into the guide channel to drive the material gas molecules to be deposited on the target substrate in an orderly manner.
[0014] Beneficial effect: During the material deposition process, the carrier gas flow is introduced through the gas pipe toward the target substrate, so that the heated material gas molecules are deposited on the target substrate in an orderly and efficient manner, further improving the thin film deposition efficiency and the material utilization rate.
[0015] In an optional embodiment, a plurality of air pipes are evenly spaced apart on the guide plate body.
[0016] Beneficial effect: While improving the efficiency of thin film deposition, it is also beneficial to improve the uniformity of the speed of material gas molecules moving toward the target substrate, thereby ensuring the uniformity of the coating thickness.
[0017] In an optional embodiment, the injection assembly includes:
[0018] The second shell has an inner wall enclosing a receiving cavity, and the receiving cavity is suitable for receiving the vapor deposition material;
[0019] A third heating element is disposed on the outer wall of the second shell, and the third heating element is suitable for heating the second shell so that the evaporation material in the accommodating cavity is heated to form material gas molecules;
[0020] The nozzle is arranged on a side of the second shell body close to the target substrate, the nozzle is connected with the accommodating cavity, and the nozzle is suitable for injecting material gas molecules toward the target substrate.
[0021] Beneficial effect: The second shell and the nozzle are heated simultaneously by the third heating element, so that the evaporation material in the accommodating cavity is heated to form material gas molecules, and the material gas molecules are sprayed into the guide channel through the nozzle, so that the material gas molecules collide with the target substrate through the guide channel and are deposited into a thin film when cooled.
[0022] In an optional embodiment, the evaporation device further includes a third shell, which is disposed at one end of the flow guide assembly away from the target substrate, and the inner wall of the third shell encloses a heat preservation cavity, which is suitable for accommodating the injection assembly.
[0023] Beneficial effects: thus avoiding heat loss of the injection assembly, ensuring the heating efficiency of the third heating element on the second shell and the nozzle, and ensuring the formation of a material gas molecular flow with a stable evaporation rate.
[0024] In an optional embodiment, a through opening is provided on a side of the third housing close to the target substrate;
[0025] One end of the nozzle is connected to the accommodating cavity, and the other end is suitable for passing through the through opening and extending into the guide channel.
[0026] Beneficial effect: The material gas molecules are ejected toward the target substrate through the nozzle, ensuring that the movement direction of the material gas molecules is toward the target substrate.
[0027] In an optional embodiment, a plurality of groups of injection assemblies are arranged in the heat preservation chamber, and the plurality of groups of injection assemblies are evenly spaced.
[0028] Beneficial effect: To ensure the uniformity of jetting from multiple nozzles to the target substrate, it is beneficial to ensure the uniformity of coating thickness.
[0029] In a second aspect, the utility model further provides a vapor deposition device, comprising: a device body, and the vapor deposition apparatus as described above.
[0030] Beneficial effects: The evaporation equipment of the second aspect includes the evaporation device of the first aspect, and therefore, the evaporation equipment of the second aspect includes all the beneficial effects of the evaporation device of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0032] Figure 1 A schematic diagram of the working principle of a vapor deposition device according to an embodiment of the utility model;
[0033] Figure 2 A side view of a guide plate body and a heating structure of a vapor deposition device according to an embodiment of the utility model;
[0034] Figure 3 It is a cross-sectional view of a third shell of a vapor deposition device according to an embodiment of the utility model.
[0035] Description of reference numerals:
[0036] 10. First housing; 101. Vacuum chamber; 11. Carrying mechanism;
[0037] 20. Target substrate;
[0038] 30. injection assembly; 31. second housing; 311. accommodating chamber; 32. third heating element; 33. nozzle;
[0039] 40. flow guide assembly; 41. flow guide plate body; 411. flow guide channel; 42. heating structure; 421. first heating element; 422. second heating element; 43. air pipe;
[0040] 50. The third shell; 501. The heat preservation chamber; 502. The opening. DETAILED DESCRIPTION
[0041] The evaporation source system in the related art mainly includes a crucible for loading materials and angle limiting plates on both sides of the crucible for controlling the evaporation area. The entire evaporation source system is arranged in a vacuum chamber. The high vacuum environment is heated by a heating device, so that the material is vaporized and ejected through the crucible nozzle. The particles move freely and adhere to the target substrate to form a thin film, completing the evaporation operation of the film layer. On the one hand, there is no requirement for the evaporation angle for the coating of the perovskite industry. However, due to the setting of the traditional angle limiting plate, when the material is heated and evaporated, part of the material adheres to the plate, which limits the evaporation of this part of the material to the target substrate, resulting in material waste; on the other hand, after the material is heated and evaporated, except for the material attached to the angle limiting plate, most of the material gas molecules will scatter and adhere to the surrounding of the vacuum chamber due to disordered movement, further causing material waste.
[0042] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0043] Combine the following Figures 1 to 3, describing an embodiment of the utility model.
[0044] According to an embodiment of the present invention, on the one hand, a vapor deposition device is provided, comprising:
[0045] First housing 10, see Figure 1 As shown, the inner wall thereof encloses a vacuum chamber 101, thereby providing a vacuum environment for evaporation;
[0046] The injection assembly 30 is arranged relatively spaced from the target substrate 20 in the vacuum chamber 101 along the height direction, and the injection assembly 30 is suitable for injecting material gas molecules toward the target substrate 20, so that the material gas molecules are cooled and deposited into a thin film on the target substrate 20;
[0047] The guide assembly 40 includes a guide plate body 41 and a heating structure 42. The guide plate body 41 is arranged between the injection assembly 30 and the target substrate 20. The inner wall of the guide plate body 41 is suitable for enclosing a guide channel 411. The guide channel 411 is suitable for guiding the material gas molecules to the target substrate 20, thereby preventing some material gas molecules from scattering in a disorderly manner and adhering to the surroundings of the vacuum chamber 101 to avoid material waste. The heating structure 42 is suitable for heating the guide plate body 41 to heat the material gas molecules to separate from or collide with the guide plate body 41.
[0048] It should be noted that the injection assembly 30 injects material gas molecules toward the target substrate 20. Due to the disordered movement of the material gas molecules, a part of the material gas molecules ejected perpendicular to the target substrate 20 can directly collide with the target substrate 20. Since the surface temperature of the target substrate 20 is low, the gas molecules are cooled and deposited into a thin film, while another part of the material gas molecules ejected not perpendicular to the target substrate 20 can collide with the guide plate body 41. Since the heating structure 42 heats the guide plate body 41, the temperature of the guide plate body 41 is relatively high, which prevents the material gas molecules that collide with the guide plate body 41 from coldly adhering to the guide plate body 41, and enables the material gas molecules that collide with the guide plate body 41 to rebound to the target substrate 20 again due to thermal motion. Finally, the material gas molecules that are not ejected perpendicular to the target substrate 20 can also collide with the target substrate 20 and form a thin film when cooled, thereby greatly improving the material utilization rate. Compared with the evaporation source system in the related art, the evaporation device provided by the utility model eliminates the setting of the traditional angle limiting plate, thereby preventing the gas molecules of some materials from being cooled and deposited on the angle limiting plate after colliding with the angle limiting plate after being heated, thus avoiding material waste.
[0049] The evaporation device provided by the utility model is provided with a guide component 40 between the injection component 30 and the target substrate 20. The guide component 40 includes a guide plate body 41 and a heating structure 42. The inner wall of the guide plate body 41 is enclosed to form a guide channel 411, thereby preventing some material gas molecules from scattering disorderly and adhering to the periphery of the vacuum chamber 101, thereby avoiding material waste. At the same time, the guide plate body 41 is heated by the heating structure 42, so that the material gas molecules that collide with the guide plate body 41 are rebounded to the target substrate 20 again, thereby avoiding the material gas molecules from being deposited on the guide plate body 41, thereby greatly improving the material utilization rate.
[0050] Among them, it can be understood that the first shell 10 is generally the cavity wall of the vacuum equipment. In the vacuum chamber 101, it also includes a carrying mechanism 11 for carrying the target substrate 20. The carrying mechanism 11 can be a supporting structure fixed inside the vacuum chamber 101, or it can be a conveying mechanism for conveying the target substrate 20 to the inside or outside of the vacuum chamber 101. When it is a conveying mechanism, an entrance and an exit are opened on the first shell 10 corresponding to the conveying direction.
[0051] Furthermore, the heating structure 42 is disposed on the outer side wall of the guide plate body 41 .
[0052] In some embodiments, please combine Figure 1 and Figure 2 As shown, the heating structure 42 includes a first heating element 421 and a second heating element 422. The first heating element 421 is arranged at one end of the guide plate body 41 close to the injection assembly 30 along the height direction, and the second heating element 422 is arranged at one end of the guide plate body 41 close to the target substrate 20 along the height direction. The heating temperature of the second heating element 422 is higher than the heating temperature of the first heating element 421, so that a temperature gradient is formed on the guide plate body 41 along the height direction, which prevents the material gas molecules from being deposited on the top of the guide plate body 41 due to the loss of collision energy, avoids affecting the evaporation area, and is beneficial to improving the material utilization rate.
[0053] For further information, see Figure 2 As shown, the first heating element 421 and the second heating element 422 can both be serpentine heating tubes or serpentine heating wire structures.
[0054] It should be noted that, generally speaking, the higher the temperature of the guide plate body 41 , the greater the energy and movement speed of the material gas molecules after colliding and rebounding from the guide plate body 41 .
[0055] In some embodiments, please combine Figure 1 and Figure 2As shown, the first heating element 421 is evenly arranged on the outer wall of the guide plate body 41 to ensure the uniformity of heat applied to the heating area of the guide plate body 41 by the first heating element 421; the second heating element 422 is evenly arranged on the outer wall of the guide plate body 41 to ensure the uniformity of heat applied to the heating area of the guide plate body 41 by the second heating element 422, thereby ensuring the uniformity of the movement speed of the material gas molecules toward the target substrate 20, and further ensuring the uniformity of the coating thickness.
[0056] It should be noted that the close-space deposition technology in the related art has poor uniformity of the actual film layer because the substrate is too close to the crucible. The evaporation device of the utility model can ensure the uniformity of the coating while greatly improving the material utilization rate.
[0057] In some embodiments, see Figure 1 As shown, the guide assembly 40 also includes a plurality of air pipes 43 , the jet direction of the air pipes 43 is set at an angle to the guide plate body 41 , and the air pipes 43 are suitable for introducing a carrier gas flow into the guide channel 411 to drive the material gas molecules to be deposited on the target substrate 20 in an orderly manner.
[0058] Furthermore, the air pipe 43 is disposed on the inner wall of the guide plate body 41 .
[0059] In this embodiment, a plurality of air pipes 43 are arranged on the guide plate body 41 so that the jet direction of the air pipes 43 is arranged at an angle to the guide plate body 41. During the material deposition process, a carrier gas flow is introduced through the air pipes 43 toward the direction close to the target substrate 20, so that the heated material gas molecules are deposited on the target substrate 20 in an orderly and efficient manner, thereby further improving the thin film deposition efficiency and the material utilization rate.
[0060] In some embodiments, see Figure 1 As shown, a plurality of gas pipes 43 are evenly spaced on the guide plate body 41, which improves the film deposition efficiency while helping to increase the uniformity of the speed of the material gas molecules moving toward the target substrate 20, thereby ensuring the uniformity of the coating thickness.
[0061] In some embodiments, see Figure 1 As shown, the injection assembly 30 includes:
[0062] The second housing 31 has an inner wall enclosing a receiving cavity 311, and the receiving cavity 311 is suitable for receiving the vapor deposition material;
[0063] The third heating element 32 is disposed on the outer wall of the second shell 31, and the third heating element 32 is suitable for heating the second shell 31, so that the evaporation material in the accommodating cavity 311 is heated to form material gas molecules;
[0064] The nozzle 33 is disposed on a side of the second housing 31 close to the target substrate 20 . The nozzle 33 is communicated with the accommodating cavity 311 . The nozzle 33 is suitable for injecting material gas molecules toward the target substrate 20 .
[0065] Furthermore, the third heating element 32 is simultaneously coated on the outer wall of the second shell 31 and the nozzle 33 to ensure the heating effect on the material.
[0066] In this embodiment, the second shell 31 and the nozzle 33 are heated simultaneously by the third heating element 32, so that the evaporation material in the accommodating cavity 311 is heated to form material gas molecules, and the material gas molecules are sprayed into the guide channel 411 through the nozzle 33, so that the material gas molecules collide with the target substrate 20 through the guide channel 411 and are deposited into a thin film when cooled.
[0067] In some embodiments, see Figure 1 As shown, the evaporation device also includes a third shell 50, which is arranged at one end of the guide component 40 away from the target substrate 20. The inner wall of the third shell 50 encloses a heat preservation chamber 501, and the heat preservation chamber 501 is suitable for accommodating the injection component 30, thereby avoiding heat loss of the injection component 30, ensuring the heating efficiency of the third heating element 32 to the second shell 31 and the nozzle 33, and ensuring the formation of a material gas molecular gas flow with a stable evaporation rate.
[0068] In some embodiments, see Figure 3 As shown, a through opening 502 is provided on one side of the third housing 50 close to the target substrate 20;
[0069] Please combine Figure 2 As shown, one end of the nozzle 33 in the height direction is connected to the accommodating cavity 311, and the other end is suitable for passing through the through opening 502 and extending into the guide channel 411, so that the material gas molecules are ejected toward the target substrate 20 through the nozzle 33, ensuring that the movement direction of the material gas molecules is toward the target substrate 20.
[0070] In some embodiments, a plurality of spray assemblies 30 are disposed in the heat preservation chamber 501 , and the plurality of spray assemblies 30 are evenly spaced to ensure uniformity of the jets from the plurality of nozzles 33 to the target substrate 20 , which is beneficial to ensuring uniformity of the coating thickness.
[0071] The working principle of the evaporation device of the utility model is uniformly described below:
[0072] The evaporation material in the accommodating cavity 311 of the second housing 31 is heated by the third heating element 32 to become material gas molecules, and then is ejected through the nozzle 33;
[0073] See also Figure 1As shown, due to the disordered movement of gas molecules, a part of the material gas molecules ejected perpendicular to the target substrate 20 can directly collide with the target substrate 20. Since the surface temperature of the target substrate 20 is low, the material gas molecules are cooled and deposited into a thin film; while another part of the material gas molecules collide with the guide plate body 41. Due to the heating effect of the first heating element 421 and the second heating element 422, the part of the material gas molecules that collide with the guide plate body 41 will not condense but will be re-reflected, and finally collide with the target substrate 20, and form a thin film on the target substrate 20 when cooled;
[0074] During the material deposition process, the gas pipe 43 introduces a carrier gas flow toward the target substrate 20 , so that the heated material gas molecules are deposited toward the target substrate 20 in an orderly and efficient manner, further improving the thin film deposition efficiency and material utilization rate.
[0075] The evaporation device provided by the utility model can increase the probability of gas molecules generated by the material being heated and attached to the target substrate without requiring an evaporation airflow angle, and can ensure the uniformity of the evaporated film layer without changing the distance from the evaporation source to the target substrate (Target-Source Distance, TS), thereby improving the utilization rate of the material and greatly reducing the material cost.
[0076] According to an embodiment of the present invention, on the other hand, a vapor deposition device is provided, including: a device body, and the vapor deposition apparatus as described above.
[0077] The evaporation equipment in this embodiment includes the above-mentioned evaporation device, and therefore, the evaporation equipment in this embodiment includes all the beneficial effects of the above-mentioned evaporation device.
[0078] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.
Claims
1. A vapor deposition device, characterized in that: include: A first shell (10), the inner wall of which encloses a vacuum chamber (101); An injection assembly (30) is arranged in the vacuum chamber (101) relatively spaced from the target substrate (20), and the injection assembly (30) is suitable for injecting material gas molecules toward the target substrate (20); A flow guide assembly (40) comprises a flow guide plate body (41) and a heating structure (42); the flow guide plate body (41) is arranged between the injection assembly (30) and the target substrate (20); the flow guide plate body (41) is suitable for enclosing and forming a flow guide channel (411); the flow guide channel (411) is suitable for guiding material gas molecules to the target substrate (20); and the heating structure (42) is suitable for heating the flow guide plate body (41) to heat the material gas molecules to separate from or collide with the flow guide plate body (41).
2. The evaporation device according to claim 1, characterized in that: The heating structure (42) comprises a first heating element (421) and a second heating element (422), wherein the first heating element (421) is arranged at one end of the guide plate body (41) close to the injection assembly (30), and the second heating element (422) is arranged at one end of the guide plate body (41) close to the target substrate (20), and the heating temperature of the second heating element (422) is higher than the heating temperature of the first heating element (421).
3. The evaporation device according to claim 2, characterized in that: The first heating element (421) is evenly arranged on the guide plate body (41); The second heating elements (422) are evenly arranged on the guide plate body (41).
4. The evaporation device according to claim 1, characterized in that: The flow guide component (40) further comprises a plurality of air pipes (43), wherein the jet direction of the air pipes (43) is arranged at an angle to the flow guide plate body (41), and the air pipes (43) are suitable for introducing a carrier gas flow into the flow guide channel (411) to drive the material gas molecules to be deposited on the target substrate (20) in an orderly manner.
5. The evaporation device according to claim 4, characterized in that: A plurality of the air pipes (43) are evenly spaced and arranged on the guide plate body (41).
6. The evaporation device according to any one of claims 1 to 5, characterized in that: The injection assembly (30) comprises: A second shell (31), the inner wall of which encloses a receiving cavity (311), wherein the receiving cavity (311) is suitable for receiving the vapor deposition material; a third heating element (32) disposed on the outer wall of the second shell (31), the third heating element (32) being suitable for heating the second shell (31) so that the vapor deposition material in the accommodating cavity (311) is heated to form material gas molecules; A nozzle (33) is arranged on a side of the second shell (31) close to the target substrate (20), the nozzle (33) is connected to the accommodating cavity (311), and the nozzle (33) is suitable for injecting material gas molecules toward the target substrate (20).
7. The evaporation device according to claim 6, characterized in that: The evaporation device further comprises a third shell (50), wherein the third shell (50) is arranged at one end of the flow guide component (40) away from the target substrate (20), and the inner wall of the third shell (50) encloses a heat preservation cavity (501), wherein the heat preservation cavity (501) is suitable for accommodating the injection component (30).
8. The evaporation device according to claim 7, characterized in that: A through opening (502) is provided on a side of the third housing (50) close to the target substrate (20); One end of the nozzle (33) is in communication with the accommodating cavity (311), and the other end is suitable for passing through the through opening (502) and extending into the guide channel (411).
9. The evaporation device according to claim 7, characterized in that: A plurality of groups of the injection assemblies (30) are arranged in the heat preservation chamber (501), and the plurality of groups of the injection assemblies (30) are arranged at even intervals.
10. A vapor deposition device, characterized in that: include: An equipment body and a vapor deposition device as claimed in any one of claims 1 to 9.