Heat dissipation channel structure for server

Abstract

The utility model provides a heat dissipation channel structure for a server, and solves the problems that most of the existing servers adopt a heat dissipation channel structure with front air inlet and rear air outlet, air becomes hot after passing through a radiator on a chip, a server assembly positioned behind the radiator cannot be effectively cooled, and the working efficiency is influenced. The radiator composed of the heat conduction base, the annular heat conduction pipe, the cooling fins, the first baffle, the second baffle and the third baffle is arranged in the server shell, a plurality of air channel structures which are arranged at intervals in the front-back direction, extend in the front-back direction and are provided with openings in the upper portions and the side portions are formed, and the purpose of cooling the cooling fins is achieved. And meanwhile, a heat dissipation channel in the server shell is not affected, the situation that when heat dissipation is conducted in the server, air becomes hot after passing through the heat dissipater on the chip is avoided, and the situation that the working efficiency is affected due to the fact that the heat of a server assembly located behind the heat dissipater cannot be effectively dissipated is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of server heat dissipation, in particular to a heat dissipation channel structure for a server. Background Art

[0002] A server is a type of computer that runs faster, has a higher load, and is more expensive than an ordinary computer. A server provides computing or application services to other clients in the network, such as PCs, smart phones, ATMs and other terminals, and even large devices such as train systems. A server has high-speed CPU computing power, long-term reliable operation, strong I / O external data throughput, and better scalability, while the storage function is mainly completed by the internal hard disk.

[0003] The heat source of the server mainly comes from the chip. Ordinary air cooling cannot effectively dissipate the heat of the chip. Usually, a radiator is installed on the chip to enhance the heat dissipation performance of the chip. The heat on the radiator is discharged through the hot air after heat exchange by combining the server's own heat dissipation duct. However, most existing servers use a heat dissipation channel structure with front air intake and rear air exhaust. After passing through the radiator on the chip, the air has become hot. The server components behind the radiator cannot be effectively cooled, affecting work efficiency. Utility Model Content

[0004] In order to solve the problem that most existing servers in the background technology adopt a heat dissipation channel structure with air flowing in from the front and out from the back, the air becomes hot after passing through the heat sink on the chip, and the server components located behind the heat sink cannot be effectively cooled, thus affecting the work efficiency, the utility model proposes a heat dissipation channel structure for the server.

[0005] The technical scheme of the utility model is: a heat dissipation channel structure for a server, comprising a server shell with an upper opening structure, two first mounting plates arranged at intervals in front and back are fixedly arranged at the left end of the server shell, a cover plate is detachably fixedly arranged at the opening of the server shell, a joint is fixedly arranged at the left end of the server shell, a plurality of first air inlet holes are opened at the left end of the server shell, the plurality of first air inlet holes together form an air inlet net, a plurality of first air outlet holes are opened at the right end of the server shell, the plurality of first air outlet holes together form two first air outlet nets arranged at intervals in front and back, a plurality of first fans arranged at intervals in front and back are fixedly arranged in the server shell, and the first fans are located on the right side of the air inlet net;

[0006] A mainboard is fixedly arranged at the bottom of the inner part of the server shell, two chips arranged at intervals in front and back are fixedly arranged on the mainboard, a heat sink is fixedly arranged on the chip, the heat sink comprises a heat-conducting base, the bottom of the heat-conducting base is fixedly arranged on the chip, a plurality of annular heat-conducting pipes arranged at intervals in front and back are fixedly penetrated on the heat-conducting base, a plurality of heat-dissipating fins extending in the front-to-back direction and arranged at intervals in the left and right are arranged above the heat-conducting base, and the heat-dissipating fins are fixedly penetrated on the plurality of annular heat-conducting pipes;

[0007] A first baffle is fixedly provided at the bottom ends of the plurality of heat sinks, a second baffle is fixedly provided at one side of the plurality of heat sinks close to the middle of the server housing, a third baffle is fixedly provided at one side of the top of the plurality of heat sinks, and a plurality of air ducts arranged at intervals front and back are formed between the plurality of heat sinks and the first baffle, the second baffle, and the third baffle, the air ducts extending in the front-to-back direction and opening at the top and the side respectively;

[0008] The front and rear sides of the server shell are both provided with second through holes that are transparent from front to back, and the second through holes are connected to the sides of the air ducts from front to back; a cooling fan is provided at the opening above the multiple air ducts, and the cooling fan is fixed on the top of the multiple heat sinks. Two first through holes that are transparent from top to bottom are provided on the cover plate, and the top of the cooling fan passes through the first through holes and is flush with the top of the cover plate.

[0009] Preferably, an air inlet duct extending in the left-right direction and having a front opening structure is fixedly provided on the front and rear sides of the server shell, the right end of the air inlet duct is connected to the second through hole front to back, and a left-right transparent air inlet hole is opened on the first mounting plate, and the air inlet hole is connected to the left end of the air inlet duct left to right.

[0010] Preferably, a channel is left between the two radiators, and the channel and the first air outlet net are staggered in front and back.

[0011] Preferably, two second fans spaced apart from each other are fixedly provided in the server casing, and the second fans are located on the left side of the first air outlet network.

[0012] Preferably, two heat sinks with openings arranged opposite to each other are fixedly provided on the front and rear sides of the server shell, the server shell is connected to the heat sink front and back, a second air outlet hole which is transparent front and back is opened on the heat sink, and multiple second air outlet holes together form a second air outlet network; a third fan is fixedly provided in the heat sink, and the two third fans are respectively located on the opposite sides of the two second air outlet networks.

[0013] Preferably, two arc-shaped air guide plates are fixedly provided in the server casing, and the two arc-shaped air guide plates are respectively located on the left sides of the two radiators.

[0014] Preferably, two second mounting plates spaced apart from each other are fixedly provided at the left end of the server housing, a dust cover with a right opening structure is commonly sleeved on the two second mounting plates, and the air intake net and the air intake hole are both located on the left side of the dust cover.

[0015] The advantages of the utility model are as follows: the utility model arranges a heat sink consisting of a heat-conducting base, an annular heat-conducting pipe, a heat sink, a first baffle, a second baffle and a third baffle in a server shell to form a plurality of air duct structures arranged at front and rear intervals and extending in the front and rear directions and opening at the top and the sides respectively. The air duct structure is isolated from the heat dissipation channel in the server shell, and the two openings of the air duct structure are connected to the outside through the first through hole and the second through hole respectively, so that the heat dissipation fan can suck the outside air into the air duct from the second through hole, and discharge the hot air from the first through hole after heat exchange with the heat sink on the inner wall of the air duct, thereby achieving the purpose of dissipating heat from the heat sink, and then achieving the purpose of dissipating heat from the chip, and at the same time does not affect the heat dissipation channel in the server shell, avoids the situation that when heat is dissipated in the server, the air becomes hot after passing through the heat sink on the chip, and prevents the server components located behind the heat sink from not being effectively cooled and affecting the work efficiency.

[0016] The utility model can not only enhance the heat dissipation performance of the chip by arranging a heat sink connected to the outside, but also reduce the heat dissipation pressure inside the heat sink and improve the heat dissipation efficiency inside the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 3 For this utility model Figure 1 Schematic diagram of the structure after removing the dust cover;

[0021] Figure 4 For this utility model Figure 1 Schematic diagram of the structure after removing the cover plate;

[0022] Figure 5 It is a structural explosion diagram of the radiator of the utility model.

[0023] In the figure: 1. server housing; 2. cover plate; 3. connector; 4. motherboard; 5. chip; 6. radiator; 61. thermal base; 62. annular heat pipe; 63. heat sink; 64. first baffle; 65. second baffle; 66. third baffle; 67. cooling fan; 7. air inlet net; 8. first air outlet net; 9. first fan; 10. air inlet duct; 11. first mounting plate; 12. air inlet hole; 13. second fan; 14. second air outlet net; 15. third fan; 16. arc-shaped air guide plate; 17. second mounting plate; 18. dust cover; 19. heat sink. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Embodiment 1: A heat dissipation channel structure for a server, such as Figure 1-5 As shown, a server shell 1 includes an upper opening structure, a cover plate 2 is detachably fixedly provided at the opening of the server shell 1, a joint 3 is fixedly provided at the left end of the server shell 1, a plurality of first air inlet holes are opened at the left end of the server shell 1, and the plurality of first air inlet holes together form an air inlet net 7, a plurality of first air outlet holes are opened at the right end of the server shell 1, and the plurality of first air outlet holes together form two first air outlet nets 8 arranged at intervals front and back, and the upper arrangement of the air inlet net 7 and the first air outlet net 8 forms a heat dissipation channel structure with left air inlet and right air outlet in the server shell 1; a plurality of first fans 9 arranged at intervals front and back are fixedly provided in the server shell 1, and the first fans 9 are located on the right side of the air inlet net 7, and the first fans 9 can guide air into the server shell 1 through the air inlet net 7 for heat dissipation.

[0026] A mainboard 4 is fixedly arranged at the bottom of the inner part of the server housing 1, two chips 5 arranged at intervals in front and back are fixedly arranged on the mainboard 4, and a heat sink 6 is fixedly arranged on the chip 5. A channel is left between the two heat sinks 6, and the channel and the first air outlet net 8 are staggered in front and back to prevent the hot air passing through the channel from being directly discharged from the right end of the server housing 1, resulting in the area between the heat sink 6 and the right end of the server housing 1 not being effectively cooled; the heat sink 6 is used to dissipate the heat of the chip 5. Specifically, the heat sink 6 includes a heat-conducting base 61, which is made of aluminum and has excellent thermal conductivity. The bottom of the heat-conducting base 61 is fixedly arranged on the chip 5 to transfer the heat emitted by the chip 5 to the heat-conducting base 61, and a plurality of annular heat-conducting pipes 62 arranged at intervals in front and back are fixedly penetrated on the heat-conducting base 61. A plurality of heat-dissipating fins 63 extending in the front-to-back direction and arranged at intervals in the left and right are arranged above the heat-conducting base 61. The heat-dissipating fins 63 are fixedly penetrated on the plurality of annular heat-conducting pipes 62, and the annular heat-conducting pipes 62 can transfer the heat on the heat-conducting base 61 to the heat-dissipating fins 63 for further heat dissipation.

[0027] A first baffle 64 is fixedly provided at the bottom ends of the plurality of heat sinks 63, and the first baffle 64 is used to seal the bottom ends of the plurality of heat sinks 63; a second baffle 65 is fixedly provided on one side of the plurality of heat sinks 63 close to the middle of the server housing 1, and the second baffle 65 is used to seal one side of the plurality of heat sinks 63; a third baffle 66 is fixedly provided on one side of the top of the plurality of heat sinks 63, and the third baffle 66 is used to seal one side of the top of the plurality of heat sinks 63; the plurality of heat sinks 63 and the first baffle 64, the second baffle 65, and the third baffle 66 together form a plurality of air ducts spaced apart from each other in the front and rear directions, and the air ducts extend in the front-to-rear direction and are opened at the top and the sides respectively.

[0028] The front and rear sides of the server housing 1 are provided with second through holes that are transparent from front to back. The second through holes are connected to the sides of the air duct from front to back, so that outside air can enter the air duct from the second through holes; a cooling fan 67 is provided at the opening above the multiple air ducts, and the cooling fan 67 is fixed on the top of the multiple heat sinks 63. The cover plate 2 is provided with two first through holes that are transparent from top to bottom. The top of the cooling fan 67 passes through the first through holes and is flush with the top of the cover plate 2. The cooling fan 67 can suck outside air into the air duct from the second through holes, and after heat exchange with the heat sink 63 on the inner wall of the air duct, the hot air is discharged from the first through holes, thereby achieving the purpose of cooling the heat sink 63, and then achieving the purpose of cooling the chip through the heat conductive base 61 and the annular heat conductive pipe 62, so as to avoid the air becoming hot after passing through the radiator on the chip 5 when cooling in the server, so as to prevent the server components located behind the radiator from not being effectively cooled and affecting the work efficiency.

[0029] An air inlet duct 10 extending in the left-right direction and having a front opening structure is fixedly provided on both the front and rear sides of the server housing 1, and the right end of the air inlet duct 10 is connected to the second through hole front to back; two first mounting plates 11 spaced apart front to back are fixedly provided on the left end of the server housing 1, and air inlet holes 12 which are transparent to the left and right are opened on the first mounting plates 11, and the air inlet holes 12 are connected to the left and right ends of the air inlet duct 10; the air inlet duct 10 sets the air inlet of the radiator 6 air duct at the left end of the server housing 1, located on the front and rear sides of the air inlet net 7, away from the first air outlet net 8 located at the right end of the server housing 1, to prevent the air inlet of the radiator 6 air duct from being too close to the first air outlet net 8, thereby inhaling hot air and affecting the heat dissipation efficiency.

[0030] Two second fans 13 are fixedly arranged in a front-to-back interval in the server housing 1, and the second fans 13 are located on the left side of the first air outlet net 8; the second fans 13 can discharge hot air from the heat dissipation channel, accelerate the heat discharge rate, and improve the heat dissipation efficiency in the server housing 1.

[0031] Two heat sinks 19 with openings facing each other are fixedly provided on the front and rear sides of the server housing 1. The server housing 1 is connected to the heat sink 19 front to back. The heat sink 19 is provided with second air outlet holes that are transparent front to back. The plurality of second air outlet holes together form a second air outlet network 14. A third fan 15 is fixedly provided in the heat sink 19. The two third fans 15 are respectively located on the opposite sides of the two second air outlet networks 14. The third fans 15 can further increase the speed at which hot air is discharged from the heat dissipation channel, speed up the heat discharge rate, and improve the heat dissipation efficiency in the server housing 1.

[0032] Two arc-shaped air guide plates 16 are fixedly provided in the server housing 1. The two arc-shaped air guide plates 16 are respectively located on the left sides of the two radiators 6. The arc-shaped air guide plates 16 can guide the air sucked by the first fan 9 to pass through the channel between the two radiators 6, thereby reducing air flow rate loss.

[0033] Two second mounting plates 17 spaced apart from each other are fixedly provided at the left end of the server housing 1. A dust cover 18 with a right opening structure is commonly sleeved on the two second mounting plates 17. A protrusion is provided on the second mounting plate 17. The dust cover 18 is clamped on the second mounting plate 17 through the protrusion. The air intake net 7 and the air intake hole 12 are both located on the left side of the dust cover 18 to prevent large particles of dust from entering the server housing 1 or the radiator 6 and affecting the heat dissipation efficiency. Meshes are provided on multiple surfaces of the dust cover 18 to increase the air intake amount and prevent air intake blockage caused by too small mesh apertures. At the same time, a slot is provided on the dust cover 18 for the joint 3 to pass through.

[0034] Working principle: When in use, the first fan 9 draws air from the air inlet net 7 into the heat dissipation channel in the server housing 1. After heat exchange, the air is discharged from the first air outlet net 8 and the second air outlet net 14 respectively through the second fan 13 and the third fan 15, thereby achieving the purpose of heat dissipation inside the server housing 1.

[0035] When in use, the cooling fan 67 is started at the same time, and the cooling fan 67 draws the outside air into the air duct from the second through hole, and discharges the hot air from the first through hole after heat exchange with the heat sink 63 on the inner wall of the air duct, thereby achieving the purpose of dissipating the heat of the heat sink 63, and then achieving the purpose of dissipating the heat of the chip through the heat conductive base 61 and the annular heat conductive pipe 62.

[0036] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is limited by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A heat dissipation channel structure for a server, characterized in that: The server shell (1) comprises an upper opening structure, wherein two first mounting plates (11) arranged at a front-to-back interval are fixedly provided at the left end of the server shell (1), a cover plate (2) is detachably fixedly provided at the opening of the server shell (1), a joint (3) is fixedly provided at the left end of the server shell (1), a plurality of first air inlet holes are provided at the left end of the server shell (1), the plurality of first air inlet holes together form an air inlet net (7), a plurality of first air outlet holes are provided at the right end of the server shell (1), the plurality of first air outlet holes together form two first air outlet nets (8) arranged at a front-to-back interval, a plurality of first fans (9) are fixedly provided in the server shell (1), and the first fans (9) are located on the right side of the air inlet net (7); A mainboard (4) is fixedly arranged at the bottom of the server housing (1); two chips (5) arranged at a front-to-back interval are fixedly arranged on the mainboard (4); a heat sink (6) is fixedly arranged on the chip (5); the heat sink (6) comprises a heat-conducting base (61); the bottom of the heat-conducting base (61) is fixedly arranged on the chip (5); a plurality of annular heat-conducting pipes (62) arranged at a front-to-back interval are fixedly penetrated on the heat-conducting base (61); a plurality of heat-dissipating fins (63) extending in the front-to-back direction and arranged at a left-to-right interval are provided above the heat-conducting base (61); the heat-dissipating fins (63) are fixedly penetrated on the plurality of annular heat-conducting pipes (62); A first baffle (64) is fixedly provided at the bottom end of the plurality of heat sinks (63), a second baffle (65) is fixedly provided at one side of the plurality of heat sinks (63) close to the middle of the server housing (1), a third baffle (66) is fixedly provided at one side of the top of the plurality of heat sinks (63), and a plurality of air ducts arranged at intervals in front and back are formed between the plurality of heat sinks (63) and the first baffle (64), the second baffle (65), and the third baffle (66), the air ducts extending in the front-to-back direction and opening at the top and the side respectively; The server housing (1) is provided with a second through hole that is transparent from front to back on both the front and back sides, and the second through hole is connected to the side of the air duct from front to back; a heat dissipation fan (67) is provided at the opening above the multiple air ducts, and the heat dissipation fan (67) is fixed on the top of the multiple heat sinks (63); the cover plate (2) is provided with two first through holes that are transparent from top to bottom, and the top of the heat dissipation fan (67) passes through the first through hole and is flush with the top of the cover plate (2).

2. A heat dissipation channel structure for a server according to claim 1, characterized in that: An air inlet duct (10) extending in the left-right direction and having a front opening structure is fixedly provided on both the front and rear sides of the server housing (1); the right end of the air inlet duct (10) is connected to the second through hole in front and back; an air inlet hole (12) which is transparent to the left and right is opened on the first mounting plate (11); the air inlet hole (12) is connected to the left end of the air inlet duct (10) in left and right directions.

3. The heat dissipation channel structure for a server according to claim 1, characterized in that: A channel is left between the two radiators (6), and the channel and the first air outlet net (8) are arranged in a front-to-back staggered manner.

4. The heat dissipation channel structure for a server according to claim 1, characterized in that: Two second fans (13) are fixedly arranged in a front-to-back spacing in the server housing (1), and the second fans (13) are located on the left side of the first air outlet network (8).

5. The heat dissipation channel structure for a server according to claim 1, characterized in that: Two heat dissipation boxes (19) with openings arranged opposite to each other are fixedly provided on both the front and rear sides of the server housing (1); the server housing (1) and the heat dissipation box (19) are connected front to back; a second air outlet hole which is transparent front to back is opened on the heat dissipation box (19); a plurality of second air outlet holes together form a second air outlet net (14); a third fan (15) is fixedly provided in the heat dissipation box (19); the two third fans (15) are respectively located on opposite sides of the two second air outlet nets (14).

6. The heat dissipation channel structure for a server according to claim 1, characterized in that: Two arc-shaped air guide plates (16) are fixedly arranged in the server housing (1), and the two arc-shaped air guide plates (16) are respectively located on the left sides of the two radiators (6).

7. The heat dissipation channel structure for a server according to claim 1, characterized in that: Two second mounting plates (17) spaced apart from each other are fixedly provided at the left end of the server housing (1); a dust cover (18) with a right opening structure is commonly sleeved on the two second mounting plates (17); and the air intake net (7) and the air intake hole (12) are both located on the left side of the dust cover (18).

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