Loudspeaker module and earphone

Abstract

The utility model discloses a loudspeaker module. The loudspeaker module comprises a loudspeaker housing, a loudspeaker and a microphone assembly. The loudspeaker shell comprises an outer surface and an inner surface which are opposite to each other, a cavity surrounded by the inner surface, a sound outlet hole and a microphone hole which are communicated with the cavity and penetrate through the inner surface and the outer surface, and a front pressure relief pipe protruding out of the outer surface; the front pressure relief pipe comprises a pressure relief hole communicated to the cavity; the loudspeaker is at least partially disposed in the chamber and fixed to the loudspeaker housing. The microphone assembly is arranged on the outer surface and corresponds to the microphone hole. The earphone comprises the loudspeaker module and an earphone shell. The loudspeaker module is integrally assembled in the earphone shell, and the front pressure relief pipe protrudes out of the earphone shell.

Description

Technical Field

[0001] The utility model relates to the technical field of earphones, and in particular to a loudspeaker module and an earphone capable of improving assembly efficiency. Background Art

[0002] As the functions provided by headphones become increasingly rich, the number of components in headphones increases. When assembling, the alignment and tolerance of these components must be considered one by one, which is more complicated. How to improve assembly efficiency and save assembly time, and even improve the efficiency of debugging and maintenance after assembly is the goal of research in this field. Utility Model Content

[0003] The utility model aims to overcome the defects of the prior art and provide a speaker module, which can improve the efficiency of assembly and maintenance.

[0004] A speaker module of the utility model comprises a speaker housing, a speaker and a microphone assembly. The speaker housing comprises an outer surface and an inner surface opposite to each other, a chamber surrounded by the inner surface, a sound outlet hole and a microphone hole communicating with the chamber and penetrating the inner surface and the outer surface, and a front pressure relief pipe protruding from the outer surface, wherein the front pressure relief pipe comprises a pressure relief hole communicating with the chamber. The speaker is at least partially disposed in the chamber and fixed to the speaker housing. The microphone assembly is disposed on the outer surface and corresponds to the microphone hole.

[0005] In an embodiment of the present invention, the loudspeaker comprises a diaphragm, the diaphragm faces the inner surface of the loudspeaker housing, the inner surface has a curved surface, and the contour undulation of the curved surface corresponds to the contour undulation of the diaphragm.

[0006] In one embodiment of the present invention, the distance between the inner surface and the diaphragm is between 0.6 mm and 1 mm.

[0007] In one embodiment of the present invention, a non-zero angle exists between the axial direction of the sound outlet and the central axis of the diaphragm.

[0008] In one embodiment of the present invention, the speaker module further comprises a sound-tuning and dust-proof mesh cloth, which is disposed on the inner surface and covers the pressure relief hole.

[0009] In one embodiment of the present invention, the diameter of the pressure relief hole is less than 1.5 mm.

[0010] In one embodiment of the present invention, the above-mentioned microphone assembly includes a circuit board and a microphone unit arranged on the circuit board, the circuit board includes a first hole corresponding to the microphone hole, the microphone unit includes a second hole corresponding to the first hole, the diameter of the microphone hole is larger than the diameter of the first hole, and the diameter of the first hole is larger than the diameter of the second hole.

[0011] In one embodiment of the present invention, the speaker module further includes a waterproof breathable membrane covering the microphone hole and located between the microphone assembly and the speaker housing.

[0012] The utility model also includes an earphone, comprising a speaker module and an earphone shell. The speaker module is integrally assembled into the earphone shell, and the front pressure relief pipe protrudes out of the earphone shell.

[0013] In one embodiment of the present invention, the speaker housing includes a first positioning portion, the earphone housing includes a second positioning portion located inside and corresponding to the first positioning portion, and the speaker module is positioned in the earphone housing by being disposed on the second positioning portion through the first positioning portion.

[0014] Based on the above, the speaker housing of the speaker module of the earphone of the utility model includes a chamber, a sound outlet hole and a microphone hole that are connected to the chamber and penetrate the inner surface and the outer surface, and a front pressure relief pipe protruding from the outer surface, and the front pressure relief pipe includes a pressure relief hole connected to the chamber. The speaker is at least partially disposed in the chamber and fixed to the speaker housing. The microphone assembly is disposed on the outer surface of the speaker housing and corresponds to the microphone hole. The speaker and the microphone assembly are disposed in the speaker housing, which can effectively improve the noise reduction effect, and at the same time, the speaker module can be assembled into the earphone housing as a whole, which is very convenient to assemble, greatly improves the assembly efficiency, saves assembly time, and can also improve the efficiency of debugging and maintenance after the earphone is assembled. In addition, the speaker housing includes a front pressure relief pipe protruding from the outer surface, and the front pressure relief pipe protrudes outside the earphone housing and is an independent external pipe, which can avoid the situation where the pressure relief channel affects the sound quality due to assembly misalignment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a cross-sectional schematic diagram of the earphone of the utility model.

[0016] Figure 2 yes Figure 1 Schematic diagram of the partial appearance of the earphone.

[0017] Figure 3 yes Figure 1 A partial schematic diagram of the interior of the headset.

[0018] Figure 4 yes Figure 1 Schematic diagram of the speaker module of the headset.

[0019] Figure 5 yes Figure 4 Schematic diagram of the explosion.

[0020] Figure 6 and Figure 7 yes Figure 4 Schematic diagrams of different cross sections.

[0021] Figure 8 yes Figure 4 Schematic diagram from another perspective.

[0022] Fig. 9 yes Figure 8 Schematic diagram of a partial cross section.

[0023] Notes on the accompanying drawings: θ: non-zero angle, A1: axial direction, A2: central axis, DS: distance, D1-D4: diameter, 10: earphone, 20, 25, 26: earphone housing, 22: second positioning part, 100: speaker module, 110: speaker housing, 111: outer surface, 112: inner surface, 1121: curved surface, 113: chamber, 114: sound outlet hole, 115: microphone hole, 116: front pressure relief pipe, 117: pressure relief hole, 118: first positioning part, 120: speaker, 122: diaphragm, 130: microphone assembly, 132: circuit board, 134: first hole, 135: reinforcement plate, 136: microphone unit, 138: second hole, 140: tuning and dustproof mesh, 145: speaker mesh, 150: waterproof and breathable membrane. DETAILED DESCRIPTION

[0024] The drawings in the embodiments provide a more detailed description of the technical solutions in the embodiments of the utility model. In the drawings, the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The described embodiments are part of the embodiments of the utility model, not all of them. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the utility model, and should not be construed as limitations on the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. The embodiments of the utility model are described in detail below in conjunction with the drawings.

[0025] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0027] Example

[0028] Figure 1 It is a cross-sectional schematic diagram of an earphone according to an embodiment of the present invention. Figure 2 yes Figure 1 Schematic diagram of the partial appearance of the earphone. Figure 3 yes Figure 1 A partial schematic diagram of the interior of the earphone. It should be noted that Figure 3 The earphone housing is intentionally indicated by dotted lines to clearly show the speaker module and the earphone housing.

[0029] See also Figures 1 to 3 The earphone 10 of this embodiment includes a speaker module 100 and earphone housings 20, 25, and 26. The earphone housings 20, 25, and 26 cover the speaker module 100 together. In this embodiment, the speaker module 100 is integrally assembled into the earphone housing 20, which makes assembly quite convenient. Since each component does not need to be assembled one by one, the assembly efficiency is greatly improved and the assembly time is saved.

[0030] Specifically, in this embodiment, the speaker housing 110 includes a first positioning portion 118, the earphone housing 20 includes a second positioning portion 22 located inside and corresponding to the first positioning portion 118, and the speaker module 100 is positioned in the earphone housing 20 through the first positioning portion 118 and disposed in the second positioning portion 22.

[0031] The first positioning portion 118 includes, for example, a hole, and the second positioning portion 22 includes, for example, a convex column, which is inserted into the hole for positioning. Of course, in one embodiment, the first positioning portion 118 may also be a convex column, and the second positioning portion 22 may also be a hole. Alternatively, in one embodiment, the first positioning portion 118 and the second positioning portion 22 may also be fixed in different ways such as snap-fitting, screwing, or clamping.

[0032] In addition, the speaker housing 110 includes a front pressure relief pipe 116 , which protrudes out of the earphone housing 20 and is an independent external pipe, thereby preventing the pressure relief channel from affecting the sound quality due to assembly misalignment.

[0033] The detailed structure of the speaker module 100 is further described below.

[0034] Figure 4 yes Figure 1 Schematic diagram of the speaker module of the headset. Figure 5 yes Figure 4 Explosion diagram. Figure 6 and Figure 7 yes Figure 4 See Figures 4 to 7 The speaker module 100 of this embodiment includes a speaker housing 110, a speaker 120, a speaker mesh 145 and a microphone assembly 130 ( Figure 5 ).

[0035] like Figure 5 As shown, the speaker housing 110 includes an outer surface 111 and an inner surface 112 opposite to each other, a chamber 113 surrounded by the inner surface 112, a sound outlet hole 114 and a microphone hole 115 communicating with the chamber 113 and penetrating the inner surface 112 and the outer surface 111, and a front pressure relief pipe 116 ( Figure 7 ).

[0036] like Figure 7 As shown, the front pressure relief tube 116 includes a pressure relief hole 117 connected to the chamber 113. When the earphone 10 is worn into the ear canal, the pressure in the ear canal will increase, which may easily cause hearing loss and may also cause the diaphragm 122 to deform slightly when vibrating, resulting in slight abnormal distortion of the sound. The pressure relief hole 117 is used to relieve the pressure of the chamber 113 (front chamber), allowing the air flow pressure in the chamber 113 to escape from the tuning hole, which can reduce the pressure in the ear canal and prevent the voice coil from being displaced due to air pressure imbalance, causing distortion or even damaging the speaker 120. It can also prevent the heat generated by the speaker 120 when it is working from heating the air in the chamber 113, thereby increasing the pressure inside the chamber 113, etc.

[0037] In this embodiment, the diameter D1 of the pressure relief hole 117 ( Figure 7 ) is less than 1.5 mm to retain the energy of the low frequency and avoid affecting the performance of the low frequency sound. In one embodiment, the diameter D1 of the pressure relief hole 117 is, for example, 0.8 mm, but is not limited thereto.

[0038] In addition, the speaker module 100 further includes a sound-tuning dust-proof mesh 140 ( Figure 5 ), which is disposed on the inner surface 112 and covers the pressure relief hole 117. The tuning dustproof mesh 140 can reduce unnecessary low-frequency vibrations, making it easier to adjust the low frequency, making the listening experience more natural and clear, and improving the comfort of long-term wearing. In addition, the tuning dustproof mesh 140 can also provide waterproof and dustproof effects.

[0039] The speaker 120 is at least partially disposed in the chamber 113 and fixed to the speaker housing 110. The speaker mesh 145 is disposed on the speaker 120. Figure 6 As shown, the speaker 120 includes a diaphragm 122, and the diaphragm 122 faces the inner surface 112 of the speaker housing 110. The inner surface 112 has a curved surface 1121, and the curved surface 1121 is smooth and round. Such a design can prevent the curved surface 1121 from generating abnormal sound due to sharp corners, and can also prevent the diaphragm 122 from being damaged by the curved surface 1121 when vibrating.

[0040] In addition, the contour undulations of the curved surface 1121 correspond to the contour undulations of the diaphragm 122 , which can enhance high-frequency energy and extend the overall bandwidth.

[0041] like Figure 6 As shown, the distance DS between the curved surface 1121 of the inner surface 112 and the diaphragm 122 is between 0.6 mm and 1 mm. If the distance DS between the curved surface 1121 of the inner surface 112 and the diaphragm 122 is less than 0.6 mm, the diaphragm 122 may have a higher probability of contacting the curved surface 1121 and generating abnormal sound. If the distance DS between the curved surface 1121 of the inner surface 112 and the diaphragm 122 is greater than 1 mm, the high-frequency sensitivity will be reduced. Therefore, when the distance DS between the curved surface 1121 of the inner surface 112 and the diaphragm 122 is within the above range, a better sound effect can be achieved.

[0042] In addition, in this embodiment, there is a non-zero angle θ between the axial direction A1 of the sound outlet 114 and the central axis A2 of the diaphragm 122. The non-zero angle θ is between 1 degree and 15 degrees, so as to provide a better sound effect under the constraints of the shape of the ear shell and the size of the earphone housing 20. In terms of hearing, the non-zero angle has more low-frequency volume than when the angle is 0 degrees. In one embodiment, the non-zero angle θ is about 13 degrees, but it is not limited thereto.

[0043] Figure 8 yes Figure 4 Schematic diagram from another perspective. Fig. 9 yes Figure 8 Schematic diagram of a partial cross section.

[0044] See also Figures 8 to 9 , the microphone assembly 130 is disposed on the outer surface 111 and corresponds to the microphone hole 115 ( Fig. 9 The microphone assembly 130 is used to solve the noise signal received inside the earphone 10. The microphone assembly 130 includes a circuit board 132 and a microphone unit 136 disposed on the circuit board 132.

[0045] like Fig. 9As shown, the circuit board 132 includes a first hole 134 corresponding to the microphone hole 115, and the microphone unit 136 includes a second hole 138 corresponding to the first hole 134. The second hole 138 of the microphone is connected to the chamber 113 through the first hole 134 and the microphone hole 115 to capture more accurate noise.

[0046] In addition, the diameter D2 of the microphone hole 115 is greater than the diameter D3 of the first hole 134, and the diameter D3 of the first hole 134 is greater than the diameter D4 of the second hole 138. Such a design can ensure that the sound in the chamber 113 can smoothly enter the microphone unit 136.

[0047] In this embodiment, the circuit board 132 is, for example, a flexible circuit board 132, and the microphone assembly 130 further includes a reinforcing plate 135 disposed below the circuit board 132 to enhance structural stability. In addition, the speaker module 100 further includes a waterproof breathable membrane 150, which covers the microphone hole 115 and is located between the microphone assembly 130 and the speaker housing 110 to achieve waterproof and sound-permeable effects.

[0048] Please go back Figure 1 In this embodiment, the area between the rear of the speaker 120 and the earphone housings 25 and 26 is the back cavity of the earphone 10. The earphone 10 of this embodiment does not have an additional speaker back cover between the rear of the speaker 120 and the earphone housings 25 and 26. In addition to saving costs, it can also increase the volume of the back cavity, thereby improving the low-frequency characteristics.

[0049] In this embodiment, since the speaker 120 and the microphone assembly 130 are both disposed on the speaker housing 110, the speaker module 100 can be integrally assembled into the earphone housing 20 while effectively improving the noise reduction effect. The modular design facilitates assembly and rework, reduces the influence of factors such as assembly deviation and cumulative tolerance, and can also avoid air leakage caused by redundant assembly gaps, which affects the active noise reduction or music listening effect, and can provide good sound performance. It can also improve the efficiency of debugging and maintenance after the earphones are assembled.

[0050] In summary, the speaker housing of the speaker module of the earphone of the present invention includes a chamber, a sound outlet hole and a microphone hole that are connected to the chamber and penetrate the inner surface and the outer surface, and a front pressure relief pipe that protrudes from the outer surface, and the front pressure relief pipe includes a pressure relief hole that is connected to the chamber. The speaker is at least partially disposed in the chamber and fixed to the speaker housing. The microphone assembly is disposed on the outer surface of the speaker housing and corresponds to the microphone hole. The speaker and the microphone assembly are disposed in the speaker housing, which can effectively improve the noise reduction effect, and at the same time, the speaker module can be assembled into the earphone housing as a whole, which is very convenient to assemble, greatly improves the assembly efficiency, saves assembly time, and can also improve the efficiency of debugging and maintenance after the earphone is assembled. In addition, the speaker housing includes a front pressure relief pipe that protrudes from the outer surface, and the front pressure relief pipe protrudes outside the earphone housing and is an independent external pipe, which can avoid the situation where the pressure relief channel affects the sound quality due to assembly misalignment.

[0051] The above embodiments are only used to illustrate the technical solution of the utility model and are not intended to limit it. Although the utility model is described in detail with reference to the above preferred embodiments, those skilled in the art should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model. Those skilled in the art can also make other changes within the spirit of the utility model and apply them to the design of the utility model, as long as they do not deviate from the technical effects of the utility model. These changes made according to the spirit of the utility model should be included in the scope of protection claimed by the utility model.

Claims

1. A speaker module, characterized in that: include: A speaker housing, comprising an outer surface and an inner surface opposite to each other, a chamber surrounded by the inner surface, a sound outlet hole and a microphone hole communicating with the chamber and penetrating the inner surface and the outer surface, and a front pressure relief pipe protruding from the outer surface, wherein the front pressure relief pipe comprises a pressure relief hole communicating with the chamber; a speaker at least partially disposed in the chamber and fixed to the speaker housing; as well as: The microphone assembly is disposed on the outer surface and corresponds to the microphone hole.

2. The speaker module according to claim 1, characterized in that: The speaker includes a diaphragm, the diaphragm faces the inner surface of the speaker housing, the inner surface has a curved surface, and the contour undulation of the curved surface corresponds to the contour undulation of the diaphragm.

3. The speaker module according to claim 2, characterized in that: The distance between the inner surface and the diaphragm is between 0.6 mm and 1 mm.

4. The speaker module according to claim 2, characterized in that: There is a non-zero angle between the axial direction of the sound outlet and the central axis of the diaphragm.

5. The speaker module according to claim 1, characterized in that: It also includes a sound-tuning and dust-proof mesh cloth, which is arranged on the inner surface and covers the pressure relief hole.

6. The speaker module according to claim 1, characterized in that: The diameter of the pressure relief hole is less than 1.5 mm.

7. The speaker module according to claim 1, characterized in that: The microphone assembly includes a circuit board and a microphone unit arranged on the circuit board, the circuit board includes a first hole corresponding to the microphone hole, the microphone unit includes a second hole corresponding to the first hole, the diameter of the microphone hole is larger than the diameter of the first hole, and the diameter of the first hole is larger than the diameter of the second hole.

8. The speaker module according to claim 1, characterized in that: It also includes a waterproof and breathable membrane, which covers the microphone hole and is located between the microphone assembly and the speaker housing.

9. A headset, comprising: A loudspeaker module as claimed in any one of claims 1 to 8; and an earphone housing, wherein the speaker module is integrally assembled into the earphone housing, and the front pressure relief pipe protrudes out of the earphone housing.

10. The earphone according to claim 9, characterized in that: The speaker housing includes a first positioning portion, the earphone housing includes a second positioning portion located inside and corresponding to the first positioning portion, and the speaker module is positioned in the earphone housing through the first positioning portion being disposed on the second positioning portion.

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