Fan-free computer radiator

Abstract

The utility model relates to a fan-free computer radiator, which belongs to the technical field of computer radiators and comprises a mounting plate, a heat dissipation processing mechanism is arranged in the mounting plate, and the heat dissipation processing mechanism comprises a fixing plate fixedly connected with the inner side of the mounting plate. A plurality of heat dissipation plates are rotationally connected to the opposite sides of the fixing plate and the mounting plate, a connecting block is fixedly connected to the side, close to the middle of the mounting plate, of each heat dissipation plate, and connecting rods are rotationally connected to the upper side and the lower side of each connecting block. According to the fan-free computer radiator, a heat transfer medium can circularly flow in the heat collection calandria, the first heat pipe, the heat dissipation calandria and the second heat pipe by using the operation of the circulating pump, so that heat generated in the operation process of a computer is conducted to each heat dissipation plate, the heat dissipation area is increased, and the heat dissipation efficiency is enhanced; and the arranged heat dissipation plate can be pushed by the pushing assembly to swing in a reciprocating mode so as to drive airflow to run to enable air to circulate, then the heat dissipation efficiency is further improved, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computer radiators, in particular to a fanless computer radiator. Background Art

[0002] The core of the computer is the CPU. The die of the CPU is usually less than 2 square centimeters, but the power consumption is tens or hundreds of watts. If the heat cannot be conducted away in time, once the heat accumulates in the die, it will lead to serious consequences. Therefore, the CPU needs to be cooled to avoid power loss or computer crashes due to heat accumulation.

[0003] Please refer to a fanless computer radiator with announcement number CN210142304U. In this patent, it is proposed that "the computer cooling method in the prior art is to use a fan to blow air to the CPU for convection cooling. However, due to the operation of the fan, a lot of noise will appear in the computer case, and the fan is easy to absorb dust, and the fan radiator needs to be regularly maintained and cleaned, and the maintenance cost is high." This patent connects the heat sink base and the heat pipe. After the phase change material in the base is vaporized, it can randomly enter the heat pipe on the base. Since all the heat pipes are connected to the base, the heat pipes on the surrounding areas dissipate heat quickly and have low pressure, while the heat pipes in the center dissipate heat slowly and have high pressure. After the phase change material is vaporized, it is distributed in the heat pipe with pressure. The overall heat dissipation is not affected by the heat dissipation speed of a single heat pipe, and the CPU is evenly cooled.

[0004] However, although the above patent can achieve fanless heat dissipation, the heat dissipation fin structure arranged outside the heat pipe is fixed and concentrated, which easily leads to poor air circulation, is not conducive to heat exchange with the air, has low heat dissipation efficiency, and has poor use effect; in view of this, the present application provides a fanless computer radiator. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a fanless computer radiator, which has the advantages of utilizing the flow of a heat transfer medium to transfer heat to a heat sink, and utilizing the swing of the heat sink to drive the airflow, thereby enhancing the heat exchange effect and improving the heat dissipation efficiency, etc., and solves the problem that the computer heat dissipation method in the prior art is to use a fan to blow air to the CPU for convection heat dissipation, but due to the operation of the fan, a lot of noise will be generated in the computer case, and the fan is easy to absorb dust, so the fan radiator needs to be maintained and cleaned regularly, and the maintenance cost is high.

[0006] To achieve the above object, the utility model provides the following technical solutions: a fanless computer radiator, comprising a mounting plate, wherein a heat dissipation processing mechanism is arranged inside the mounting plate;

[0007] The heat dissipation mechanism comprises a fixing plate fixedly connected to the inner side of the mounting plate, a plurality of heat dissipation plates are rotatably connected to the side opposite to the fixing plate and the mounting plate, a connecting block is fixedly connected to the side of the heat dissipation plate close to the middle of the mounting plate, the upper and lower sides of the connecting block are rotatably connected to connecting rods, and the front and rear sides of the mounting plate are fixedly connected to a pushing assembly for pushing the heat dissipation plate to rotate;

[0008] A first heat pipe is fixedly connected inside the mounting plate, a second heat pipe is fixedly connected to the bottom of the fixing plate, a heat dissipation pipe connected to the first heat pipe and the second heat pipe is fixedly connected inside the heat dissipation plate, and a heat collection component for collecting and transferring heat is arranged on the top of the mounting plate.

[0009] Furthermore, the heat collecting assembly comprises a heat collecting frame fixedly connected to the top of the mounting plate, a heat collecting pipe is fixedly connected inside the heat collecting frame, and a heat transfer plate is fixedly connected to the top of the heat collecting frame.

[0010] Furthermore, a circulation pump is fixedly connected to the inner side of the mounting plate, and two ends of the circulation pump are respectively connected to the heat collecting exhaust pipe and the second heat pipe, and the other end of the heat collecting exhaust pipe is connected to the first heat pipe.

[0011] Furthermore, a rotating shaft penetrating the heat dissipation plate is fixedly connected to one side of the fixing plate and the mounting plate opposite to each other, and a first rotating hole slidably matched with the rotating shaft is provided inside the heat dissipation plate.

[0012] Furthermore, both upper and lower sides of the connection block are fixedly connected with a limiting rod penetrating the connecting rod, and a second rotating hole slidably matched with the limiting rod is provided inside the limiting rod.

[0013] Furthermore, the pushing assembly includes an electric push rod fixedly connected to the front and rear sides of the mounting plate and corresponding to the position of the heat sink, and the output end of the electric push rod is fixedly connected to a stop block.

[0014] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0015] The fanless computer radiator can install the mounting plate at the bottom of the computer. The operation of the circulating pump can make the heat transfer medium circulate in the heat collecting pipe, the first heat pipe, the heat dissipating pipe and the second heat pipe, so as to facilitate the heat generated during the operation of the computer to be transferred to the heat dissipation plate. The heat dissipation plates are evenly dispersed and arranged to increase the heat dissipation area and enhance the heat dissipation efficiency. The heat dissipation plate can also swing back and forth under the push of the pushing component, so as to utilize the swinging action to drive the airflow to circulate the air, further enhance the heat dissipation efficiency, and effectively improve the use effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1This is a cross-sectional view of the structure of the utility model;

[0017] Figure 2 This is a bottom sectional view of the heat dissipation plate of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the heat collecting frame of the utility model.

[0019] In the figure: 1. mounting plate; 2. fixing plate; 3. rotating shaft; 4. heat sink; 5. connecting block; 6. limiting rod; 7. connecting rod; 8. first heat pipe; 9. second heat pipe; 10. heat dissipation pipe; 11. heat collecting frame; 12. heat transfer plate; 13. circulating pump; 14. electric push rod; 15. stop block; 16. heat collecting pipe. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3 A fanless computer radiator in this embodiment includes a mounting plate 1, and a heat dissipation processing mechanism is arranged inside the mounting plate 1.

[0022] In this embodiment, the heat dissipation treatment mechanism includes a fixed plate 2 fixedly connected to the inner side of the mounting plate 1, a plurality of heat dissipation plates 4 are rotatably connected to the opposite side of the fixed plate 2 and the mounting plate 1, a rotating shaft 3 passing through the heat dissipation plate 4 is fixedly connected to the opposite side of the fixed plate 2 and the mounting plate 1, and a first rotating hole slidably adapted to the rotating shaft 3 is opened inside the heat dissipation plate 4, so that the rotating shaft 3 can pass through the heat dissipation plate 4 using the first rotating hole, thereby causing the heat dissipation plate 4 to rotate around the axis of the rotating shaft 3.

[0023] Among them, a connecting block 5 is fixedly connected to one side of the heat dissipation plate 4 close to the middle of the mounting plate 1, and connecting rods 7 are rotatably connected to the upper and lower sides of the connecting block 5. Limit rods 6 that penetrate the connecting rod 7 are fixedly connected to the upper and lower sides of the connecting block 5, and a second rotating hole that is slidably adapted to the limit rod 6 is opened inside the limit rod 6, so that the limit rod 6 can pass through the connecting rod 7 through the second rotating hole to realize the rotational connection between the connecting rod 7 and the connecting block 5.

[0024] Among them, the front and rear sides of the mounting plate 1 are fixedly connected with a pushing component for pushing the heat sink 4 to rotate, and the pushing component includes an electric push rod 14 fixedly connected to the front and rear sides of the mounting plate 1 and corresponding to the position of the heat sink 4, and the output end of the electric push rod 14 is fixedly connected with a stop block 15, so that the stop block 15 can push the heat sink 4 to rotate as the electric push rod 14 runs.

[0025] In this embodiment, a first heat pipe 8 is fixedly connected to the inside of the mounting plate 1, a second heat pipe 9 is fixedly connected to the bottom of the fixing plate 2, and a heat dissipation pipe 10 connected to the first heat pipe 8 and the second heat pipe 9 is fixedly connected to the inside of the heat dissipation plate 4, so that the heat dissipation plate 4 can utilize the setting of the heat dissipation pipe 10 to improve the heat dissipation effect, and a heat collection component for achieving heat collection and heat transfer is provided on the top of the mounting plate 1.

[0026] Among them, the heat collecting assembly includes a heat collecting frame 11 fixedly connected to the top of the mounting plate 1, a heat collecting exhaust pipe 16 is fixedly connected inside the heat collecting frame 11, and a heat transfer plate 12 is fixedly connected to the top of the heat collecting frame 11, so that the heat of the electric energy can be conveniently transferred to the heat collecting exhaust pipe 16 by using the heat transfer plate 12.

[0027] Among them, a circulation pump 13 is fixedly connected to the inner side of the mounting plate 1, and the two ends of the circulation pump 13 are respectively connected to the heat collecting exhaust pipe 16 and the second heat pipe 9, and the other end of the heat collecting exhaust pipe 16 is connected to the first heat pipe 8, so that the circulation pump 13 can be used to operate so that the heat transfer medium circulates in the heat collecting exhaust pipe 16, the first heat pipe 8, the heat dissipation exhaust pipe 10 and the second heat pipe 9, so as to conduct the heat generated during the operation of the computer to the heat sink 4.

[0028] The beneficial effects of the above embodiments are:

[0029] The fanless computer radiator can install the mounting plate 1 on the bottom of the computer. The operation of the circulating pump 13 can make the heat transfer medium circulate in the heat collecting exhaust pipe 16, the first heat pipe 8, the heat dissipating exhaust pipe 10 and the second heat pipe 9, so as to facilitate the heat generated during the operation of the computer to be transferred to the heat dissipation plate 4. The heat dissipation plate 4 is evenly dispersed and arranged to increase the heat dissipation area and enhance the heat dissipation efficiency; and the heat dissipation plate 4 can also swing back and forth under the push of the pushing component, so as to utilize the swinging action to drive the airflow to operate, so that the air circulates, further enhances the heat dissipation efficiency, and effectively improves the use effect of the device.

[0030] The working principle of the above embodiment is:

[0031] The fanless computer radiator can fix the mounting plate 1 on the bottom of the computer, and the heat transfer plate 12 in the heat collection frame 11 is arranged to fit the heat generating part inside the computer, so as to facilitate the heat generated by the operation of the electric energy to be transferred to the heat collection pipe 16, and with the operation of the circulation pump 13, the heat transfer medium can circulate in the heat collection pipe 16, the first heat pipe 8, the heat dissipation pipe 10 and the second heat pipe 9, so as to facilitate the heat generated during the operation of the computer to be transferred to the heat dissipation plate 4, and the heat dissipation is realized by using the heat dissipation plate 4;

[0032] During this process, the operation of the electric push rod 14 can also be used to make the block 15 press the heat sink 4, so as to facilitate the swing of the heat sink 4, and the provided connecting rod 7 can be used to link the heat sink 4 at the corresponding position in the front and rear directions to facilitate the synchronous swinging. With the alternating operation of the front and rear electric push rods 14, the heat sink 4 can be made to swing back and forth, so as to facilitate the use of the swing of the heat sink 4 to drive the airflow, and then drive the airflow to circulate the air, so as to achieve the effect of enhancing the heat dissipation efficiency.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fanless computer radiator, comprising a mounting plate (1), characterized in that: A heat dissipation processing mechanism is arranged inside the mounting plate (1); The heat dissipation treatment mechanism comprises a fixing plate (2) fixedly connected to the inner side of the mounting plate (1); a plurality of heat dissipation plates (4) are rotatably connected to the fixing plate (2) and the mounting plate (1) on one side opposite to the fixing plate (2); a connecting block (5) is fixedly connected to the side of the heat dissipation plate (4) close to the middle of the mounting plate (1); the upper and lower sides of the connecting block (5) are rotatably connected to connecting rods (7); and the front and rear sides of the mounting plate (1) are fixedly connected to a pushing assembly for pushing the heat dissipation plate (4) to rotate; A first heat pipe (8) is fixedly connected inside the mounting plate (1), a second heat pipe (9) is fixedly connected to the bottom of the fixing plate (2), a heat dissipation pipe (10) connected to the first heat pipe (8) and the second heat pipe (9) is fixedly connected inside the heat dissipation plate (4), and a heat collection component for realizing heat collection and heat transfer is arranged on the top of the mounting plate (1).

2. A fanless computer radiator according to claim 1, characterized in that: The heat collection assembly comprises a heat collection frame (11) fixedly connected to the top of the mounting plate (1), a heat collection pipe (16) fixedly connected inside the heat collection frame (11), and a heat transfer plate (12) fixedly connected to the top of the heat collection frame (11).

3. A fanless computer radiator according to claim 2, characterized in that: A circulation pump (13) is fixedly connected to the inner side of the mounting plate (1), and the two ends of the circulation pump (13) are respectively connected to a heat collecting exhaust pipe (16) and a second heat pipe (9), and the other end of the heat collecting exhaust pipe (16) is connected to the first heat pipe (8).

4. The fanless computer radiator according to claim 1, characterized in that: A rotating shaft (3) penetrating the heat dissipation plate (4) is fixedly connected to one side of the fixing plate (2) and the mounting plate (1) opposite to each other, and a first rotating hole slidably matched with the rotating shaft (3) is provided inside the heat dissipation plate (4).

5. The fanless computer radiator according to claim 1, characterized in that: The upper and lower sides of the connection block (5) are fixedly connected with a limit rod (6) penetrating the connecting rod (7), and a second rotating hole slidably matched with the limit rod (6) is provided inside the limit rod (6).

6. The fanless computer radiator according to claim 1, characterized in that: The pushing assembly comprises an electric push rod (14) fixedly connected to the front and rear sides of the mounting plate (1) and corresponding to the position of the heat sink (4), and an abutment block (15) is fixedly connected to the output end of the electric push rod (14).

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