Key assembly and electronic equipment

Abstract

The utility model provides a key assembly and electronic equipment, and the key assembly comprises a key cap which is provided with a pressing wall and a supporting leg; the key cap supporting plate is connected with the supporting legs, and a first groove is formed between the pressing wall and the key cap supporting plate; the pressure sensing module is fixed in the first groove, and the pressure sensing module is connected with the pressing wall; the frame body is provided with a keycap mounting hole, at least part of the keycap is located in the keycap mounting hole, and the pressed surface of the pressing wall is located outside the keycap mounting hole; the vibration module is located in the keycap mounting hole, and the pressure sensing module is electrically connected with the vibration module; the side, far away from the pressing wall, of the keycap supporting plate is provided with a protruding pin, and the protruding pin abuts against the vibration module. According to the invention, the user can obtain pressing feedback in time.

Description

Technical Field

[0001] The present application belongs to the field of electrical technology, and in particular, relates to a key assembly and an electronic device. Background Art

[0002] Electronic devices, such as mobile phones and tablet computers, need to be provided with a key assembly to realize the key function of the electronic device. The key assembly in the prior art cannot sensitively feedback the pressing result to the user after detecting that the key cap is pressed. Utility Model Content

[0003] An object of the embodiments of the present utility model is to provide an improved key assembly and electronic device.

[0004] According to a first aspect of an embodiment of the application, a key assembly is provided, including:

[0005] A key cap, wherein the key cap has a pressing wall and a supporting foot;

[0006] A key cap support plate, the key cap support plate is connected to the support foot, and a first groove is provided between the pressing wall and the key cap support plate;

[0007] A pressure sensing module, the pressure sensing module is fixed in the first groove, and the pressure sensing module is connected to the pressing wall;

[0008] A frame body, wherein the frame body has a keycap mounting hole, at least a portion of the keycap is located in the keycap mounting hole, and a pressed side of the pressing wall is located outside the keycap mounting hole;

[0009] A vibration module, the vibration module is located in the key cap mounting hole, and the pressure sensing module is electrically connected to the vibration module;

[0010] A convex foot is arranged on one side of the key cap support plate away from the pressing wall, and the convex foot abuts against the vibration module.

[0011] In some embodiments of the present application, the frame body also has a second groove connected to the keycap mounting hole, the supporting foot is provided with a third groove, and the second groove is arranged opposite to the third groove; the key assembly also includes a key insert, a part of the key insert is located in the second groove, and a part of the key insert is located in the third groove, so that the keycap is limited to the keycap mounting hole.

[0012] In some embodiments of the present application, the key assembly further includes a sealing ring, which is disposed on the outer peripheral side of the keycap and located between the pressing wall and the third groove, and the sealing ring is interference fit with the keycap mounting hole.

[0013] In some embodiments of the present application, there is a first gap between the supporting foot and the bottom wall of the keycap mounting hole.

[0014] In some embodiments of the present application, the vibration module includes a spring and a piezoelectric ceramic sheet, and the piezoelectric ceramic sheet is connected to the spring; the two ends of the spring are abutted against the bottom wall of the keycap mounting hole, and between the two ends of the spring, the bottom wall of the keycap mounting hole is recessed in a direction away from the pressing wall to form a cavity, and the piezoelectric ceramic sheet is suspended in the cavity.

[0015] In some embodiments of the present application, a boss is provided in the cavity, and a distance between the piezoelectric ceramic sheet and a top surface of the boss is smaller than a distance between the piezoelectric ceramic sheet and a bottom surface of the cavity.

[0016] In some embodiments of the present application, the spring sheet has a first end and a second end, the first end and the second end are abutted against the bottom wall, the distance between the first end and the piezoelectric ceramic sheet is equal to the distance between the second end and the piezoelectric ceramic sheet, and the portion of the spring sheet between the first end and the piezoelectric ceramic sheet and the portion of the spring sheet between the second end and the piezoelectric ceramic sheet are all suspended in the recessed portion of the cavity.

[0017] In some embodiments of the present application, the vibration module also includes a reinforcement sheet, the piezoelectric ceramic sheet is connected between the spring sheet and the reinforcement sheet, and the projection area of ​​the piezoelectric ceramic sheet toward the spring sheet is larger than the projection area of ​​the reinforcement sheet toward the spring sheet.

[0018] In some embodiments of the present application, the vibration module further includes a reinforcing sheet, the spring sheet is connected between the piezoelectric ceramic sheet and the reinforcing sheet, and the projection of the piezoelectric ceramic sheet toward the spring sheet falls within the projection of the reinforcing sheet toward the spring sheet.

[0019] According to a second aspect of an embodiment of the present application, an electronic device is provided, comprising: a key assembly as described in any of the preceding items.

[0020] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0022] Figure 1 is an exploded view of a button assembly according to some specific embodiments.

[0023] Figure 2It is a schematic diagram of the installation of the key assembly according to some specific embodiments.

[0024] Figure 3 for Figure 2 A partial enlarged view of the key component in .

[0025] Figure 4 is an exploded view of a vibration module according to some specific embodiments.

[0026] Figure 5 for Figure 4 The main view of the vibration module in .

[0027] Figure 6 Exploded views of vibration modules according to other specific embodiments.

[0028] Figure 7 for Figure 6 The main view of the vibration module in .

[0029] Figure 8 It is a three-dimensional diagram of the sealing ring and the keycap.

[0030] Explanation of the reference numerals in the accompanying drawings: 1. keycap; 101. pressing wall; 102. first gap; 103. first groove; 104. supporting foot; 105. third groove; 2. sealing ring; 3. pressure sensing module; 4. key insert; 5. vibration module; 501. spring; 5011. first end; 5012. second end; 502. piezoelectric ceramic sheet; 503. reinforcing sheet; 6. frame; 601. keycap mounting hole; 602. second groove; 603. bottom wall; 604. cavity; 6041. recess; 6042. boss; 6043. top surface; 6044. bottom surface; 605. second gap; 7. adhesive backing; 8. keycap support plate; 801. convex foot; 9. glue. DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0033] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0034] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0036] like Figure 1 , Figure 2 , Figure 3 and Figure 8 As shown, according to the first aspect of an embodiment of the present application, a key component is provided, which can be applied to electronic devices, such as smart phones, laptops, tablet computing devices, smart watches, head-mounted devices and headphones, etc. Users can implement adjustment functions of the electronic devices through the key component, such as adjusting the volume, screen brightness, etc.

[0037] like Figure 1 As shown, according to some embodiments of the present application, the key assembly includes: a keycap 1, a keycap support plate 8, a pressure sensing module 3, a frame 6 and a vibration module 5. The keycap 1 is used to receive a user's pressing operation. The pressure sensing module 3 can be manufactured by installing a pressure-sensitive device on a printed circuit board or a flexible circuit board, and is used to detect the user's pressing on the keycap 1, and convert the pressure signal into an electrical signal to realize the adjustment function of the electronic device, or to make the vibration module 5 vibrate. In some embodiments of the present application, the pressure sensing module 3 is formed by connecting a pressure sensor, a flexible circuit board and a supporting steel sheet together, with less constituent materials, a simple structure and low cost. In addition to being used to install the keycap 1, the frame 6 can also be used as a supporting structure for electronic devices such as circuit boards, screens, antennas, speakers, etc. of electronic equipment. The vibration module 5 can use components such as electric motors and piezoelectric ceramic sheets. When the vibration module receives an electrical signal, it can generate vibration, and this vibration can be fed back to the user.

[0038] like Figure 1 , Figure 2 , Figure 3 and Figure 8 As shown, in some embodiments of the present application, the keycap 1 has a pressing wall 101 and a supporting foot 104. The pressing wall 101 is used to receive the user's pressing, and the supporting foot 104 is used to limit the keycap 1 in the keycap mounting hole 601 of the frame 6. The pressing wall 101 and the supporting foot 104 can be integrally formed, or the supporting foot 104 can be bonded or welded to the pressing wall 101, or the pressing wall 101 and the supporting foot 104 can be connected together in other ways.

[0039] like Figure 1 , Figure 3 and Figure 8 As shown, in some embodiments of the present application, the keycap support plate 8 is connected to the support foot 104. For example, the keycap support plate 8 can be a separate plate, which is connected to the support foot 104 by welding, clamping, etc., or the keycap support plate 8 can be integrally formed with the keycap 1, and then the keycap 1 is machined to form the keycap support plate 8, and the keycap support plate 8 is connected to the support foot 104. After the keycap support plate 8 is connected to the support foot 104, a first groove 103 is provided between the pressing wall 101 and the keycap support plate 8. For example, the separate keycap support plate 8 is clamped with the support foot 104 and there is a spacing space between the pressing wall 101, and the spacing space serves as the first groove 103, or the integrally formed keycap 1 is machined to machine a groove between the two support feet 104, and the groove serves as the first groove 103, and a bottom wall of the groove serves as the keycap support plate 8. Due to the presence of the first groove 103, the strength of the pressing wall 101 is weakened, and it is more likely to deform.

[0040] like Figure 2 and Figure 3 As shown, in some embodiments of the present application, the pressure sensing module 3 is fixed in the first groove 103, and the pressure sensing module 3 is connected to the pressing wall 101 by bonding with glue 9 or by welding. After the pressure sensing module 3 is connected to the pressing wall 101, the pressing wall 101 will be deformed when pressed by the user, and the deformation will cause the pressure sensing module 3 to generate an electrical signal. Since the pressure sensing module 3 is fixed in the first groove 103, the pressure sensing module 3 is not easy to fall off after being frequently pressed under the clamping of the pressing wall 101 and the keycap support plate 8, thereby improving the reliability of the press detection.

[0041] like Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments of the present application, the frame 6 has a keycap mounting hole 601, which can be formed by machining the frame 6 or by injection molding the frame 6. The support leg 104 of the keycap 1 is inserted into the keycap mounting hole 601. After assembly, at least part of the keycap 1 is located in the keycap mounting hole 601, and the pressed side of the pressing wall 101 is located outside the keycap mounting hole 601. In other words, in the case of Figure 3 In the perspective shown, the side of the pressing wall 101 pressed by the user should protrude from the outer surface of the frame 6, so that the user can easily find the keycap 1 through the touch of fingers, and thus press the pressing wall 101. In this way, the user can also quickly find the keycap 1 and press it in a dark environment.

[0042] like Figure 1 , Figure 2 and Figure 3As shown, the vibration module 5 is located in the keycap mounting hole 601. The keycap support plate 8 has a side close to the pressing wall 101 and a side away from the pressing wall 101, wherein the side of the keycap support plate 8 close to the pressing wall 101 faces the first groove 103, and the side of the keycap support plate 8 away from the pressing wall 101 is provided with a convex foot 801. The convex foot 801 can be integrally formed with the keycap support plate 8, or fixed to the keycap support plate 8 by welding, riveting, etc. During assembly, the vibration module 5 can be placed in the keycap mounting hole 601 first, and then the keycap 1 connected with the pressure sensing module 3 and the keycap support plate 8 can be inserted into the keycap mounting hole 601, so that the convex foot 801 abuts against the vibration module 5. The pressure sensing module 3 is electrically connected to the vibration module 5. This electrical connection can be that the pressure sensing module 3 sends an electrical signal to the vibration module 5 to make the vibration module 5 vibrate, or the pressure sensing module 3 first sends the electrical signal to the main control chip, and then the main control chip sends the electrical signal to the vibration module 5 to make the vibration module 5 vibrate.

[0043] When the user presses the pressing wall 101, the pressing wall 101 is deformed, and the pressure sensing module 3 generates an electrical signal. On the one hand, the pressure sensing module 3 transmits the electrical signal to the main control chip, and the main control chip adjusts the electronic device according to the electrical signal of the pressure sensing module 3. On the other hand, the pressure sensing module 3 transmits the electrical signal to the vibration module 5, causing the vibration module 5 to vibrate. The vibration of the vibration module 5 is transmitted to the pressing wall 101 through the protruding feet 801 on the keycap support plate 8 and the supporting feet 104 of the keycap 1, so that the user can get sensitive pressing feedback.

[0044] like Figure 2 and Figure 3 As shown, in some embodiments of the present application, the frame 6 further has a second groove 602 connected to the keycap mounting hole 601, and the second groove 602 can be formed by further machining the keycap mounting hole 601 to remove part of the material of the frame 6, or it can be formed when the frame 6 is injection molded. The support foot 104 is provided with a third groove 105, and the third groove 105 can be formed by machining the support foot 104 to remove part of the material, or it can be formed when the keycap 1 is injection molded. After the support foot 104 is inserted into the keycap mounting hole 601, the second groove 602 and the third groove 105 are arranged opposite to each other, and then the key insert 4 is inserted, and a part of the key insert 4 is located in the second groove 602, and a part of it is located in the third groove 105, so that the keycap 1 is limited in the keycap mounting hole 601, effectively avoiding the risk of the keycap 1 falling off.

[0045] like Figure 1 , Figure 2 , Figure 3 and Figure 8As shown, in some embodiments of the present application, the key assembly further includes a sealing ring 2. The sealing ring 2 can be made of materials such as rubber and silicone. The sealing ring 2 can be a separately molded part, which is sleeved on the outer peripheral side of the keycap 1, or it can be injection molded on the outer peripheral side of the keycap 1 through a liquid molding process, so as to form an integrated structure with the keycap 1. The sealing ring 2 is arranged on the outer peripheral side of the keycap 1, and is located between the pressing wall 101 and the third groove 105. After the keycap 1 is inserted into the keycap mounting hole 601, the sealing ring 2 is interference fit with the keycap mounting hole 601. Since the sealing ring 2 is located between the pressing wall 101 and the third groove 105, it can block water vapor outside the frame, prevent water vapor, dust, iron filings, etc. from entering the key assembly and electronic equipment, and improve the sealing effect.

[0046] In some embodiments of the present application, the sealing ring 2 can also cover the first groove 103 , thereby protecting the pressure sensing module 3 in the first groove 103 .

[0047] like Figure 3 As shown, in some embodiments of the present application, there is a first gap 102 between the support foot 104 and the bottom wall 603 of the keycap mounting hole 601, and accordingly, there is also a gap between the pressing wall 101 and the inner surface of the keycap mounting hole 601 of the frame 6. The first gap 102 provides a pressing stroke for the keycap 1, and can also prevent the tolerance accumulation of various components, so as to avoid the keycap 1 being clamped and causing the vibration module 5 to be unable to drive the keycap 1 to vibrate together. After the pressing wall 101 of the keycap 1 is pressed down by the user, the first gap 102 can disappear, and the support foot 104 can abut against the bottom wall 603, preventing the keycap 1 from being over-pressed and damaging the vibration module 5.

[0048] In some embodiments of the present application, after the key assembly is assembled, the keycap support plate 8 and the vibration module 5 are pre-interfered. Exemplarily, the keycap support plate 8 is made of a metal material with a certain rigidity to form a long strip shape. The keycap support plate 8 is first deformed, and then the keycap support plate 8 is clamped onto the support foot 104, so that a first groove 103 is formed between the keycap support plate 8 and the pressing wall 101, and the keycap support plate 8 will not interfere with the pressure sensing module 3. After the keycap 1 is limited in the keycap mounting hole 601, there is a certain clamping force between the convex foot 801 and the vibration module 5, which deforms the vibration module 5, and the vibration module 5 will also give the keycap support plate 8 a reaction force. When the vibration module 5 vibrates, it can timely and effectively transmit the vibration to the keycap 1, and at the same time, the keycap support plate 8 plays a role of unloading. When the vibration module 5 vibrates, part of the force will be transmitted to the two ends of the key cap support plate 8 through the protruding feet 801, and the two ends of the key cap support plate 8 are connected to the supporting feet 104, so that the vibration force can be transmitted to the key cap 1, and the vibration feedback is sensitive.

[0049] like Figure 2 and Figure 3As shown, in some embodiments of the present application, the vibration module 5 includes a spring 501 and a piezoelectric ceramic sheet 502. The spring 501 can be made of a material with a certain elasticity, and the piezoelectric ceramic sheet 502 is connected to the spring 501. When the electrical signal acts on the piezoelectric ceramic sheet 502, the piezoelectric ceramic sheet 502 will produce mechanical deformation with the change of voltage and frequency, thereby driving the spring 501 to produce mechanical deformation. The two ends of the spring 501 abut against the bottom wall 603 of the keycap mounting hole 601, and can be fixed by adhesive 7, or fixed by welding or the like. In some embodiments, although there is adhesive 7 between the spring 501 and the bottom wall 603, the function of the adhesive 7 is to achieve the bonding between the two, so the spring 501 is still regarded as abutting against the bottom wall 603. For the sake of clarity, the parts where the spring 501 abuts against the bottom wall 603 are marked as the first end 5011 and the second end 5012 respectively. Between the first end 5011 and the second end 5012 of the spring 501, the bottom wall 603 of the key cap mounting hole 601 is recessed in a direction away from the pressing wall 101 to form a cavity 604. The cavity 604 can be formed by further machining the key cap mounting hole 601 to remove part of the material, or can be formed during the injection molding of the frame 6. After the first end 5011 and the second end 5012 of the spring 501 are bonded to the bottom wall 603 by the adhesive 7, the piezoelectric ceramic sheet 502 is suspended in the cavity 604, so that the spring 501 forms a vibration arm distance d, so that the vibration power of the piezoelectric ceramic sheet 502 can reach the maximum.

[0050] like Figure 2 and Figure 3 As shown in FIG. 1 , in some embodiments of the present application, a boss 6042 is provided in the cavity 604. The boss 6042 may be formed when removing part of the frame material, or may be formed when the frame 6 is injection molded. Although the boss 6042 exists, since it is part of the cavity 604, Figure 3 In the perspective shown, the top surface 6043 of the boss 6042 is still lower than the bottom wall 603 of the keycap mounting hole 601. Therefore, there is a second gap 605 between the vibration component 5 and the top surface 6043 and the bottom surface 6044 of the cavity 604, and the second gap 605 allows the vibration component 5 to generate sufficient amplitude. The distance between the piezoelectric ceramic piece 502 and the top surface 6043 of the boss 6042 is smaller than the distance between the piezoelectric ceramic piece 502 and the bottom surface 6044 of the cavity 604, that is, the top surface 6043 of the boss 6042 is closer to the piezoelectric ceramic piece 502 than the bottom surface 6044 of the cavity 604. This structure can prevent the piezoelectric ceramic piece 502 from being over-pressurized and broken, while ensuring that the spring piece 501 can have a sufficient vibration arm distance to fully vibrate.

[0051] like Figure 2As shown, in some embodiments of the present application, after the first end 5011 and the second end 5012 of the spring 501 abut against the bottom wall 603, the distance d between the first end 5011 and the piezoelectric ceramic sheet 502 is equal to the distance d between the second end 5012 and the piezoelectric ceramic sheet 502, that is, the piezoelectric ceramic sheet 502 is exactly connected to the middle position of the spring 501, so that the vibration arm distance d on both sides of the spring 501 is equal, and the vibration feedback of the vibration module 5 to the keycap 1 is more uniform. Part of the spring piece 501 between the first end 5011 and the piezoelectric ceramic piece 502 and part of the spring piece 501 between the second end 5012 and the piezoelectric ceramic piece 502 are all suspended in the concave portion 6041 of the cavity 604, that is, the portion of the vibration arm distance d of the spring piece 501 is completely suspended in the concave portion 6041 of the cavity 604, so the distance between the piezoelectric ceramic piece 502 and the top surface 6043 of the convex portion 6042 is smaller than the distance between the portion of the vibration arm distance d of the spring piece 501 and the bottom surface 6044 of the concave portion 6041. In terms of the size of the second gap 605, the second gap 605 between the piezoelectric ceramic piece 502 and the top surface 6043 of the convex portion 6042 is small, and the second gap 605 between the portion of the vibration arm distance d of the spring piece 501 and the bottom surface 6044 of the concave portion 6041 is large. This allows the spring piece 501 to have a larger deformation space, resulting in a better vibration effect.

[0052] like Figure 4 As shown, in some embodiments of the present application, the vibration module 5 further includes a reinforcing sheet 503 , and the piezoelectric ceramic sheet 502 is connected between the spring sheet 501 and the reinforcing sheet 503 , that is, the piezoelectric ceramic sheet 502 is clamped by the spring sheet 501 and the reinforcing sheet 503 .

[0053] like Figure 5 As shown, in some embodiments of the present application, the projection area of ​​the piezoelectric ceramic sheet 502 projected onto the spring sheet 501 is larger than the projection area of ​​the reinforcing sheet 503 projected onto the spring sheet 501, that is, the size of the reinforcing sheet 503 is smaller than the size of the piezoelectric ceramic sheet 502. The purpose of this design is that since the reinforcing sheet 503 is directly attached to the piezoelectric ceramic sheet 502, the oversized size of the reinforcing sheet 503 will not help to improve the overall strength, but will easily cause the reinforcing sheet 503 and the piezoelectric ceramic sheet 502 to deviate during the bonding process, thereby affecting the assembly. Therefore, in the structure in which the piezoelectric ceramic sheet 502 is clamped by the spring sheet 501 and the reinforcing sheet 503, the size of the reinforcing sheet 503 is smaller than the size of the piezoelectric ceramic sheet 502, which can not only improve the structural strength of the vibration module 5 and prevent the piezoelectric ceramic sheet 502 from breaking when it is impacted, but also prevent the reinforcing sheet 503 and the piezoelectric ceramic sheet 502 from deviating during the assembly process. After the reinforcing sheet 503 is connected to the piezoelectric ceramic sheet 502 , welding points are reserved at both ends of the piezoelectric ceramic sheet 502 in the length direction for connecting to an external circuit to receive electrical signals.

[0054] like Figure 6 As shown, in some embodiments of the present application, the vibration module 5 further includes a reinforcing sheet 503 , and the spring sheet 501 is connected between the piezoelectric ceramic sheet 502 and the reinforcing sheet 503 , that is, the spring sheet 501 is clamped by the piezoelectric ceramic sheet 502 and the reinforcing sheet 503 .

[0055] like Figure 7 As shown, in some embodiments of the present application, the projection of the piezoelectric ceramic sheet 502 toward the spring sheet 501 falls within the projection of the reinforcing sheet 503 toward the spring sheet 501, that is, the size of the reinforcing sheet 503 is larger than the size of the piezoelectric ceramic sheet 502. The purpose of this design is to directly attach the reinforcing sheet 503 to the spring sheet 501, which is equivalent to increasing the thickness of the area where the piezoelectric ceramic sheet 502 is located, which is of great help in improving the overall strength of the vibration module 5.

[0056] According to a second aspect of an embodiment of the present application, there is also provided an electronic device, comprising: a key assembly as described in any of the preceding items.

[0057] The electronic device may be, for example, a smart phone, a laptop, a tablet computing device, a smart watch, a head-mounted device, and a headset, and the key assembly is used to adjust the functions of the electronic device, such as increasing or decreasing the volume, increasing or decreasing the screen brightness, etc. When the user presses the pressing wall 101 of the key module to adjust the electronic device, the vibration module 5 can sensitively transmit the vibration to the key cap 1, so that the user can obtain the pressing feedback in time.

[0058] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A button assembly, characterized in that: include: A key cap, wherein the key cap has a pressing wall and a supporting foot; A key cap support plate, the key cap support plate is connected to the support foot, and a first groove is provided between the pressing wall and the key cap support plate; A pressure sensing module, the pressure sensing module is fixed in the first groove, and the pressure sensing module is connected to the pressing wall; A frame body, wherein the frame body has a keycap mounting hole, at least a portion of the keycap is located in the keycap mounting hole, and a pressed side of the pressing wall is located outside the keycap mounting hole; A vibration module, the vibration module is located in the key cap mounting hole, and the pressure sensing module is electrically connected to the vibration module; A convex foot is arranged on one side of the key cap support plate away from the pressing wall, and the convex foot abuts against the vibration module.

2. The key assembly according to claim 1, characterized in that: The frame body also has a second groove communicating with the key cap mounting hole, the support foot is provided with a third groove, and the second groove is arranged opposite to the third groove; The key assembly further comprises a key insert, a portion of which is located in the second groove and a portion of which is located in the third groove, so that the key cap is limited to be located in the key cap installation hole.

3. The key assembly according to claim 2, characterized in that: It also includes a sealing ring, which is arranged on the outer peripheral side of the key cap and located between the pressing wall and the third groove, and the sealing ring is interference-fitted with the key cap mounting hole.

4. The key assembly according to claim 1, characterized in that: A first gap is formed between the supporting foot and the bottom wall of the key cap mounting hole.

5. The key assembly according to claim 1, characterized in that: The vibration module includes a spring and a piezoelectric ceramic sheet, and the piezoelectric ceramic sheet is connected to the spring; The two ends of the spring sheet abut against the bottom wall of the key cap mounting hole. Between the two ends of the spring sheet, the bottom wall of the key cap mounting hole is recessed in a direction away from the pressing wall to form a cavity, and the piezoelectric ceramic sheet is suspended in the cavity.

6. The key assembly according to claim 5, characterized in that: A boss is provided in the cavity, and a distance between the piezoelectric ceramic sheet and a top surface of the boss is smaller than a distance between the piezoelectric ceramic sheet and a bottom surface of the cavity.

7. The key assembly according to claim 6, characterized in that: The spring sheet has a first end and a second end, the first end and the second end are abutted against the bottom wall, the distance between the first end and the piezoelectric ceramic sheet is equal to the distance between the second end and the piezoelectric ceramic sheet, and the portion of the spring sheet between the first end and the piezoelectric ceramic sheet and the portion of the spring sheet between the second end and the piezoelectric ceramic sheet are all suspended in the concave portion of the cavity.

8. The key assembly according to claim 5, characterized in that: The vibration module also includes a reinforcing sheet, the piezoelectric ceramic sheet is connected between the spring sheet and the reinforcing sheet, and a projection area of ​​the piezoelectric ceramic sheet projected toward the spring sheet is larger than a projection area of ​​the reinforcing sheet projected toward the spring sheet.

9. The key assembly according to claim 5, characterized in that: The vibration module also includes a reinforcing sheet. The spring sheet is connected between the piezoelectric ceramic sheet and the reinforcing sheet. The projection of the piezoelectric ceramic sheet toward the spring sheet falls within the projection of the reinforcing sheet toward the spring sheet.

10. An electronic device, characterized in that: include: A key assembly according to any one of claims 1 to 9.

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